JP3508729B2 - Imaging device - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a mobile phone, a PD.
Mobile information terminals such as A, other personal computers,
The present invention relates to an imaging device used by being incorporated in an electronic device such as a video camera or a scanner.

[0002]

2. Description of the Related Art In recent years, image pickup devices have been widely used, and are widely used in mobile information terminals such as mobile phones with the progress of communication technology. Such an imaging device is required to be further downsized, and various technological developments for downsizing have been made.

For example, in Japanese Laid-Open Patent Publication No. 11-191864, a CC is provided on one surface of a substrate provided with a conductive printed wiring.
A D chip is arranged, an opening is formed at a position of the substrate of the CCD chip facing the effective pixel area, and an imaging surface of the CCD chip is arranged so as to face the opening provided on the substrate. It describes a solid-state imaging device, and further describes that the distance between the imaging lens and the CCD chip can be made closer by expanding the opening of the substrate toward the imaging lens.

[0004]

However, in the conventional image pickup apparatus, the positioning of the CCD chip with respect to the image pickup lens is carried out between the lens holder holding the image pickup lens and the substrate provided with the CCD chip. In positioning by such a substrate, it is not possible to obtain highly accurate positioning accuracy even if the end face, a hole for positioning, etc. are used, and by making the distance between the imaging lens and the CCD chip close, the device can be made compact in the distance direction. Can be converted, but CC
When the displacement of the D chip occurs, the effective image circle of the imaging lens deviates from the effective pixel area of the CCD chip,
There is a problem that an image at a position where the image height is high, that is, the outermost image is not formed on the effective pixel area of the CCD chip, and a good image cannot be obtained. In particular, when a sheet-shaped substrate such as an FPC is used, it is very difficult to secure a desired positioning accuracy because the substrate itself is thin and soft.

On the other hand, the effective image circle of the image pickup lens is made sure so that the effective image circle formed on the image pickup lens is surely within the effective pixel area of the CCD chip even when the displacement of the CCD chip occurs. It may be possible to increase the size, but if the effective image circle of the imaging lens is increased, distortion and aberration will increase due to the structure of the lens, and such distortion and aberration will make it impossible to obtain a good image. In order to increase the effective image circle of the imaging lens while suppressing aberrations and aberrations, the aperture of the imaging lens must be increased. When an imaging lens with a large aperture is used, the device becomes large and the device becomes heavy. There are problems such as.

Further, in the conventional image pickup device, the substrate located between the lens holder and the CCD chip extends in the left-right direction, and the IC 7, the capacitor 8, the resistor 9, etc. are mounted on each of the extended portions. Although it is configured, the miniaturization in the thickness direction has been studied, but the miniaturization in the width direction has not been studied at all.

The present invention has been made in order to solve the above problems, and a novel image pickup apparatus capable of obtaining a good image in which distortion and chromatic aberration are suppressed while the apparatus can be downsized. The purpose is to provide.

[0008]

According to another aspect of the present invention, there is provided an image pickup device comprising: a substrate having an opening formed at an end portion in a longitudinal direction; and a light receiving surface exposed through the opening to the back surface of the substrate. A fixed image pickup device, a frame body in which the image pickup device is arranged inside and fixed to the back surface of the substrate, an image pickup lens arranged on the front surface side of the substrate, and the image pickup lens supported by the substrate. By contacting the lens barrel portion having a leg portion extending to the back surface side outside the end portion of the, the effective portion of the image pickup lens and the light receiving surface, It is provided with a means for providing a relative position of.

An image pickup device according to a second aspect of the present invention uses an adhesive as a connecting means for connecting the frame body and the leg portion.

An image pickup device according to a third aspect of the present invention includes a substrate having an opening formed at an end portion in the longitudinal direction, and an image pickup element having a light receiving surface exposed through the opening and fixed to the back surface of the substrate. A frame body in which the image pickup device is arranged inside and fixed to the back surface of the substrate, an image pickup lens arranged on the front surface side of the substrate, and a lens barrel portion having a leg portion supporting the image pickup lens, Locking means for locking the leg portion and the frame body outside the end portion of the substrate so that the effective image circle of the imaging lens and the light receiving surface are in a predetermined relative position. It is equipped with.

According to a fourth aspect of the present invention, in the image pickup device, the locking means is provided with a protrusion and a hole in the leg and the frame, respectively, or a hole and a protrusion in the leg and the frame, respectively. Parts are provided.

