JP2002262139A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device capable of being miniaturized and also obtaining an excellent image where production of distortion and aberration is suppressed. SOLUTION: The image pickup device includes a board at the end in the length direction of which an opening is formed, an image pickup element whose light receiving face is exposed through the opening and fixed on a rear side of the board, a frame having the image pickup element in its inside and fixed on the rear side of the board, an image pickup lens placed on the front side of the board, and a mirror barrel section that supports the image pickup lens and has a leg extended to the rear side at the outside of the end of the board. The image pickup device is configured such that pressing the leg contact with the frame so as to bring an effective image circle of the image pickup lens and the light receiving face to have a prescribed relative position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to portable telephones, PDs, and the like.
A and other personal digital assistants, other personal computers,
The present invention relates to an imaging device incorporated in an electronic device such as a video camera or a scanner.

[0002]

2. Description of the Related Art In recent years, imaging devices have been widely used, and are widely used in portable information terminals such as cellular phones with the development of communication technology. Such imaging devices are required to be further miniaturized, and various technical developments related to miniaturization are being carried out.

For example, Japanese Patent Application Laid-Open No. 11-191864 discloses that a CC printed on one surface of a substrate on which conductive printed wiring is provided.
A D chip is arranged, an opening is formed at a position of the substrate of the CCD chip facing the effective pixel area, and an imaging surface of the CCD chip is arranged so as to face the opening provided on the substrate. It describes a solid-state imaging device, and further describes that the distance between the imaging lens and the CCD chip can be reduced by expanding the opening of the substrate toward the imaging lens.

[0004]

However, in the conventional imaging apparatus, the positioning of the CCD chip with respect to the imaging lens is performed between a lens holder holding the imaging lens and a substrate provided with the CCD chip. In positioning with such a substrate, high-precision positioning accuracy cannot be obtained even by using the end face, the positioning hole, and the like, and the distance between the imaging lens and the CCD chip is reduced to reduce the size of the device in the distance direction. Is possible, but CC
If the D chip is misaligned, the effective image circle of the imaging lens deviates from the effective pixel area of the CCD chip.
There is a problem that an image at a position where the image height is high, that is, an outermost image is not formed on the effective pixel area of the CCD chip, and a good image cannot be obtained. In particular, when a sheet-like substrate such as an FPC is used, it is very difficult to secure desired positioning accuracy because the substrate itself is thin and soft.

On the other hand, even when the position of the CCD chip is displaced, the effective image circle formed on the image pickup lens must be within the effective pixel area of the CCD chip. Although it is conceivable to increase the effective image circle of the imaging lens, distortion and aberration increase due to the lens structure, and a good image cannot be obtained due to such distortion and aberration. In order to increase the effective image circle of the imaging lens while suppressing aberrations and aberrations, it is necessary to increase the aperture of the imaging lens, and if an imaging lens having a large aperture is used, the apparatus becomes large and the apparatus becomes heavy And so on.

In the conventional imaging apparatus, a substrate located between a lens holder and a CCD chip extends in the left-right direction, and an IC 7, a capacitor 8, a resistor 9, and the like are mounted on each of the extended portions. Although it is configured, miniaturization in the thickness direction is being studied, but miniaturization in the width direction is not studied at all.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and a new image pickup apparatus capable of obtaining a good image with reduced distortion and chromatic aberration while reducing the size of the apparatus. The purpose is to provide.

[0008]

According to a first aspect of the present invention, there is provided an image pickup apparatus comprising: a substrate having an opening formed at an end in a longitudinal direction; and a light receiving surface exposed through the opening to form a back surface of the substrate. A fixed imaging element, a frame body in which the imaging element is disposed and fixed to the back surface of the substrate, an imaging lens disposed on the front side of the substrate, and the substrate By contacting the lens barrel having a leg extending to the back surface outside the end of the lens unit with the leg and the frame, the effective image circle of the imaging lens and the light receiving surface are adjusted to a predetermined position. Is provided.

According to a second aspect of the present invention, in the image pickup apparatus, the connecting means for connecting the frame and the leg is made of an adhesive.

