JP3365723B2 - Method of manufacturing electronic circuit component mounting board and electronic circuit component mounting board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic circuit component mounting substrate and an electronic circuit component mounting substrate, and more particularly to a circuit used by mounting an electronic circuit component such as a semiconductor element or a resistance element. The present invention relates to a board manufacturing method and an electronic circuit component mounting board obtained by such a manufacturing method.

[0002]

2. Description of the Related Art As a technique for mounting electronic circuit parts on a circuit board, a recess is formed in the board, the electronic circuit part is inserted into the recess, and the circuit of the electronic circuit part is exposed inside the recess of the board. Techniques for connecting to inner layer circuits are known. This technology does not allow the electronic circuit parts to significantly project onto the surface of the board, so the overall thickness of the board product can be reduced, the electronic circuit parts can be protected by being surrounded by the recesses in the board, and the electronic circuit parts can be directly inserted in the recesses Moreover, it has an advantage that it can be connected to an inner layer circuit.

However, in the above technique, a plating solution, an etching solution, or the like adheres to the inside of the recess in the plating process for forming a circuit on the surface of the substrate or forming a through-hole circuit penetrating the substrate. Must be prevented. In particular, it is necessary to take care not to adversely affect the inner layer circuit exposed inside the recess.

In Japanese Unexamined Patent Publication (Kokai) No. 5-226839, a so-called dry film is attached to the surface of the substrate so as to cover the recess, and a plating process is performed to allow the plating solution or the like to penetrate into the recess. A technique for preventing this is disclosed. The dry film is a material that is used as a mask material or the like for forming a thin film of a circuit pattern in a general wiring circuit board manufacturing technique. After applying a dry film, if you expose it in a pattern and develop it,
Since only the exposed portion is selectively cured, the unexposed portion is removed with a solvent or the like to obtain a patterned mask.

The above technique has an advantage that a mask film for forming a pattern such as a through-hole circuit formed on a substrate can also be used as a dry film for closing the above-mentioned recess.

[0006]

However, the method using a dry film shown in the above prior art has a problem that the dry film is peeled off by the alkaline solution used in the plating treatment. If the dry film is attached in close contact with the surface of the substrate, there may be no problem, but the dry film that covers the recess of the substrate and is placed in the shape of a film in the hollow is an alkaline solution for plating. When the liquid acts, the dry film easily peels off. When the dry film peels off, in addition to the alkaline solution for plating described above, chemicals, resin solutions, contaminants, etc. used in various processing steps penetrate into the inside of the recess and are exposed inside the recess. Etc. will be polluted or damaged.

[0007] Therefore, an object of the present invention is to solve the problem of the technique of closing the recess for mounting electronic circuit parts by using the dry film, and make the peeling of the dry film difficult.

[0008]

A method of manufacturing an electronic circuit component mounting substrate according to the present invention includes a substrate main body, an opening arranged in the substrate main body, into which an electronic circuit component is inserted, and an opening inside the opening. A method of manufacturing a board having a connection circuit section connected to an electronic circuit component and a plating circuit section arranged on the surface of the board body, including the following steps.

(A) A step of closing the opening of the substrate body and attaching a dry film. (b) A step of applying a resin to the outer surface side of the dry film to form a protective layer covering the dry film. (c) A step of forming a plated circuit portion on the surface of the substrate body. (d) A step of removing the protective layer and the dry film.

Each constituent element will be specifically described. [Electronic Circuit Parts] Various kinds of electronic circuit parts mounted on a board in a normal circuit board product such as a semiconductor element, a resistance element, a capacitor element, and a sensor element are used. The electronic circuit component is provided with a terminal and a connection surface for electrically or mechanically connecting to an external circuit.

[Substrate] As the substrate body, a circuit substrate made of usual materials and structures is used. Usually, a multi-layer substrate formed by stacking a plurality of substrates is used. The synthetic resin, fiber reinforced resin, ceramics, glass and other materials may be used alone or in combination.

The board body is provided with an opening for mounting an electronic circuit component. The opening has a shape into which a part or the whole of the electronic circuit component can be inserted. The opening may be a hole having a bottom formed from one surface of the substrate body to the middle of the thickness, or may be a hole penetrating the front and back of the substrate body. In order to form the opening in the substrate body, a usual substrate processing technique can be applied. For example, mechanical processing such as cutting processing, chemical processing such as etching, and laser processing can be applied. By laminating a substrate having through holes formed in advance and a substrate having no through holes, a substrate body having a hole-shaped opening with a bottom can be manufactured.

On the inner surface of the opening, there is provided a connection circuit portion connected to the electronic circuit component. The connection circuit portion can be formed on the substrate body having the opening formed therein by using a normal circuit forming technique. Further, the inner layer circuit arranged between the substrates of the multilayer substrate can be used. Of the individual boards constituting the multilayer board, the inner layer circuit may be exposed only on the end surface exposed to the opening, or the conductor circuit connected to the inner layer circuit may be arranged on the end surface exposed to the opening. it can.

A circuit may be formed in advance or a conductor layer for forming the circuit may be formed on the surface other than the opening of the substrate body. The plating circuit part is
It is formed on the substrate body after the opening is formed. A dry film and a protective layer are used to protect the inside of the opening when forming the plated circuit portion. The material and forming means of the plated circuit portion are not particularly limited, and ordinary circuit forming technology can be applied.

The plated circuit portion includes a normal wiring circuit arranged on the outer surface of the substrate body as well as a through hole circuit. The through-hole circuit can be formed by forming a through hole in the substrate body and disposing a plating layer from the inner surface of the through hole to the surface of the substrate body at the periphery of the through hole. The through-hole circuit can connect the inner layer circuit and the outer surface circuit or the inner layer circuit of the multilayer substrate.

[Step of pasting dry film] The material of the dry film is
A film material used as a mask material or the like is used. A material that is weak against an alkaline solution for plating may be used. The work of closing the opening of the substrate body and sticking the dry film can be performed in the same manner as the normal film sticking work for mask formation.

When the dry film is also used as a mask material when forming a circuit or the like on the surface of the substrate body,
Apply a dry film so that it covers up to the necessary parts as a mask material. When the dry film is exposed and developed, a strong cured film is formed. The dry film may be left unexposed at a portion of the surface of the substrate body where a circuit or the like is to be formed, and then removed after development. Therefore, the dry film after the exposure and development processing may be arranged only at the position where the opening is closed, or at the position corresponding to the circuit pattern on the surface of the substrate body in addition to the position where the opening is closed. . For these operations, photoengraving technology applied to ordinary circuit formation is used.

If the opening penetrates the substrate body, or if both sides of the substrate body have hole-shaped openings, dry films are attached to both sides of the substrate body. [Process of forming protective layer] The resin to be the protective layer is a resin material capable of forming a film having durability against various treatments applied to the substrate body having the opening such as plating solution and etching solution. If so, an appropriate resin material is used from among ordinary synthetic resin materials. If a thermosetting resin is used as the resin, the durability against various heat treatments applied to the substrate body after forming the protective layer becomes high.

A protective layer is formed by applying a molten resin onto a dry film and curing the resin. Do not apply resin to the dry film where holes are formed for circuit formation. The thickness of the protective film is sufficient so that the plating solution or the like does not penetrate to the dry film side. After the opening of the board body is covered with the dry film and the protective layer, various processing steps necessary for manufacturing the circuit board can be performed without much consideration for the existence of the opening. Specifically, in addition to the circuit forming process, a process of stacking another substrate on the substrate body,
A step of immersing the whole substrate in various processing liquids or exposing it to various gas atmospheres can also be performed.

[Step of Forming Plated Circuit Section] The plated circuit section includes not only a normal surface wiring circuit but also a conductor structure formed by plating such as a through hole circuit and a via hole circuit. When forming a through hole circuit or a via hole circuit, after forming a through hole or a hole up to the middle of the thickness in the substrate body, a conductor film is formed inside the hole or hole.

The plated circuit portion is formed of a normal plated metal for a conductor circuit, such as copper or a copper alloy. The plating circuit portion may be formed only by a chemical plating method using a plating treatment liquid, or a thicker conductor layer may be formed on the conductor portion formed by the chemical plating method by an electroplating method. When carrying out the chemical plating method, an ordinary alkaline solution can be used.

The specific treatment method of the plating treatment is the same as the ordinary circuit forming technique. [Step of Laminating Substrate] Another substrate can be laminated on the substrate body on which the dry film and the protective layer are arranged. The different substrate may be a single-layer substrate or a multi-layer substrate on which a circuit is formed in advance, or may be a simple plate of resin, ceramic, glass, or the like, and a dry film and a protective layer are provided. It may be another substrate body.

In order to laminate and integrate the substrates, it is sufficient to interpose an adhesive between the substrates to be laminated and to bond the substrates, or to heat and cure them by interposing a thermosetting resin. A prepreg sheet may be sandwiched between the substrates and heat-cured. [Step of Removing Protective Layer and Dry Film] Of the protective layer and the dry film formed on the substrate body, at least the protective layer and the dry film where the opening is closed are removed. At a place where there is no problem even if the protective layer or the dry film is present, the protective layer or the dry film may be left as it is.

The protective layer and the dry film may be removed at once in the same step, or the protective layer and the dry film may be removed in separate steps. In order to remove the protective layer, ordinary chemical or physical removing means can be adopted depending on the material of the resin forming the protective layer. For example, the protective layer may be irradiated with laser light to vaporize and remove the protective layer. Various types of radiation can be used instead of laser light. It is also possible to spray abrasive particles onto the protective layer to scrape off. A solvent that dissolves the protective layer may be used, but in this case, it is necessary to perform a treatment that does not damage the substrate structure other than the protective layer.

To remove the dry film, the same means as the means for removing the protective layer can be used. In particular, if an alkaline solution for plating, in which the dry film is easily dissolved, is used, efficient removal is possible. The alkaline solution for plating has little adverse effect on the circuit and other parts of the substrate.
An electronic component is inserted into the opening and mounted on the substrate main body from which the protective layer and the dry film that close the opening are removed by a conventional means. The connection circuit arranged on the inner surface of the opening and the connection terminal of the electronic component can be connected by conductor connection means such as plating or conductor paste. The electronic component can also be fixed by adhering it to the opening with an adhesive. It is also possible to provide an engagement mechanism that is freely engageable with each other between the electronic component and the opening.

[0026]

DETAILED DESCRIPTION OF THE INVENTION

[First Embodiment] In the embodiments shown in FIGS. 1 to 7, a substrate body 10 having an opening 40 on one surface is used. As shown in FIG. 1, the substrate body 10 includes a plurality of unit substrates 12 and 1.
Reference numeral 4 is a multi-layer substrate integrated in the middle with prepreg layers 16 and 17. Circuit layers 32 and 34 are formed in advance on both surfaces of the unit substrates 12 and 14, respectively.
The circuit layer 32 which is an inner layer when the four are bonded together,
34 is a so-called inner layer circuit.

The opening 4 is previously formed in each unit substrate 12, 14.
After forming a through hole at a position where 0, the circuit layer 3
2, 34 are formed, and a part of the circuit layers 32, 34 are also arranged on the inner peripheral surface of the through hole. Unit substrates 12, 14 having such through holes and circuit layers 32, 34,
A prepreg layer 16 in which through holes similar to the above are formed in advance,
The openings 40 are formed in the substrate body 10 by stacking the layers 17. A part of the circuit layers 32, 34 is exposed and arranged on the inner surface of the opening 40, and serves as a connection circuit part for connecting with an electronic circuit component.

A resin plate layer 18 is attached to one surface of the substrate body 10, and the lower surface of the opening 40 is closed. As shown in FIG. 2, the substrate body 1 on the opening side of the opening 40
The dry film 50 is attached to the entire surface of 0. Opening 4
0 is closed by the dry film 50. As shown in FIG. 3, the portion of the dry film 50 outside the periphery of the opening 40 is removed.

Specifically, if the dry film 50 is exposed in a pattern to expose only a region slightly wider than the outer shape of the opening 40, and then development is performed, only the portion blocking the opening 40 is cured. To do. If the unexposed portion of the dry film 50 is dissolved and removed with a solvent, the dry film 50 remains only in the portion that closes the opening 40. As shown in FIG. 4, the protective layer 60 is formed on the entire surface of the substrate body 10 including the upper surface of the dry film 50. Specifically, the protective layer 60 is formed by applying a resin liquid of a thermosetting resin and then heat-curing the resin liquid.

As shown in FIG. 5, the through-hole circuit 70 is formed on the substrate body 10 by the usual plating method. That is, the through hole 7 is formed in the substrate body 10 by punching or the like.
2 is formed through and a plating resist layer is formed on the surface excluding the position where the through hole circuit 70 is formed, and then a conductor layer is attached by a plating process such as a chemical plating method. A through hole circuit 70 is manufactured by forming a conductor layer on the peripheral portion.