In the image pickup device according to the invention of claim 5, an opening is formed at an end in the longitudinal direction, and land portions arranged on both sides of the opening portion and a wiring pattern connected to these land portions are provided. A substrate having an input / output terminal fixed to the back surface of the substrate so that the light receiving surface is exposed through the opening, and an input / output terminal electrically connected to the land, and the image capturing element is arranged inside. Then, a frame body fixed to the back surface of the substrate, an imaging lens arranged on the front surface side of the substrate, a lens barrel having a leg portion supporting the imaging lens, and an outer side of an end portion of the substrate It is provided with means for bringing the leg portion and the frame body into contact with each other so that the effective image circle of the imaging lens and the light receiving surface are in a predetermined relative position.

An image pickup device according to a sixth aspect of the present invention is such that chip components such as a capacitor, a resistor, and a signal processing IC are arranged in a circuit wiring portion provided on the substrate.

An image pickup device according to a seventh aspect of the present invention is such that the image pickup element and the frame body on the back side of the substrate are resin-sealed.

An image pickup device according to an eighth aspect of the present invention is such that the substrate is a film substrate.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Hereinafter, Embodiment 1 of the present invention will be described. This will be described with reference to FIGS. 1 to 4. 1 shows a first embodiment of the present invention. 2 is a cross-sectional configuration diagram showing the image pickup apparatus according to FIG. 2, and FIG. 2 is an exploded configuration diagram partially showing the image pickup apparatus shown in FIG. In FIGS. 1 and 2, 1 is an imaging lens, 2 is a lens barrel portion that supports the imaging lens 1, and 3 is a structure integrally formed with the lens barrel portion 2 for fixing the mirror portion 2 to a substrate or the like. Legs 4 are substrates, 5 are openings formed at the ends of the substrate 4, 6 is an image pickup device mounted face down on the substrate 4, 7 is an image pickup device 6 exposed at the openings 5 of the substrate 4.
A light-receiving surface of the image pickup device, a reference numeral 8 denotes a positioning frame body (hereinafter, referred to as a frame body) fixed to the back surface of the substrate 4 with the image pickup device 6 arranged inside, and 9 denotes the image pickup device 6 and the frame body 8 sealed inside. It is a sealing member made of resin or the like. As shown in FIG. 1, the imaging lens 1
The light 10 condensed by the light passes through the opening 5 of the substrate 4 and reaches the light receiving surface 7 of the image pickup device 6. Light-receiving surface 7 of image sensor 6
An effective image circle 11 is imaged by the imaging lens 1 at.

Further, 12 is a conductive substance called a bump, 13 to 17 are connecting means such as an adhesive, and 18 is a substrate 4.
Of the condenser, resistor,
A circuit wiring unit (hereinafter referred to as a chip component mounting unit) for mounting chip components such as a signal processing IC. The chip component mounting unit 18 includes an integrated circuit chip for driving the image pickup device 6 and performing signal processing. Hereafter, an IC chip) 19, a capacitor 20, a resistor 21, etc. are mounted. As shown in FIG. 1, the image pickup device 6 is fixed to the back surface of the substrate 4 by an adhesive 13, and is electrically connected to the substrate 4 by bumps 12. Further, the frame 8 is attached to the substrate 4 by the adhesive 14.
It is fixed on the back of the.

Here, the frame 8 will be described in detail.
The frame 8 positions the image pickup lens 1 and the image pickup device 6, and the effective image circle 11 formed by the image pickup lens 1 and the image pickup device 6
The light receiving surface 7 of is to be at a predetermined relative position, and is connected to the image pickup device 6 and the leg portion 3 of the lens barrel portion 2 by adhesives 15 and 16. That is, the frame body 8
Is a member capable of ensuring higher dimensional accuracy than the substrate 4, and the light-receiving surface 7 of the image sensor 6 is accurately positioned at a predetermined distance from the outer end surface of the frame 8 connected to the image sensor 6. ing. Then, as shown in FIG. 1, the outer end surface of the substrate 4 is designed to project outward from the end surface of the substrate 4 when fixed to the back surface of the substrate 4. The position of the imaging lens 1 is determined by the distance from the leg portion 3 which is integrally formed with the lens barrel portion 2. Since the lens barrel 2 is made of a resin member such as plastic, the imaging lens 1 can be positioned easily and accurately.

