JPH08151427A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH08151427A JPH08151427A JP23717394A JP23717394A JPH08151427A JP H08151427 A JPH08151427 A JP H08151427A JP 23717394 A JP23717394 A JP 23717394A JP 23717394 A JP23717394 A JP 23717394A JP H08151427 A JPH08151427 A JP H08151427A
- Authority
- JP
- Japan
- Prior art keywords
- red phosphorus
- flame retardant
- epoxy resin
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は難燃性に優れた半導体封
止用エポキシ樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor encapsulating epoxy resin composition having excellent flame retardancy.
【0002】[0002]
【従来の技術】従来、ダイオード、トランジスタ、集積
回路等の電子部品は、エポキシ樹脂組成物で封止されて
いる。この組成物中には、難燃剤としてハロゲン系難燃
剤単独あるいはハロゲン系難燃剤と三酸化アンチモンと
の併用、充填材として溶融シリカ、結晶シリカ等の無機
充填材が配合されている。ところが、環境衛生の点から
ハロゲン系難燃剤、三酸化アンチモンを使用しない難燃
性エポキシ樹脂組成物が要求されている。2. Description of the Related Art Conventionally, electronic parts such as diodes, transistors and integrated circuits have been encapsulated with an epoxy resin composition. In this composition, a halogen-based flame retardant alone or a combination of a halogen-based flame retardant and antimony trioxide is used as a flame retardant, and an inorganic filler such as fused silica or crystalline silica is blended as a filler. However, from the viewpoint of environmental hygiene, there is a demand for a flame-retardant epoxy resin composition that does not use a halogen-based flame retardant or antimony trioxide.
【0003】この要求に対して、水酸化アルミニウムや
水酸化マグネシウムの様な金属水酸化物、ホウ素化合物
等が検討されてきたが、不純物が多くかつ多量に添加し
ないと効果が発現できないことから実用化には至ってい
ない。又赤燐系の難燃剤は少量の添加で効果が有りエポ
キシ樹脂組成物の難燃化に有用であるが、赤燐は微量の
水分と反応しフォスフィンや腐食性の燐酸を生ずるた
め、耐湿性に対する要求が極めて厳しい半導体封止用エ
ポキシ樹脂組成物には使用できない。このため、赤燐粒
子を水酸化アルミニウム、金属酸化物、その他の無機化
合物、熱硬化性樹脂等の有機化合物で被覆し、赤燐の安
定化を図っているが半導体封止用エポキシ樹脂組成物に
採用できるまでの水準には至っていない。In response to this requirement, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, boron compounds, etc. have been studied, but they are practically used because they contain many impurities and cannot be effective unless they are added in large amounts. It has not been realized. Red phosphorus-based flame retardants are effective in adding a small amount and are useful for making an epoxy resin composition flame-retardant. However, red phosphorus reacts with a small amount of water to generate phosphine and corrosive phosphoric acid, so that moisture resistance is high. It cannot be used for epoxy resin compositions for semiconductor encapsulation, which have extremely strict requirements. For this reason, red phosphorus particles are coated with aluminum hydroxide, metal oxides, other inorganic compounds, organic compounds such as thermosetting resins to stabilize red phosphorus. It hasn't reached the standard yet.
【0004】[0004]
【発明が解決しようとする課題】本発明は、この様な問
題に対して、赤燐系難燃剤の添加により難燃化を達成
し、かつイオン捕捉剤の添加により耐湿性を向上させ、
ハロゲン系難燃剤、三酸化アンチモンを含まない半導体
封止用エポキシ樹脂組成物を提供するものである。SUMMARY OF THE INVENTION In order to solve such problems, the present invention achieves flame retardancy by adding a red phosphorus flame retardant and improves moisture resistance by adding an ion scavenger.
The present invention provides a semiconductor encapsulating epoxy resin composition containing no halogen-based flame retardant and antimony trioxide.
【0005】[0005]
【課題を解決するための手段】本発明は、(A)エポキ
シ樹脂、(B)フェノール樹脂硬化剤、(C)硬化促進
剤、(D)赤燐系難燃剤、(E)イオン捕捉剤及び
(F)無機充填材からなる半導体封止用エポキシ樹脂組
成物である。The present invention provides (A) epoxy resin, (B) phenol resin curing agent, (C) curing accelerator, (D) red phosphorus flame retardant, (E) ion scavenger, and (F) An epoxy resin composition for semiconductor encapsulation, which comprises an inorganic filler.
【0006】本発明で用いる赤燐系難燃剤には赤燐単独
も含まれるが酸化され易く、又不安定なため取り扱いに
難点があり、フェノール樹脂、又は水酸化アルミニウム
及びフェノール樹脂の混合物で赤燐の表面を予め被覆さ
れたものが好ましい。被覆された難燃剤中の赤燐の含有
量は60〜95重量%であることが好ましい。赤燐含有
量が60重量%未満だと多量に添加する必要があり、9
5重量%を越えると赤燐の安定性の点で問題がある。又
赤燐系難燃剤の粒径としては、平均粒径が10〜70μ
m、最大粒径が150μm以下のものが好ましい。平均
粒径が10μm未満だと組成物の流動性の低下をきた
し、70μmを越えると難燃剤の分散性が悪くなる。又
最大粒径が150μmを越えるとパッケージの充填性に
問題が生じる。赤燐系難燃剤としては、例えば燐化学工
業(株)のノーバレッド、ノーバエクセル等があり市場よ
り容易に入手することができる。全組成物中の赤燐の含
有量としては0.3〜5重量%が好ましく、0.3重量
%未満だと難燃性が不足する。又赤燐系難燃剤は可燃性
で難燃剤自身が酸化して難燃性を発揮するため、5重量
%を越えると難燃剤が多過ぎることにより難燃剤が燃焼
を助ける働きをし難燃性が不足する。The red phosphorus-based flame retardant used in the present invention includes red phosphorus alone, but is difficult to handle because it is easily oxidized and unstable, and the red resin is a red resin or a mixture of aluminum hydroxide and phenol resin. It is preferable that the surface of phosphorus is previously coated. The content of red phosphorus in the coated flame retardant is preferably 60 to 95% by weight. If the red phosphorus content is less than 60% by weight, it is necessary to add a large amount.
If it exceeds 5% by weight, there is a problem in the stability of red phosphorus. The average particle size of the red phosphorus flame retardant is 10 to 70μ.
m, and the maximum particle size is preferably 150 μm or less. When the average particle size is less than 10 μm, the fluidity of the composition is lowered, and when it exceeds 70 μm, the dispersibility of the flame retardant is deteriorated. Further, if the maximum particle size exceeds 150 μm, there is a problem in the filling property of the package. Examples of red phosphorus flame retardants include Noval red and Nova Excel of Phosphorus Chemical Co., Ltd., which can be easily obtained from the market. The content of red phosphorus in the entire composition is preferably 0.3 to 5% by weight, and if it is less than 0.3% by weight, flame retardancy is insufficient. The red phosphorus flame retardant is flammable, and the flame retardant itself oxidizes and exhibits flame retardancy. If it exceeds 5% by weight, the flame retardant acts too much due to the excessive amount of flame retardant and thus the flame retardant property. Run out.
【0007】本発明に用いるイオン捕捉剤は、燐酸、有
機酸アニオン、ハロゲンアニオン、アルカリ金属カチオ
ン、アルカリ土類金属カチオン等を捕促することにより
イオン性不純物を減少させるものである。赤燐より発生
する燐酸によりアルミニウムが腐食することは知られて
おり、燐酸を捕促することによりアルミニウムの腐食反
応を防止するものである。イオン捕捉剤としては、Bi
OX(OH)Y(NO3)Z〔ここで、X=0.9〜1.
