JP3343704B2 - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JP3343704B2 JP3343704B2 JP29525294A JP29525294A JP3343704B2 JP 3343704 B2 JP3343704 B2 JP 3343704B2 JP 29525294 A JP29525294 A JP 29525294A JP 29525294 A JP29525294 A JP 29525294A JP 3343704 B2 JP3343704 B2 JP 3343704B2
- Authority
- JP
- Japan
- Prior art keywords
- flame retardant
- red phosphorus
- epoxy resin
- based flame
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は難燃性に優れた半導体封
止用エポキシ樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation having excellent flame retardancy.
【０００２】[0002]
【従来の技術】従来、ダイオード、トランジスタ、集積
回路等の電子部品は、エポキシ樹脂組成物で封止されて
いる。この組成物中には、難燃剤としてハロゲン系難燃
剤単独あるいはハロゲン系難燃剤と三酸化アンチモンと
の併用、充填材として溶融シリカ、結晶シリカ等の無機
充填材が配合されている。ところが、環境衛生の点から
ハロゲン系難燃剤、三酸化アンチモンを使用しない難燃
性エポキシ樹脂組成物が要求されている。2. Description of the Related Art Conventionally, electronic components such as diodes, transistors, and integrated circuits have been sealed with an epoxy resin composition. In this composition, a halogen-based flame retardant alone or a combination of a halogen-based flame retardant and antimony trioxide is used as a flame retardant, and an inorganic filler such as fused silica or crystalline silica is blended as a filler. However, from the viewpoint of environmental hygiene, a flame-retardant epoxy resin composition that does not use a halogen-based flame retardant or antimony trioxide is required.
【０００３】この要求に対して、水酸化アルミニウムや
水酸化マグネシウム等の金属水酸化物、硼素化合物等が
検討されてきたが、不純物が多くかつ多量に添加しない
と難燃効果が発現できないことから実用化には至ってい
ない。又赤燐系の難燃剤は少量の添加でも難燃効果が有
りエポキシ樹脂組成物の難燃化に有用であるが、赤燐は
微量の水分と反応しフォスフィンや腐食性の燐酸を生ず
るため、耐湿性に対する要求が極めて厳しい半導体封止
用エポキシ樹脂組成物には使用できない。このため、赤
燐粒子を水酸化アルミニウム、金属酸化物、その他の無
機化合物、熱硬化性樹脂等の有機化合物で被覆し、赤燐
の安定化を図っているが半導体封止用エポキシ樹脂組成
物に採用できるまでの水準には至っていない。[0003] In response to this demand, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, boron compounds, and the like have been studied. It has not been put to practical use. Red phosphorus-based flame retardants have a flame retardant effect even when added in a small amount and are useful for making the epoxy resin composition flame-retardant.However, red phosphorus reacts with a small amount of water to produce phosphine and corrosive phosphoric acid. It cannot be used for epoxy resin compositions for semiconductor encapsulation, which have extremely severe requirements for moisture resistance. For this reason, red phosphorus particles are coated with organic compounds such as aluminum hydroxide, metal oxides, other inorganic compounds, and thermosetting resins to stabilize red phosphorus. It has not yet reached the level where it can be adopted.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、この様な問
題に対して、赤燐系難燃剤と硼素系難燃剤を併用して、
各々の難燃剤の添加量を減らすことにより、耐燃性を維
持しながら耐湿性を向上させ、アンチモン及びハロゲン
フリーの半導体封止用エポキシ樹脂組成物を提供すると
ころにある。The present invention solves such a problem by using a red phosphorus-based flame retardant and a boron-based flame retardant in combination.
It is an object of the present invention to provide an antimony- and halogen-free epoxy resin composition for encapsulating a semiconductor by reducing the amount of each flame retardant to improve the moisture resistance while maintaining the flame resistance.
【０００５】[0005]
【課題を解決するための手段】本発明は、（Ａ）エポキ
シ樹脂、（Ｂ）フェノール樹脂硬化剤、（Ｃ）硬化促進
剤、（Ｄ）赤燐系難燃剤、（Ｅ）硼素系難燃剤及び
（Ｆ）無機充填材からなる半導体封止用エポキシ樹脂組
成物である。The present invention comprises (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing accelerator, (D) a red phosphorus flame retardant, and (E) a boron flame retardant. And (F) an epoxy resin composition for semiconductor encapsulation comprising an inorganic filler.
【０００６】本発明で用いる赤燐系難燃剤には赤燐単独
も含まれるが酸化され易く、又不安定なため取扱いに難
点があり、フェノール樹脂、又は水酸化アルミニウムお
よびフェノール樹脂の混合物で赤燐の表面を予め被覆さ
れたものが好ましい。被覆された難燃剤中の赤燐の含有
量は６０〜９５重量％であることが好ましい。赤燐含有
量が６０重量％未満だと多量に添加する必要があり、９
５重量％を超えると赤燐の安定性の点で問題がある。又
赤燐系難燃剤の粒径としては、平均粒径が１０〜７０μ
ｍ、最大粒径が１５０μｍ以下のものが好ましい。平均
粒径が１０μｍ未満だと組成物の流動性の低下をきた
し、７０μｍを越えると難燃剤の分散性が悪くなる。又
最大粒径が１５０μｍを越えるとパッケージの充填性に
問題が生じる。赤燐系難燃剤としては、例えば燐化学工
業（株）のノーバレッド、ノーバエクセル等があり市場
より容易に入手することができる。全組成物中の赤燐の
含有量としては０．１〜５重量％が好ましく、０．１重
量％未満だと硼素系難燃剤を併用しても難燃性が不足す
る。又赤燐系難燃剤は可燃性で難燃剤自身が酸化して難
燃性を発揮するため、５重量％を超えると難燃剤が多過
ぎることにより難燃剤が燃焼を助ける働きをし難燃性が
不足する。The red phosphorus-based flame retardant used in the present invention includes red phosphorus alone, but it is easily oxidized and has difficulty in handling due to instability. It is preferable that the surface of phosphorus is coated in advance. The content of red phosphorus in the coated flame retardant is preferably from 60 to 95% by weight. If the content of red phosphorus is less than 60% by weight, a large amount needs to be added.
If it exceeds 5% by weight, there is a problem in the stability of red phosphorus. The average particle diameter of the red phosphorus flame retardant is 10 to 70 μm.
m, and those having a maximum particle size of 150 μm or less are preferred. If the average particle size is less than 10 μm, the fluidity of the composition will decrease, and if it exceeds 70 μm, the dispersibility of the flame retardant will deteriorate. On the other hand, if the maximum particle size exceeds 150 μm, there is a problem in the filling property of the package. Examples of red phosphorus-based flame retardants include Nova Red and Nova Excel manufactured by Rin Kagaku Kogyo Co., Ltd., which can be easily obtained from the market. The content of red phosphorus in the whole composition is preferably from 0.1 to 5% by weight, and if it is less than 0.1% by weight, the flame retardancy becomes insufficient even when a boron-based flame retardant is used in combination. Red phosphorus-based flame retardants are flammable, and the flame retardants themselves oxidize and exhibit flame retardancy. If the content exceeds 5% by weight, the flame retardant acts to assist combustion due to the excessive amount of the flame retardant. Run out.
【０００７】本発明に用いる硼素系難燃剤は硼酸塩のも
のが好ましく、とくに成形性との兼ね合いから硼酸亜鉛
（２ＺｎＯ・３Ｂ2Ｏ3・３．５Ｈ2Ｏ）が好ましい。こ
の硼酸亜鉛は市場より容易に入手できる。硼素系の難燃
剤は充填材量、赤燐系難燃剤の添加量によるが全組成物
中に０．５〜８重量％含有することが好ましい。０．５
重量％以下だと赤燐系難燃剤の添加量が多くなり耐湿性
が低下し、８重量％を超えると成形性が低下するためで
ある。[0007] Boron-based flame retardant used in the present invention is preferably from borate, zinc borate (2ZnO · 3B 2 O 3 · 3.5H 2 O) is preferable particularly from consideration of the formability. This zinc borate is readily available on the market. The boron-based flame retardant is preferably contained in the entire composition in an amount of 0.5 to 8% by weight, depending on the amount of the filler and the amount of the added red phosphorus-based flame retardant. 0.5
When the content is less than 8% by weight, the amount of the added red phosphorus-based flame retardant increases, and the moisture resistance decreases. When the content exceeds 8% by weight, the moldability decreases.
【０００８】本発明に用いるエポキシ樹脂は、１分子中
にエポキシ基を２個以上有するモノマー、オリゴマー、
ポリマー全般を言い、その分子量、分子構造を特に限定
するものではないが、例えばビフェニル型エポキシ化合
物、ビスフェノール型エポキシ化合物、フェノールノボ
ラック型エポキシ樹脂、クレゾールノボラック型エポキ
シ樹脂、トリフェノールメタン型エポキシ化合物、アル
キル変性トリフェノールメタン型エポキシ化合物及びト
リアジン核含有エポキシ樹脂等が挙げられ、単独でも混
合して用いても差し支えない。本発明に用いるフェノー
ル樹脂硬化剤は、その分子量、分子構造を特に限定する
ものではないが、例えばフェノールノボラック樹脂、ク
レゾールノボラック樹脂、ジシクロペンタジエン変性フ
ェノール樹脂、パラキシリレン変性フェノール樹脂、テ
ルペン変性フェノール樹脂、トリフェノールメタン化合
物等が挙げられ、特にフェノールノボラック樹脂、ジシ
クロペンタジエン変性フェノール樹脂、パラキシリレン
変性フェノール樹脂、テルペン変性フェノール樹脂等が
好ましく、単独でも混合しても差し支えない。又、これ
らの硬化剤の配合量としては、エポキシ化合物のエポキ
シ基数とフェノール樹脂硬化剤の水酸基数の比は０．８
〜１．２が好ましい。[0008] The epoxy resin used in the present invention is a monomer or oligomer having two or more epoxy groups in one molecule.
It refers to polymers in general, and its molecular weight and molecular structure are not particularly limited. For example, biphenyl type epoxy compounds, bisphenol type epoxy compounds, phenol novolak type epoxy resins, cresol novolak type epoxy resins, triphenol methane type epoxy compounds, alkyl compounds Examples include a modified triphenolmethane-type epoxy compound and a triazine nucleus-containing epoxy resin, which may be used alone or in combination. The phenolic resin curing agent used in the present invention is not particularly limited in its molecular weight and molecular structure. Triphenolmethane compounds and the like are mentioned, and phenol novolak resins, dicyclopentadiene-modified phenol resins, paraxylylene-modified phenol resins, terpene-modified phenol resins and the like are preferable, and they may be used alone or in combination. The ratio of the number of epoxy groups in the epoxy compound to the number of hydroxyl groups in the phenolic resin curing agent is 0.8%.
-1.2 is preferred.
【０００９】本発明に用いる硬化促進剤は、エポキシ基
と水酸基との硬化反応を促進させるものであればよく、
一般に封止材料に使用されているものを広く使用するこ
とができる。例えば１，８−ジアザビシクロウンデセ
ン、トリフェニルホスフィン、ベンジルジメチルアミン
や２−メチルイミダゾール等が挙げられ、単独でも混合
して用いても差し支えない。無機充填材としては、溶融
シリカ粉末、結晶シリカ粉末、アルミナ、窒化珪素等が
挙げられる。これら無機充填材の配合量は成形性と信頼
性のバランスから全組成物中に６０〜９０重量％含有す
ることが好ましい。特に充填材量の多い配合では、球状
の溶融シリカを用いるのが一般的である。The curing accelerator used in the present invention may be any as long as it promotes a curing reaction between an epoxy group and a hydroxyl group.
What is generally used for a sealing material can be widely used. For example, 1,8-diazabicycloundecene, triphenylphosphine, benzyldimethylamine, 2-methylimidazole and the like can be mentioned, and they can be used alone or in combination. Examples of the inorganic filler include fused silica powder, crystalline silica powder, alumina, and silicon nitride. The amount of the inorganic filler is preferably 60 to 90% by weight in the whole composition in view of the balance between moldability and reliability. In particular, in a composition having a large amount of filler, spherical fused silica is generally used.
【００１０】本発明のエポキシ樹脂組成物はエポキシ樹
脂、フェノール樹脂硬化剤、硬化促進剤、赤燐系難燃
剤、硼素系難燃剤及び無機充填材を必須成分とするが、
これ以外に必要に応じてシランカップリング剤、カーボ
ンブラック、ベンガラ等の着色剤、天然ワックス、合成
ワックス等の離型剤及びシリコーンオイル、ゴム等の低
応力添加剤等の種々の添加剤を適宜配合しても差し支え
ない。又本発明の封止用エポキシ樹脂組成物を成形材料
として製造するには、必須成分である各成分、その他の
添加剤をミキサー等によって充分に均一に混合した後、
更に熱ロール又はニーダー等で溶融混練し、冷却後粉砕
して封止材料とすることができる。これらの成形材料は
電気部品あるいは電子部品であるトランジスタ、集積回
路等の被覆、絶縁、封止等に適用することができる。The epoxy resin composition of the present invention comprises an epoxy resin, a phenol resin curing agent, a curing accelerator, a red phosphorus flame retardant, a boron flame retardant and an inorganic filler as essential components.
In addition to this, various additives such as a silane coupling agent, a coloring agent such as carbon black and red iron oxide, a release agent such as natural wax and synthetic wax, and a low stress additive such as silicone oil and rubber may be appropriately used. It can be mixed. In addition, in order to produce the sealing epoxy resin composition of the present invention as a molding material, after each component which is an essential component and other additives are sufficiently uniformly mixed by a mixer or the like,
Furthermore, it can be melt-kneaded with a hot roll or a kneader, cooled, and pulverized to obtain a sealing material. These molding materials can be applied to coating, insulation, sealing, and the like of transistors and integrated circuits, which are electric or electronic components.
【００１１】以下本発明を実施例で具体的に説明する。 実施例１ 下記組成物 オルソクレゾールノボラック型エポキシ樹脂（融点６５℃、エポキシ当量２０ ０ｇ／ｅｑ） １８．３重量部 フェノールノボラック樹脂硬化剤（軟化点８０℃、水酸基当量１０４ｇ／ｅｑ ） ９．５重量部 溶融シリカ粉末（平均粒径１５μｍ、比表面積２．２ｍ2／ｇ） ６７．５重量部 トリフェニルホスフィン ０．２重量部 カーボンブラック ０．５重量部 カルナバワックス ０．５重量部 赤燐系難燃剤Ａ（水酸化アルミニウム及びフェノール樹脂の混合物で赤燐を表 面処理したもので、赤燐含有量７５重量％、平均粒径４０μｍ、最大粒径１５０ μｍ） ０．５重量部 硼酸亜鉛（２ＺｎＯ・３Ｂ2Ｏ3・３．５Ｈ2Ｏ） ３．０重量部 をミキサーで常温で混合し、７０〜１００℃で２軸ロー
ルにより混練し、冷却後粉砕して成形材料とした。更に
得られた成形材料をタブレット化し、低圧トランスファ
ー成形機にて１７５℃、７０Ｋｇ／ｃｍ2、１２０秒の
条件で、耐燃テスト用試験片を成形し、又耐湿性試験用
として３×３．５ のチップを１６ｐＤＩＰに封止し
た。封止したテスト用素子について下記の耐湿性試験を
行なった。評価結果を表１に示す。耐燃テスト：ＵＬ−
９４垂直試験（試料厚さ１．０ｍｍ）、難燃性で表し
た。耐湿性試験：封止したテスト用素子をプレッシャー
クッカー試験（１２５℃、１００％ＲＨ）を行い、回路
のオープン不良を測定した。Hereinafter, the present invention will be described specifically with reference to examples. Example 1 The following composition: Orthocresol novolak type epoxy resin (melting point: 65 ° C., epoxy equivalent: 200 g / eq) 18.3 parts by weight Phenol novolak resin curing agent (softening point: 80 ° C., hydroxyl equivalent: 104 g / eq) 9.5 parts by weight Parts fused silica powder (average particle size 15 μm, specific surface area 2.2 m 2 / g) 67.5 parts by weight triphenylphosphine 0.2 parts by weight carbon black 0.5 parts by weight carnauba wax 0.5 parts by weight Combustion agent A (Red phosphorus surface treated with a mixture of aluminum hydroxide and phenolic resin, red phosphorus content: 75% by weight, average particle size: 40 μm, maximum particle size: 150 μm) 0.5 part by weight Zinc borate (2ZnO 2) · 3B 2 a O 3 · 3.5H 2 O) 3.0 parts by weight at room temperature in a mixer, kneaded by biaxial roll at 70 to 100 ° C., cooled pulverized Was a molding material Te. Further, the obtained molding material was tableted, and a test piece for a flame resistance test was molded with a low pressure transfer molding machine at 175 ° C., 70 kg / cm 2 for 120 seconds, and 3 × 3.5 for a moisture resistance test. Was sealed in 16pDIP. The following moisture resistance test was performed on the sealed test element. Table 1 shows the evaluation results. Flame resistance test: UL-
94 vertical test (sample thickness 1.0 mm), expressed as flame retardancy. Moisture resistance test: The sealed test element was subjected to a pressure cooker test (125 ° C., 100% RH), and the open defect of the circuit was measured.
【００１２】実施例２〜７ 表１の処方に従って配合し、実施例１と同様にして成形
材料を得た。なお実施例５の赤燐系難燃剤Ｂは、フェノ
ール樹脂で赤燐を表面処理したもので、赤燐含有量８５
重量％、平均粒径２５μｍ、最大粒径１５０μｍであ
る。この成形材料で試験用の封止した成形品を得、この
成形品を用いて実施例１と同様に耐燃テスト及び耐湿性
試験を行なった。評価結果を表１に示す。 比較例１〜９ 表２の処方に従って配合し、実施例１と同様にして成形
材料を得た。比較例８、９のブロム化エポキシ樹脂は、
軟化点６０℃、エポキシ当量３６０ｇ／ｅｑである。こ
の成形材料で試験用の封止した成形品を得、この成形品
を用いて実施例１と同様に耐燃テスト及び耐湿性試験を
行なった。試験結果を表２に示す。Examples 2 to 7 Compounded according to the formulation shown in Table 1 and obtained in the same manner as in Example 1. The red phosphorus-based flame retardant B of Example 5 was obtained by subjecting red phosphorus to a surface treatment with a phenolic resin.
% By weight, average particle size 25 μm, maximum particle size 150 μm. A sealed molded product for a test was obtained from this molding material, and a flame resistance test and a moisture resistance test were performed using this molded product in the same manner as in Example 1. Table 1 shows the evaluation results. Comparative Examples 1 to 9 Compounded according to the formulation in Table 2, and a molding material was obtained in the same manner as in Example 1. The brominated epoxy resins of Comparative Examples 8 and 9 were:
The softening point is 60 ° C and the epoxy equivalent is 360 g / eq. A sealed molded product for a test was obtained from this molding material, and a flame resistance test and a moisture resistance test were performed using this molded product in the same manner as in Example 1. Table 2 shows the test results.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【表２】 [Table 2]
【００１５】[0015]
【発明の効果】本発明の組成物により、半導体素子を封
止することにより、ハロゲン系難燃剤、三酸化アンチモ
ンを含まないの耐湿性及び難燃性に優れた半導体装置を
得ることができる。As described above, by encapsulating a semiconductor element with the composition of the present invention, a semiconductor device containing no halogen-based flame retardant and antimony trioxide and having excellent moisture resistance and flame retardancy can be obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 23/31 (58)調査した分野(Int.Cl.7，ＤＢ名) G08L 63/00 - 63/10 C08G 59/62 C08K 3/02 C08K 3/38 H01L 23/29 ──────────────────────────────────────────────────の Continuation of the front page (51) Int.Cl. 7 identification code FI H01L 23/31 (58) Investigated field (Int.Cl. 7 , DB name) G08L 63/00-63/10 C08G 59/62 C08K 3/02 C08K 3/38 H01L 23/29
Claims (3)
樹脂硬化剤、（Ｃ）硬化促進剤、（Ｄ）赤燐系難燃剤、
（Ｅ）硼素系難燃剤及び（Ｆ）無機充填材からなり、全
組成物中の赤燐の含有量が０．１〜５重量％であり、全
組成物中の硼素系難燃剤の含有量が０．５〜８重量％で
あることを特徴とする半導体封止用エポキシ樹脂組成
物。1. An epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) a red phosphorus-based flame retardant,
(E) Ri Do boron-based flame retardant and (F) an inorganic filler, the total
The content of red phosphorus in the composition is 0.1 to 5% by weight,
When the content of the boron-based flame retardant in the composition is 0.5 to 8% by weight,
Oh semiconductor encapsulating epoxy resin composition according to claim Rukoto.
又は水酸化アルミニウム及びフェノール樹脂の混合物で
被覆されてなり、該赤燐系難燃剤中の赤燐の含有量が６
０〜９５重量％で、かつ平均粒径が１０〜７０μｍ、最
大粒径が１５０μｍ以下である請求項１記載の半導体封
止用エポキシ樹脂組成物。2. The red phosphorus-based flame retardant converts red phosphorus into a phenol resin,
Or, it is coated with a mixture of aluminum hydroxide and a phenol resin, and the content of red phosphorus in the red phosphorus-based flame retardant is 6 or less.