Next, the structure of the lens barrel portion 2 will be described.
As shown in FIG. 1, in the lens barrel portion 2, a leg portion 3 of a portion connected to the frame body 8 extends from the front surface side to the back surface side of the substrate 4, and the frame body 8 fixed to the back surface of the substrate 4 is connected. It is formed as long as possible. Further, such leg portions 3 are formed not only in the longitudinal direction of the substrate 4 but also in the width direction of the substrate 4 as shown in FIG. With such a configuration, when the lens barrel portion 2 is arranged on the front surface side of the substrate 4, the leg portions 3 of the lens barrel portion 2 are arranged on the rear surface side of the substrate 4 and fixed to the rear surface of the substrate 4. It is possible to connect to the frame body 8. Then, as described above, the imaging lens 1 is accurately positioned by the distance from the leg portion of the lens barrel portion 2, and the light receiving surface 7 of the imaging element 6 is also accurately positioned by the distance from the outer end surface of the frame body 8. Therefore, by connecting the leg portion 3 of the lens barrel portion 2 and the frame body 8 serving as a reference for such positioning with the adhesive 16, the image pickup lens 1 image pickup is performed regardless of the type of the substrate 4 used. The element 6 can be accurately positioned.

In the image pickup apparatus according to this embodiment,
Although the leg portion 3 of the lens barrel portion 2 and the frame body 8 are connected by the adhesive 16, the invention is not limited to this. Other connection means may be used to connect the frame body 8 and the leg portion of the lens barrel portion 2. Even when 3 and 3 are connected, the positioning can be performed similarly.

Next, the operation will be described. Imaging lens 1
Collects the light 10 and forms an effective image circle 1 on the light receiving surface 7 of the image sensor 6.
Image 1 The light 10 imaged on the light receiving surface 7 is converted into an electric signal by the image pickup device 6. Image sensor 6 is bump 1
The electrical signal output from the image sensor 6 is electrically connected to the substrate 4 via 2 and is output to the IC chip 19 and the like via the bump 12 and a wiring pattern (described later) formed on the substrate 4. It As described above, the image pickup lens 1 and the image pickup device 6 can be accurately positioned regardless of the type of substrate used, and an effective image circle having the same size as the light receiving surface 7 of the image pickup device 6 is formed. Even when the image pickup lens is used, the effective image circle 11 formed by the image pickup lens 1 and the light receiving surface 7 of the image pickup element 6 can be set at a predetermined relative position.

That is, when the effective image circle 11 formed by the image pickup lens 1 is made to have the same size as the light receiving surface 7 of the image pickup element 6, a slight positional deviation between the image pickup lens 1 and the image pickup element 6 causes The effective image circle 11 formed by the image pickup lens 1 is formed at a position displaced from the light receiving surface 7 of the image pickup element 6, but in the image pickup apparatus according to the present embodiment, the substrate 4 is formed.
Since the image pickup lens 1 and the image pickup device 6 can be accurately positioned regardless of the type of the image pickup lens, an image pickup lens that forms an effective image circle having a size similar to that of the light receiving surface 7 of the image pickup device 6 as described above. Even when is used, the outermost part of the effective image circle 11 formed by the image pickup lens 1 can be made to enter the light receiving surface 7 of the image pickup element 6, and the space between the image pickup lens 1 and the image pickup element 6 can be increased. The light-receiving surface 7 of the image sensor 6 in consideration of the positional deviation
It is not necessary to use an imaging lens that forms a larger effective image circle, and the size of the device can be reduced, while a good image with suppressed distortion and chromatic aberration can be obtained.

Next, the substrate 4 and the image pickup device 6 are shown in FIG.
And FIG. 4 will be described. FIG. 3 shows a substrate 4 of the image pickup apparatus shown in FIG. 1 and an image pickup device 6 fixed to the back surface of the substrate 4.
FIG. The imaging device according to the present embodiment is
In order to miniaturize the device, a rectangular substrate elongated in one direction as shown in FIG. 3 is used. The substrate 4 is preferably a sheet-shaped substrate such as an FPC or a film-shaped substrate from the viewpoint of making the image pickup device thin and lightweight. Then, the opening 5 corresponding to the image pickup area of the light receiving surface 7 of the image pickup device 6 is formed at one end of the longitudinal direction thereof, and the chip component mounting portion 18 such as the IC chip 19 is provided at the other side thereof. . With such a configuration, the substrate space in the peripheral portion of the opening 5 can be made large enough to fix the frame body 8, and the size of the image pickup device in the peripheral portion of the image pickup lens 1 can be changed. Can be close to.

For example, in the case of the device configuration as in the prior art, since the electronic parts such as IC chips are arranged on both sides of the substrate with the image pickup element sandwiched therebetween, the size of the peripheral portion of the image pickup lens is larger than that of the image pickup element. Although the size is considerably large, according to the imaging device of the present embodiment, the size of the peripheral part of the imaging lens 1 can be made close to the size of the imaging element 6, and a small electronic device such as a mobile phone. When the image pickup device is incorporated into the device, the degree of freedom of the arrangement location can be greatly improved, and the image pickup device suitable for a small electronic device or the like can be obtained.

FIG. 4 is a configuration diagram showing a specific configuration example of the substrate 4 and the image pickup device 6 as described above. FIG. 4A is a specific configuration diagram of the image pickup device 6, in which input / output terminals are provided on both sides of the light receiving surface 7. Further, FIG. 4B is a specific configuration diagram of the substrate 4, in which the land portions 23 are arranged on both sides of the opening 5. A wiring pattern 24 as shown in FIG. 4B is connected to the land portion 23, and is connected to an IC chip or the like provided on the other side in the longitudinal direction of the substrate 4, which is not shown. FIG. 4C is a configuration diagram showing a state where the image sensor 6 is fixed to the back surface of the substrate 4, and the input / output terminals 22 of the image sensor 6 and the land portions 23 of the substrate 4 are electrically connected via the bumps 12. Has been done.

As described above, according to the image pickup apparatus of the present embodiment, the frame body 8 in which the image pickup element 6 is arranged is fixed to the back surface of the substrate 4, and the frame body 8 and the front surface side of the substrate 4 Since the leg portion 3 of the lens barrel portion 2 extending to the rear surface side is connected by the connecting means 16, positioning between the image pickup lens 1 and the image pickup element 6 when a sheet-like substrate or a film-like substrate such as an FPC is used. Can be done accurately,
Even when an image pickup lens for forming an effective image circle having a size similar to that of the light receiving surface 7 of the image pickup element 6 is used, the effective image circle 11 formed by the image pickup lens 1 and the light receiving surface 7 of the image pickup element 6 are , The relative position can be set to a predetermined value, and the size of the apparatus can be reduced, while a good image with suppressed distortion and chromatic aberration can be obtained. In the present embodiment, the case where the substrate 4 is a long rectangular substrate has been described as an example, but the mounting portion of the image sensor 6 is suppressed to the chip size as much as possible, and the frame body 8 and the lens barrel 2 are integrally configured. The shape thereof is not limited as long as it is a structure capable of abutting with the leg portion 3.

Embodiment 2. Next, the second embodiment of the present invention. The image pickup apparatus according to the present invention will be described with reference to FIG. In the image pickup apparatus according to the above-described embodiment, the image pickup lens 1 is positioned by the distance from the leg portion 3 of the lens barrel portion 2, the image pickup element 6 is positioned by the distance from the outer surface of the frame body 8, and the positioning reference is used. The image pickup lens 1 and the image pickup device 6 are positioned by connecting the leg portion 3 of the lens barrel portion 2 and the frame body 8 by the connecting means 16, but the image pickup apparatus according to the present embodiment is The image pickup lens 1 and the image pickup device 6 are positioned by the engagement of the engagement means provided on the lens barrel 3 and the frame 8.

FIG. 5 shows the second embodiment of the present invention. 3 is a cross-sectional configuration diagram showing an image pickup device according to FIG. In FIG. 5, 25 is a protrusion such as a positioning pin provided on the leg 3 of the lens barrel 2, 26 is a hole provided in the frame 8, 27 is a position corresponding to the hole 26 of the frame 8. Is a hole portion of the substrate 4 provided in the above, and the projecting portion 25 and the hole portion 26 constitute a locking means. Then, in the imaging device according to the present embodiment,
The imaging lens 1 is positioned by the distance from the projection 25 provided on the leg portion 3 of the lens barrel portion 2, and the imaging element 6 is
Since the protrusion 25 is positioned by the distance from the hole 26 of the frame 8 into which the protrusion 25 is inserted, these distances can be set beforehand in advance.
Accurate positioning of the image pickup lens 1 and the image pickup device 6 is realized by adjusting the image pickup lens 1 so that the image pickup lens 1 and the image pickup device 6 have a predetermined relative position. In the drawings, the same reference numerals indicate the same or corresponding parts,
Detailed description of these is omitted.

In the image pickup apparatus according to the present embodiment, when the lens barrel portion 2 is arranged on the front surface side of the substrate 4, the protrusion 25 provided on the lower surface of the leg portion 3 has the corresponding holes in the frame body 8 and the substrate 4. It is inserted into the portion 26 and locks the lens barrel portion 2 and the frame body 8. Note that the projection 25 inserted into the holes 25 and 26 may be fixed with an adhesive as needed. As a result, the image pickup lens 1 and the image pickup element 6 can be accurately positioned regardless of the type of the substrate 4, and even when the effective image circle of the image pickup lens 1 is made to have the same size as the image pickup element 6, the image pickup lens 1 The effective image circle 11 formed by 1 and the light receiving surface 7 of the image pickup device 6 can be set at a predetermined relative position.

As described above, according to the image pickup apparatus of the present embodiment, the locking means 25 provided on the frame 8 and the lens barrel portion 2,
Since the lens barrel portion 2 arranged on the front surface side of the substrate 4 and the frame body 8 fixed to the back surface of the substrate 4 are locked by 26 and 27, a sheet-like substrate such as FPC or a film-like substrate is used. In this case, the positioning between the image pickup lens 1 and the image pickup element 6 can be performed accurately, and the image pickup element 6
The effective image circle 1 formed by the image pickup lens 1 is also used when an image pickup lens for forming an effective image circle having a size similar to
1 and the light receiving surface 7 of the image pickup device 6 can be set to a predetermined relative position, and the device can be downsized as in the image pickup device according to the above-described embodiment, while suppressing distortion and chromatic aberration. A good image can be obtained.

Embodiment 3. Next, the third embodiment of the present invention. The image pickup apparatus according to the above will be described with reference to FIG. In the imaging device according to the above-described embodiment, the leg portion 3 of the lens barrel portion 2 is provided with the protrusion 25 such as a positioning pin, and the frame body 8 and the substrate 4 are provided with the holes 26 and 27 corresponding to the protrusion 25. However, the configuration may be reversed. In the image pickup apparatus according to the present embodiment, a protrusion such as a positioning pin is provided on the frame body 8 and a hole corresponding to the protrusion is provided on the leg 3 of the lens barrel 2. 6 shows a third embodiment of the present invention. 7 is a cross-sectional configuration diagram showing an imaging device according to FIG.
Reference numeral 28 denotes a protrusion such as a positioning pin provided on the frame body 2,
Reference numeral 9 is a hole provided in the leg portion 3 of the lens barrel portion 2. In addition,
In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed description thereof will be omitted.

In the image pickup apparatus according to the present embodiment, the image pickup element 6 is positioned by the distance from the protrusion 28 provided on the frame body 8, and the image pickup lens 1 has the lens barrel portion into which the protrusion 28 is inserted. Since the positioning is performed according to the distance from the second hole 29, the distance between the imaging lens 1 and the imaging element 6 is accurately adjusted by adjusting these distances in advance so as to be a predetermined relative position. The protrusion 28 and the hole 29 form a locking means.

As described above, according to the image pickup apparatus of the present embodiment, the locking means 28 provided on the frame 8 and the lens barrel portion 2,
Since the lens barrel portion 2 arranged on the front surface side of the substrate 4 and the frame body 8 fixed to the rear surface of the substrate 4 are locked by 29, F
When a sheet-shaped substrate or a film-shaped substrate such as a PC is used, the positioning between the image pickup lens 1 and the image pickup device 6 can be accurately performed, and an effective image circle of the same size as the image pickup device 6 is formed. Even when the image pickup lens for imaging is used, the effective image circle 11 formed by the image pickup lens 1 and the light receiving surface 7 of the image pickup element 6 can be set at a predetermined relative position. As with the image pickup apparatus, the apparatus can be downsized, and a good image with suppressed distortion and chromatic aberration can be obtained.

