JP3387322B2 - Electronics - Google Patents
ElectronicsInfo
- Publication number
- JP3387322B2 JP3387322B2 JP22487896A JP22487896A JP3387322B2 JP 3387322 B2 JP3387322 B2 JP 3387322B2 JP 22487896 A JP22487896 A JP 22487896A JP 22487896 A JP22487896 A JP 22487896A JP 3387322 B2 JP3387322 B2 JP 3387322B2
- Authority
- JP
- Japan
- Prior art keywords
- leg
- hole
- electronic device
- frame
- leg portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント基板上に装
着される枠体を有する電子機器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a frame body mounted on a printed circuit board.
【０００２】[0002]
【従来の技術】以下、従来の電子機器について説明す
る。2. Description of the Related Art A conventional electronic device will be described below.
【０００３】従来の電子機器は、図６に示すように、プ
リント基板１上に四角形をした枠体２が装着されるもの
であった。図６において１はプリント基板であり２は枠
体である。そして、３はこの枠体２の下端に設けられた
脚部である。４はプリント基板１上に設けられた孔であ
り、この孔４に前記脚部３が挿入されてその裏で半田固
定されるものである。In a conventional electronic device, as shown in FIG. 6, a rectangular frame body 2 is mounted on a printed circuit board 1. In FIG. 6, 1 is a printed circuit board and 2 is a frame. 3 is a leg portion provided at the lower end of the frame body 2. Reference numeral 4 denotes a hole provided on the printed circuit board 1. The leg portion 3 is inserted into the hole 4 and fixed by soldering on the back side thereof.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の構成では、枠体２は長方四辺形となってお
り、この枠体２は、弾性を有する金属で形成されている
ため、図７にその上面図を示すように枠体２の長辺２ａ
と、この長辺２ａに接する短辺２ｂが接するわけである
が、この短辺２ｂは弾性を有するために隙間５ができて
しまう。従って、この隙間５を押さえて、きちんとした
長方形にしながらプリント基板１の孔４に脚部３を挿入
することは非常に困難であった。However, in such a conventional structure, the frame body 2 has a rectangular shape, and the frame body 2 is formed of a metal having elasticity. 7, the long side 2a of the frame 2 as shown in the top view
Then, the short side 2b that is in contact with the long side 2a is in contact, but since the short side 2b has elasticity, a gap 5 is formed. Therefore, it is very difficult to insert the leg portion 3 into the hole 4 of the printed board 1 while pressing the gap 5 to form a neat rectangle.
【０００５】本発明は、このような問題点を解決するも
のでプリント基板に装着し易い枠体を有する電子機器を
提供することを目的としたものである。An object of the present invention is to solve the above problems and to provide an electronic device having a frame body that can be easily mounted on a printed circuit board.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に本発明の電子機器は、電子部品が挿入されたプリント
基板と、このプリント基板に装着された枠体とから成
り、前記プリント基板は、前記枠体の下端に設けられた
脚部が挿入される孔と、この孔の周辺に設けられた銅箔
部を有し、前記枠体は、弾性を有する導電性の金属で形
成されると共にその一部が重合する重合部を有し、この
重合部の内側に重合される面とこの面に隣接する面との
曲げ部の刻印は、他の面に形成される曲げ部の刻印より
浅くし、前記枠体に設けられた前記脚部はプリント基板
に設けられた銅箔部と半田付けされる構成としたもので
ある。In order to achieve this object, an electronic apparatus of the present invention comprises a printed board on which electronic components are inserted and a frame mounted on the printed board. , A hole provided at a lower end of the frame body into which a leg portion is inserted and a copper foil portion provided around the hole, and the frame body is formed of a conductive metal having elasticity. With a part of which is polymerized with this,
Between the surface to be superposed inside the superposed part and the surface adjacent to this surface
The marking of the bent part is more than the marking of the bent part formed on the other surface.
It is made shallow, and the leg portions provided on the frame body are configured to be soldered to the copper foil portions provided on the printed circuit board.
【０００７】これにより、前記枠体のプリント基板への
装着は非常に容易になる。This makes it very easy to mount the frame body on the printed circuit board.