The through-hole circuit 70 has the inner layer circuits 32 and 34 of the unit substrates 12 and 14 inside the through-hole 72.
Connected to. As shown in FIG. 6, the protective layer 60 around the opening 40 is removed. Specifically, the method shown in FIGS. 17 and 18 is adopted. In the method shown in FIG. 17, laser light 80 is irradiated to vaporize and disappear the protective layer 60. The laser light 80 is irradiated through an optical system such as a condenser lens 82 so as to remove only the protective layer 60 at a predetermined position above the opening 40. By adjusting the focal position and wavelength characteristics of the laser light 80, it is possible to leave the dry film 50 and remove only the protective layer 60 in a predetermined range.

The method shown in FIG.
The protective layer 60 is scraped off by injecting the abrasive grains 90 from the above to collide with the protective layer 60. The material of the abrasive grains 90 and the spraying force are adjusted so that the dry film 50 under the protective layer 60 is not scraped off. Next, as shown in FIGS. 6 to 7, the dry film 50 that closes the opening 40 is removed.
Specifically, the dry film 50 is dissolved and removed by bringing the dry film 50 into contact with an alkaline solution for plating.

As a result, in the process of forming the through hole circuit 70 by the plating process, the opening 40 and the through hole circuit having excellent quality performance are not adversely affected without adversely affecting the opening 40 and the circuits 32 and 34 therein. An electronic circuit component mounting substrate including 70 is obtained. [Second Embodiment] In the embodiment shown in FIGS.
A circuit is formed on the surface of the substrate body 10.

Since the basic processing steps are the same as those in the above-mentioned embodiment, the difference will be mainly described. The steps from the preparation of the substrate body 10 to the attachment of the dry film 50 are the same as the steps shown in FIGS. As shown in FIG. 8, in addition to the dry film 50 at the position where the opening 40 is closed in the substrate body 10, the dry film 52 is left on the surface of the substrate body 10 at a position apart therefrom. Specifically, it is possible to leave the dry film 52 in such a pattern shape by changing the exposure pattern of the dry film 50.

As shown in FIG. 9, the dry film 50,
The protective layers 60 and 62 are formed on the layer 52. Protective layer 60,
62 is not formed on the surface of the substrate body 10 where the dry films 50 and 52 do not exist. As shown in FIG. 10, a through hole circuit 70 is formed on the substrate body 10 by a plating method. At this time, the plating circuit 74 is also formed on the surface of the substrate body 10 on which the dry films 50 and 52 and the protective layers 60 and 62 are not arranged.

As shown in FIG. 11, the protective layer 60 and the dry film 50 where the opening 40 is closed are removed.
The portion of the protective layer 62 and the dry film 52 formed on the surface of the substrate body 10 remains. As a result, in addition to the opening 40 and the through-hole circuit 70, an electronic circuit component mounting board including the plating circuit 74 on the board surface can be obtained.

In the above embodiment, the dry film 50,
52 and the protective layers 60 and 62 have both the function of closing the opening 40 and the function of forming the circuit pattern of the plating circuit 74, and the labor of the work can be saved and the efficient substrate manufacturing can be achieved. Since the plating circuit 74 is directly formed on the surface of the substrate body 10, the thickness of the entire circuit board can be reduced and the number of working steps can be reduced as compared with the case where another substrate on which the plating circuit 74 is formed is bonded.

[Third Embodiment] In the embodiment shown in FIGS. 12 to 13, another substrate 100 is laminated on the surface of the substrate body 10. Since the basic processing steps are the same as those in the above-described embodiment, different points will be mainly described.

As shown in FIG. 12, after the dry film 50 and the protective layer 60 for closing the opening 40 are formed on the substrate body 10, another substrate 100 is laminated on the protective layer 60 via the prepreg layer 102. To do. Such a substrate 100
Even in the laminating process, the opening 40 has the dry film 50.
Since it is closed by the protective layer 60, it is possible to prevent the inside of the opening 40 from being soiled or damaged. The protective layer 60 made of resin is well bonded to the prepreg layer 102.

As shown in FIG. 13, after forming the through-hole circuit 70 in the same manner as described above, the protective layer 60 and the dry film 50 that close the opening 40 are removed. Although the protective layer 60 is left between the substrate body 10 and the substrate 100,
The protective layer 60 is integrated with the prepreg layer 102 and the like to be a structural material of the substrate. As a result, the opening 40 can be well protected even when the step of stacking another substrate 100 on the substrate body 10 is performed. In particular, it is possible to prevent a part of the adhesive or prepreg resin used during the work of laminating the substrates from scattering into the opening 40 and adhering to the circuits 32, 34 and the like.

[Fourth Embodiment] In the embodiment shown in FIGS. 14 to 16, the dry film 50 is formed on both surfaces of the opening 40.
Close with. Since the basic processing steps are the same as those in the above-described embodiment, different points will be mainly described.

As shown in FIG. 14, the openings 40 are open on both sides of the substrate body 10. The resin plate layer 18 in the embodiment shown in FIG. 1 is not provided. As shown in FIG. 15, a dry film 50 is attached to both sides of the substrate body 10 at positions where the openings 40 are closed, and further covered with a protective layer 60. As shown in FIG. 16, after forming the through-hole circuit 70 in the same manner as described above, the protective layer 60 and the dry film 50 that close the opening 40 on both surfaces of the substrate body 10 are removed.

As a result of the above, an electronic circuit component mounting board having the opening 40 on both sides thereof can be obtained.

[0044]

According to the method of manufacturing a substrate for mounting electronic circuit components according to the present invention, a dry film for closing the opening for mounting electronic circuit components is covered with a protective layer, thereby forming a plating circuit. When performing, the dry film does not peel off, the opening can be well protected,
It is possible to prevent the quality performance of the inner layer circuit exposed inside the opening from being impaired.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing one step of a manufacturing process of a substrate for mounting an electronic circuit component according to an embodiment of the present invention.

FIG. 2 is a sectional view showing the next stage.

FIG. 3 is a sectional view showing the next stage.

FIG. 4 is a sectional view showing the next stage.

FIG. 5 is a sectional view showing the next stage.

FIG. 6 is a sectional view showing the next stage.

FIG. 7 is a sectional view showing the next stage.

FIG. 8 is a cross-sectional view showing one stage of a manufacturing process that represents another embodiment.

FIG. 9 is a sectional view showing the next step.

FIG. 10 is a sectional view showing the next stage.

FIG. 11 is a sectional view showing the next step.

FIG. 12 is a cross-sectional view showing one stage of a manufacturing process that represents another embodiment.

FIG. 13 is a sectional view showing the next step.

FIG. 14 is a sectional view showing a step in a manufacturing process showing another embodiment.

FIG. 15 is a sectional view showing the next step.

FIG. 16 is a sectional view showing the next step.

FIG. 17 is a cross-sectional view showing a step of removing a protective layer in a manufacturing process showing another embodiment.

FIG. 18 is a cross-sectional view showing a protective layer removing step according to another embodiment.

[Explanation of symbols]

10 Board body 12, 14 unit board 32, 34 circuit layers 40 opening 50 dry film 60 protective layer 70 through-hole circuit

─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-5-343849 (JP, A) JP-A-5-326747 (JP, A) JP-A-9-172257 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 23/12-23/15

Claims (7)

(57) [Claims] 1. A substrate main body, an opening arranged in the substrate main body for inserting an electronic circuit component, a connection circuit unit arranged inside the opening and connected to the electronic circuit component, and arranged on a surface of the substrate main body. A method of manufacturing a substrate having a plated circuit part, the method comprising: (a) A step of covering the opening of the substrate body and attaching a dry film. (b) A step of applying a resin to the outer surface side of the dry film to form a protective layer covering the dry film. (c) A step of forming a plated circuit portion on the surface of the substrate body. (d) A step of removing the protective layer and the dry film. 2. The step (a) of applying the dry film includes, in addition to the place for closing the opening,
The method of manufacturing an electronic circuit component mounting substrate according to claim 1, wherein the dry film is also disposed at a place where the plated circuit portion is prevented from being formed. 3. The surface of the substrate body on the side where the dry film and the protective layer are arranged after the step (b) of forming the protective layer and before the step (c) of forming the plated circuit section. The method for manufacturing an electronic circuit component mounting substrate according to claim 1 or 2, further comprising a step (e) of stacking another substrate on. 4. The opening penetrates both sides of the substrate body, and the step (a) of sticking the dry film covers both sides of the opening and sticks the dry film to each of them. A method for manufacturing a substrate for mounting an electronic circuit component according to any one of 1. 5. The electron according to claim 1, wherein in the step (d) of removing the protective layer and the dry film, the dry film is removed with an alkaline solution after removing the protective layer by laser irradiation. Manufacturing method of circuit component mounting board. 6. The method according to claim 1, wherein in the step (d) of removing the protective layer and the dry film, the dry film is removed with an alkaline solution after removing the protective layer with abrasive grains. Manufacturing method of electronic circuit component mounting substrate. 7. An electronic circuit component mounting substrate manufactured by the method according to claim 1.