According to a third aspect of the present invention, there is provided an image pickup apparatus comprising: a substrate having an opening formed at an end in a longitudinal direction; and an image pickup element having a light receiving surface exposed through the opening and fixed to a back surface of the substrate. A frame fixed to the rear surface of the substrate with the image sensor disposed therein, an imaging lens disposed on the front surface of the substrate, and a lens barrel having legs for supporting the imaging lens; By locking the leg and the frame outside the end of the substrate, an effective image circle of the imaging lens and the light receiving surface are positioned at a predetermined relative position with locking means. It is provided with.

According to a fourth aspect of the present invention, in the imaging device, the locking means has a projection and a hole on the leg and the frame, respectively, or a hole and a projection on the leg and the frame, respectively. Part is provided.

According to a fifth aspect of the present invention, there is provided an image pickup apparatus, wherein an opening is formed at an end in a longitudinal direction, lands provided on both sides of the opening, and a wiring pattern connected to these lands. And an image sensor having an input / output terminal fixed to the back surface of the substrate so that a light receiving surface is exposed through the opening, and having an input / output terminal electrically connected to the land portion. And a frame fixed to the rear surface of the substrate, an imaging lens disposed on the front surface side of the substrate, a lens barrel having legs supporting the imaging lens, and an outer side of an end of the substrate. Means are provided so that the leg portion and the frame are brought into contact with each other so that the effective image circle of the imaging lens and the light receiving surface are at predetermined relative positions.

According to a sixth aspect of the present invention, in the image pickup apparatus, chip components such as a capacitor, a resistor, and a signal processing IC are arranged in a circuit wiring portion provided on the substrate.

According to a seventh aspect of the present invention, the image pickup device and the frame on the rear surface side of the substrate are resin-sealed.

According to an eighth aspect of the present invention, in the imaging device, the substrate is a film substrate.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, Embodiment 1 of the present invention. Will be described with reference to FIGS. FIG. 1 shows a first embodiment of the present invention. And FIG. 2 is an exploded configuration diagram partially showing the imaging device shown in FIG. 1 and 2, reference numeral 1 denotes an imaging lens, 2 denotes a lens barrel that supports the imaging lens 1, and 3 denotes a lens unit configured integrally with the lens barrel 2 for fixing a mirror unit 2 to a substrate or the like. The legs 4, 4 are substrates, 5 is an opening formed at the end of the substrate 4, 6 is an image sensor mounted face down on the substrate 4, and 7 is an image sensor 6 exposed at the opening 5 of the substrate 4.
Reference numeral 8 denotes a positioning frame (hereinafter, referred to as a frame) fixed to the back surface of the substrate 4 with the image sensor 6 disposed therein. Reference numeral 9 denotes the image sensor 6 and the frame 8 sealed therein. It is a sealing member made of resin or the like. As shown in FIG.
The light 10 condensed by the light reaches the light receiving surface 7 of the image sensor 6 through the opening 5 of the substrate 4. Light receiving surface 7 of image sensor 6
An effective image circle 11 is formed by the image pickup lens 1 on the image.

Reference numeral 12 denotes a conductive material called a bump, reference numerals 13 to 17 denote connection means such as an adhesive, and reference numeral 18 denotes a substrate 4
, A capacitor, a resistor,
A circuit wiring unit (hereinafter, chip component mounting unit) for mounting chip components such as a signal processing IC, and the chip component mounting unit 18 has an integrated circuit chip (not shown) for driving the image sensor 6 and performing signal processing. An IC chip 19, a capacitor 20, a resistor 21, and the like are mounted. As shown in FIG. 1, the image sensor 6 is fixed to the back surface of the substrate 4 by an adhesive 13 and is electrically connected to the substrate 4 by bumps 12. Further, the frame 8 is fixed to the substrate 4 by the adhesive 14.
It is fixed to the back of.