[0034]

As described above, according to the present invention, the lens barrel portion for supporting the image pickup lens arranged on the front surface side of the substrate and the frame body in which the image pickup element is arranged inside and fixed to the rear surface of the substrate are fixed. And are configured so that they can be connected or locked by the connecting means or the locking means provided on the lens barrel and the frame,
While the device can be downsized, it is possible to obtain a good image with suppressed distortion and chromatic aberration.

[Brief description of drawings]

FIG. 1 is a first embodiment of the present invention. 3 is a cross-sectional configuration diagram showing an image pickup device according to FIG.

FIG. 2 is an exploded configuration diagram of the image pickup apparatus shown in FIG.

FIG. 3 is a perspective view showing a substrate of the image pickup apparatus shown in FIG. 1 and an image pickup element fixed to a back surface of the substrate.

FIG. 4 is a configuration diagram showing a specific configuration example of the image sensor and the substrate shown in FIG.

FIG. 5 is a second embodiment of the present invention. 3 is a cross-sectional configuration diagram showing an image pickup device according to FIG.

FIG. 6 is a third embodiment of the present invention. 3 is a cross-sectional configuration diagram showing an image pickup device according to FIG.

[Explanation of symbols]

1 imaging lens, 2 lens barrel part, 3 leg part, 4 substrate, 5
Aperture, 6 Image sensor, 7 Light receiving surface, 8 Frame, 9
Sealing means, 10 effective image circle, 11 bumps (conductive material), 15 connecting means, 19 IC chips, 22 input / output terminals, 23 lands, 24 wiring patterns, 25,
28 protrusions, 26, 29 holes, 25, 26 or 2
8,29 Locking means.

Front page continued (72) Inventor Nobuo Ueda 2-3-3 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Co., Ltd. (56) Reference Japanese Unexamined Patent Publication No. 9-55487 (JP, A) Fukukaihei 6-23375 ( JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H04N 5/222-5/257

Claims (8)

(57) [Claims] 1. A substrate having an opening formed at an end portion in the longitudinal direction, an image sensor fixed to the back surface of the substrate by exposing the light receiving surface through the opening, and the image sensor arranged inside. A frame fixed to the back surface of the substrate, an imaging lens arranged on the front surface side of the substrate, and a leg portion that supports the imaging lens and extends to the back surface outside the end portion of the substrate. The effective image circle of the imaging lens and the light receiving surface are configured to be in a predetermined relative position by abutting the lens barrel portion, the leg portion, and the frame body. Imaging device. 2. The image pickup apparatus according to claim 1, wherein the connecting means for connecting the frame body and the leg portion is an adhesive. 3. A substrate having an opening formed at an end in the longitudinal direction, an image sensor fixed to the back surface of the substrate by exposing the light receiving surface through the opening, and the image sensor arranged inside. A frame body fixed to the back surface of the substrate, an imaging lens arranged on the front surface side of the substrate, a lens barrel having legs for supporting the imaging lens, and the outside of the end of the substrate. An image pickup device, characterized in that the leg portion and the frame body are locked to each other, and a locking means is provided so that an effective image circle of the imaging lens and the light receiving surface are in a predetermined relative position. apparatus. 4. The locking means is characterized in that the leg and the frame are provided with a projection and a hole, respectively, or the leg and the frame are provided with a hole and a projection, respectively. The imaging device according to claim 3. 5. A substrate having an opening formed at an end in the longitudinal direction and having land portions arranged on both sides of the opening portion and a wiring pattern connected to these land portions, and through the opening portion. An image sensor fixed to the back surface of the substrate so that the light-receiving surface is exposed and having an input / output terminal electrically connected to the land portion, and the image sensor is placed inside and fixed to the back surface of the substrate. A frame, an imaging lens arranged on the front surface side of the substrate, a lens barrel having a leg supporting the imaging lens, and the leg and the frame outside the end of the substrate. An image pickup apparatus characterized in that the effective image circle of the image pickup lens and the light receiving surface are arranged in a predetermined relative position by abutting against each other. 6. The circuit wiring portion provided on the substrate,
The image pickup device according to claim 3, wherein chip components such as a capacitor, a resistor, and a signal processing IC are arranged. 7. The image pickup device and the frame body on the back surface side of the substrate are resin-sealed.
7. The image pickup device according to any one of 6 to 6. 8. The image pickup device according to claim 1, wherein the substrate is a film substrate.