1、Y=0.6〜0.8、Z=0.2〜0.4〕、Mg
4.3Al2(OH)12.6CO3・3.5H2O、Sb2O5・
2H2O、SbSiVBiWOX(OH)Y(NO3)Z・n
H2O〔ここで、V=0.1〜0.3、W=1.5〜
1.9、X=4.1〜4.5、Y=1.2〜1.6、Z
=0.2〜0.3、n=1〜2〕等が挙げられ、これら
の内ではBiOX(OH)Y(NO3)Z、Mg4.3Al
2(OH)12.6CO3・3.5H2Oが陰イオンを選択的
に捕捉するためより好ましく、これらは単独でも混合し
て用いてもよい。又これらのものは市場より容易に入手
できる。このイオン捕捉剤は、全組成物中に0.2〜2
重量%含有することが好ましい。0.2重量%未満だと
耐湿性が不足し、2重量%を越えると難燃性が低下する
ためである。The ion scavenger used in the present invention reduces ionic impurities by stimulating phosphoric acid, organic acid anions, halogen anions, alkali metal cations, alkaline earth metal cations and the like. It is known that aluminum is corroded by phosphoric acid generated from red phosphorus, and it is intended to prevent the corrosion reaction of aluminum by promoting phosphoric acid. As an ion scavenger, Bi
O X (OH) Y (NO 3 ) Z [where X = 0.9 to 1.
1, Y = 0.6 to 0.8, Z = 0.2 to 0.4], Mg
4.3 Al 2 (OH) 12.6 CO 3 · 3.5H 2 O, Sb 2 O 5 ·
2H 2 O, SbSi V Bi W O X (OH) Y (NO 3) Z · n
H 2 O [where V = 0.1 to 0.3, W = 1.5 to
1.9, X = 4.1 to 4.5, Y = 1.2 to 1.6, Z
= 0.2~0.3, n = 1~2], and the like, BiO X (OH) Y ( NO 3) is a of these Z, Mg 4.3 Al
2 (OH) 12.6 CO 3 .3.5H 2 O is more preferable because it selectively captures anions, and these may be used alone or in combination. Also, these items are easily available from the market. This ion scavenger is 0.2 to 2 in the total composition.
It is preferable to contain it by weight%. This is because if it is less than 0.2% by weight, the moisture resistance is insufficient, and if it exceeds 2% by weight, the flame retardancy decreases.
【0008】本発明に用いるエポキシ樹脂は、1分子中
にエポキシ基を2個以上有するモノマー、オリゴマー、
ポリマー全般を言い、その分子量、分子構造を特に限定
するものではないが、例えばビフェニル型エポキシ化合
物、ビスフェノール型エポキシ化合物、フェノールノボ
ラック型エポキシ樹脂、クレゾールノボラック型エポキ
シ樹脂、トリフェノールメタン型エポキシ化合物、アル
キル変性トリフェノールメタン型エポキシ化合物及びト
リアジン核含有エポキシ樹脂等が挙げられ、単独でも混
合して用いても差し支えない。本発明に用いるフェノー
ル樹脂硬化剤は、その分子量、分子構造を特に限定する
ものではないが、例えばフェノールノボラック樹脂、ク
レゾールノボラック樹脂、ジシクロペンタジエン変性フ
ェノール樹脂、パラキシリレン変性フェノール樹脂、テ
ルペン変性フェノール樹脂、トリフェノールメタン化合
物等が挙げられ、特にフェノールノボラック樹脂、ジシ
クロペンタジエン変性フェノール樹脂、パラキシリレン
変性フェノール樹脂、テルペン変性フェノール樹脂等が
好ましく、単独でも混合しても差し支えない。また、こ
れらの硬化剤の配合量としては、エポキシ化合物のエポ
キシ基数とフェノール樹脂硬化剤の水酸基数の比は0.
8〜1.2が好ましい。The epoxy resin used in the present invention is a monomer, oligomer, or the like having two or more epoxy groups in one molecule.
It refers to polymers in general, and its molecular weight and molecular structure are not particularly limited, but examples thereof include biphenyl type epoxy compounds, bisphenol type epoxy compounds, phenol novolac type epoxy resins, cresol novolac type epoxy resins, triphenol methane type epoxy compounds, alkyls. Examples thereof include modified triphenol methane type epoxy compounds and triazine nucleus-containing epoxy resins, which may be used alone or in combination. Phenolic resin curing agent used in the present invention, the molecular weight, although not particularly limited molecular structure, for example, phenol novolac resin, cresol novolac resin, dicyclopentadiene modified phenol resin, paraxylylene modified phenol resin, terpene modified phenol resin, Examples thereof include triphenol methane compounds. Phenol novolac resins, dicyclopentadiene-modified phenol resins, paraxylylene-modified phenol resins, terpene-modified phenol resins and the like are preferable, and they may be used alone or in combination. Further, as a blending amount of these curing agents, the ratio of the number of epoxy groups of the epoxy compound and the number of hydroxyl groups of the phenol resin curing agent is 0.
8 to 1.2 is preferable.
【0009】本発明に用いる硬化促進剤は、エポキシ基
と水酸基との硬化反応を促進させるものであればよく、
一般に封止材料に使用されているものを広く使用するこ
とができる。例えば1,8−ジアザビシクロウンデセ
ン、トリフェニルホスフィン、ベンジルジメチルアミン
や2−メチルイミダゾール等が挙げられ、単独でも混合
して用いても差し支えない。無機充填材としては、溶融
シリカ粉末、結晶シリカ粉末、アルミナ、窒化珪素等が
挙げられる。これら無機充填材の配合量は成形性と信頼
性のバランスから全樹脂組成物中に60〜90重量%含
有することが好ましい。特に充填材量の多い配合では、
球状の溶融シリカを用いるのが一般的である。The curing accelerator used in the present invention may be any one as long as it accelerates the curing reaction between the epoxy group and the hydroxyl group.
What is generally used as a sealing material can be widely used. Examples thereof include 1,8-diazabicycloundecene, triphenylphosphine, benzyldimethylamine and 2-methylimidazole, which may be used alone or in combination. Examples of the inorganic filler include fused silica powder, crystalline silica powder, alumina, silicon nitride and the like. The blending amount of these inorganic fillers is preferably 60 to 90% by weight based on the balance between moldability and reliability. Especially with a large amount of filler,
It is common to use spherical fused silica.
【0010】本発明のエポキシ樹脂組成物はエポキシ樹
脂、フェノール樹脂硬化剤、硬化促進剤、赤燐系難燃
剤、イオン捕捉剤及び無機充填材を必須成分とするが、
これ以外に必要に応じてシランカップリング剤、カーボ
ンブラック、ベンガラ等の着色剤、天然ワックス、合成
ワックス等の離型剤及びシリコーンオイル、ゴム等の低
応力添加剤等の種々の添加剤を適宜配合しても差し支え
ない。又本発明の封止用エポキシ樹脂組成物を成形材料
として製造するには、必須成分である各成分、その他の
添加剤をミキサー等によって充分に均一に混合した後、
更に熱ロールまたはニーダー等で溶融混練し、冷却後粉
砕して封止材料とすることができる。これらの成形材料
は電気部品あるいは電子部品であるトランジスタ、集積
回路等の被覆、絶縁、封止等に適用することができる。The epoxy resin composition of the present invention contains an epoxy resin, a phenol resin curing agent, a curing accelerator, a red phosphorus flame retardant, an ion scavenger and an inorganic filler as essential components.
In addition to these, various additives such as a silane coupling agent, a coloring agent such as carbon black and red iron oxide, a release agent such as natural wax and a synthetic wax, and a low stress additive such as silicone oil and rubber are appropriately added as necessary. There is no problem even if it is mixed. Further, in order to produce the encapsulating epoxy resin composition of the present invention as a molding material, after the components which are essential components and other additives are sufficiently uniformly mixed by a mixer or the like,
Further, it can be melt-kneaded with a hot roll or a kneader, cooled, and then pulverized to obtain a sealing material. These molding materials can be applied to coating, insulation, sealing, etc. of transistors, integrated circuits, etc., which are electric or electronic parts.
【0011】以下本発明を実施例で具体的に説明する。 実施例1 下記組成物 オルソクレゾールノボラック型エポキシ樹脂(融点65℃、エポキシ当量20 0g/eq) 18.3重量部 フェノールノボラック樹脂硬化剤(軟化点80℃、水酸基当量104g/eq ) 9.5重量 部 溶融シリカ粉末(平均粒径15μm、比表面積2.2m2/g) 68.5重量部 トリフェニルホスフィン 0.2重量部 カーボンブラック 0.5重量部 カルナバワックス 0.5重量部 赤燐系難燃剤A(水酸化アルミニウム及びフェノール樹脂の混合物で赤燐を表 面処理したもので、赤燐含有量75重量%、平均粒径40μm、最大粒径150 μm) 2.0重量部 ビスマス系イオン捕捉剤〔BiOX(OH)Y(NO3)Z〕 0.5重量部 をミキサーで常温で混合し、70〜100℃で2軸ロー
ルにより混練し、冷却後粉砕して成形材料とした。更に
得られた成形材料をタブレット化し、低圧トランスファ
ー成形機にて175℃、70Kg/cm2、120秒の
条件で、耐燃テスト用試験片を成形し、又耐湿性試験用
として3×3.5mmのチップを16pDIPに封止し
た。封止したテスト用素子について下記の耐湿性試験を
行なった。 耐燃テスト:ULー94垂直試験(試料厚さ1.0m
m)、難燃性で表した。 耐湿性試験:封止したテスト用素子をプレッシャークッ
カー試験(125℃、100%RH)を行い、回路のオ
ープン不良を測定した。試験結果を表1に示す。The present invention will be specifically described below with reference to examples. Example 1 Composition below Orthocresol novolac type epoxy resin (melting point 65 ° C., epoxy equivalent 200 g / eq) 18.3 parts by weight Phenol novolac resin curing agent (softening point 80 ° C., hydroxyl equivalent 104 g / eq) 9.5 parts by weight Parts fused silica powder (average particle size 15 μm, specific surface area 2.2 m 2 / g) 68.5 parts by weight triphenylphosphine 0.2 parts by weight carbon black 0.5 parts by weight carnauba wax 0.5 parts by weight Combustion agent A (red phosphorus surface-treated with a mixture of aluminum hydroxide and phenol resin, red phosphorus content 75% by weight, average particle size 40 μm, maximum particle size 150 μm) 2.0 parts by weight Bismuth ion trapping agent [BiO X (OH) Y (NO 3) Z ] 0.5 parts by weight at room temperature in a mixer, kneaded by biaxial roll at 70 to 100 ° C. Was molded material followed by cooling then pulverizing. Further, the obtained molding material was tabletted, and a low pressure transfer molding machine was used to mold a test piece for flame resistance test under the conditions of 175 ° C., 70 Kg / cm 2 and 120 seconds, and 3 × 3.5 mm for humidity resistance test. The chip was encapsulated in 16 pDIP. The following moisture resistance test was performed on the sealed test element. Flame resistance test: UL-94 vertical test (sample thickness 1.0m
m), expressed as flame retardancy. Moisture resistance test: The sealed test element was subjected to a pressure cooker test (125 ° C., 100% RH) to measure the open circuit failure. Table 1 shows the test results.
【0012】実施例2〜7 表1の処方に従って配合し、実施例1と同様にして成形
材料を得た。なお実施例5のアルミニウム・マグネシウ
ム系イオン捕捉剤は、Mg4.3Al2(OH)12.6CO3
・3.5H2Oで、実施例6の赤燐系難燃剤Bは、フェ
ノール樹脂で赤燐を表面処理したもので、赤燐含有量8
5重量%、平均粒径25μm、最大粒径150μmであ
る。この成形材料で試験用の封止した成形品を得、この
成形品を用いて実施例1と同様に耐燃テスト及び耐湿性
試験を行なった。試験結果を表1に示す。 比較例1〜7 表2の処方に従って配合し、実施例1と同様にして成形
材料を得た。比較例7のブロム化エポキシ樹脂は、軟化
点60℃、エポキシ当量360g/eqである。この成
形材料で試験用の封止した成形品を得、この成形品を用
いて実施例1と同様に耐燃テスト及び耐湿性試験を行な
った。試験結果を表2に示す。Examples 2 to 7 Compounding was carried out according to the formulation shown in Table 1, and molding materials were obtained in the same manner as in Example 1. The aluminum / magnesium ion scavenger of Example 5 was Mg 4.3 Al 2 (OH) 12.6 CO 3
The red phosphorus flame retardant B of Example 6 was 3.5 H 2 O, and the red phosphorus was surface-treated with a phenol resin.
5% by weight, average particle size 25 μm, and maximum particle size 150 μm. A molded product sealed with a test material was obtained from this molding material, and a flame resistance test and a moisture resistance test were conducted in the same manner as in Example 1 using this molded product. Table 1 shows the test results. Comparative Examples 1 to 7 Compounding was carried out according to the formulation of Table 2 and molding materials were obtained in the same manner as in Example 1. The brominated epoxy resin of Comparative Example 7 has a softening point of 60 ° C. and an epoxy equivalent of 360 g / eq. A molded product sealed with a test material was obtained from this molding material, and a flame resistance test and a moisture resistance test were conducted in the same manner as in Example 1 using this molded product. The test results are shown in Table 2.
【0013】[0013]
【表1】 [Table 1]
【0014】[0014]
【表2】 [Table 2]
【0015】[0015]
【発明の効果】本発明の組成物により、半導体素子を封
止することにより、ハロゲン系難燃剤、三酸化アンチモ
ンを含まない耐湿性及び難燃性に優れた半導体装置を得
ることができる。By encapsulating a semiconductor element with the composition of the present invention, it is possible to obtain a semiconductor device which does not contain a halogen-based flame retardant and antimony trioxide and has excellent moisture resistance and flame retardancy.
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08K 3/18 NKV C08L 63/00 NLD H01L 23/29 23/31 Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display location C08K 3/18 NKV C08L 63/00 NLD H01L 23/29 23/31
Claims (5)
樹脂硬化剤、(C)硬化促進剤、(D)赤燐系難燃剤、
(E)イオン補捉剤及び(F)無機充填材からなること
を特徴とする半導体封止用エポキシ樹脂組成物。1. (A) Epoxy resin, (B) Phenolic resin curing agent, (C) Curing accelerator, (D) Red phosphorus flame retardant,
An epoxy resin composition for semiconductor encapsulation, comprising (E) an ion scavenger and (F) an inorganic filler.
又は水酸化アルミニウム及びフェノール樹脂の混合物で
被覆されてなり、該赤燐系難燃剤中の赤燐の含有量が6
0〜95重量%で、かつ平均粒径が10〜70μm、最
大粒径が150μm以下である請求項1記載の半導体封
止用エポキシ樹脂組成物。2. The red phosphorus flame retardant is red phosphorus which is a phenol resin,
Alternatively, it is coated with a mixture of aluminum hydroxide and a phenol resin, and the content of red phosphorus in the red phosphorus flame retardant is 6
The epoxy resin composition for semiconductor encapsulation according to claim 1, which is 0 to 95% by weight, has an average particle size of 10 to 70 μm, and has a maximum particle size of 150 μm or less.
3)Z〔ここで、X=0.9〜1.1、Y=0.6〜0.
8、Z=0.2〜0.4〕及び/又はMg4.3Al2(O
H)12.6CO3・3.5H2Oである請求項1又は請求項
2記載の半導体封止用エポキシ樹脂組成物。3. The ion scavenger is BiO x (OH) Y (NO
3 ) Z [where X = 0.9 to 1.1 and Y = 0.6 to 0.
8, Z = 0.2 to 0.4] and / or Mg 4.3 Al 2 (O
H) The epoxy resin composition for semiconductor encapsulation according to claim 1 or 2, which is 12.6 CO 3 .3.5H 2 O.
重量%である請求項1、請求項2又は請求項3記載の半
導体封止用エポキシ樹脂組成物。4. The content of red phosphorus in the entire composition is 0.3-5.
The epoxy resin composition for semiconductor encapsulation according to claim 1, 2 or 3, which is in weight%.
0.2〜2重量%である請求項1、請求項2、請求項3
又は請求項4記載の半導体封止用エポキシ樹脂組成物。5. The content of the ion scavenger in the total composition is 0.2 to 2% by weight, claim 1, claim 2, claim 3.
Alternatively, the epoxy resin composition for semiconductor encapsulation according to claim 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23717394A JPH08151427A (en) | 1994-09-27 | 1994-09-30 | Epoxy resin composition |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23107494 | 1994-09-27 | ||
JP6-231074 | 1994-09-27 | ||
JP23717394A JPH08151427A (en) | 1994-09-27 | 1994-09-30 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08151427A true JPH08151427A (en) | 1996-06-11 |
Family
ID=26529681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23717394A Pending JPH08151427A (en) | 1994-09-27 | 1994-09-30 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08151427A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0783025A3 (en) * | 1995-12-22 | 1997-10-01 | Sumitomo Bakelite Co | Epoxy resin composition |
JPH10152599A (en) * | 1996-11-21 | 1998-06-09 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
JPH10182940A (en) * | 1996-12-27 | 1998-07-07 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing material and semiconductor device produced by using the composition |
JPH11279379A (en) * | 1998-01-27 | 1999-10-12 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing of semiconductor, and semiconductor apparatus |
JP2002327105A (en) * | 2001-05-07 | 2002-11-15 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor apparatus |
US6858300B2 (en) | 2000-05-25 | 2005-02-22 | Nippon Chemical Industrial Co., Ltd | Red phosphorus-base flame retardant for epoxy resins, red phosphorus-base flame retardant compositions therefor, processes for the production of both, epoxy resin compositions for sealing for semiconductor devices, sealants and semiconductor devices |
KR100675267B1 (en) * | 2000-01-14 | 2007-01-26 | 오츠카 가가쿠 홀딩스 가부시키가이샤 | Epoxy resin composition and electronic part |
EP2123712A1 (en) | 2008-05-19 | 2009-11-25 | Evonik Degussa GmbH | Epoxy resin composition and electronic part |
-
1994
- 1994-09-30 JP JP23717394A patent/JPH08151427A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0783025A3 (en) * | 1995-12-22 | 1997-10-01 | Sumitomo Bakelite Co | Epoxy resin composition |
US5869553A (en) * | 1995-12-22 | 1999-02-09 | Sumitomo Bakelite Company Limited | Epoxy resin composition comprising red phosphorus |
JPH10152599A (en) * | 1996-11-21 | 1998-06-09 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
JPH10182940A (en) * | 1996-12-27 | 1998-07-07 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing material and semiconductor device produced by using the composition |
JPH11279379A (en) * | 1998-01-27 | 1999-10-12 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing of semiconductor, and semiconductor apparatus |
KR100675267B1 (en) * | 2000-01-14 | 2007-01-26 | 오츠카 가가쿠 홀딩스 가부시키가이샤 | Epoxy resin composition and electronic part |
US6858300B2 (en) | 2000-05-25 | 2005-02-22 | Nippon Chemical Industrial Co., Ltd | Red phosphorus-base flame retardant for epoxy resins, red phosphorus-base flame retardant compositions therefor, processes for the production of both, epoxy resin compositions for sealing for semiconductor devices, sealants and semiconductor devices |
JP2002327105A (en) * | 2001-05-07 | 2002-11-15 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor apparatus |
EP2123712A1 (en) | 2008-05-19 | 2009-11-25 | Evonik Degussa GmbH | Epoxy resin composition and electronic part |
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