Here, the frame 8 will be described in detail.
The frame 8 positions the image pickup lens 1 and the image pickup device 6 to position the effective image circle 11 formed by the image pickup lens 1 and the image pickup device 6.
The light receiving surface 7 is positioned at a predetermined relative position, and is connected to the image sensor 6 and the leg 3 of the lens barrel 2 by adhesives 15 and 16. That is, the frame 8
Is a member that can ensure higher dimensional accuracy than the substrate 4, and the light receiving surface 7 of the image sensor 6 is accurately positioned at a predetermined distance from the outer end surface of the frame 8 connected to the image sensor 6. ing. Then, as shown in FIG. 1, the outer end surface is designed to have a dimension protruding outside the end surface of the substrate 4 when fixed to the back surface of the substrate 4. The position of the imaging lens 1 is determined by the distance from the leg 3 integrally formed with the lens barrel 2. Since the lens barrel 2 is made of a resin material such as plastic, the positioning of the imaging lens 1 can be easily and accurately performed.

Next, the configuration of the lens barrel 2 will be described.
As shown in FIG. 1, the lens barrel 2 has a leg 3 connected to the frame 8 extending from the front surface of the substrate 4 to the rear surface, and the frame 8 fixed to the rear surface of the substrate 4 is connected. It is formed as long as possible. Such legs 3 are formed not only in the longitudinal direction of the substrate 4 but also in the width direction of the substrate 4 as shown in FIG. With such a configuration, when the lens barrel 2 is disposed on the front side of the substrate 4, the legs 3 of the lens barrel 2 are disposed on the rear side of the substrate 4 and fixed to the rear side of the substrate 4. The connection with the frame body 8 can be made. As described above, the imaging lens 1 is accurately positioned by the distance from the leg of the lens barrel 2, and the light receiving surface 7 of the imaging element 6 is also accurately positioned by the distance from the outer end surface of the frame 8. Since the legs 3 of the lens barrel 2 and the frame 8 serving as a reference for such positioning are connected by the adhesive 16, the imaging of the imaging lens 1 is performed regardless of the type of the substrate 4 used. The element 6 can be accurately positioned.

In the image pickup apparatus according to the present embodiment,
Although the leg 3 of the lens barrel 2 and the frame 8 are connected by the adhesive 16, the present invention is not limited to this, and other connecting means may be used to connect the leg 8 of the lens barrel 2 and the leg of the lens barrel 2. 3 can be similarly positioned.

Next, the operation will be described. Imaging lens 1
Converges the light 10 and places the effective image circle 1 on the light receiving surface 7 of the image sensor 6
1 is imaged. The light 10 formed on the light receiving surface 7 is converted into an electric signal by the image sensor 6. The image pickup element 6 has the bump 1
2 and electrically connected to the substrate 4, and an electric signal output from the image sensor 6 is output to the IC chip 19 and the like via the bump 12 and a wiring pattern (described later) formed on the substrate 4. You. As described above, the imaging lens 1 and the imaging element 6 can be accurately positioned regardless of the type of substrate used, and form an effective image circle having a size substantially equal to that of the light receiving surface 7 of the imaging element 6. Even when an imaging lens is used, the effective image circle 11 formed by the imaging lens 1 and the light receiving surface 7 of the imaging element 6 can be set at a predetermined relative position.

That is, when the effective image circle 11 formed by the image pickup lens 1 is approximately the same size as the light receiving surface 7 of the image pickup device 6, a slight displacement between the image pickup lens 1 and the image pickup device 6 causes The effective image circle 11 formed by the image pickup lens 1 is formed at a position shifted from the light receiving surface 7 of the image pickup device 6, but in the image pickup apparatus according to the present embodiment, the substrate 4
Irrespective of the type, the imaging lens 1 and the imaging element 6 can be accurately positioned, so that the imaging lens forms an effective image circle having a size similar to that of the light receiving surface 7 of the imaging element 6 as described above. Is used, the outermost part of the effective image circle 11 formed by the imaging lens 1 can be made to enter the light receiving surface 7 of the imaging element 6, and the distance between the imaging lens 1 and the imaging element 6 can be reduced. The light receiving surface 7 of the image sensor 6 is taken into account in consideration of the displacement.
It is not necessary to use an imaging lens that forms a larger effective image circle, and the apparatus can be reduced in size and the like, and a good image with reduced distortion and chromatic aberration can be obtained.

Next, the substrate 4 and the image pickup device 6 will be described with reference to FIG.
This will be described with reference to FIG. FIG. 3 shows a substrate 4 of the imaging device shown in FIG.
FIG. The imaging device according to the present embodiment includes:
In order to reduce the size of the device, a rectangular substrate long in one direction as shown in FIG. 3 is used. The substrate 4 is desirably a sheet-like substrate or a film-like substrate such as an FPC from the viewpoint of reducing the thickness and weight of the imaging device. An opening 5 corresponding to the imaging area of the light receiving surface 7 of the imaging element 6 is formed at one end in the longitudinal direction, and a chip component mounting portion 18 such as an IC chip 19 is provided on the other side. . With such a configuration, the substrate space in the periphery of the opening 5 can be made large enough to fix the frame 8, and the size of the imaging device in the periphery of the imaging lens 1 is reduced by the imaging device 6. Can be approximated.

For example, in the case of the device configuration as in the prior art, since electronic components such as an IC chip are arranged on both sides of the substrate with the image pickup device interposed therebetween, the size of the periphery of the image pickup lens is smaller than that of the image pickup device. According to the imaging apparatus of the present embodiment, the size at the periphery of the imaging lens 1 can be made to be close to the size of the imaging element 6, and the size of the electronic device is small. When an imaging device is incorporated in a camera, the degree of freedom of the arrangement location can be greatly improved, and an imaging device suitable for a small electronic device or the like can be obtained.

FIG. 4 is a configuration diagram showing a specific configuration example of such a substrate 4 and an image sensor 6. FIG. 4A is a specific configuration diagram of the imaging element 6, in which input / output terminals are provided on both sides of the light receiving surface 7. FIG. 4B is a specific configuration diagram of the substrate 4, and lands 23 are provided on both sides of the opening 5. A wiring pattern 24 as shown in FIG. 4B is connected to the land portion 23 and is connected to an IC chip (not shown) provided on the other side in the longitudinal direction of the substrate 4. FIG. 4C is a configuration diagram showing a state in which the image sensor 6 is fixed to the back surface of the substrate 4, and the input / output terminals 22 of the image sensor 6 are electrically connected to the lands 23 of the substrate 4 via the bumps 12. Have been.

As described above, according to the image pickup apparatus of the present embodiment, the frame 8 in which the image pickup device 6 is disposed is fixed to the back surface of the substrate 4, and the frame 8 and the front side of the substrate 4 Since the leg 3 of the lens barrel 2 extending to the back side is connected by the connection means 16, positioning between the imaging lens 1 and the imaging element 6 when a sheet-like substrate or a film-like substrate such as an FPC is used. Can be done exactly,
Even when an imaging lens for forming an effective image circle having the same size as the light receiving surface 7 of the imaging element 6 is used, the effective image circle 11 formed by the imaging lens 1 and the light receiving surface 7 of the imaging element 6 Can be set at a predetermined relative position, and the size of the apparatus can be reduced, while a good image with reduced distortion and chromatic aberration can be obtained. In the present embodiment, the case where the substrate 4 is a long rectangular substrate has been described as an example. However, the mounting portion of the imaging element 6 is kept as small as possible in chip size, and the frame 8 and the lens barrel 2 are integrally formed. The shape is not limited as long as it is a structure that can abut the leg 3 that has been made.

Embodiment 2 FIG. Next, Embodiment 2 of the present invention. Will be described with reference to FIG. In the imaging apparatus according to the above-described embodiment, the imaging lens 1 is positioned based on the distance from the leg 3 of the lens barrel 2, the imaging element 6 is positioned based on the distance from the outer surface of the frame 8, and these positioning standards are used. The leg 3 of the lens barrel 2 and the frame 8 are connected by the connecting means 16 to position the imaging lens 1 and the imaging element 6, but the imaging device according to the present embodiment is The imaging lens 1 and the imaging element 6 are positioned by the locking of the locking means provided on the lens barrel 3 and the frame 8.

FIG. 5 shows a second embodiment of the present invention. 1 is a cross-sectional configuration diagram illustrating an imaging device according to the first embodiment. 5, reference numeral 25 denotes a projection such as a positioning pin provided on the leg 3 of the lens barrel 2, 26 denotes a hole provided in the frame 8, and 27 denotes a position corresponding to the hole 26 of the frame 8. The projection 25 and the hole 26 constitute locking means. In the imaging device according to the present embodiment,
The imaging lens 1 is positioned by a distance from a projection 25 provided on the leg 3 of the lens barrel 2.
Since the projection 25 is positioned by the distance from the hole 26 of the frame 8 into which the projection 25 is inserted, these distances are set in advance.
By performing adjustment so as to be a predetermined relative position, accurate positioning between the imaging lens 1 and the imaging element 6 is realized. In the drawings, the same reference numerals indicate the same or corresponding parts,
A detailed description of these will be omitted.