【０００８】[0008]
【発明の実施の形態】本発明の請求項１に記載の発明
は、電子部品が挿入されたプリント基板と、このプリン
ト基板に装着された枠体とから成り、前記プリント基板
は、前記枠体の下端に設けられた脚部が挿入される孔
と、この孔の周辺に設けられた銅箔部を有し、前記枠体
は、弾性を有する導電性の金属で形成されると共に、そ
の一部が重合する重合部を有し、この重合部の内側に重
合される面とこの面に隣接する面との曲げ部の刻印は、
他の面に形成される曲げ部の刻印より浅くし、前記枠体
に設けられた前記脚部はプリント基板に設けられた銅箔
部と半田付けされる電子機器であり、前記枠体は、前記
重合部に係止することができるので、前記枠体のプリン
ト基板への装着は非常に容易となる。また、重合部の内
側に重合される面は、他に比べて弾性効果が働くので、
重合部はより強固に重合され、さらに挿入が容易とな
る。 BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention comprises a printed board on which electronic components are inserted and a frame mounted on the printed board, wherein the printed board is the frame. Has a hole into which a leg portion provided at the lower end of the hole is inserted and a copper foil portion provided around the hole, and the frame body is formed of a conductive metal having elasticity and Part has a polymerized part that overlaps, and
The marking of the bend between the mating surface and the surface adjacent to this surface is
It is shallower than the marking of the bent portion formed on the other surface, the leg portion provided on the frame body is an electronic device to be soldered to a copper foil portion provided on a printed circuit board, and the frame body is Since it can be locked to the overlapping portion, the frame body can be attached to the printed circuit board very easily. Also, within the overlap section
The surface that is superposed on the side has an elastic effect compared to other surfaces, so
The polymerized part is more strongly polymerized, and insertion is easier.
It
【０００９】請求項２に記載の発明は、重合部に各々脚
部を有する請求項１に記載の電子機器であり、この重合
部に設けられた脚部に半田付けをすると、毛細管現象に
より重合部も確実に半田付けされ、電気的なシールドが
より強固となる。The invention according to claim 2 is the electronic apparatus according to claim 1, wherein each of the overlapping portions has a leg portion, and when the legs provided in the overlapping portion are soldered, they are polymerized by a capillary phenomenon. The parts are also soldered securely, and the electrical shield becomes stronger.
【００１０】請求項３に記載の発明は、重合部に設けら
れた脚部は平坦にするとともに、重合部以外に設けられ
た脚部には凸部を有する請求項２に記載の電子機器であ
り、このことによりプリント基板に設けられる孔の大き
さは共通化できる。According to a third aspect of the present invention, in the electronic device according to the second aspect, the leg portion provided in the overlapping portion is made flat and the leg portion provided other than the overlapping portion has a convex portion. By this, the size of the holes provided in the printed circuit board can be made common.
【００１１】[0011]
【００１２】請求項４に記載の発明は、四面を有する直
方体であって、その対向する長辺には、直方体の中心を
対称点として短辺からそれぞれ長辺の略４分の１の距離
の長辺上にそれぞれ１個の脚を設けた請求項３に記載の
電子機器である。このように脚部を配設することによ
り、パターン設計の自由度が大きくなるとともにバラン
スのとれた取り付け強度が得られる。According to a fourth aspect of the present invention, there is provided a rectangular parallelepiped having four faces, and the long sides facing each other are separated from the short side by a distance of about a quarter of the long side with the center of the rectangular parallelepiped as a symmetry point. The electronic device according to claim 3 , wherein one leg is provided on each of the long sides. By arranging the legs in this way, the degree of freedom in pattern design is increased and a well-balanced mounting strength is obtained.
【００１３】請求項５に記載の発明は、外側に重合され
る面に形成される脚部の脚巾は内側に重合される脚部の
脚幅より狭くした請求項３に記載の電子機器であり、重
合が多少ずれたとしても角孔に容易に挿入できるととも
に、枠体の四辺形の矯正ができる。According to a fifth aspect of the present invention, in the electronic device according to the third aspect , the leg width of the leg portion formed on the surface overlapped on the outside is narrower than the leg width of the leg portion overlapped on the inside. Even if the polymerization is slightly deviated, it can be easily inserted into the square hole and the quadrilateral of the frame can be corrected.
【００１４】請求項６に記載の発明は、外側に重合され
る面に凹部あるいは孔を設けると共に内側に重合される
面には前記凹部あるいは前記孔に嵌合する凸部を設けた
請求項３に記載の電子機器であり、この嵌合により枠体
の形状が崩れ難くなるとともに、プリント基板の角孔に
容易に挿入できる。[0014] claimed invention according to claim 6, claim on the surface to be polymerized inside provided with a recess or hole in the surface to be polymerized outside provided with a convex portion to be fitted into the recess or the hole 3 According to the electronic device described in (1), the fitting makes it difficult for the shape of the frame to collapse, and can be easily inserted into the square hole of the printed circuit board.
