JP3155652B2 - Substrate cleaning device - Google Patents

Substrate cleaning device

Info

Publication number
JP3155652B2
JP3155652B2 JP22975293A JP22975293A JP3155652B2 JP 3155652 B2 JP3155652 B2 JP 3155652B2 JP 22975293 A JP22975293 A JP 22975293A JP 22975293 A JP22975293 A JP 22975293A JP 3155652 B2 JP3155652 B2 JP 3155652B2
Authority
JP
Japan
Prior art keywords
cleaning
substrate
brush
disk brush
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP22975293A
Other languages
Japanese (ja)
Other versions
JPH0786222A (en
Inventor
博嗣 熊澤
重美 藤山
太 島井
宏仁 佐合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP22975293A priority Critical patent/JP3155652B2/en
Priority to KR1019940020527A priority patent/KR100299333B1/en
Publication of JPH0786222A publication Critical patent/JPH0786222A/en
Application granted granted Critical
Publication of JP3155652B2 publication Critical patent/JP3155652B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明はガラス基板等の表面に付
着している微細なゴミを排除する洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus for removing fine dust adhering to the surface of a glass substrate or the like.

【０００２】[0002]

【従来の技術】例えばガラス基板の一面にＴＦＴ（薄膜
トランジスタ）を形成したカラー液晶基板を製作するに
は、半導体ウェハ上にデバイスを形成する場合と同様に
被膜の形成等多くの表面処理工程を経て製作される。2. Description of the Related Art For example, in order to manufacture a color liquid crystal substrate in which a TFT (thin film transistor) is formed on one surface of a glass substrate, many surface treatment steps such as formation of a coating film are performed in the same manner as when forming a device on a semiconductor wafer. Be produced.

【０００３】ここで、表面処理を行う前後にガラス基板
表面にゴミが付着していると、歩留まり低下の原因とな
るので、従来から表面処理を行う前後には必ず洗浄処理
を行っている。斯かる洗浄処理を行う装置としてディス
クブラシ或いはロールブラシで表面に付着しているゴミ
を排出するものが知られている。[0003] Here, the dust on the glass substrate surface before and after the surface treatment is attached, so causing a decrease Ri yield or, before or after the conventional surface treatment after performing sure cleaning process I have. As a device for performing such a cleaning process, there is known a device for discharging dust adhering to the surface with a disk brush or a roll brush.

【０００４】[0004]

【発明が解決しようとする課題】上述したようにブラシ
によってゴミを排除する場合には、ブラシにゴミが付着
し、洗浄能力が低下しやすく、また洗浄能力自体も十分
でなく洗浄時間がかかる不利がある。しかも、表面に傷
をつける恐れがあり問題となっている。When the dust is removed by the brush as described above, the dust adheres to the brush, and the cleaning ability is apt to be reduced. Further, the cleaning ability itself is not sufficient and the cleaning time is long. There is. In addition, there is a possibility that the surface may be damaged, which is a problem.

【０００５】[0005]

【課題を解決するための手段】上記課題を解決すべく本
発明に係る洗浄装置は、基板を回転せしめるテーブルに
対し相対的な水平位置が可変とされたディスクブラシ
と、このディスクブラシが取付けられている中空軸内に
臨ませた洗浄液を供給するパイプとを備え、前記ディス
クブラシと基板表面との間に洗浄水を噴出する超音波ノ
ズルとを一体的に移動せしめるようにした。In order to solve the above-mentioned problems, a cleaning apparatus according to the present invention comprises a disk brush having a variable horizontal position relative to a table for rotating a substrate, and a disk brush to which the disk brush is attached. Inside the hollow shaft
A pipe for supplying the exposed cleaning liquid is provided, and an ultrasonic nozzle for jetting cleaning water is integrally moved between the disk brush and the substrate surface.

【０００６】[0006]

【作用】ディスクブラシと水流により基板表面からゴミ
を離脱せしめ、超音波ノズルからの振動した洗浄液で上
記の離脱を助長する。しかも、基板表面には損傷を与え
ない。The dust is released from the substrate surface by the disk brush and the water flow, and the above-mentioned release is promoted by the vibrating cleaning liquid from the ultrasonic nozzle. Moreover, the substrate surface is not damaged.

【０００７】[0007]

【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。ここで、図１は本発明に係る基板洗浄装置の
全体平面図、図２はディスクブラシと超音波ノズルの移
動機構の縦断面図、図３はディスクブラシと超音波ノズ
ルの拡大断面図であり、基板洗浄装置１は図１に示すよ
うに、洗浄を行うステージＳ１と濯ぎと乾燥を行うステ
ージＳ２からなり、各ステージＳ１，Ｓ２にはガラス基
板Ｗを回転せしめるテーブル２，３が配置され、ステー
ジＳ１，Ｓ２間にはガラス基板Ｗの搬送路４が設けられ
ている。Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is an overall plan view of the substrate cleaning apparatus according to the present invention, FIG. 2 is a longitudinal sectional view of a moving mechanism of the disk brush and the ultrasonic nozzle, and FIG. 3 is an enlarged sectional view of the disk brush and the ultrasonic nozzle. As shown in FIG. 1, the substrate cleaning apparatus 1 includes a stage S1 for cleaning and a stage S2 for rinsing and drying. Tables 2 and 3 for rotating the glass substrate W are disposed on each of the stages S1 and S2. A transfer path 4 for the glass substrate W is provided between the stages S1 and S2.

【０００８】また、洗浄を行うステージＳ１に隣接して
ディスクブラシと超音波ノズルの移動機構１０を設けて
いる。この移動機構１０は図２に示すように、洗浄装置
１の本体内にベース１１を配置し、このベース１１上に
レール１２を設け、このレール１２に支持台１３を係合
し、この支持台１３の一部に設けたナット部１４をモー
タ１５によって回転せしめられるスクリューシャフト１
６に螺合し、支持台１３を図２において左右方向に移動
可能としている。Further, a moving mechanism 10 for moving the disk brush and the ultrasonic nozzle is provided adjacent to the stage S1 for cleaning. As shown in FIG. 2, the moving mechanism 10 has a base 11 disposed in the main body of the cleaning apparatus 1, a rail 12 is provided on the base 11, and a support 13 is engaged with the rail 12. 13 is a screw shaft 1 in which a nut portion 14 provided in a part of
6, and the support 13 can be moved in the left-right direction in FIG.

【０００９】支持台１３の上部には中空アーム１７の基
部を取り付け、この中空アーム１７の先端には筒体１８
を垂下し、この筒体１８内に中空軸１９を回転自在に支
承している。A base of a hollow arm 17 is attached to the upper part of the support base 13, and a cylindrical body 18 is attached to the tip of the hollow arm 17.
And a hollow shaft 19 is rotatably supported in the cylindrical body 18.

【００１０】また、中空アーム１７内の基部にはモータ
２０を設け、このモータ２０の軸に固着したプーリ２１
と前記中空軸１９の上端に固着したプーリ２２との間に
ベルト２３を張設し、モータ２０にて中空軸１９を回転
せしめるようにしている。A motor 20 is provided at the base in the hollow arm 17, and a pulley 21 fixed to the shaft of the motor 20 is provided.
A belt 23 is stretched between the shaft and a pulley 22 fixed to the upper end of the hollow shaft 19 so that the hollow shaft 19 is rotated by a motor 20.

【００１１】そして、前記中空軸１９の下端にはディス
クブラシ２４が取り付けられ、また中空軸１９内にはデ
ィスクブラシ２４内に洗浄液を供給するパイプ２５が臨
み、このパイプ２５にはチューブ２６から洗浄液が供給
される。更に、筒体１８の下部からは側方にブラケット
２７，２７が伸び、これらブラケット２７，２７に超音
波ノズル２８，２８を取り付け、これら超音波ノズル２
８，２８にはチューブ２９，２９を介して洗浄液を供給
するようにしている。尚、それぞれの超音波ノズルでは
異なる波長の超音波を印加するようにしている。At the lower end of the hollow shaft 19, a disk brush 24 is mounted. Inside the hollow shaft 19, a pipe 25 for supplying a cleaning liquid into the disk brush 24 faces. Is supplied. Further, brackets 27, 27 extend laterally from the lower part of the cylindrical body 18, and ultrasonic nozzles 28, 28 are attached to these brackets 27, 27.
The cleaning liquid is supplied to the tubes 8 and 28 via the tubes 29 and 29. In addition, each ultrasonic nozzle applies an ultrasonic wave of a different wavelength.

【００１２】以上において、洗浄を行うには、ステージ
Ｓ１のテーブル２上にガラス基板Ｗを載置してテーブル
２とともにガラス基板Ｗを回転せしめる。この回転速度
は回転塗布に比べて小さく、したがって吸着等によって
ガラス基板Ｗを固着する必要はない。In the above, in order to perform the cleaning, the glass substrate W is placed on the table 2 of the stage S1, and the glass substrate W is rotated together with the table 2. This rotation speed is lower than that of spin coating, and therefore it is not necessary to fix the glass substrate W by suction or the like.

【００１３】そして、ガラス基板Ｗを回転させつつパイ
プ２５及び超音波ノズル２８から洗浄液を供給しつつデ
ィスクブラシ２４を回転せしめて、ガラス基板Ｗ表面に
付着しているゴミを表面から離脱せしめる。ここで、デ
ィスクブラシ２４による洗浄は、ブラシの下端部をガラ
ス基板Ｗ表面から若干浮かせた状態でディスクブラシ２
４を回転させて行う。即ち、洗浄はディスクブラシ２４
を接触させて行う掻き取りではなく、ディスクブラシ２
４の回転によって洗浄液に泡立ち現象を起こさせ、これ
により基板表面を傷付けることなくゴミを離脱する。Then, the disc brush 24 is rotated while supplying the cleaning liquid from the pipe 25 and the ultrasonic nozzle 28 while rotating the glass substrate W, and the dust adhering to the surface of the glass substrate W is separated from the surface. Here, cleaning with broom 24 broom 2 lower ends of the brush in a state of or slightly floated from the glass substrate W surface
4 is rotated. That is, the cleaning is performed by the disc brush 24.
Instead of scraping by contacting the
The rotation of 4 causes a bubbling phenomenon to occur in the cleaning liquid, thereby removing dust without damaging the substrate surface.

【００１４】また、超音波ノズル２８、２８は筒体１８
の下部から伸びるブラケット２７、２７に取り付けら
れ、その軸線がディスクブラシ２４方向に傾いて異なる
波長超音波が印加されながらディスクブラシ２４とガラ
ス基板Ｗ表面との間に洗浄水を供給し、ディスクブラシ
２４に付着しているゴミ等を洗い落とす。そして、ガラ
ス基板Ｗの全面を洗浄するには図１に示すようにアーム
１７を水平面内で揺動せしめることで行う。Also, the ultrasonic nozzles 28 , 28
Attached to brackets 27, 27 extending from the bottom of the
And its axis is inclined in the direction of the disc brush 24 to be different.
The cleaning water is supplied between the disk brush 24 and the surface of the glass substrate W while the wavelength ultrasonic wave is being applied to wash away dust and the like adhering to the disk brush 24. The entire surface of the glass substrate W is cleaned by swinging the arm 17 in a horizontal plane as shown in FIG.

【００１５】尚、実施例としては基板としてガラス基板
を示したが、半導体ウェハ等の基板でもよい。また、超
音波ノズルは１つでもよい。Although a glass substrate is shown as a substrate in the embodiment, a substrate such as a semiconductor wafer may be used. Further, one ultrasonic nozzle may be used.

【００１６】[0016]

【発明の効果】以上に説明したように本発明に係る被膜
処理前後の基板表面の洗浄装置は、ディスクブラシと超
音波ノズルとを基板表面に対し一体的に水平動可能と
し、超音波ノズルからディスクブラシと基板表面との間
に洗浄水を供給しつつ洗浄を行うようにしたので、ディ
スクブラシに付着したゴミ等を効果的に取り除くことが
できるとともに洗浄効果自体も促進され、洗浄に要する
時間を大幅に短縮することができる。As described above, the apparatus for cleaning a substrate surface before and after the coating process according to the present invention enables the disk brush and the ultrasonic nozzle to be horizontally movable integrally with the substrate surface. Since cleaning is performed while supplying cleaning water between the disk brush and the substrate surface, dust and the like attached to the disk brush can be effectively removed, and the cleaning effect itself is promoted, and the time required for cleaning is increased. it can be shortened to a large width.

【００１７】特に、それぞれ異なる超音波を印加する超
音波ノズルをディスクブラシを中心として対向する位置
に配置することで、超音波による洗浄効果を更に向上す
ることができる。In particular, by arranging ultrasonic nozzles for applying different ultrasonic waves at positions facing each other around the disk brush, the cleaning effect by the ultrasonic waves can be further improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る基板洗浄装置の全体平面図FIG. 1 is an overall plan view of a substrate cleaning apparatus according to the present invention.

【図２】ディスクブラシと超音波ノズルの移動機構の縦
断面図FIG. 2 is a longitudinal sectional view of a moving mechanism of a disk brush and an ultrasonic nozzle.

【図３】ディスクブラシと超音波ノズルの拡大断面図FIG. 3 is an enlarged sectional view of a disk brush and an ultrasonic nozzle.

【符号の説明】[Explanation of symbols]

１…基板洗浄装置、２…テーブル、１０…移動機構、１
７…アーム、２４…ディスクブラシ、２８…超音波ノズ
ル、Ｓ１…洗浄ステージ、Ｓ２…濯ぎステージ、Ｗ…基
板。DESCRIPTION OF SYMBOLS 1 ... Substrate cleaning apparatus, 2 ... Table, 10 ... Moving mechanism, 1
7: Arm, 24: Disk brush, 28: Ultrasonic nozzle, S1: Cleaning stage, S2: Rinse stage, W: Substrate.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐合 宏仁 神奈川県川崎市中原区中丸子150番地 東京応化工業株式会社内 (56)参考文献 特開 平５−15857（ＪＰ，Ａ) 特開 平５−134398（ＪＰ，Ａ) 実開 平１−107129（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/304 644 H01L 21/304 643 B08B 3/12 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hirohito Sai 150 Nakamaruko, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Tokyo Ohka Kogyo Co., Ltd. (56) References JP-A-5-15857 (JP, A) 134398 (JP, A) Japanese Utility Model 1-107129 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/304 644 H01L 21/304 643 B08B 3/12

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 基板表面に存在するゴミを排除する洗浄
装置において、この洗浄装置は基板を回転せしめるテー
ブルと、このテーブルに対し相対的な水平位置が可変と
されたディスクブラシと、このディスクブラシが取付け
られている中空軸内に臨ませた洗浄液を供給するパイプ
と、前記ディスクブラシと一体的に移動するとともに前
記ディスクブラシと基板表面との間に洗浄水を噴出する
超音波ノズルとを備えていることを特徴とする基板洗浄
装置。1. A cleaning device for eliminating dust present on the substrate surface, and a table for rotating the cleaning device substrate, a disc brush relative horizontal position relative to the table is a variable, this broom Is mounted
Pipe that supplies the cleaning liquid that faces the hollow shaft
If, before as well as moving the disk brush and integrally
An apparatus for cleaning a substrate, comprising: an ultrasonic nozzle for jetting cleaning water between the disk brush and the surface of the substrate. 【請求項２】 前記超音波ノズルはディスクブラシを中
心として対向する位置に一対以上設けられ、それぞれの
ノズルで印加される超音波の波長が異なることを特徴と
する請求項１に記載の基板洗浄装置。2. The substrate cleaning apparatus according to claim 1, wherein a pair or more of the ultrasonic nozzles are provided at positions facing each other with a disk brush as a center, and wavelengths of ultrasonic waves applied by the respective nozzles are different. apparatus.
JP22975293A 1993-09-16 1993-09-16 Substrate cleaning device Expired - Fee Related JP3155652B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP22975293A JP3155652B2 (en) 1993-09-16 1993-09-16 Substrate cleaning device
KR1019940020527A KR100299333B1 (en) 1993-09-16 1994-08-19 Board Cleaning Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22975293A JP3155652B2 (en) 1993-09-16 1993-09-16 Substrate cleaning device

Publications (2)

Publication Number Publication Date
JPH0786222A JPH0786222A (en) 1995-03-31
JP3155652B2 true JP3155652B2 (en) 2001-04-16

Family

ID=16897134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22975293A Expired - Fee Related JP3155652B2 (en) 1993-09-16 1993-09-16 Substrate cleaning device

Country Status (2)

Country Link
JP (1) JP3155652B2 (en)
KR (1) KR100299333B1 (en)

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TW364165B (en) * 1996-11-29 1999-07-11 Canon Kk Method for fabricating semiconductor device
JP3630524B2 (en) * 1997-05-08 2005-03-16 大日本スクリーン製造株式会社 Substrate cleaning device
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
KR100333059B1 (en) * 1998-11-14 2002-10-25 삼성전자 주식회사 Method for washing of wafer and washing apparatus sane
WO2000059006A1 (en) * 1999-03-30 2000-10-05 Koninklijke Philips Electronics N.V. Semiconductor wafer cleaning apparatus and method
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JPH0786222A (en) 1995-03-31
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