JPH10341087A - Connection structure of frame and printed circuit board - Google Patents
Connection structure of frame and printed circuit boardInfo
- Publication number
- JPH10341087A JPH10341087A JP9152219A JP15221997A JPH10341087A JP H10341087 A JPH10341087 A JP H10341087A JP 9152219 A JP9152219 A JP 9152219A JP 15221997 A JP15221997 A JP 15221997A JP H10341087 A JPH10341087 A JP H10341087A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- circuit board
- printed circuit
- side wall
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、テレビジョンチュ
ーナや、モジュレータなどのように電子回路を構成した
プリント基板を金属板からなる枠体内に配置した構造の
電子機器に適用して好適な枠体とプリント基板との接続
構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus having a structure in which a printed circuit board, such as a television tuner or a modulator, having an electronic circuit is disposed in a metal frame. And a connection structure for a printed circuit board.
【0002】[0002]
【従来の技術】図4は、従来の電子機器の要部を示す斜
視図、図5は、図4の電子機器の組立を説明するための
分解斜視図、図6は、従来の枠体とプリント基板との接
続構造を説明するための要部斜視図、図7は、図6のB
−B線における要部断面図である。図4〜図7に示すよ
うに、金属板からなる矩形の箱形の枠体10は、四方を
囲む側壁10aと、側壁10aによって形成された上方
の開放部10bと下方の開放部10cとを備えている。
側壁10aの下方には、複数個(例えば4個)の切り欠
き部10dが形成されている。また、プリント基板11
は、矩形であって、その表裏面に集積回路やコイルやチ
ップ部品などの電子部品(図示せず)が載置されてお
り、端部には複数個(例えば4個)の外方に突出した凸
部11aを備え、また、端部の所定の箇所に複数個の導
電パターン11bが形成されている。この導電パターン
11bは、枠体10に接地するために設けられている。2. Description of the Related Art FIG. 4 is a perspective view showing a main part of a conventional electronic device, FIG. 5 is an exploded perspective view for explaining the assembly of the electronic device of FIG. 4, and FIG. FIG. 7 is a perspective view of a main part for describing a connection structure with a printed circuit board.
It is principal part sectional drawing in the -B line. As shown in FIGS. 4 to 7, a rectangular box-shaped frame 10 made of a metal plate includes a side wall 10 a surrounding four sides, and an upper opening 10 b and a lower opening 10 c formed by the side wall 10 a. Have.
Below the side wall 10a, a plurality (for example, four) of notches 10d are formed. The printed circuit board 11
Has a rectangular shape, and electronic components (not shown) such as an integrated circuit, a coil, and a chip component are mounted on the front and back surfaces thereof. And a plurality of conductive patterns 11b are formed at predetermined positions on the ends. The conductive pattern 11b is provided to be grounded to the frame 10.
【0003】また、枠体10の側壁10aとプリント基
板11の端面との間には、所定の幅寸法t2の隙間13
(図7参照)が形成され、この隙間13は、枠体10内
にプリント基板11を組み込み易くするために設けられ
ている。そして、このプリント基板11は、枠体10内
に配置されて、そのプリント基板11の端部に形成され
た導電パターン11bと枠体10の側壁10aとは半田
12によって半田付けされて、導電パターン11bは枠
体10に接地されているA gap 13 having a predetermined width t2 is provided between the side wall 10a of the frame 10 and the end face of the printed circuit board 11.
(See FIG. 7). The gap 13 is provided to facilitate the incorporation of the printed board 11 into the frame 10. The printed circuit board 11 is disposed in the frame 10, and the conductive pattern 11 b formed on the end of the printed circuit board 11 and the side wall 10 a of the frame 10 are soldered by the solder 12 to form the conductive pattern. 11b is grounded to the frame 10
【0004】上記電子機器の組立について説明する。ま
ず、プリント基板11を枠体10の下方の開放部10c
から挿入し、プリント基板11の凸部11aを、枠体1
0の切り欠き部10dに係合させてプリント基板11を
枠体10に仮固定する。次に、プリント基板11の端部
の所定の箇所に形成された導電パターン11bにクリー
ム状の半田12を塗布し、このクリーム状の半田12を
塗布した状態で枠体10を加熱炉(図示せず)に通す
と、半田12が熔けて、プリント基板11の導電パター
ン11bと枠体10の側壁10aとが半田付けされる。
このとき、半田12は、枠体10とプリント基板11と
の間の隙間13を介して跨ぐようにして枠体10とプリ
ント基板11とを接続する状態である。[0004] The assembly of the above electronic equipment will be described. First, the printed circuit board 11 is connected to the opening 10 c below the frame 10.