【００１５】以下、本発明の実施の形態について図１か
ら図５を用いて説明する。図１は本発明の電子機器の斜
視図である。図１において１１はプリント基板であり、
１２は、このプリント基板１１上に装着される枠体であ
る。また１３ａ，１３ｂ，１３ｃはこの枠体１２の下辺
に設けられた脚部である。この脚部１３ａ，１３ｂ，１
３ｃはプリント基板１１上に設けられた孔１４に挿入さ
れる。このプリント基板１１の裏面であって孔１４の近
傍には接続用の銅箔が設けられている。An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. FIG. 1 is a perspective view of an electronic device of the present invention. In FIG. 1, 11 is a printed circuit board,
A frame 12 is mounted on the printed circuit board 11. Further, 13a, 13b, 13c are leg portions provided on the lower side of the frame body 12. These legs 13a, 13b, 1
3c is inserted into a hole 14 provided on the printed board 11. A copper foil for connection is provided on the back surface of the printed board 11 near the hole 14.
【００１６】また、この枠体１２は直方体をしており、
この短辺の一辺には重合部１５が設けられている。この
重合部１５において重合面１６は外側に重合される面で
あり、面１７は内側に重合される面である。そして外側
に位置する重合面１６の下辺と内側に位置する面１７の
下辺にはそれぞれ脚部１８，１９が設けられている。ま
た、この外側に位置する重合面１６の脚部１８は内側に
位置する面１７の脚部１９の幅より狭くなっている。こ
の事により多少脚部１８，１９の位置がばらついたとし
ても、孔１４に容易に挿入できるとともに、枠体１２の
形状も矯正することができるものである。The frame 12 is a rectangular parallelepiped,
An overlapping portion 15 is provided on one side of this short side. In the overlapping portion 15, the overlapping surface 16 is a surface to be overlapped outward, and the surface 17 is an inside to be overlapped. Further, leg portions 18 and 19 are provided on the lower side of the overlapping surface 16 located on the outer side and the lower side of the surface 17 located on the inner side, respectively. Further, the leg portion 18 of the overlapping surface 16 located on the outside is narrower than the width of the leg portion 19 of the surface 17 located on the inner side. As a result, even if the positions of the legs 18 and 19 are slightly varied, they can be easily inserted into the holes 14 and the shape of the frame 12 can be corrected.
【００１７】図２は枠体１２の展開図である。２０は枠
体１２に設けられた刻印であり、この刻印２０のうち先
ほどの重合部１５の内側に位置する面１７と、それに隣
接する面１２ａとの間の刻印２０ａは他の刻印２０より
も浅くしている。これは刻印２０を浅くすることによ
り、他より弾性を強くして枠体１２の重合部１５が嵌合
したとき、枠体１２の形状を強固に保つためである。FIG. 2 is a development view of the frame body 12. Reference numeral 20 denotes a marking provided on the frame body 12. Among the markings 20, the marking 20a between the surface 17 located inside the overlapping portion 15 and the surface 12a adjacent to it is more marked than the other markings 20. It's shallow. This is because by making the marking 20 shallower, it becomes more elastic than others and the shape of the frame 12 is kept strong when the overlapping portion 15 of the frame 12 is fitted.
【００１８】また脚部１３ａは、枠体１２の長辺１２ａ
の先ほどの重合部１５を有する面１７から長辺１２ａの
４分の１の所に設けている。また脚部１３ｂはもう一方
の端面１７ａから長辺１２ｂの４分の１の所に設けてい
る。そしてこの重合部１５に設けられた脚部１８の幅１
８ａはもう一つの脚部１９の幅１９ａの略半分にしてい
る。ここで、このシールド枠体１２は導電性の金属で形
成すると共にその板厚は０．３mmのものを使用してい
る。The legs 13a are formed by the long sides 12a of the frame body 12.
It is provided at a quarter of the long side 12a from the surface 17 having the overlapping portion 15 of the above. Further, the leg portion 13b is provided one quarter of the long side 12b from the other end surface 17a. And the width 1 of the leg portion 18 provided in the overlapping portion 15
8a is approximately half the width 19a of the other leg 19. Here, the shield frame 12 is formed of a conductive metal and has a plate thickness of 0.3 mm.
【００１９】図３は枠体１２の上面図である。重合部１
５において、外側の重合面１６と内側の重合面１７は、
浅い刻印部２０ａにより外側に弾性力が働くので隙間が
生じない。また脚部１３ａと１３ｂは枠体１２の中心Ａ
を対称点にして設けて、脚部の数を少なくしているの
で、バランスよく装着できるとともに、プリント基板の
パターン設計の自由度が大きくなる。FIG. 3 is a top view of the frame body 12. Overlap part 1
5, the outer overlapping surface 16 and the inner overlapping surface 17 are
Since the shallow engraved portion 20a exerts an elastic force on the outside, no gap is formed. The legs 13a and 13b are located at the center A of the frame 12.
Are provided at symmetrical points and the number of legs is reduced, so that they can be mounted in a well-balanced manner and the degree of freedom in pattern design of the printed circuit board is increased.
【００２０】図４は脚部１３を示し、このように重合部
１５を形成する脚部１８，１９はそれぞれ平坦になって
いる。一方、重合部１５を形成しない他の脚部１３ａ，
１３ｂ，１３ｃにおいては、凸部２１を形成している。
したがって、プリント基板に設けられる孔１４の大きさ
を共通化できる。FIG. 4 shows the leg portion 13, and thus the leg portions 18 and 19 forming the overlapping portion 15 are each flat. On the other hand, other leg portions 13a that do not form the overlapping portion 15
In 13b and 13c, the convex portion 21 is formed.
Therefore, the size of the holes 14 provided in the printed circuit board can be made common.
【００２１】図５は重合部１５を示し、このように外側
に重合される面１６に孔２２を設けると共に内側に重合
される面１７には前記孔２２に嵌合する凸部２３を設け
ている。このことにより枠体１２の形状が崩れ難くプリ
ント基板１２の角孔１４に容易に挿入できる。FIG. 5 shows the overlapped portion 15. The surface 16 to be overlapped on the outside is provided with a hole 22 and the surface 17 to be overlapped on the inside is provided with a convex portion 23 to be fitted into the hole 22. There is. As a result, the shape of the frame 12 does not easily collapse and the frame 12 can be easily inserted into the square hole 14 of the printed board 12.
【００２２】[0022]
【発明の効果】以上のように、本発明によれば、電子部
品が挿入されたプリント基板に装着された枠体は、弾性
を有する導電性の金属で形成されるとともに、その一部
が重合する重合部を有し、この重合部の内側に重合され
る面とこの面に隣接する面との曲げ部の刻印は、他の面
に形成される曲げ部の刻印より浅くした構成としたの
で、枠体のプリント基板への枠体の装着は非常に容易に
なる。As described above, according to the present invention, the frame mounted on the printed circuit board in which the electronic component is inserted is made of a conductive metal having elasticity, and a part of the frame is polymerized. It has a polymerization unit which is polymerized inside the overlapping portion
Marking on the bent surface between the surface that is adjacent to this surface and the surface that is adjacent to this surface
Since the structure is made shallower than the marking of the bent portion formed in the above , the mounting of the frame body on the printed circuit board becomes very easy.
【図１】本発明の一実施の形態による電子機器の要部斜
視図FIG. 1 is a perspective view of an essential part of an electronic device according to an embodiment of the present invention.
【図２】同電子機器に装着される枠体の展開図FIG. 2 is a development view of a frame body attached to the electronic device.
【図３】同枠体の上面図FIG. 3 is a top view of the frame body.
【図４】同枠体の要部平面図FIG. 4 is a plan view of the main part of the frame body.
【図５】同枠体の要部斜視図FIG. 5 is a perspective view of a main part of the frame body.
【図６】従来の電子機器の要部斜視図FIG. 6 is a perspective view of a main part of a conventional electronic device.
【図７】同上面図FIG. 7 is a top view of the same.
１１ プリント基板 １２ 枠体 １３ａ 脚部 １３ｂ 脚部 １３ｃ 脚部 １４ 孔 １５ 重合部 １６ 外側に位置する重合面 １７ 内側に位置する面 １８ 脚部 １９ 脚部 11 printed circuit boards 12 frame 13a legs 13b leg 13c leg 14 holes 15 Overlap 16 Overlapping surface located on the outside 17 Inside surface 18 legs 19 legs
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平３−266499（ＪＰ，Ａ) 特開 昭58−95897（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 9/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-3-266499 (JP, A) JP-A-58-95897 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 9/00
Claims (6)
このプリント基板に装着された枠体とから成り、前記プ
リント基板は、前記枠体の下端に設けられた脚部が挿入
される孔と、この孔の周辺に設けられた銅箔部を有し、
前記枠体は、弾性を有する導電性の金属で形成されると
共にその一部が重合する重合部を有し、この重合部の内
側に重合される面とこの面に隣接する面との曲げ部の刻
印は、他の面に形成される曲げ部の刻印より浅くし、前
記枠体に設けられた前記脚部は前記プリント基板に設け
られた銅箔部と半田付けされる電子機器。1. A printed circuit board having an electronic component inserted therein,
The printed board has a hole to which a leg portion provided at a lower end of the frame is inserted, and a copper foil portion provided around the hole. ,
The frame body is formed of a conductive metal having elasticity and has a polymerized portion in which a part thereof is polymerized .
