JP3493234B2 - ポリマーフィルムの構造化プロセス - Google Patents
ポリマーフィルムの構造化プロセスInfo
- Publication number
- JP3493234B2 JP3493234B2 JP31562794A JP31562794A JP3493234B2 JP 3493234 B2 JP3493234 B2 JP 3493234B2 JP 31562794 A JP31562794 A JP 31562794A JP 31562794 A JP31562794 A JP 31562794A JP 3493234 B2 JP3493234 B2 JP 3493234B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer film
- container
- gas
- plasma
- erosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 96
- 229920006254 polymer film Polymers 0.000 title claims description 126
- 230000008569 process Effects 0.000 title claims description 89
- 239000000203 mixture Substances 0.000 claims abstract description 48
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- 230000003628 erosive effect Effects 0.000 claims description 86
- 238000005530 etching Methods 0.000 claims description 18
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 13
- 238000013021 overheating Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- WURBVZBTWMNKQT-UHFFFAOYSA-N 1-(4-chlorophenoxy)-3,3-dimethyl-1-(1,2,4-triazol-1-yl)butan-2-one Chemical compound C1=NC=NN1C(C(=O)C(C)(C)C)OC1=CC=C(Cl)C=C1 WURBVZBTWMNKQT-UHFFFAOYSA-N 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 238000004886 process control Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 17
- 239000011888 foil Substances 0.000 abstract description 7
- 238000009827 uniform distribution Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 101
- 239000010408 film Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- 230000005284 excitation Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
- B29C2037/903—Measuring, controlling or regulating by means of a computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH348693 | 1993-11-23 | ||
| CH03486/93-7 | 1993-11-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH083339A JPH083339A (ja) | 1996-01-09 |
| JP3493234B2 true JP3493234B2 (ja) | 2004-02-03 |
Family
ID=4257036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31562794A Expired - Fee Related JP3493234B2 (ja) | 1993-11-23 | 1994-11-24 | ポリマーフィルムの構造化プロセス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5746929A (OSRAM) |
| EP (1) | EP0658416B1 (OSRAM) |
| JP (1) | JP3493234B2 (OSRAM) |
| AT (1) | ATE199072T1 (OSRAM) |
| CA (1) | CA2136361C (OSRAM) |
| DE (1) | DE59409654D1 (OSRAM) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2751665B1 (fr) * | 1996-07-23 | 1998-09-04 | Air Liquide | Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface |
| FR2751664B1 (fr) * | 1996-07-23 | 1998-09-04 | Air Liquide | Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface d'un substrat solide en defilement |
| AU2002229042A1 (en) * | 2000-12-12 | 2002-06-24 | Shri Diksha Corporation | Lightweight circuit board with conductive constraining cores |
| US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
| US20040258885A1 (en) * | 2002-09-05 | 2004-12-23 | Kreutter Nathan P. | Etched dielectric film in microfluidic devices |
| WO2006024009A2 (en) * | 2004-08-24 | 2006-03-02 | C-Core Technologies, Inc. | Edge plated printed wiring boards |
| US7301105B2 (en) * | 2004-08-27 | 2007-11-27 | Stablcor, Inc. | Printed wiring boards possessing regions with different coefficients of thermal expansion |
| KR20070112274A (ko) * | 2005-03-15 | 2007-11-22 | 씨-코어 테크놀로지즈, 인코포레이티드 | 인쇄배선기판 내에 억제 코어 재료를 구성하는 방법 |
| USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
| WO2008008552A2 (en) * | 2006-07-14 | 2008-01-17 | Stablcor, Inc. | Build-up printed wiring board substrate having a core layer that is part of a circuit |
| US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
| PH12022550412A1 (en) * | 2019-08-24 | 2024-04-22 | Lohia Corp Ltd | A process and an apparatus for bag formation |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4209356A (en) * | 1978-10-18 | 1980-06-24 | General Electric Company | Selective etching of polymeric materials embodying silicones via reactor plasmas |
| JPS5925227A (ja) * | 1982-08-02 | 1984-02-09 | Hitachi Ltd | プラズマエツチング装置 |
| AU544534B2 (en) * | 1983-06-14 | 1985-06-06 | Toyota Jidosha Kabushiki Kaisha | Plasma coating |
| US4445966A (en) * | 1983-06-20 | 1984-05-01 | Honeywell Inc. | Method of plasma etching of films containing chromium |
| WO1985004121A1 (fr) * | 1984-03-12 | 1985-09-26 | Commissariat A L'energie Atomique | Traitement de surface d'une piece et utilisation de ce traitement pour ameliorer l'adherence d'un revetement depose ensuite sur la piece, notamment par projection a chaud |
| JPS61268730A (ja) * | 1985-05-22 | 1986-11-28 | Mazda Motor Corp | プラズマ処理装置 |
| JPS6250335A (ja) * | 1985-08-29 | 1987-03-05 | Toyoda Gosei Co Ltd | プラズマ処理装置 |
| JPS6289736A (ja) * | 1985-10-15 | 1987-04-24 | Daihatsu Motor Co Ltd | プラズマ処理装置 |
| JPS6399243A (ja) * | 1986-10-15 | 1988-04-30 | Mazda Motor Corp | プラズマ処理装置 |
| US5215619A (en) * | 1986-12-19 | 1993-06-01 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
| KR970003885B1 (ko) * | 1987-12-25 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 에칭 방법 및 그 장치 |
| US4971651A (en) * | 1990-02-05 | 1990-11-20 | Hitachi, Ltd. | Microwave plasma processing method and apparatus |
| DE4232998A1 (de) * | 1992-10-01 | 1994-04-07 | Basf Ag | Verfahren zur Oberflächenbehandlung von Kunststoffteilen |
| US5372673A (en) * | 1993-01-25 | 1994-12-13 | Motorola, Inc. | Method for processing a layer of material while using insitu monitoring and control |
-
1994
- 1994-11-02 AT AT94810634T patent/ATE199072T1/de not_active IP Right Cessation
- 1994-11-02 EP EP94810634A patent/EP0658416B1/de not_active Expired - Lifetime
- 1994-11-02 DE DE59409654T patent/DE59409654D1/de not_active Expired - Lifetime
- 1994-11-22 CA CA002136361A patent/CA2136361C/en not_active Expired - Fee Related
- 1994-11-24 JP JP31562794A patent/JP3493234B2/ja not_active Expired - Fee Related
-
1997
- 1997-08-18 US US08/912,537 patent/US5746929A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0658416A3 (OSRAM) | 1995-07-26 |
| DE59409654D1 (de) | 2001-03-15 |
| US5746929A (en) | 1998-05-05 |
| EP0658416B1 (de) | 2001-02-07 |
| ATE199072T1 (de) | 2001-02-15 |
| JPH083339A (ja) | 1996-01-09 |
| CA2136361A1 (en) | 1995-05-24 |
| EP0658416A2 (de) | 1995-06-21 |
| CA2136361C (en) | 2005-11-15 |
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