In the image pickup apparatus according to the present embodiment, when the lens barrel 2 is disposed on the front surface side of the substrate 4, the projections 25 provided on the lower surface of the leg 3 correspond to the corresponding holes of the frame 8 and the substrate 4. The lens barrel 2 is inserted into the portion 26 to lock the lens barrel 2 and the frame 8. The projections 25 inserted into the holes 25 and 26 may be fixed by an adhesive as needed. Thereby, regardless of the type of the substrate 4, the imaging lens 1 and the imaging element 6 can be accurately positioned, and even when the effective image circle of the imaging lens 1 is approximately the same size as the imaging element 6, 1, the effective image circle 11 and the light receiving surface 7 of the image sensor 6 can be set at a predetermined relative position.

As described above, according to the imaging apparatus of the present embodiment, the locking means 25 provided on the frame 8 and the lens barrel 2,
Since the lens barrel 2 disposed on the front surface side of the substrate 4 and the frame 8 fixed to the back surface of the substrate 4 are locked by 26 and 27, a sheet-like substrate such as FPC or a film-like substrate is used. In this case, the positioning between the imaging lens 1 and the imaging element 6 can be accurately performed, and the imaging element 6
The effective image circle 1 formed by the imaging lens 1 is also used when an imaging lens that forms an effective image circle having the same size as that of the imaging lens 1 is used.
1 and the light receiving surface 7 of the image sensor 6 can be set at a predetermined relative position, and the device can be miniaturized similarly to the image pickup device according to the above-described embodiment, but distortion and chromatic aberration are suppressed. Good images can be obtained.

Embodiment 3 Next, Embodiment 3 of the present invention. Will be described with reference to FIG. The imaging device according to the above embodiment is provided with a projection 25 such as a positioning pin on the leg 3 of the lens barrel 2, and with holes 26 and 27 corresponding to the projection 25 on the frame 8 and the substrate 4. However, the configuration may be reversed. In the imaging device according to the present embodiment, a projection such as a positioning pin is provided on the frame 8, and a hole corresponding to the projection is provided on the leg 3 of the lens barrel 2. FIG. 6 shows a third embodiment of the present invention. FIG. 7 is a cross-sectional configuration diagram illustrating an imaging device according to the first embodiment.
Reference numeral 28 denotes a protrusion such as a positioning pin provided on the frame 8;
9 is a hole provided in the leg 3 of the lens barrel 2. In addition,
In the drawings, the same reference numerals denote the same or corresponding parts, and a detailed description thereof will be omitted.

In the image pickup apparatus according to the present embodiment, the image pickup device 6 is positioned by a distance from the protrusion 28 provided on the frame 8, and the image pickup lens 1 is a lens barrel into which the protrusion 28 is inserted. Since the positioning is performed based on the distance from the second hole portion 29, the distance between the imaging lens 1 and the imaging element 6 is accurately adjusted by adjusting these distances in advance so as to be a predetermined relative position. The projection 28 and the hole 29 constitute locking means.

As described above, according to the imaging apparatus of the present embodiment, the locking means 28 provided on the frame 8 and the lens barrel 2,
Since the lens barrel 2 disposed on the front side of the substrate 4 and the frame 8 fixed to the back surface of the substrate 4 are locked by 29, F
When a sheet-like substrate or a film-like substrate such as a PC is used, the positioning between the imaging lens 1 and the imaging device 6 can be accurately performed, and an effective image circle having the same size as the imaging device 6 is formed. Even when an imaging lens that forms an image is used, the effective image circle 11 formed by the imaging lens 1 and the light receiving surface 7 of the imaging element 6 can be set at a predetermined relative position. As in the case of the imaging device, the size of the device can be reduced, and a good image with reduced distortion and chromatic aberration can be obtained.

