JP2007305384A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which is easily miniaturized and having a terminal member folded easily. <P>SOLUTION: The push switch 1 comprises a base 2 of synthetic resin having a plurality of receptacles 13 to be mounted on a printed board 20, a plurality of terminal members 3 fixed to the base 2 by insert molding and soldered to lands 21 of a wiring pattern, stationary contacts 10-12 deriving the terminal members 3, reverse springs 4-6, an operating member 8, a metal frame 9 and so on, wherein the push switch 1 is mounted on the printed board 20 by attaching the base 2 to a notch part 23 provided in an edge part of the printed board 20. The base 2 has a guide wall part 14 adjacent to the receptacles 13, and the terminal members 3 are bent along the external surface of the guide wall part 14. Recessed step parts 15 are formed with the external surface of the receptacles 13 and the external surface of the guide wall part 14, and the terminal members 3 are arranged in the recessed step parts 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component that can be mounted on an edge of a printed circuit board, and more particularly to an electronic component that is suitable for use as a lateral push type push switch.

2. Description of the Related Art Conventionally, there is known a technique for realizing various functions and miniaturization of various electronic devices by attaching an electronic component to a notch provided on an edge of a printed board. For example, in the case of a lateral push type push switch that is pressed in a direction substantially parallel to the printed circuit board, a synthetic resin base (case) that holds and fixes the terminal member by insert molding is attached to the edge of the printed circuit board. A terminal that is inserted into a notch formed in the part and is mounted on the printed circuit board with a receiving part protruding from the side and rear of the base, and is bent along the outer surface of the receiving part. A member is soldered to a wiring pattern on a printed circuit board (for example, see Patent Document 1). In the push switch configured in this way, when an operation member that can move back and forth with respect to the base is pressed, the pressing operation force can be received by the inner wall surface of the cutout portion of the printed circuit board. Strength reliability can be increased. In addition, the space factor is improved by using the edge of the printed circuit board as a mounting area, and the height of the push switch protruding on the printed circuit board is suppressed because the base is inserted into the cutout of the printed circuit board. Can do.
Japanese Patent Laying-Open No. 2001-210176 (page 5-8, FIG. 5)

  However, if the terminal member is configured to extend along the outer surface of the receiving part of the base as in the prior art described above, the tip part of the terminal member is removed because the bottom surface of the receiving part is the board mounting surface. There is a problem in that it is difficult to reduce the size of the push switch because the push switch has to be protruded outward from the receiving portion. Further, in such a conventional technique, after the terminal member led backward from the fixed contact exposed at the inner bottom portion of the base is bent along the outer surface of the receiving portion, the tip end portion of the terminal member is placed on the upper surface of the printed circuit board. Since it has to be bent along the direction, there is a problem that the bending of the terminal member is complicated.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide an electronic member that can be easily miniaturized and that can be easily bent.

  In order to achieve the above object, the present invention provides a base made of a synthetic resin having a plurality of receiving portions projecting outward from the back surface and side surfaces, and a plurality of terminal members held and fixed to the base by insert molding. An electronic component in which the receiving part is mounted on the printed circuit board by inserting the base into a notch provided on an edge of the printed circuit board, Concave steps are formed at a plurality of locations adjacent to at least the bottom surface side of the receiving portion that protrudes rearward from the back surface of the base, and the tip portions of the terminal members are respectively disposed in the concave steps.

  In the electronic component configured as described above, the base member is inserted into the notch provided at the edge of the printed circuit board, and the bottom surface of the receiving part is mounted on the printed circuit board. Since it can be placed in the recessed step of the base, the tip of the terminal member can be positioned and soldered on the wiring pattern of the printed circuit board without protruding outward, and the plane of the electronic component The size can be reduced by reducing the typical size. Moreover, since it is not necessary to make the front-end | tip part of a terminal member protrude outside, each terminal member can be set to the simple shape which is easy to bend.

  In the above configuration, the base is preferably provided with a plurality of guide wall portions protruding rearward from the back surface and adjacent to the receiving portion, and the terminal members are preferably bent along the outer surfaces of these guide wall portions, If such a configuration is adopted, the terminal member is projected linearly outward from the inner bottom of the base during insert molding, and the projecting portion is bent along the outer surface of the guide wall after insert molding. Since a terminal member having a desired shape is obtained, insert molding and bending can be easily performed. In this case, when an inclined surface is formed on the outer surface of the guide wall portion so that the gap between the corresponding terminal members increases as the corner portion of the guide wall portion is closer, the bent portion is bent along the inclined surface of the guide wall portion. It is more preferable because the terminal member can be easily formed into a desired shape by considering the spring back of the terminal member in advance.

  Further, in the above configuration, it is preferable that a receiving portion is always present between the terminal member and another terminal member arranged in the vicinity thereof, so that the solder adhered to one terminal member and the other Since the solder adhering to the terminal member can be cut off by the receiving portion, the effect of preventing a soldering defect that the terminal members are short-circuited is enhanced.

  Further, in the above configuration, the substrate mounting surface is formed on each of the bottom surface side and the top surface side of the receiving portion, and the concave step portion is also formed on the portion adjacent to the top surface side of the receiving portion protruding backward. When the base is mounted on the printed circuit board in an upside down position, the base part of the terminal member can be placed in the recessed step part of the base and the base part can be placed on the printed circuit board. Since it can be placed on the wiring pattern and soldered, the same electronic component can be mounted on the printed circuit board in two orientations without impairing the miniaturization or bending process, thereby increasing versatility. .

  Further, in the above configuration, an operation member capable of moving back and forth with respect to the base, a movable contact member driven by the operation member, and a metal frame attached to the base to prevent the operation member from falling off If a metal frame is soldered to a land on the printed circuit board, a lateral push type push switch with increased mounting strength to the printed circuit board by soldering the metal frame can be realized.

  The electronic component of the present invention has a posture in which the base is inserted into the notch provided at the edge of the printed circuit board and the bottom surface of the receiving part is mounted on the printed circuit board, and the tip of the terminal member is recessed in the base. Since it can arrange | position in a step part, it can be positioned and soldered on the wiring pattern of a printed circuit board, without making the front-end | tip part of a terminal member protrude outside. Therefore, it is possible to reduce the planar size of the electronic component such as a lateral push type push switch that is suitable for mounting on the edge of the printed circuit board. Moreover, since this electronic component does not need to project the front-end | tip part of a terminal member to outward, each terminal member can be set to the simple shape which is easy to bend.

  1 is an exploded perspective view of a push switch according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the push switch, and FIG. 3 is the push switch. 4 is a front view showing the internal structure of the base of the push switch, FIG. 5 is a perspective view showing the push switch mounted on a printed circuit board, and FIG. 6 is an exploded perspective view corresponding to FIG. FIG. 7 is a perspective view showing a state in which the push switch is mounted on a printed circuit board in an upside down posture.

  An electronic component described as an example of this embodiment is a lateral push type push switch 1 mounted on an edge of a printed circuit board 20, and this push switch 1 is a synthetic resin base 2 having an open end 2a on the front surface. A plurality of terminal members 3 held and fixed to the base 2 by insert molding, conductive reversal springs 4, 5, 6 and spacers 7 housed and held in the internal space of the base 2, An operation member 8 capable of moving back and forth in the internal space, a metal frame 9 that is externally mounted on the base 2 to prevent the operation member 8 from falling off, and fixed contacts 10 and 11 disposed on the inner bottom portion of the base 2. , 12 mainly. The reversing spring 4 formed into an elliptical dome shape corresponds to a first-stage movable contact that is reversed first to switch contacts when the operating member 8 is pressed. The reversing spring 5 and reversing spring 6 formed into a circular dome shape correspond to the second-stage movable contact that is overlapped in order to increase the operating force, and the first-stage movable contact (reversing spring 4) is reversed. When the operation member 8 is pressed in this state, the movable contact at the second stage is reversed to perform contact switching. As shown in FIG. 4, the fixed contact includes a central fixed contact 10, a pair of first outer fixed contacts 11, and a pair of second outer fixed contacts 12, which correspond to the fixed contacts 10, 11, 12, respectively. A terminal member 3 is led out.

  The base 2 is provided with three receiving portions 13 that are formed to protrude rearward from the left and right side surfaces 2c and three guide wall portions 14 that are formed to protrude rearward from four locations on the rear surface 2b. ing. The receiving portions 13 and the guide wall portions 14 are alternately arranged and the receiving portions 13 are always interposed between the adjacent guide wall portions 14. The bottom surfaces of the receiving portions 13 are all in the same plane, and in the mounted state shown in FIG. 5, the bottom surfaces of the receiving portions 13 are substrate mounting surfaces. However, the top surfaces of the receiving portions 13 are also all on the same plane, and when the base 2 is mounted on the printed circuit board 20 in the posture reversed upside down as shown in FIG. The top surface is the substrate mounting surface. Since the guide wall portion 14 is formed to be slightly smaller than the receiving portion 13 protruding from the back surface 2b, the concave step portion 15 is defined by the outer surface of the receiving portion 13 and the outer surface of the guide wall portion 14. Has been. This concave step portion 15 means a concave space in which the outer surface from the top surface of the guide wall portion 14 through the back surface to the bottom surface protrudes and these three surfaces do not protrude outward from the receiving portion 13. ing. In addition, as shown in FIG. 2, inclined surfaces 14 a and 14 b are formed on the top surface and the back surface of the guide wall portion 14. On the other hand, the receiving portion 13 projecting from the side surface 2c is formed in an L shape in plan view, and its base end portion protrudes laterally. Note that the engaging protrusion 16 projecting from the front surface of the base 2 and the engaging step portion 17 carved from the rear surface are both for positioning and locking the metal frame 9.

  The terminal member 3 is obtained by bending a portion of the conductive metal piece held and fixed to the base 2 by insert molding and existing outside the base 2. The terminal member 3 is bent in multiple stages along the outer surface of the guide wall portion 14, but as shown by a two-dot chain line in FIG. 2, the terminal member 3 is moved from the inner bottom portion of the base 2 at the time of insert molding. A terminal member 3 having a desired shape disposed in the recessed step portion 15 is obtained by projecting outwardly in a straight line and bending the projecting portion along the outer surface of the guide wall portion 14 after insert molding. Yes. The terminal member 3 generates a spring back near the corner portion of the guide wall portion 14 at the time of the bending process, but inclined surfaces 14a and 14b that anticipate the spring back are formed on the outer surface of the guide wall portion 14. It is easy to bend the terminal member 3 into a desired shape. That is, there is a gap between the terminal member 3 after bending and the outer surface of the guide wall portion 14 that expands as it approaches the corner portion of the guide wall portion 14 due to the spring back. Since the inclined surfaces 14a and 14b are formed in advance on the outer surface, the angle of the bent portion of the terminal member 3 can be set to 90 degrees or 90 degrees or less as shown in FIG. The printed circuit board 20 is provided with a plurality of lands 21 (part of the wiring pattern) for soldering the terminal members 3. As shown in FIG. 2, the bottom surface of the distal end portion of the terminal member 3 is slightly lifted from the bottom surface of the receiving portion 13, and a cream solder accommodating portion at the time of mounting is provided in the recessed step portion 15.

  Of the conductive metal piece held and fixed to the base 2 by insert molding, the portions exposed to the inner bottom of the base 2 are the above-described fixed contacts 10, 11, and 12. The central fixed contact 10 is opposed to the central portion of the reversing spring 6 so as to be able to contact and separate, and the pair of first outer fixed contacts 11 is always in contact with the peripheral portion of the reversing spring 6. The pair of second outer fixed contacts 12 are always in contact with the peripheral edge of the reversing spring 4, and the central portion of the reversing spring 4 is opposed to the central portion of the reversing spring 5 through the opening 7 a of the spacer 7. is doing. A driven protrusion 4 a that abuts against the back surface of the operation member 8 is provided at the center of the reversing spring 4.

  The operation member 8 includes a knob 8 a that protrudes forward from the opening 9 a of the metal frame 9 and a flange portion 8 b that is prevented from advancing by the metal frame 9, and a portion other than the knob 8 a is in the internal space of the base 2. It is stored. The operation member 8 can be moved forward and backward with respect to the base 2, and when the knob 8 a is pressed, the central portions of the reversal springs 4 to 6 are pressed by the operation member 8.

  The metal frame 9 includes an opening 9 a through which the knob 8 a of the operation member 8 is inserted so as to be movable forward and backward, a pair of engagement holes 9 b that are positioned through the engagement protrusions 16 of the base 2, and the base 2. It has a pair of clamping pieces 9c that are elastically contacted to the side surface 2c and positioned on the engaging step portion 17, and a pair of board mounting pieces 9d that are soldered to the dummy lands 22 of the printed board 20. However, the dummy land 22 is a land electrically isolated from the wiring pattern of the printed circuit board 20. The metal frame 9 is attached to the base 2 in a positioned state by the engagement holes 9b and the holding pieces 9c, and prevents the operation member 8 from falling off. The dummy land 22 may be connected to the ground pattern of the printed circuit board 20 and grounded to prevent breakdown due to static electricity.