From the frame body 1
The printed circuit board 11 is temporarily fixed to the frame body 10 by engaging with the notch 10d of No. 0. Next, cream-like solder 12 is applied to the conductive pattern 11b formed at a predetermined location at the end of the printed circuit board 11, and the frame 10 is placed in a heating furnace (not shown) with the cream-like solder 12 applied. 2), the solder 12 is melted, and the conductive pattern 11b of the printed circuit board 11 and the side wall 10a of the frame 10 are soldered.
At this time, the solder 12 is in a state of connecting the frame 10 and the printed board 11 so as to straddle through the gap 13 between the frame 10 and the printed board 11.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、従来の
枠体とプリント基板との接続構造では、温度サイクル試
験などで枠体10とプリント基板11との間に熱膨張の
差による伸縮で歪みがX・Y方向(図4参照)に生じ
る。この歪みは、例えばプリント基板11に膨張による
伸びが生じたとき(矢印X1・Y1方向)は、それぞれ
の半田12に押圧力が加えられ、また、収縮による縮み
が生じたとき(矢印X2・Y2方向)は、それぞれの半
田12に引っ張り力が加えられることになる。このプリ
ント基板11の伸縮による半田12への引っ張り力や押
圧力がそれぞれの半田12に加えられると、半田12に
亀裂が入ったり、分断されたりして、枠体10とプリン
ト基板11との接続が破損し、安定しないという問題が
ある。また、従来の枠体とプリント基板との接続構造で
は、枠体10の側壁10aとプリント基板11の上面の
導電パターン11bとの間のみに、半田12が接続され
ており、接続面積が少ないことから、枠体とプリント基
板との機械的な接続が弱いという問題がある。However, in the conventional connection structure between the frame and the printed circuit board, the distortion due to the expansion and contraction due to the difference in thermal expansion between the frame 10 and the printed circuit board 11 in a temperature cycle test or the like causes X. -It occurs in the Y direction (see Fig. 4). For example, when the printed board 11 expands due to expansion (in the directions indicated by arrows X1 and Y1), a pressing force is applied to each solder 12 and when the printed circuit board 11 contracts due to contraction (arrows X2 and Y2). Direction), a tensile force is applied to each solder 12. When a tensile force or a pressing force is applied to the solder 12 due to the expansion and contraction of the printed circuit board 11, the solder 12 is cracked or divided, and the connection between the frame 10 and the printed circuit board 11 is caused. However, there is a problem that it is damaged and is not stable. In the conventional connection structure between the frame and the printed circuit board, the solder 12 is connected only between the side wall 10a of the frame 10 and the conductive pattern 11b on the upper surface of the printed circuit board 11, and the connection area is small. Therefore, there is a problem that the mechanical connection between the frame and the printed circuit board is weak.
【0006】本発明は、上述の問題点に解決を与えるも
ので、その目的は、枠体とプリント基板との接続部分に
歪みなどが生じても、接続部分が破損しない接続構造を
提供することである。An object of the present invention is to provide a connection structure in which the connection portion is not damaged even if the connection portion between the frame and the printed circuit board is distorted. It is.
【0007】[0007]
【課題を解決するための手段】本発明の枠体とプリント
基板との接続構造は、金属板から成り、側壁と該側壁と
一体に形成された舌片とを有する枠体と、該枠体内に配
置されたランド部を有するプリント基板とを備え、前記
舌片は側壁と同一平面上であって、側壁の横方向に延
び、一方の端部が側壁に連設された保持部と、該保持部
の他方の端部と連設され、側壁の内面から枠体内方に傾
斜されて設けられた折り曲げ片と、傾斜された該折り曲
げ片の他方の端部から側壁の縦方向に前記枠体の側壁と
平行に延びて設けられた遊端部とから成り、前記プリン
ト基板のランド部と前記枠体の舌片の遊端部とを半田付
け固定したことである。According to the present invention, there is provided a connection structure between a frame and a printed circuit board according to the present invention, the frame comprising a metal plate and having a side wall and a tongue piece formed integrally with the side wall; A printed circuit board having a land portion disposed on the side surface, wherein the tongue piece is coplanar with the side wall, extends in the lateral direction of the side wall, and has one end portion connected to the side wall; A bent piece which is provided continuously with the other end of the holding portion and is provided to be inclined from the inner surface of the side wall toward the inside of the frame; and the frame body extends in the longitudinal direction of the side wall from the other end of the bent bent piece. The land portion of the printed circuit board and the free end portion of the tongue piece of the frame are fixed by soldering.
【0008】また、本発明の枠体とプリント基板との接
続構造は、プリント基板の前記枠体の舌片の遊端部と対
応する位置に切り欠き部を形成して、該切り欠き部の内
周面に導電パターンを形成したことである。In the connection structure of the frame and the printed board according to the present invention, a notch is formed at a position corresponding to the free end of the tongue of the frame on the printed board, and the notch is formed. That is, a conductive pattern was formed on the inner peripheral surface.
【0009】[0009]
【発明の実施の形態】図1は、本発明の枠体とプリント
基板との接続構造を説明するための要部斜視図、図2
は、図1のA−A線における要部断面図、図3は、本発
明の電子機器に係るプリント基板を説明するための要部
斜視図である。図1〜図3に示すように枠体とプリント
基板との接続構造は、金属板から成り、矩形の箱形の枠
体1と、枠体1の内部に配置されたプリント基板2とを
備えている。枠体1は、四方を囲む側壁1aと、該側壁
1aの上方と下方とに形成された開放部(図示せず)と
を備えている。また、四方の側壁1aのそれぞれの箇所
には、複数個の舌片1bが、打ち抜き、折り曲げして側
壁1aと一体に形成されている。 また、金属板から成
る側壁1aを、打ち抜き、折り曲げして形成された舌片
1bは、側壁1aと同一平面上であって、側壁1aの横
方向に延びて設けられ、一方の端部が側壁に連設された
保持部1cと、該保持部1cの他方の端部と連設され、
側壁1aの内面から枠体内方に傾斜されて設けられた折
り曲げ片1dと、傾斜された該折り曲げ片1dの他方の
端部から側壁1aの縦方向に前記枠体の側壁と平行に延
びて設けられた矩形の遊端部1eとを備えている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of a main part for describing a connection structure between a frame and a printed board according to the present invention.
Is a cross-sectional view of a main part taken along the line AA in FIG. 1, and FIG. 3 is a perspective view of the main part for describing a printed circuit board according to the electronic apparatus of the present invention. As shown in FIGS. 1 to 3, the connection structure between the frame body and the printed board is made of a metal plate, and includes a rectangular box-shaped frame body 1 and a printed board 2 arranged inside the frame body 1. ing. The frame 1 includes a side wall 1a surrounding four sides, and open portions (not shown) formed above and below the side wall 1a. Also, a plurality of tongue pieces 1b are punched out and bent at each part of the four side walls 1a to be formed integrally with the side walls 1a. A tongue piece 1b formed by punching and bending a side wall 1a made of a metal plate is provided on the same plane as the side wall 1a and extends in the lateral direction of the side wall 1a. And a holding portion 1c connected to the other end of the holding portion 1c,
A bent piece 1d is provided to be inclined into the inside of the frame from the inner surface of the side wall 1a. And a rectangular free end 1e.
【0010】また、プリント基板2は、表裏面に例えば
集積回路やコイルやチップ部品などの電子部品(図示せ
ず)がマウントされており、枠体1の舌片1bと対応す
る位置に切り欠き部2aが形成されており、該切り欠き
部2aの内周面2bには、無電解メッキなどで形成され
た半田付け用のランド部2cが形成されている。また、
プリント基板2の表面には、導電パターン2dが形成さ
れており、該導電パターン2dの端部にはランド部2e
が設けられている。そして、プリント基板2の表面のラ
ンド部2eと切り欠き部2aのランド部2cとは接続さ
れている。そして、プリント基板2の切り欠き部2aの
内周面2bに、舌片1bの遊端部1eの下端部が対向し
ている。また、切り欠き部2aと遊端部1eとの間には
所定の幅寸法t1の隙間4が形成されている。また、前
記切り欠き部2aの内周面2bのランド部2cとプリン
ト基板2のランド部2eとに半田3が半田付けされて、
この半田3によって、プリント基板2の切り欠き部2a
に形成されたランド部2cと、前記導電パターン2dの
端部のランド部2eとが舌片1bの遊端部1eと接続す
る。このランド部2cへの半田付けによって、切り欠き
部2aと遊端部1eとが半田3によって接続される。An electronic component (not shown) such as an integrated circuit, a coil, or a chip component is mounted on the front and back surfaces of the printed circuit board 2, and is cut out at a position corresponding to the tongue 1 b of the frame 1. A portion 2a is formed, and a land portion 2c for soldering formed by electroless plating or the like is formed on the inner peripheral surface 2b of the notch portion 2a. Also,
A conductive pattern 2d is formed on the surface of the printed circuit board 2, and a land 2e is formed at an end of the conductive pattern 2d.
Is provided. The land 2e on the surface of the printed circuit board 2 is connected to the land 2c of the cutout 2a. The lower end of the free end 1e of the tongue 1b faces the inner peripheral surface 2b of the cutout 2a of the printed circuit board 2. A gap 4 having a predetermined width t1 is formed between the notch 2a and the free end 1e. The solder 3 is soldered to the land 2c of the inner peripheral surface 2b of the cutout 2a and the land 2e of the printed board 2.
The solder 3 allows the notch 2a of the printed circuit board 2 to be formed.
The land 2c formed at the end of the tongue 1b and the land 2e at the end of the conductive pattern 2d are connected to the free end 1e of the tongue 1b. The notch 2a and the free end 1e are connected by the solder 3 by soldering to the land 2c.
【0011】次に、この枠体とプリント基板との接続構
造の組立について説明する。先ず、枠体1の下方の開放
部(図示せず)からプリント基板2を枠体1に組み込ん
で、枠体1にプリント基板2を仮固定する。この仮固定
の状態のとき、枠体1の舌片1bの遊端部1eは、プリ
ント基板2の切り欠き部2aに対向している。 次に、
遊端部1eと切り欠き部2aとが対向している箇所に形
成されたランド部2cと導電パターン2dの端部のラン
ド部2eとにクリーム状の半田3を塗布し、このクリー
ム状の半田3を塗布した状態で枠体1とプリント基板2
とを加熱炉(図示せず)に通すと、半田3が熔けて、プ
リント基板2と枠体1の舌片1bとが半田付けされる。
このとき切り欠き部2aの内周面2bに形成されたラン
ド部2cにもクリーム状の半田3が付着するので、遊端
部1eの下端部と切り欠き部2aの内周面2bのランド
部2cとが半田付けされる。Next, the assembly of the connection structure between the frame and the printed circuit board will be described. First, the printed board 2 is assembled into the frame 1 from an opening (not shown) below the frame 1, and the printed board 2 is temporarily fixed to the frame 1. In this temporarily fixed state, the free end 1e of the tongue piece 1b of the frame 1 faces the cutout 2a of the printed circuit board 2. next,
A creamy solder 3 is applied to a land 2c formed at a position where the free end 1e and the notch 2a face each other, and a land 2e at the end of the conductive pattern 2d. 3 and the printed circuit board 2
Is passed through a heating furnace (not shown), so that the solder 3 is melted, and the printed board 2 and the tongue piece 1b of the frame 1 are soldered.
At this time, the creamy solder 3 also adheres to the land 2c formed on the inner peripheral surface 2b of the notch 2a, so that the lower end of the free end 1e and the land on the inner peripheral surface 2b of the notch 2a. 2c is soldered.
【0012】この遊端部1eとランド部2cとを接続す
る半田3、及び遊端部1eと導電パターン2dの端部の
ランド部2eとを接続する半田3によって、プリント基
板2と遊端部1eの下端部とは充分な面積の半田にて強
固な接続がされる。この半田付けによって、枠体1にプ
リント基板2が接続されて組立は完了するる。そして、
この本発明の枠体とプリント基板との接続構造を備えた
電子機器に温度サイクル試験などを行い、枠体1とプリ
ント基板2との間に温度サイクルによる熱膨張などによ
る伸縮の差が生じても、この伸縮の差による歪みは、枠
体1の舌片1bの移動によって吸収されて半田3による
接続が損なわれることはない。The printed circuit board 2 and the free end are connected by the solder 3 connecting the free end 1e and the land 2c and the solder 3 connecting the free end 1e and the land 2e at the end of the conductive pattern 2d. The lower end of 1e is firmly connected by a sufficient area of solder. The printed circuit board 2 is connected to the frame 1 by this soldering, and the assembly is completed. And
A temperature cycle test or the like is performed on the electronic device having the connection structure between the frame and the printed board of the present invention, and a difference in expansion and contraction occurs between the frame 1 and the printed board 2 due to thermal expansion and the like due to the temperature cycle. However, the distortion due to the difference in expansion and contraction is absorbed by the movement of the tongue piece 1b of the frame 1, and the connection by the solder 3 is not impaired.
【0013】次に、この枠体1の舌片1bによる熱膨張
の伸縮の差による歪みの吸収について説明する。まず、
プリント基板2が枠体1に対して、熱による膨張によっ
て、図1に示す矢印X1・Y1方向に移動すると、プリ
ント基板2のランド部2c、2eに固着されている半田
3には押圧力が加わるが、この押圧力は、それぞれの舌
片1bを構成する保持部1cと折り曲げ片1dとによっ
て吸収される。これは、枠体1に対するプリント基板2
の矢印X1・Y1方向への移動によって、折り曲げ片1
dの両端部の折り曲げられている部分がヒンジ動作を行
い一層折り曲げられたり、延ばされたりして変形すると
ともに、保持部1cが側壁1aから外方に変形して、こ
のプリント基板2の矢印X1・Y1方向への移動による
半田3に対する押圧力を吸収する。Next, the absorption of distortion due to the difference in expansion and contraction of thermal expansion by the tongue piece 1b of the frame 1 will be described. First,
When the printed circuit board 2 moves in the directions of arrows X1 and Y1 shown in FIG. 1 with respect to the frame 1 due to thermal expansion, a pressing force is applied to the solder 3 fixed to the lands 2c and 2e of the printed circuit board 2. In addition, this pressing force is absorbed by the holding portion 1c and the bent piece 1d that constitute each tongue piece 1b. This is the printed circuit board 2 with respect to the frame 1
Is moved in the directions of the arrows X1 and Y1 so that the bent piece 1
The bent parts at both ends of the printed circuit board d are hinged to be further bent or extended to be deformed, and the holding part 1c is deformed outward from the side wall 1a, so that the arrow of the printed board 2 is formed. The pressing force against the solder 3 due to the movement in the X1 and Y1 directions is absorbed.
【0014】次に、プリント基板2が枠体1に対して、
収縮によって、図1に示す矢印X2・Y2方向に移動す
ると、半田3には引っ張り力が加わるが、この引っ張り
力は、それぞれの舌片1bを構成する保持部1cと折り
曲げ片1dとによって、膨張と同様な動きにて半田3に
対する引っ張り力が吸収される。Next, the printed circuit board 2 is
When the solder 3 moves in the directions of arrows X2 and Y2 shown in FIG. 1 due to shrinkage, a tensile force is applied to the solder 3. The tensile force is expanded by the holding portion 1c and the bent piece 1d constituting each tongue 1b. The tensile force on the solder 3 is absorbed by the same movement as the above.
【0015】[0015]
【発明の効果】本発明の枠体とプリント基板との接続構
造では、枠体1の側壁1aに一体に複数個設けられた舌
片1bを構成する遊端部1eとプリント基板2のランド
部2c、ランド部2eとを半田付けすることで、それぞ
れの舌片によって、枠体に対するプリント基板のX方
向、Y方向への微小距離移動が可能となり、温度サイク
ル試験などで枠体とプリント基板との間に熱膨張の差に
よる伸縮での歪みが生じて、プリント基板2が枠体1に
対して移動を生じたときでも、半田3に加えられる引っ
張り力や押圧力は、保持部1cと折り曲げ片1dと遊端
部1eとから成る舌片1bで、この歪みが吸収されて半
田3による接続を損なうことがないという効果を奏す
る。According to the connection structure between the frame and the printed circuit board of the present invention, the free end 1e and the land of the printed circuit board 2 constitute a plurality of tongue pieces 1b integrally provided on the side wall 1a of the frame 1. By soldering the land 2e and the land 2e, the tongues allow the printed circuit board to move a small distance in the X and Y directions with respect to the frame. When the printed circuit board 2 is displaced with respect to the frame 1 due to expansion and contraction due to the difference in thermal expansion between them, the tensile force and the pressing force applied to the solder 3 are not equal to those of the holding section 1c. The tongue piece 1b composed of the piece 1d and the free end 1e has an effect that the distortion is absorbed and the connection by the solder 3 is not impaired.
【0016】また、本発明の枠体とプリント基板との接
続構造では、プリント基板の切り欠き部の内周面にラン
ド部を形成したことによって、半田によるプリント基板
の枠体への接続が、プリント基板のランド部との接続に
加えて、内周面のランド部と枠体の舌片との半田接続も
加わり、充分な面積の半田にて接続されることから安定
した接続が得られるという効果を奏する。Further, in the connection structure between the frame and the printed board according to the present invention, the land is formed on the inner peripheral surface of the cutout portion of the printed board, so that the connection of the printed board to the frame by soldering can be performed. In addition to the connection with the land part of the printed circuit board, solder connection between the land part on the inner peripheral surface and the tongue piece of the frame is also added, and it is said that stable connection can be obtained because it is connected with solder of sufficient area It works.
【図1】本発明の枠体とプリント基板との接続構造を説
明するための要部斜視図。FIG. 1 is an essential part perspective view for explaining a connection structure between a frame and a printed board according to the present invention.
【図2】図1のA−A線における要部断面図。FIG. 2 is a sectional view of an essential part taken along line AA of FIG. 1;
【図3】本発明の電子機器に係るプリント基板を説明す
るための要部斜視図。FIG. 3 is an essential part perspective view for explaining a printed circuit board according to the electronic apparatus of the present invention.
【図4】従来の電子機器を示す斜視図。FIG. 4 is a perspective view showing a conventional electronic device.
【図5】図4の電子機器の組立を説明するための分解斜
視図。FIG. 5 is an exploded perspective view for explaining assembly of the electronic device of FIG. 4;
【図6】従来の枠体とプリント基板との接続構造を説明
するための要部斜視図。FIG. 6 is an essential part perspective view for explaining a conventional connection structure between a frame and a printed circuit board.
【図7】図6のB−B線における要部断面図。FIG. 7 is a sectional view of a main part taken along line BB of FIG. 6;
1 枠体 1a 側壁 1b 舌片 1c 保持部 1d 折り曲げ部 1e 遊端部 2 プリント基板 2a 切り欠き部 2b 内周面 2c、2e ランド部 2d 導電パターン 3 半田 4 隙間 DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 1b Tongue piece 1c Holding part 1d Bend part 1e Free end part 2 Printed circuit board 2a Notch part 2b Inner peripheral surface 2c, 2e Land part 2d Conductive pattern 3 Solder 4 Gap
Claims (2)
形成された舌片とを有する枠体と、該枠体内に配置され
たランド部を有するプリント基板とを備え、前記舌片は
前記側壁と同一平面上であって、前記側壁の横方向に延
び、一方の端部が前記側壁に連設された保持部と、該保
持部の他方の端部と連設され、前記側壁の内面から前記
枠体内方に傾斜されて設けられた折り曲げ片と、傾斜さ
れた該折り曲げ片の他方の端部から前記側壁の縦方向に
前記枠体の前記側壁と平行に延びて設けられた遊端部と
から成り、前記プリント基板のランド部と前記枠体の舌
片の遊端部とを半田付け固定したことを特徴とする枠体
とプリント基板との接続構造。1. A frame made of a metal plate and having a side wall and a tongue piece formed integrally with the side wall, and a printed board having a land portion disposed in the frame body, wherein the tongue piece is provided. A holding portion provided on the same plane as the side wall, extending in the lateral direction of the side wall, and having one end portion connected to the side wall and the other end portion of the holding portion; A bent piece that is inclined from the inner surface into the inside of the frame, and a play piece that extends from the other end of the inclined bent piece in the longitudinal direction of the side wall in parallel with the side wall of the frame. An end structure, wherein a land of the printed circuit board and a free end of a tongue piece of the frame are fixed by soldering.
端部と対応する位置に切り欠き部を形成して、該切り欠
き部の内周面にランド部を形成したことを特徴とする請
求項1記載の枠体とプリント基板との接続構造。2. A notch is formed at a position corresponding to a free end of a tongue of the frame body of the printed circuit board, and a land is formed on an inner peripheral surface of the notch. A connection structure between a frame and a printed circuit board according to claim 1.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9152219A JPH10341087A (en) | 1997-06-10 | 1997-06-10 | Connection structure of frame and printed circuit board |
KR2019980009735U KR200200102Y1 (en) | 1997-06-10 | 1998-06-09 | A connecting structure between a frame body and a printed board |
CN98102383A CN1100475C (en) | 1997-06-10 | 1998-06-10 | Connecting structure of frame and printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9152219A JPH10341087A (en) | 1997-06-10 | 1997-06-10 | Connection structure of frame and printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10341087A true JPH10341087A (en) | 1998-12-22 |
Family
ID=15535693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9152219A Withdrawn JPH10341087A (en) | 1997-06-10 | 1997-06-10 | Connection structure of frame and printed circuit board |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH10341087A (en) |
KR (1) | KR200200102Y1 (en) |
CN (1) | CN1100475C (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001054251A (en) * | 1999-08-06 | 2001-02-23 | Mitsumi Electric Co Ltd | Board protecting device |
US7633016B2 (en) | 2006-03-17 | 2009-12-15 | Alps Electric Co., Ltd. | Coupling structure between circuit board and frame member |
JP2013247180A (en) * | 2012-05-24 | 2013-12-09 | Sharp Corp | Case structure |
CN105805575A (en) * | 2016-04-15 | 2016-07-27 | 宁波市凯迪森照明科技有限公司 | LED floodlight |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005175314A (en) * | 2003-12-12 | 2005-06-30 | Alps Electric Co Ltd | Electronic circuit unit |
-
1997
- 1997-06-10 JP JP9152219A patent/JPH10341087A/en not_active Withdrawn
-
1998
- 1998-06-09 KR KR2019980009735U patent/KR200200102Y1/en not_active IP Right Cessation
- 1998-06-10 CN CN98102383A patent/CN1100475C/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001054251A (en) * | 1999-08-06 | 2001-02-23 | Mitsumi Electric Co Ltd | Board protecting device |
US7633016B2 (en) | 2006-03-17 | 2009-12-15 | Alps Electric Co., Ltd. | Coupling structure between circuit board and frame member |
JP2013247180A (en) * | 2012-05-24 | 2013-12-09 | Sharp Corp | Case structure |
CN105805575A (en) * | 2016-04-15 | 2016-07-27 | 宁波市凯迪森照明科技有限公司 | LED floodlight |
Also Published As
Publication number | Publication date |
---|---|
KR19990003854U (en) | 1999-01-25 |
CN1100475C (en) | 2003-01-29 |
CN1204941A (en) | 1999-01-13 |
KR200200102Y1 (en) | 2001-01-15 |
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