The indentation of the bend between the surface to be overlapped with the side and the surface adjacent to this surface.
The mark should be shallower than the marking of the bending part formed on the other surface, and
Electronics the leg portion provided on the serial frame is a copper foil portion by soldering provided on the printed circuit board.
記載の電子機器。2. The electronic device according to claim 1, wherein each of the overlapping portions has a leg portion.
ともに、重合部以外に設けられた脚部には凸部を有する
請求項２に記載の電子機器。3. The electronic device according to claim 2, wherein the leg portion provided in the overlapping portion is made flat and the leg portion provided other than the overlapping portion has a convex portion.
する長辺には、直方体の中心を対称点として短辺からそ
れぞれ長辺の略４分の１の距離の長辺上にそれぞれ１個
の脚部を設けた請求項３に記載の電子機器。 4. A rectangular parallelepiped having four faces, which faces each other.
On the long side of the
One on each long side at a distance of approximately one quarter of the long side
The electronic device according to claim 3, wherein the leg portion is provided.
脚幅は内側に重合される脚部の脚幅より狭くした請求項
３に記載の電子機器。 5. A leg formed on a surface to be superposed on the outside.
The leg width is made narrower than the leg width of the legs overlapped inward.
The electronic device according to item 3.
設けると共に、内側に重合される面には前記凹部あるい
は前記孔に嵌合する凸部を設けた請求項３に記載の電子
機器。 6. A recess or a hole is formed on the surface to be polymerized to the outside.
The surface to be overlapped inward with the recess is provided.
The electron according to claim 3, wherein a protrusion is provided to fit into the hole.
machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22487896A JP3387322B2 (en) | 1996-08-27 | 1996-08-27 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22487896A JP3387322B2 (en) | 1996-08-27 | 1996-08-27 | Electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1070349A JPH1070349A (en) | 1998-03-10 |
| JP3387322B2 true JP3387322B2 (en) | 2003-03-17 |
Family
ID=16820591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22487896A Expired - Fee Related JP3387322B2 (en) | 1996-08-27 | 1996-08-27 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3387322B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11330766A (en) * | 1998-05-11 | 1999-11-30 | Alps Electric Co Ltd | Electronic equipment |
-
1996
- 1996-08-27 JP JP22487896A patent/JP3387322B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1070349A (en) | 1998-03-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2151411A (en) | A case for an electronic device | |
| GB2261998A (en) | Shield device for printed circuit boards | |
| JP2004319381A (en) | Grounding terminal | |
| JP3387322B2 (en) | Electronics | |
| JP3062909U (en) | Tuner unit | |
| JP3870769B2 (en) | Connector mounting structure | |
| JP3924122B2 (en) | Electronics | |
| JP3303948B2 (en) | Printed wiring board connector | |
| CN215010824U (en) | Circuit board assembly and electronic equipment | |
| WO2023181817A1 (en) | Connector | |
| JPH10341087A (en) | Connection structure of frame and printed circuit board | |
| JP2000077834A (en) | Printed-circuit board | |
| JP2008091776A (en) | Printed board unit, combined printed board unit, method for manufacturing printed board unit, method for manufacturing combined printed board unit, and electronic apparatus | |
| JP3721310B2 (en) | Connecting device for connecting two boards | |
| JPH051909Y2 (en) | ||
| JP3569951B2 (en) | Tuner case | |
| JP3907389B2 (en) | Shield plate | |
| JPH0555596U (en) | Lead shape of shield case for printed wiring board | |
| JPH03129681A (en) | Electronic component for surface mounted | |
| JP2002203620A (en) | Plug | |
| JPH0595059U (en) | Lead frame mounting structure | |
| JPH0244537Y2 (en) | ||
| JPH0343727Y2 (en) | ||
| JPH08130361A (en) | Printed wiring board | |
| JPH11204954A (en) | Electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |