KR100299333B1 - Board Cleaning Device - Google Patents
Board Cleaning Device Download PDFInfo
- Publication number
- KR100299333B1 KR100299333B1 KR1019940020527A KR19940020527A KR100299333B1 KR 100299333 B1 KR100299333 B1 KR 100299333B1 KR 1019940020527 A KR1019940020527 A KR 1019940020527A KR 19940020527 A KR19940020527 A KR 19940020527A KR 100299333 B1 KR100299333 B1 KR 100299333B1
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- KR
- South Korea
- Prior art keywords
- brush
- substrate
- disk brush
- disk
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000000428 dust Substances 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 9
- 239000011521 glass Substances 0.000 description 14
- 238000004381 surface treatment Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Coating Apparatus (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
본 발명은 세정을 단시간에 효과적으로 수행하는 기판세정장치에 관한 것으로, 모터(20)의 축에 고착한 풀리(21)와 중심축(19)의 상단에 고착한 풀리(22) 사이에 벨트(23)를 장설하여 중공축(19)을 회전시키도록 하고, 이 중공축(19)의 하단에 디스크부러쉬(24)를 부착하고, 또한 중공축(19)내에 디스크부러쉬(24)내에 세정액을 공급하는 파이프(25)가 접해있고, 이 파이프(25)에는 튜브(26)로부터 세정액이 공급된다. 또한 디스크부러쉬(24)에서는 측방으로 브라켓(27), (27)이 연장되고, 이들 브라켓(27), (27)에 초음파 노즐(28), (28)을 부착하고, 이들 초음파 노즐(28), (28)에는 튜브(29), (29)를 거쳐 세정액을 공급하도록 되어 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus that effectively performs cleaning in a short time, and includes a belt (23) between a pulley (21) fixed to an axis of a motor (20) and a pulley (22) fixed to an upper end of a central axis (19). ) To rotate the hollow shaft 19, attach the disk brush 24 to the lower end of the hollow shaft 19, and supply the cleaning liquid into the disk brush 24 in the hollow shaft 19. The pipe 25 abuts, and the cleaning liquid is supplied to the pipe 25 from the tube 26. In the disk brush 24, the brackets 27 and 27 extend laterally, and the ultrasonic nozzles 28 and 28 are attached to these brackets 27 and 27, and these ultrasonic nozzles 28 , 28 are supplied to the cleaning liquid via the tubes 29 and 29.
Description
제1도는 본 발명에 관한 기판 세정장치의 전체 평면도이고,1 is an overall plan view of a substrate cleaning apparatus according to the present invention,
제2도는 디스크 부러쉬와 초음파 노즐의 이동기구의 종단면도이고,2 is a longitudinal sectional view of the disk brush and the moving mechanism of the ultrasonic nozzle,
제3도는 디스크 부러쉬와 초음파 노즐의 확대단면도이다.3 is an enlarged cross-sectional view of the disc brush and the ultrasonic nozzle.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 기판 세정장치 2 : 테이블1 substrate cleaning device 2 table
10 : 이동기구 17 : 암10: moving mechanism 17: arm
24 : 디스크 부러쉬 28 : 초음파노즐24: disc brush 28: ultrasonic nozzle
S1 : 세정스테이지 S2 : 헹굼스테이지S1: washing stage S2: rinsing stage
W : 기판W: Substrate
본 발명은 유리 기판 등의 표면에 부착되어 있는 미세한 먼지를 세정하는 장치에 관한 것이다.The present invention relates to an apparatus for cleaning fine dust adhered to a surface of a glass substrate or the like.
예를 들면 유리 기판의 한쪽 면에 TFT(막판 트랜지스터)를 형성한 컬러 액정기판을 제작하는 데에는 반도체 웨이퍼 상에 디바이스를 형성하는 경우와 같이 피막의 형성 등의 다단계의 표면처리 공정을 경유하여 제작한다.For example, in order to produce a color liquid crystal substrate having TFTs (film transistors) formed on one surface of a glass substrate, it is produced via a multi-step surface treatment process such as formation of a film as in the case of forming a device on a semiconductor wafer. .
여기서 표면처리를 행하는 전후에 유리 기판 표면에 먼지가 부착하여 있으면 원료에 대한 제품의 비율이 저하하는 원인이 되기 때문에 종래부터 표면처리를 행하기 전후에는 반드시 세정처리를 행하고 있다. 이러한 세정처리를 행하는 장치로서 디스크 부러쉬로 또는 롤부러쉬로 표면에 부착하고 있는 먼지를 배척하는 것이 알려져 있다.If dust adheres to the surface of the glass substrate before and after the surface treatment, the ratio of the product to the raw material is lowered. Therefore, the cleaning treatment is always performed before and after the surface treatment. As a device for performing such a cleaning process, it is known to remove dust adhering to the surface with a disk brush or a roll brush.
상술한 바와 같이 부러쉬에 의해 먼지를 배제하는 경우에는 부러쉬에 먼지가부착하여 세정능력이 저하하기 쉽고, 또한 세정능력 자체도 충분히 않고 세정시간이걸리는 불리함이 있다. 더욱이 상처를 일으키는 우려가 있는 문제로 되고 있다.As described above, when the dust is removed by the brush, there is a disadvantage that the dust adheres to the brush, so that the cleaning ability is easily lowered, and the cleaning time is not sufficient, and the cleaning time is long. Moreover, it becomes a problem which may cause a wound.
상기 과제를 해결하기 위한 본 발명에 관한 세정장치는 기판을 회전시키는 테이블에 대하여 상대적인 수평위치가 가변되는 디스크 부러쉬와 이 디스크 부러쉬와 기판표면의 사이에 세정수를 분출하는 초음파 노즐을 일체로 이동시키도록 되어있다.The cleaning apparatus according to the present invention for solving the above problems integrally moves a disk brush whose horizontal position is changed relative to a table for rotating the substrate and an ultrasonic nozzle for ejecting the cleaning water between the disk brush and the substrate surface. It is supposed to.
디스크 부러쉬와 회전에 의한 물 흐름에 의해 기판 표면에서 먼지를 이탈시키고, 초음파 노즐로부터 진동한 세정액에서 상기 이탈을 조장한다. 더욱이 기판표면에는 손상을 주지 않는다.The dust is removed from the surface of the substrate by the disk brush and the water flow by rotation, and the separation is encouraged by the cleaning liquid vibrated from the ultrasonic nozzle. Moreover, it does not damage the substrate surface.
이하 본 발명의 실시예를 첨부도면에 의하여 설명한다. 여기서 제1도는 본발명에 관한 기판 세정장치의 전체 평면도, 제2도는 디스크 부러쉬와 초음파 노즐의 이동기구의 종단면도, 제3도는 디스크 부러쉬와 초음파 노즐의 확대 단면도이며, 기판세정 장치의 (1)는 제1도에 나타낸 바와 같이 세정을 행하는 스테이지 S1과 헹굼과 건조를 행하는 스테이지 S2로 되며, 각 스테이지 S1, S2에는 유리 기판 W를 회전시키는 테이블(2), (3)이 배치되며, 스테이지 S1, S2 사이에는 유리기판 W의 반송로(4)가 설치되어 있다.Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is an overall plan view of a substrate cleaning apparatus according to the present invention, FIG. 2 is a longitudinal sectional view of a moving mechanism of a disk brush and an ultrasonic nozzle, and FIG. 3 is an enlarged sectional view of a disk brush and an ultrasonic nozzle, and (1) As shown in FIG. 1, it becomes stage S1 which wash | cleans, and stage S2 which performs rinsing and drying, The table S2, 3 which rotates the glass substrate W is arrange | positioned at each stage S1, S2, and stage S1 The conveyance path 4 of the glass substrate W is provided between S2 and S2.
또한 세정을 행하는 스테이지 S1에 인접하여 디스크 부러쉬와 초음파 노즐의 이동기구(10)를 설치하고 있다. 이 이동기구(10)는 제2도에 나타낸 바와 같이, 세정장치(1)의 본체내에 베이스(11)를 설치하고, 이 베이스(11)상에 레일(12)을 설치하고, 이 레일(12)에 지지대(13)를 계합하고, 이 지지대(13)의 일부에 설치된 넛트부(14)를 모터(15)에 의해 회전되는 스크류 샤프트(16)에 나사로 결합되고, 지지대(13)를 제2도에서 좌우방향으로 이동 가능하도록 하고 있다.Further, the disk brush and the moving mechanism 10 of the ultrasonic nozzle are provided adjacent to the stage S1 for cleaning. As shown in FIG. 2, the moving mechanism 10 includes a base 11 in the main body of the washing apparatus 1, a rail 12 on the base 11, and the rail 12. ), And the nut part 14 provided in a part of the support 13 is screwed to the screw shaft 16 rotated by the motor 15, and the support 13 is attached to the second support. It is made to be movable in the left-right direction in figure.
지지대(13)의 상부에는 중공(中空) 암(17)의 기부를 부착하고, 이 중공 암(17)의 선단에는 통체(18)를 걸고, 이 통체(18)대에 중공축(19)을 회전자재로 지지하고 있다.The base of the hollow arm 17 is attached to the upper part of the support 13, the cylinder 18 is fastened to the tip of this hollow arm 17, and the hollow shaft 19 is attached to this cylinder 18 base. It is supported by rotating materials.
또한, 중공 암(17)내의 기부에는 모터(20)를 설치하고, 이 모터(20)의 축에 고착한 풀리(21)와 상기 중공축(19)의 상단에 고착한 풀리(22) 사이에 벨트(23)를 늘려 설치하고, 모터(20)에서 중공축(19)을 회전시키도록 하고 있다.In addition, a motor 20 is installed at the base of the hollow arm 17, and is provided between the pulley 21 fixed to the shaft of the motor 20 and the pulley 22 fixed to the upper end of the hollow shaft 19. The belt 23 is extended and provided so that the hollow shaft 19 may be rotated by the motor 20.
그리하여 상기 중공축(19)의 하단에는 디스크 부러쉬(24)가 부착되고, 또한 중공축(19)에는 디스크 부러쉬(24)내에 세정액을 공급하는 파이프(25)가 행하여 있으며, 이 파이프(25)에는 튜브(25)에서 세정액이 공급된다. 또한 디스크 부러쉬(24)로부터는 측방에 브라켓트(27),(27)이 연장되고, 이들 브라켓트(27),(27)에 초음파 노즐(28),(28)을 부착하고, 이들 초음파 노즐(28),(28)에는 튜브(29),(29)를 경유하여 세정액을 공급하도록 하고 있다. 또, 각각의 초음파 노즐에서는 다른 파장의 초음파를 인가하도록 하고 있다.Thus, a disk brush 24 is attached to the lower end of the hollow shaft 19, and a pipe 25 for supplying a cleaning liquid into the disk brush 24 is provided on the hollow shaft 19. The cleaning liquid is supplied from the tube 25. In addition, brackets 27 and 27 extend from the disk brush 24 to the side, and the ultrasonic nozzles 28 and 28 are attached to the brackets 27 and 27, and these ultrasonic nozzles 28 ) And 28 are supplied with a cleaning liquid via the tubes 29 and 29. Moreover, each ultrasonic nozzle is made to apply ultrasonic waves of a different wavelength.
이상에서, 세정을 행하기 위하여는 스테이지 S1의 테이블(2)상에 유리 기판W를 올려놓아 테이블(2)과 함께 유리 기판 W를 회전시키고 있다. 이 회전속도는 회전도포에 비례하여 적게 되어 부착 등에 의해 유리 기판 W를 고착할 필요는 없다.As mentioned above, in order to perform washing | cleaning, the glass substrate W is mounted on the table 2 of stage S1, and the glass substrate W is rotated with the table 2. As shown in FIG. This rotational speed decreases in proportion to the rotational coating, and it is not necessary to fix the glass substrate W by adhesion or the like.
그리하여 유리 기판 W를 회전시키면서 파이프(25) 및 초음파 노즐(28)에서 세정액을 공급하면서 디스크 부러쉬(24)를 회전시켜서 유리 기판 W표면에 부착하여있는 먼지를 표면에서 이탈시킨다.Thus, the disk brush 24 is rotated while supplying the cleaning liquid from the pipe 25 and the ultrasonic nozzle 28 while rotating the glass substrate W to remove the dust adhering to the glass substrate W surface from the surface.
여기서 디스크 부러쉬(24)에 의한 세정은 부러쉬의 하단부를 유리 기판 W표면에서 약간 띄운 상태에서 디스크 부러쉬(24)를 회전시킨다. 즉, 세정은 디스크 부러쉬(24)를 접촉시켜 행하여 휘젓지 않고, 디스크 부러쉬(24)의 회전에 의해 세정액에 거품을 일으키고 이에 의해 기판 표면에 상처를 입히지 않고 먼지를 이탈시킨다.The cleaning by the disc brush 24 rotates the disc brush 24 in a state in which the lower end of the brush is slightly lifted from the glass substrate W surface. In other words, the cleaning is performed by contacting the disk brushes 24 without causing them to stir, but bubbles are generated in the cleaning liquid by the rotation of the disk brushes 24, thereby removing dusts without damaging the surface of the substrate.
또한, 초음파 노즐(28)은 축선이 디스크 부러쉬(24) 방향으로 기울어 있으며, 또한 디스크 부러쉬(24)로부터 연장되는 브라켓트(27)에 부착되어 있기 때문에, 디스크 부러쉬(24)의 회전과 함께 초음파 노즐(28)도 그 주위를 회전하고, 디스크 부러쉬(24)와 유리기판 W표면 사이에 세정수를 공급하고, 디스크 부러쉬(24)에 부착하고 있는 먼지 등을 씻어 떨어뜨린다. 그리하여 유리 기판 W의 전체면적을 세정하는 데에는 제1도에 나타난 바와 같이 암(17)을 수평면 내에서 요동시키면서 수행한다.In addition, the ultrasonic nozzle 28 is inclined in the direction of the disc brush 24, and the ultrasonic nozzle 28 is attached to the bracket 27 extending from the disc brush 24, so that the ultrasonic nozzle is rotated together with the rotation of the disc brush 24. (28) also rotates around, supplies washing water between the disk brush 24 and the glass substrate W surface, and washes off the dust and the like adhering to the disk brush 24. Thus, the cleaning of the entire area of the glass substrate W is carried out while swinging the arm 17 in the horizontal plane as shown in FIG.
또, 실시예에서는 기판으로서 유리 기판을 나타내나, 반도체 웨이퍼 등의 기판이어도 좋다. 또한, 초음파 노즐은 1개이어도 좋다.Moreover, although a glass substrate is shown as a board | substrate in an Example, the board | substrate, such as a semiconductor wafer, may be sufficient. In addition, one ultrasonic nozzle may be sufficient.
이상에서 설명한 바와 같이, 본 발명에 관한 피막처리 전후의 기판 표면의 세정장치는 디스크 부리쉬와 초음파 노즐을 기판 표면에 대하여 일체적으로 수평 가능하게 하고, 초음파 노즐로부터 디스크 부러쉬와 기판 표면사이에 세정수를 공급하면서 세정을 행하도록 하기 때문에, 디스크 부러쉬에 부착한 먼지 등을 효과적으로 제거할 수 있음과 동시에 세정효과 자체도 촉진되고, 세정에 요하는 시간을 대폭 단축할 수 있다.As described above, the cleaning apparatus for the substrate surface before and after the coating treatment according to the present invention allows the disk brush and the ultrasonic nozzle to be integrally horizontal to the substrate surface, and is cleaned between the disk brush and the substrate surface from the ultrasonic nozzle. Since the cleaning is performed while supplying water, dust and the like adhering to the disk brush can be effectively removed, and the cleaning effect itself is also promoted, and the time required for cleaning can be greatly shortened.
특히, 각각 다른 초음파를 인가하는 초음파 노즐을 디스크 부러쉬를 중심으로 대향하는 위치에 배치하여 초음파에 의한 세정효과를 한층 향상시킬 수 있다.In particular, the ultrasonic nozzles to which different ultrasonic waves are applied may be disposed at positions opposite to the disk brush, thereby further improving the cleaning effect by the ultrasonic waves.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22975293A JP3155652B2 (en) | 1993-09-16 | 1993-09-16 | Substrate cleaning device |
| JP229752/1993 | 1993-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950009958A KR950009958A (en) | 1995-04-26 |
| KR100299333B1 true KR100299333B1 (en) | 2001-12-01 |
Family
ID=16897134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940020527A KR100299333B1 (en) | 1993-09-16 | 1994-08-19 | Board Cleaning Device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3155652B2 (en) |
| KR (1) | KR100299333B1 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6743723B2 (en) | 1995-09-14 | 2004-06-01 | Canon Kabushiki Kaisha | Method for fabricating semiconductor device |
| TW364165B (en) * | 1996-11-29 | 1999-07-11 | Canon Kk | Method for fabricating semiconductor device |
| JP3630524B2 (en) * | 1997-05-08 | 2005-03-16 | 大日本スクリーン製造株式会社 | Substrate cleaning device |
| US6202658B1 (en) | 1998-11-11 | 2001-03-20 | Applied Materials, Inc. | Method and apparatus for cleaning the edge of a thin disc |
| KR100333059B1 (en) * | 1998-11-14 | 2002-10-25 | 삼성전자 주식회사 | Method for washing of wafer and washing apparatus sane |
| JP2002540623A (en) * | 1999-03-30 | 2002-11-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Semiconductor wafer cleaning apparatus and method |
| KR20010054422A (en) * | 1999-12-06 | 2001-07-02 | 김광교 | Cleaning apparatus |
| JP2001246331A (en) | 2000-03-08 | 2001-09-11 | Sharp Corp | Cleaning device |
| KR100405449B1 (en) * | 2000-10-30 | 2003-11-15 | 삼성전자주식회사 | Cleaning apparatus for semiconducter wafer |
| US6904637B2 (en) | 2001-10-03 | 2005-06-14 | Applied Materials, Inc. | Scrubber with sonic nozzle |
| US20030192577A1 (en) * | 2002-04-11 | 2003-10-16 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
| KR20040029578A (en) * | 2002-10-01 | 2004-04-08 | 주식회사 실트론 | A device for cleaning wafer by a megasonic cleaner |
| US20050109371A1 (en) | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
| US9646859B2 (en) * | 2010-04-30 | 2017-05-09 | Applied Materials, Inc. | Disk-brush cleaner module with fluid jet |
| JP5955601B2 (en) * | 2012-03-27 | 2016-07-20 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
| CN103386406B (en) * | 2013-08-08 | 2015-04-01 | 常州市科沛达超声工程设备有限公司 | Double-side scrubbing equipment between wafer production processes |
| CN106040627A (en) * | 2015-04-17 | 2016-10-26 | 光全球半导体有限公司 | Wafer cleaning method and wafer cleaning device used therein |
| JP6933448B2 (en) * | 2016-04-22 | 2021-09-08 | 株式会社荏原製作所 | Substrate cleaning equipment |
| WO2017154673A1 (en) | 2016-03-08 | 2017-09-14 | 株式会社荏原製作所 | Substrate cleaning device, substrate cleaning method, substrate processing device, and substrate drying device |
| US20170271145A1 (en) * | 2016-03-21 | 2017-09-21 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Method and an apparatus for cleaning substrates |
| CN107470194A (en) * | 2017-09-18 | 2017-12-15 | 李刚 | A kind of Cardiological respirator cleaning device |
| CN109712927A (en) * | 2018-12-28 | 2019-05-03 | 天津洙诺科技有限公司 | A kind of cleaning semiconductor chip machine |
-
1993
- 1993-09-16 JP JP22975293A patent/JP3155652B2/en not_active Expired - Fee Related
-
1994
- 1994-08-19 KR KR1019940020527A patent/KR100299333B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0786222A (en) | 1995-03-31 |
| KR950009958A (en) | 1995-04-26 |
| JP3155652B2 (en) | 2001-04-16 |
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