  When the push switch 1 configured as described above is mounted on the edge of the printed circuit board 20, as shown in FIGS. 5 and 6, the push switch 1 is formed on the basis of a rectangular cutout 23 formed on the edge. The base 2 is inserted and each receiving part 13 is mounted on the printed circuit board 20. At this time, the receiving portion 13 protruding from the back surface 2 b of the base 2 is mounted at the back of the notch 23, and the receiving portion 13 protruding from the left and right side surfaces 2 c of the base 2 is notched 23. Therefore, the base 2 can be mounted on the printed circuit board 20 in a stable posture. Further, when the base 2 is mounted on the printed circuit board 20, the tip of each terminal member 3 is positioned on the corresponding land 21 of the wiring pattern, and the board mounting piece 9 d of the metal frame 9 is placed on the dummy land 22. Position on top. Cream solder is applied to the lands 21 and the dummy lands 22 in advance. When the push switch 1 is arranged and pressed from above, the cream solder spreads and enters the lower surface of the tip of each terminal member 3 temporarily. Fixed. Since the cream solder pressed during the temporary fixing is accommodated in the cream solder accommodating portion in the recessed step portion 15, the cream solder does not enter the lower surface of the receiving portion 13, and the installation height varies after reflow soldering. And the generation of solder balls can be prevented. At this time, since the base 2 is roughly positioned by the notch 23, it is easy to align the terminal members 3 with the lands 21 and the substrate mounting pieces 9d with the dummy lands 22. After that, the push switch 1 is passed through the reflow soldering device, the cream solder is melted and solidified by infrared rays or hot air, and each terminal member 3 is soldered to the land 21 to be electrically and mechanically connected. The attachment piece 9d is soldered to the dummy land 22 and mechanically connected.

  In this way, when the push switch 1 mounted on the edge of the printed circuit board 20 is operated to press the knob 8a of the operation member 8 in a direction substantially parallel to the printed circuit board 20, the reversing springs 4 to 6 are driven and reversed. Two types of contact switching can be performed. Specifically, when the operation member 8 is pressed by a predetermined stroke, first, the central portion of the reversing spring 4 that is the first-stage movable contact is reversed and contacts the central portion of the reversing spring 5. Contact switching is performed when the outer fixed contact 11 and the second outer fixed contact 12 are conducted. When the pressing operation force is removed in this state, the reversing spring 4 is elastically restored to its original shape, so that the reversing spring 4 returns to the off state, and the operating member 8 is pushed back to the original position by the restoring force of the reversing spring 4. On the other hand, when the operation member 8 is further pressed by a predetermined stroke while the reversing spring 4 is reversed, the central portion of the reversing spring 4 drives the central portions of the reversing springs 5 and 6 that are the second-stage movable contacts. Therefore, the central portion of the reversing spring 6 comes into contact with the central fixed contact 10, and contact switching is performed by connecting the central fixed contact 10 and the first and second outer fixed contacts 11, 12. Further, when the pressing operation force is removed in this state, the reversing springs 4 to 6 are all restored to their original shapes and returned to the off state, and the operating member 8 is returned to the original position by the restoring force of the reversing springs 4 to 6. Pushed back.

  In this way, the lateral push type push switch 1 mounted on the notch 23 at the edge of the printed circuit board 20 can receive the pressing operation force against the operation member 8 by the inner wall surface of the notch 23, so that the mounting strength is high. Reliability is increasing. In addition, the space factor is improved by using the edge portion of the printed circuit board 20 as a mounting area, and the height 2 of the push switch 1 protruding on the printed circuit board 20 is inserted because the base 2 is inserted into the notch 23. Has the advantage of being suppressed.

  In the present embodiment, the base 2 is inserted into the notch 23 and the bottom surface of the receiving part 13 is mounted on the printed circuit board 20, and exists in the recessed step 15 of the base 2. Since the tip of the terminal member 3 can be positioned and soldered on the land 21 without protruding outward, it is easy to reduce the size of the push switch 1 so as to suppress the planar size. . Moreover, since this push switch 1 does not need to make the front-end | tip part of the terminal member 3 protrude outside, each terminal member 3 is bend | folded by the simple shape. Moreover, since each terminal member 3 can be processed into a desired shape by bending along the outer surface of the guide wall portion 14 after insert molding, its workability is very good. Further, since the inclined surfaces 14a and 14b are formed on the outer surface of the guide wall portion 14 with the spring back of the terminal member 3 anticipated in advance, the bending accuracy of each terminal member 3 is also increased.

  Further, in the push switch 1 according to the present embodiment example, since the receiving portion 13 is necessarily interposed between the terminal member 3 and another terminal member 3 disposed in the vicinity thereof, one terminal is provided. The solder attached to the member 3 and the solder attached to the other terminal member 3 can be blocked by the receiving portion 13. Therefore, the effect of preventing the soldering failure that the terminal members 3 are short-circuited is increasing.

  Further, the push switch 1 according to the present embodiment includes a metal frame 9 that is attached to the base 2 and prevents the operation member 8 from falling off, and a board mounting piece 9 d of the metal frame 9 is provided on the printed board 20. Therefore, the mounting strength with respect to the printed circuit board 20 is extremely high.

  Further, as shown in FIG. 7, the push switch 1 according to the present embodiment can also be mounted on the printed circuit board 20 in a posture in which the base 2 is reversed upside down. In this case, the side that was the top surface of the receiving portion 13 in FIG. 5 becomes the substrate mounting surface, and the base portion of the terminal member 3 disposed in the recessed step portion 15 of the base 2 is positioned on the land 21 of the wiring pattern. And will be soldered. Also in this case, the board mounting piece 9 d of the metal frame 9 can be soldered to the dummy land 22. If the same push switch 1 can be mounted on the printed circuit board in two postures as described above, the versatility is increased and it is convenient, and the component management cost is also reduced.

  In this embodiment, the terminal member 3 is bent into a U shape along the outer surface of the guide wall portion 14. However, the terminal member 3 is bent along the top surface and the back surface of the guide wall portion 14. It may be bent into a letter shape. Further, like the push switch 18 shown as the second embodiment in FIG. 8, the intermediate portion of the terminal member 3 can be bent into a shape extending obliquely. Furthermore, if a positioning projection 9e is provided at the tip of the board mounting piece 9d of the metal frame 9 as in the push switch 19 shown as the third embodiment in FIG. 9, a positioning hole into which the positioning projection 9e can be inserted. By providing on the printed circuit board side, the positioning operation at the time of mounting becomes easy, and the mounting strength can be improved.

  Further, in each of the above embodiments, the lateral push type push switch is illustrated, but the present invention is also applicable to other electronic components such as a connector mounted on the edge of the printed board.

1 is an exploded perspective view of a push switch according to a first embodiment of the present invention. It is sectional drawing of this push switch. It is a top view of this push switch. It is a front view which shows the internal structure of the base of this push switch. It is a perspective view which shows the state which mounted this push switch in the printed circuit board. FIG. 6 is an exploded perspective view corresponding to FIG. 5. It is a perspective view which shows the state mounted in the printed circuit board with the attitude | position which turned this push switch upside down. It is a perspective view of the back side of a push switch concerning the example of a 2nd embodiment of the present invention. It is a perspective view of the back side of the push switch concerning the example of a 3rd embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,18,19 Push switch 2 Base 2b Back surface 2c Side surface 3 Terminal member 4-6 Reversing spring 7 Spacer 8 Operation member 9 Metal frame 9d Substrate attachment piece 10-12 Fixed contact 13 Receiving part 14 Guide wall part 14a, 14b Inclination Surface 15 Concave step 20 Printed circuit board 21 Land 22 Dummy land 23 Notch

Claims (6)

A synthetic resin base having a plurality of receiving portions projecting outward from the back surface and the side surface, and a plurality of terminal members held and fixed to the base by insert molding, the base being an edge of the printed circuit board By inserting into the notch provided in the part, the receiving part is an electronic component adapted to be mounted on the printed circuit board,
A concave step portion is formed at a plurality of positions adjacent to at least the bottom surface side of the receiving portion that protrudes rearward from the back surface of the base, and the tip end portion of the terminal member is disposed in each of the concave step portions. Electronic parts.   2. The guide base according to claim 1, wherein the base is provided with a plurality of guide wall portions that protrude rearward from the back surface and are adjacent to the receiving portion, and the terminal members are bent along the outer surfaces of the guide wall portions, respectively. Electronic parts characterized by that.   3. The electronic component according to claim 2, wherein an inclined surface is formed on the outer surface of the guide wall portion so that a gap between the terminal member corresponding to the outer surface of the guide wall portion increases as it approaches the corner portion of the guide wall portion.   The electronic component according to any one of claims 1 to 3, wherein the receiving portion is necessarily present between the terminal member and another terminal member disposed in the vicinity thereof.   5. The portion according to claim 1, wherein a substrate mounting surface is formed on each of a bottom surface side and a top surface side of the receiving portion, and the portion adjacent to the top surface side of the receiving portion protruding rearward. An electronic component, wherein the concave step portion is also formed. 6. The operation member according to claim 1, wherein the operation member is capable of moving back and forth with respect to the base, a movable contact member driven by the operation member, and the operation member attached to the base. An electronic component comprising: a metal frame that prevents the metal frame from falling off, and soldering the metal frame to a land on the printed circuit board.

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