The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin composition is 0 to 95% by weight, has an average particle size of 10 to 70 µm, and has a maximum particle size of 150 µm or less.
Ｂ2Ｏ3・３．５Ｈ2Ｏ）である請求項１又は請求項２記
載の半導体封止用エポキシ樹脂組成物。3. The boron-based flame retardant is zinc borate (2ZnO.3).
3. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the composition is B 2 O 3 .3.5H 2 O).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29525294A JP3343704B2 (en) | 1994-11-29 | 1994-11-29 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29525294A JP3343704B2 (en) | 1994-11-29 | 1994-11-29 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08151505A JPH08151505A (en) | 1996-06-11 |
| JP3343704B2 true JP3343704B2 (en) | 2002-11-11 |
Family
ID=17818190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29525294A Expired - Fee Related JP3343704B2 (en) | 1994-11-29 | 1994-11-29 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3343704B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW339353B (en) * | 1995-12-22 | 1998-09-01 | Sumitomo Bakelite Co | Epoxy resin composition |
| JPH10152599A (en) * | 1996-11-21 | 1998-06-09 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JP3608930B2 (en) * | 1997-08-07 | 2005-01-12 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| JP2000281874A (en) | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| WO2001005889A1 (en) * | 1999-07-14 | 2001-01-25 | Hitachi, Ltd. | Epoxy resin composition for semiconductor sealing and semiconductor device |
| TWI258634B (en) * | 1999-10-22 | 2006-07-21 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element using the same, a process for producing resist pattern and resist pattern laminate |
| KR100679368B1 (en) * | 1999-12-31 | 2007-02-05 | 주식회사 케이씨씨 | Epoxy resin composition for sealing semiconductor element and semiconductor device using the same |
| JP3489025B2 (en) * | 2000-01-14 | 2004-01-19 | 大塚化学ホールディングス株式会社 | Epoxy resin composition and electronic component using the same |
| SG90752A1 (en) * | 2000-09-26 | 2002-08-20 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
| KR100407209B1 (en) * | 2000-12-06 | 2003-11-28 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device |
| KR100660082B1 (en) * | 2005-05-12 | 2006-12-20 | 권성웅 | Improved Phenolic Foam Using Novolak Type Phenolic Resin and its Method and the Composition |
| CN101189275B (en) * | 2005-05-31 | 2011-08-17 | 株式会社艾迪科 | Hardenable epoxy resin composition |
| EP2123712A1 (en) | 2008-05-19 | 2009-11-25 | Evonik Degussa GmbH | Epoxy resin composition and electronic part |
-
1994
- 1994-11-29 JP JP29525294A patent/JP3343704B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08151505A (en) | 1996-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0915118B1 (en) | Epoxy resin composition and semiconductor device encupsulated therewith | |
| JP3343704B2 (en) | Epoxy resin composition | |
| JP3537082B2 (en) | Epoxy resin composition and semiconductor device | |
| JP3317481B2 (en) | Resin composition for semiconductor encapsulation | |
| JPH08151427A (en) | Epoxy resin composition | |
| JP2843244B2 (en) | Epoxy resin composition | |
| JP3339772B2 (en) | Epoxy resin composition | |
| JPH10152599A (en) | Epoxy resin composition | |
| JP3389095B2 (en) | Epoxy resin composition and semiconductor device | |
| JP2626377B2 (en) | Epoxy resin composition and semiconductor device | |
| JP3003887B2 (en) | Resin composition for semiconductor encapsulation | |
| JP2001158852A (en) | Epoxy resin composition and semiconductor device | |
| JP3310447B2 (en) | Epoxy resin composition | |
| JPH07173372A (en) | Epoxy resin composition | |
| JP3235798B2 (en) | Epoxy resin composition | |
| JP2938080B2 (en) | Epoxy resin composition for semiconductor encapsulation | |
| JP3305097B2 (en) | Epoxy resin composition | |
| JP3310446B2 (en) | Epoxy resin composition | |
| JP3008981B2 (en) | Epoxy resin composition | |
| JP2000248155A (en) | Epoxy resin composition and semiconductor device | |
| JP2000281874A (en) | Epoxy resin composition and semiconductor device | |
| JPH1077390A (en) | Epoxy resin composition | |
| JP3305098B2 (en) | Epoxy resin composition | |
| JP2576726B2 (en) | Epoxy resin composition | |
| JP3235799B2 (en) | Epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090830 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100830 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110830 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120830 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130830 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |