CN106040627A - Wafer cleaning method and wafer cleaning device used therein - Google Patents
Wafer cleaning method and wafer cleaning device used therein Download PDFInfo
- Publication number
- CN106040627A CN106040627A CN201610236821.4A CN201610236821A CN106040627A CN 106040627 A CN106040627 A CN 106040627A CN 201610236821 A CN201610236821 A CN 201610236821A CN 106040627 A CN106040627 A CN 106040627A
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- wafer
- pad
- cleaning
- attachment part
- stationary fixture
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- 238000004140 cleaning Methods 0.000 title claims abstract description 162
- 238000000034 method Methods 0.000 title claims abstract description 38
- 235000012431 wafers Nutrition 0.000 claims description 167
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 35
- 239000007921 spray Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer cleaning method and a wafer cleaning device used therein, and the method and device are used for removing foreign matters from the wafer in a manufacturing process of a semiconductor. The device comprisers a rotating chuck which rotatingly supports a wafer; a cleaning arm which is located at one side of the rotating chuck and is provided with an arm part which extends towards the wafer on the rotating chuck; a fixed clamping tool which is connected to an end part of the arm part, and is provided with a groove towards the wafer; a pad attaching part which is inserted into the groove, and is bulged outside the fixed clamping tool; and a cleaning pad, the first surface of which is provided with an adhesive layer which is attached to the pad attaching part, and the second surface of which is provided with a pad surface contacting with the wafer.
Description
Technical field
The present invention relates to a kind of deimpurity for going from wafer during semiconductor fabrication process
Wafer cleaning methods, and relate to a kind of wafer cleaning apparatus in the method.
Background technology
In semiconductor fabrication process, in order to remove various foreign bodies from wafer, (such as granule, metal is miscellaneous
Matter, organic pollution or skin covering of the surface), individually carry out wet type cleaning process, then wafer is dried.
The example of this wet method includes the chemical cleaning method using chemicals and uses physical force
Rotary scrubber clean method.Wherein, main use rotary scrubber clean method.
Rotary scrubber clean method is divided into: use the clean method of pure water, use pure water and brush
Method and the clean method of use ultrasound wave.Fig. 1 exemplifies traditional rotation washing using pure water
Device cleaning device.
Such rotary scrubber includes the rotating cup 12 of cylinder, and rotating cup 12 is placed in substrate
On 11, there is opening, and be configured to when rotating cup 12 moves upward surround wafer W.
Pure water jet nozzle 13 is positioned at the side on rotating cup 12, makes pure water spray to wafer from pure water jet nozzle 13
W。
Spin chuck 17 is used for being pivotably supported wafer W, and is positioned in rotating cup 12.Cleaning
Arm 20 is positioned at the position outside rotating cup 12, and the end of cleaning arm 20 is configured at fixing axle
Rotate on 22.
Sponge (or brush) 24 is attached to the end of cleaning arm 20.When wafer W rotates,
Sponge 24 contacts with the surface of wafer W and removes foreign body from wafer W.
In Conventional cleaning methods, when using sponge 24 to clean wafer W, foreign body is bonded to sponge
24.So, when needs clean another wafer W subsequently, use cleaning chemistry thing cleaning should be increased
The operation of sponge 24.
Further, owing to sponge 24 is consumable goods, thus when cleaning of the wafer W of predetermined quantity
Sponge 24 should be replaced by new sponge afterwards.Additionally, it is more complicated that sponge 24 is replaced by new sponge,
And renewal cost is high.
It addition, Conventional cleaning methods has a problem in that: by using pure water jet nozzle 13 by pure water from sea
The side of continuous 24 sprays to wafer W to clean wafer W, then floats individually by increasing hydraulic pressure
Wash the surface of wafer so that clean operation and rising operation are carried out respectively, and thus yield is low.
Summary of the invention
Therefore, the present invention already allows for the problems referred to above occurred in prior art, the purpose of the present invention
It is: a kind of wafer cleaning methods is provided, is used for carrying out clean operation and the rising operation of wafer simultaneously.