[0034]

As described above, according to the present invention, the lens barrel supporting the imaging lens disposed on the front surface side of the substrate and the frame body having the imaging element disposed inside and fixed to the back surface of the substrate. Are configured to be connected or locked by connecting means or locking means provided on the lens barrel and the frame body,
While the size of the apparatus can be reduced, a good image with reduced distortion and chromatic aberration can be obtained.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention. 1 is a cross-sectional configuration diagram illustrating an imaging device according to the first embodiment.

FIG. 2 is an exploded configuration diagram of the imaging device shown in FIG.

FIG. 3 is a perspective view showing a substrate of the imaging device shown in FIG. 1 and an imaging element fixed to the back surface of the substrate.

FIG. 4 is a configuration diagram illustrating a specific configuration example of an image sensor and a substrate illustrated in FIG. 3;

FIG. 5 is a second embodiment of the present invention. 1 is a cross-sectional configuration diagram illustrating an imaging device according to the first embodiment.

FIG. 6 shows a third embodiment of the present invention. 1 is a cross-sectional configuration diagram illustrating an imaging device according to the first embodiment.

[Explanation of symbols]

1 imaging lens, 2 lens barrel, 3 legs, 4 substrate, 5
Aperture, 6 image sensor, 7 light receiving surface, 8 frame, 9
Sealing means, 10 effective image circle, 11 bumps (conductive material), 15 connection means, 19 IC chip, 22 input / output terminals, 23 lands, 24 wiring patterns, 25,
28 protrusion, 26, 29 hole, 25, 26 or 2
8,29 locking means.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Tadashi Minobe, 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Nobuo Ueda 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Rishi Electric Co., Ltd. F-term (reference) 2H044 AC01 AE01 AE06 5C022 AC42 AC54 AC70 AC78

Claims (8)

[Claims] 1. A substrate having an opening formed at an end in a longitudinal direction, an image sensor fixed to a back surface of the substrate with a light receiving surface exposed through the opening, and the image sensor arranged inside. A frame fixed to the back surface of the substrate, an imaging lens disposed on the front surface side of the substrate, and a leg supporting the imaging lens and extending to the rear surface outside the end of the substrate. The effective barrel of the imaging lens, the effective image circle of the imaging lens, and the light receiving surface are arranged at a predetermined relative position by abutting the leg portion and the frame. Imaging device. 2. The imaging device according to claim 1, wherein the connecting means between the frame and the leg is an adhesive. 3. A substrate having an opening formed at an end in a longitudinal direction, an image pickup device having a light receiving surface exposed through the opening and fixed to the back surface of the substrate, and the image pickup device disposed inside. A frame fixed to the back surface of the substrate, an imaging lens disposed on the front side of the substrate, a lens barrel having legs supporting the imaging lens, and an outer side of an end of the substrate. An image pickup device comprising: a locking unit that locks a leg and the frame so that an effective image circle of the imaging lens and the light receiving surface are at a predetermined relative position. apparatus. 4. The locking means, wherein the leg and the frame are provided with a projection and a hole, respectively, or the leg and the frame are provided with a hole and a projection respectively. The imaging device according to claim 3. 5. A substrate having an opening at an end in the longitudinal direction, a substrate having lands disposed on both sides of the opening, and a wiring pattern connected to the lands; An image sensor having an input / output terminal electrically connected to the land portion, the image sensor being fixed to the back surface of the substrate so that the light receiving surface is exposed, and the image sensor being arranged inside and being fixed to the back surface of the substrate. Frame, an imaging lens disposed on the front side of the substrate, a lens barrel having legs supporting the imaging lens, and the legs and the frame outside the end of the substrate. An imaging apparatus, wherein an effective image circle of the imaging lens and the light receiving surface are configured to be in a predetermined relative position by being in contact with each other. 6. A circuit wiring portion provided on the substrate,
The imaging device according to claim 3, wherein chip components such as a capacitor, a resistor, and a signal processing IC are arranged. 7. The image pickup device and the frame on the back side of the substrate are resin-sealed.
7. The imaging device according to any one of claims 1 to 6. 8. The imaging device according to claim 1, wherein said substrate is a film-shaped substrate.