Further, another object of the present invention is to: providing a kind of wafer cleaning apparatus, it is easy to
Change chip cleaning pad, need not cleaning chemistry thing and there is the long life, thus realize cost
Reduction.
To achieve these goals, the present invention provides a kind of wafer cleaning apparatus, including: spin chuck,
It is pivotably supported wafer；Cleaning arm, it is positioned at the side of described spin chuck, and has court
The arm section extended to the described wafer being placed on described spin chuck；Stationary fixture, it is connected to institute
State the end of arm section, and there is the groove being formed towards described wafer；Pad attachment part, it is inserted
Enter in described groove, and be projected into outside described stationary fixture；And cleaning pad, its first surface has
There is the tack coat for being attached to described pad attachment part, and have on its second surface with described
The pad surface of contact wafers.
Further, to achieve these goals, the present invention provides a kind of wafer cleaning apparatus, including:
Spin chuck, it is pivotably supported wafer；Side nozzle, it is configured to laterally spray to pure water
Described wafer；Cleaning arm, it is positioned at the side of described spin chuck, and has towards being placed in described
The arm section that described wafer on spin chuck extends；Stationary fixture, it is connected to described arm section
End, and there is the groove being formed towards described wafer；Pad attachment part, it inserts in described groove,
And it is projected into outside described stationary fixture；Cleaning pad, has for being attached on its first surface
To the tack coat of described pad attachment part, and have on its second surface and the pad of described contact wafers
Surface；And central nozzle, its core being positioned on the pad surface of described cleaning pad is sentenced described
Pure water sprays to described wafer vertically.
It addition, described pad surface may include that multiple contact portion and can divide it at described contact site
Between the ditch that formed, the plurality of contact portion can be with described contact wafers can the most mutually dividing
Open.
Described wafer cleaning apparatus can farther include: elastic component, and it inserts in described stationary fixture
With by described pad attachment part towards described wafer bias.
To achieve these goals, the present invention provides a kind of wafer cleaning methods, comprising: by wafer
It is positioned on spin chuck to be pivotably supported described wafer；When use has and described contact wafers
Pad surface cleaning pad clean described wafer time, use side nozzle by pure water from the edge, side of cleaning pad
Laterally spray to described wafer；Use the central nozzle of the central part office being positioned at described cleaning pad by pure water
Core from the pad surface of described cleaning pad sprays to described wafer vertically, cleans the most simultaneously
Described wafer and the surface of the described wafer of rinsing.
By above description it will be obvious that: the present invention provides a kind of wafer cleaning methods, wherein by pure water
Wafer is sprayed to vertically to carry out clean operation and the rinsing of wafer simultaneously from the core of cleaning pad
Operation, thus shortens the waiting time and increases cleaning efficiency.
Further, the present invention provides a kind of wafer cleaning apparatus, and wherein cleaning pad is attached to pad attachment
Part, is thus easy to chip cleaning pad is replaced by new pad, it is easy to discharge foreign body via cleaning pad,
From without cleaning chemical, and cleaning pad longer service life can be realized and thus reduce
Cost.
Accompanying drawing explanation
Fig. 1 is the figure exemplifying the traditional rotary scrubber cleaning device using pure water；
Fig. 2 is the figure of the structure exemplifying the wafer cleaning apparatus according to first embodiment of the invention；
Fig. 3 is the detailed figure of stationary fixture and other parts exemplifying Fig. 2；
Fig. 4 is to exemplify cleaning pad to be attached to shown in Fig. 3 pad the figure of the state of attachment part；
Fig. 5 is the photo of the contact portion of the cleaning pad exemplifying Fig. 3；
Fig. 6 is the figure of the structure exemplifying the wafer cleaning apparatus according to second embodiment of the invention；
Fig. 7 is the detailed figure of stationary fixture and other parts exemplifying Fig. 6；With
Fig. 8 is the figure of the state exemplifying the pad attachment part that cleaning pad is attached in Fig. 7.
Detailed description of the invention
<the first embodiment>
Fig. 2 is the figure of the structure exemplifying the wafer cleaning apparatus according to first embodiment of the invention,
Fig. 3 is the detailed figure of stationary fixture and other parts exemplifying Fig. 2, and Fig. 4 is to exemplify cleaning
Pad is attached to shown in Fig. 3 pad the figure of the state of attachment part, and Fig. 5 is the cleaning exemplifying Fig. 3
The photo of the contact portion of pad.
The wafer cleaning apparatus 100 of the present invention includes: spin chuck 110, cleaning arm 120, fixing
Fixture 130, pad attachment part 140, cleaning pad 150, etc..
Spin chuck 110 is pivotably supported wafer W.Spin chuck 110 may be structured to up and down
Motion.When wafer W on spin chuck 110 in place and when being supported, wafer W also with
Spin chuck 110 rotates and rotates.
The column shaped rotating cup 116 with opening can be located on substrate 115.Rotating cup 116 can be gone up
Lower motion also can surround wafer W when rotating cup 16 moves upward.Pure water jet nozzle 117 can be located at rotation
The end of revolving cup 116 is to spray to wafer W by pure water from pure water jet nozzle 117.
Cleaning arm 120 is positioned at the side of spin chuck 110.Cleaning arm 120 comprises the steps that vertically prolongs
The vertical portion 121 stretched and being connected with vertical portion 121 and towards being placed on spin chuck 110
Wafer W extend arm section 122.Cleaning arm 120 may be structured to move up and down.
Stationary fixture 130 is connected to the end of the arm section 122 of spin chuck 110.Stationary fixture
130 can be connected to arm section 122 via another part.Stationary fixture 130 is for receiving and supporting pad
Attachment part 140.
Stationary fixture 130 can include that fixture 131 and lower clamp 132, upper fixture 131 are connected to
Arm section 122, lower clamp 132 couples with upper fixture 131 and has the groove formed towards wafer W
132b.Such as, lower clamp 132 can couple in screw threads for fastening mode with upper fixture 131.
Upper fixture 131 can include that neck portion 131a, neck portion 131a have screw thread and arm section 122
Connect.Upper fixture 131 is formed as the shape of post, and described post has the appearance in heart part wherein
Receive space.
Lower clamp 132 is formed as the shape of post, and it is empty that described post has the receiving in heart part wherein
Between, step part 132a may be formed in the end of lower clamp 132 and towards described post center to
Inwardly projecting.Step part 132a prevents padding attachment part 140 and removes from groove 132b.
Pad attachment part 140 is inserted in the groove 132b of stationary fixture 130, pads attachment part 140
End be projected into outside stationary fixture 130.The lower end 140a of pad attachment part 140 is shaped as
Its cross section is made to reduce with the step part 132a corresponding to lower clamp 132.Therefore, pad attachment part
140 can be generally formed as "T"-shaped shape.
When padding attachment part 140 and being inserted in the groove 132b of stationary fixture 130, limit betwixt
Trickle gap is to allow pad attachment part 140 light exercise.Such as, pad attachment part 140 can
It is made up of plastic material.
Cleaning pad 150 is attached to pad the lower end 140a of attachment part 140 so that cleaning pad 150 with
The surface contact of wafer W, thus foreign body is removed from it when wafer W rotates.Cleaning pad 150
A surface there is the tack coat 151 that will be attached to pad attachment part 140, and its another
Surface has the pad surface 152 contacted with wafer W.
Pad surface 152 includes: multiple contact portions 152a and between these contact portions 152a
The ditch 152b formed, multiple contact portions 152a are separated from each other at a predetermined interval, in cleaning
Operating process contacts with wafer W.Ditch 152b may be disposed so that grille-like.
If each contact portion 152a all contacts with the surface of wafer W under pure water spray regime,
Then the foreign body in wafer W is pulled to the outside of contact portion 152a, thus tends to along each contact
The ditch 152b formed between part 152a discharges from wafer W.So, contact portion 152a is made
The pollution caused due to foreign body minimizes so that even if after wafer W is cleaned, seldom have
Foreign body is bonded to contact portion 152a.Further, it is not directly contacted with wafer W due to ditch 152b
Surface, thus the foreign body in wafer W will not be bonded to ditch 152b.Therefore, even if working as wafer W
After cleaned, pad surface 152 also can keep its original state, without being stained with foreign body.
Elastic component 135 inserts in stationary fixture 130 will pad attachment part 140 towards wafer W
Biasing.Elastic component 135 can be spring.Elastic component 135 makes pad surface 152 reliably contact
The surface of wafer W, thus improves the efficiency removing foreign body from wafer W.
If the traditional rotary scrubber shown in wafer cleaning apparatus 100 and Fig. 1 by the present invention
Compare, then the sponge 24 of rotary scrubber does not has foreign body drain passageway so that wafer W clean operation
After completing, a considerable amount of foreign body is bonded to the surface of sponge 24.Therefore, clean subsequently when needs
During another wafer W, inevitably need increase use cleaning chemical at 70～105 DEG C from
Sponge 24 removes the operation of foreign body.
In contrast to this, in the wafer cleaning apparatus 100 of the present invention, the pad surface of cleaning pad 150
152 include contact portion 152a and ditch 152b, to allow the foreign body released from contact portion 152a
It is prone to discharge along ditch 152b.So, the pollution on pad surface 152 minimizes, thus when cleaning wafer
Pure water can be directly used to be cleaned operation during W, without using cleaning chemical, with from pad
Foreign body is removed on surface 152.Therefore, process number is made to reduce, thus in the operation of cleaning wafer W
Improve cleaning efficiency and save the cost of cleaning chemical.
It addition, in tradition rotary scrubber, even if using cleaning chemical, the pollution of sponge 24
Thing is likely to remove completely so that the service life of sponge 24 shortens, and will be attached to arm
Sponge 24 be replaced by new sponge and be not easy to, thus to take a long time and described sponge is changed
For new sponge.
In contrast to this, in the wafer cleaning apparatus 100 of the present invention, direct to cleaning pad 150
Pollution is minimized so that the replacement cycle of cleaning pad 150 extends, then the replacing of cleaning pad 150
Cost is more much smaller than the replacement cost of sponge 24.Therefore, it can save the cleaning cost of wafer W.
Further, the process that cleaning pad 150 is replaced by new cleaning pad can particularly simple be carried out,
This is because, it is only necessary to existing cleaning pad 150 is removed from pad attachment part 140, then will
New cleaning pad 150 is attached to pad attachment part 140.
<the second embodiment>
Fig. 6 is the figure exemplifying the structure of wafer cleaning apparatus according to embodiments of the present invention, Fig. 7
It it is the detailed figure of stationary fixture and other parts exemplifying Fig. 6；Fig. 8 is that to exemplify cleaning pad attached
Receive the figure of the state of pad attachment part in Fig. 7.
Wafer cleaning methods according to the present invention includes following steps: wafer W is positioned at rotation
To be pivotably supported described wafer W on chuck 110；Contact with described wafer W when use has
The cleaning pad 160 on pad surface 162 when cleaning described wafer W, use side nozzle 120 by pure water
Described wafer W is laterally sprayed to from the side of cleaning pad 160；Use is positioned at described cleaning pad 160
The central nozzle 170 of central part office by pure water from the pad surface 162 of described cleaning pad 160
Core spray to described wafer W vertically, clean the most simultaneously described wafer W and rinsing institute
State the surface of wafer W.
The wafer cleaning apparatus being used for implementing this wafer cleaning methods according to the present invention is configured to
Including: spin chuck 110, side nozzle 120, cleaning arm 130, stationary fixture 140, pad attachment
Part 150, cleaning pad 160 and central nozzle 170.
Spin chuck 110 is pivotably supported wafer W.Spin chuck 110 may be structured to up and down
Motion.When wafer W on spin chuck 110 in place and when being supported, wafer W also with
Spin chuck 110 rotates and rotates.
The column shaped rotating cup 116 with opening can be located on substrate 115.Rotating cup 116 can be gone up
Lower motion also can surround wafer W when rotating cup 16 moves upward.
Further, side nozzle 120 is positioned at the side on rotating cup 116 so that pure water is from side
Nozzle 120 sprays to wafer W.Thus, pure water can be directly used to be cleaned when cleaning wafer
Operation, without using chemicals.
Cleaning arm 130 is positioned at the side of spin chuck 110.Cleaning arm 130 comprises the steps that vertically prolongs
The vertical portion 131 stretched and being connected with vertical portion 131 and towards being placed on spin chuck 110
Wafer W extend arm section 132.Cleaning arm 130 may be structured to move up and down.
Stationary fixture 140 is connected to the end of the arm section 132 of cleaning arm 130.Stationary fixture 140
Can connect via another part of arm section 132.Stationary fixture 140 is attached with supporting pad for receiving
Connect part 150.
Stationary fixture 140 can include that fixture 141 and lower clamp 142, upper fixture 141 are connected to
Arm section 132, lower clamp 142 couples with upper fixture 141 and has the groove formed towards wafer W
142b.Such as, lower clamp 142 can couple in screw threads for fastening mode with upper fixture 141.
Upper fixture 141 can include neck portion 141a, neck portion 141a have screw thread with arm section
132 connect.Upper fixture 141 is formed as the shape of cylinder, and described cylinder has heart portion wherein
Receiving space in Fen.
Lower clamp 142 is formed as the shape of cylinder, and described cylinder has the appearance in heart part wherein
Receiving space, step part 142a may be formed in the end of lower clamp 142 with towards described cylinder
Center inwardly projecting.Step part 142a prevents padding attachment part 150 and removes from groove 142b.
Pad attachment part 150 is inserted in the groove 142b of stationary fixture 140, pads attachment part 150
End be projected into outside stationary fixture 140.The lower end 150a of pad attachment part 150 is shaped as
Its cross section is made to reduce with the step part 142a corresponding to lower clamp 142.Therefore, pad attachment part
150 can be generally formed as "T"-shaped shape.
When padding attachment part 150 and being inserted in the groove 142b of stationary fixture 140, limit betwixt
Trickle gap is to allow pad attachment part 150 light exercise.Such as, pad attachment part 150 can
It is made up of plastic material.
Cleaning pad 160 is attached to pad the lower end 150a of attachment part 150 so that cleaning pad 160 with
The surface contact of wafer W, thus when wafer W removes foreign body the most from it.Cleaning pad
One surface of 160 has the tack coat 161 that will be attached to pad attachment part 150, and its another
Individual surface has the pad surface 162 contacted with wafer W.
Pad surface 162 includes: multiple contact portions 162a and between these contact portions 162a
The ditch 162b formed, multiple contact portions 162a are separated from each other at a predetermined interval, in cleaning
Operating process contacts with wafer W.Ditch 162b may be disposed so that grille-like.
If it is to say, under pure water spray regime each contact portion 162a all with wafer W
Surface contacts, then the foreign body in wafer W is pulled to the outside of contact portion 162a, thus tends to
The ditch 162b formed between each contact portion 162a discharges from wafer W.So, contact is made
The pollution that part 162a causes due to foreign body minimizes so that even if after wafer W is cleaned,
Foreign body is seldom had to be bonded to contact portion 162a.
Further, owing to ditch 162b is not directly contacted with the surface of wafer W, thus in wafer W
Foreign body will not be bonded to ditch 162b.Therefore, even if after wafer W is cleaned, pad surface
162 also can keep its original state, without being stained with foreign body.
Meanwhile, during elastic component 145 inserts stationary fixture 140 with will pad attachment part 150 towards
Wafer W biases.Elastic component 145 can be spring.Elastic component 145 makes pad surface 162 reliable
The surface of ground contact wafer W, thus improves the efficiency removing foreign body from wafer W.
Central nozzle 170 is positioned at the central part office on the pad surface 162 of cleaning pad 160, to incite somebody to action
Pure water sprays to wafer W vertically.Central nozzle 170 is formed to penetrate the pad table of cleaning pad 160
Face 162.Such central nozzle 170 sprays pure water, and its hydraulic pressure is higher than the hydraulic pressure of side nozzle 120,
Thus make the clean operation of employing cleaning pad 160 and the efficiency of rising operation all maximize.
Further, Fig. 6 is to as shown in 8, and central nozzle 170 is preferably formed as penetrating
Stationary fixture 140 and pad attachment part 150 center on the pad surface 162 for cleaning pad 160
Part is exposed, and pure water thus sprays to wafer W vertically.
Therefore, central nozzle 170 is stably formed to penetrate stationary fixture 140 so that in wafer W
By cleaning pad 160 cleaned time, the pure water under high pressure is stably fed to the cleaning contacted with each other
Between pad surface 162 and the wafer W of pad 160.
It is to say, by central nozzle 170, pure water is from the pad surface 162 of cleaning pad 160
Core spray to wafer W vertically, to clean wafer W and to rinse wafer surface simultaneously, from
And shorten cleaning time and the rinsing time of wafer simultaneously.
Thus, use cleaning pad 160, carry out simultaneously from wafer W remove foreign body cleaning process and
Wafer rinsing process, thus shorten the waiting time and move to rinsing device required time, thus make total
The process time reduces.
If the traditional rotary scrubber shown in wafer cleaning apparatus 100 and Fig. 1 by the present invention
Compare, then the sponge 24 of rotary scrubber does not has foreign body drain passageway so that wafer W clean operation
After completing, a considerable amount of foreign body adheres to the surface of sponge 24.Therefore, clean subsequently when needs
During another wafer W, inevitably need increase use cleaning chemical at 70～105 DEG C from
Sponge 24 removes the operation of foreign body.
In contrast to this, in the wafer cleaning apparatus 100 of the present invention, the pad surface of cleaning pad 160
162 include contact portion 162a and ditch 162b, to allow the foreign body released from contact portion 162a
It is prone to discharge along ditch 162b.
So, the pollution on pad surface 162 minimizes, thus can directly make when cleaning wafer W
It is cleaned operation with pure water, removes foreign body without using cleaning chemical from pad surface 162.
Therefore, in the operation of cleaning wafer W, process number reduces, and thus improves cleaning efficiency also
Save the cost of cleaning chemical.
It addition, in tradition rotary scrubber, even if using cleaning chemical, the pollution of sponge 24
Thing is likely to remove completely so that the service life of sponge 24 shortens, and will be attached to arm
Sponge 24 be replaced by new sponge and be not easy to, thus to take a long time and described sponge is changed
For new sponge.
In contrast to this, in the wafer cleaning apparatus 100 of the present invention, direct to cleaning pad 160
Pollution is minimized so that the use cycle stretch-out of cleaning pad 160, the then replacing of cleaning pad 160
Cost is more much smaller than the replacement cost of sponge 24.Therefore, it can save the cleaning cost of wafer W.
Further, the operation that cleaning pad 160 is replaced by new cleaning pad can particularly simple be carried out,
This is because, it is only necessary to existing cleaning pad 160 is removed from pad attachment part 150, and then
It is attached to new cleaning pad 160 pad attachment part 150.
Claims (12)
1. a wafer cleaning apparatus, including:
Spin chuck, it is pivotably supported wafer；
Cleaning arm, it is positioned at the side of described spin chuck, and has towards being placed in described rotating clamp
The arm section that described wafer on dish extends；
Stationary fixture, it is connected to the end of described arm section, and has and be formed towards described crystalline substance
The groove of sheet；
Pad attachment part, it inserts in described groove, and is projected into outside described stationary fixture；With
Cleaning pad, has the bonding for being attached to described pad attachment part on its first surface
Layer, and there is pad surface with described contact wafers on its second surface.
Wafer cleaning apparatus the most according to claim 1, wherein said pad surface includes: many
Individual contact portion and the ditch formed between described contact portion, the plurality of contact portion and described crystalline substance
Sheet contact is also separated from each other at a predetermined interval.
Wafer cleaning apparatus the most according to claim 1, farther includes:
Elastic component, its insert in described stationary fixture with by described pad attachment part towards described wafer
Biasing.
4. a wafer cleaning apparatus, including:
Spin chuck, it is pivotably supported wafer；
Side nozzle, it is configured to laterally spray to pure water described wafer；
Cleaning arm, it is positioned at the side of described spin chuck, and has towards being placed in described rotating clamp
The arm section that described wafer on dish extends；
Stationary fixture, it is connected to the end of described arm section, and has and be formed towards described crystalline substance
The groove of sheet；
Pad attachment part, it inserts in described groove, and is projected into outside described stationary fixture；
Cleaning pad, has the bonding for being attached to described pad attachment part on its first surface
Layer, and there is pad surface with described contact wafers on its second surface；With
Central nozzle, its core being positioned on the pad surface of described cleaning pad is sentenced described pure water
Spray to described wafer vertically.
Wafer cleaning apparatus the most according to claim 4, the pad surface of wherein said cleaning pad
Including: multiple contact portions and the ditch formed between described contact portion, the plurality of contact portion
With described contact wafers being separated from each other at a predetermined interval.
Wafer cleaning apparatus the most according to claim 4, farther includes:
Elastic component, its insert in described stationary fixture with by described pad attachment part towards described wafer
Biasing.
Wafer cleaning apparatus the most according to claim 4, wherein said central nozzle is formed
For penetrating described stationary fixture and described pad attachment part and in the pad surface of described cleaning pad
Heart part is exposed, and thus described pure water is sprayed to described wafer vertically.
8. a wafer cleaning methods, including:
By wafer orientation on spin chuck to be pivotably supported described wafer；
When using the cleaning pad with the pad surface with described contact wafers to clean described wafer, use
Pure water is laterally sprayed to described wafer from the side of cleaning pad by side nozzle；With
Use is positioned at the central nozzle of the central part office of described cleaning pad by pure water from described cleaning pad
Pad surface on core spray to described wafer vertically, clean described wafer and drift the most simultaneously
Wash the surface of described wafer.
Wafer cleaning methods the most according to claim 8, the pad surface of wherein said cleaning pad
Including: multiple contact portions and the ditch formed between described contact portion, the plurality of contact portion
With described contact wafers being separated from each other at a predetermined interval.
Wafer cleaning methods the most according to claim 8, wherein said cleaning pad is removable
Being attached to stationary fixture with removing, described stationary fixture has the groove being formed towards described wafer.
11. wafer cleaning methods according to claim 10, wherein said cleaning pad is attached to
Described pad attachment part, described pad attachment part is inserted in the groove of described stationary fixture, and highlights
Outside described stationary fixture.
12. wafer cleaning methods according to claim 10, wherein said cleaning pad its
There is on one surface the tack coat for being attached to described pad attachment part, and at its second surface
On there is the pad surface with described contact wafers.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150054348A KR20160123766A (en) | 2015-04-17 | 2015-04-17 | Apparatus for cleaning wafer |
| KR10-2015-0054348 | 2015-04-17 | ||
| KR10-2015-0170818 | 2015-12-02 | ||
| KR1020150170818A KR20170064843A (en) | 2015-12-02 | 2015-12-02 | Method of cleaning wafer and Apparatus for cleaning wafer thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106040627A true CN106040627A (en) | 2016-10-26 |
Family
ID=57176670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610236821.4A Pending CN106040627A (en) | 2015-04-17 | 2016-04-15 | Wafer cleaning method and wafer cleaning device used therein |
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| CN (1) | CN106040627A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019110176A (en) * | 2017-12-18 | 2019-07-04 | 株式会社東京精密 | Cleaning device |
| CN110838434A (en) * | 2018-08-17 | 2020-02-25 | 台湾积体电路制造股份有限公司 | Cleaning system and cleaning method |
| US11211232B2 (en) * | 2018-10-29 | 2021-12-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods for cleaning semiconductor device manufacturing apparatus |
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| EP0764478A1 (en) * | 1995-09-20 | 1997-03-26 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
| JPH09134896A (en) * | 1995-11-08 | 1997-05-20 | Fujitsu Ltd | Device and method for cleaning substrate |
| US6148463A (en) * | 1997-05-19 | 2000-11-21 | Ebara Corporation | Cleaning apparatus |
| CN101540269A (en) * | 2008-03-20 | 2009-09-23 | 盛美半导体设备（上海）有限公司 | Method and device for cleaning semiconductor chip |
| KR20100119330A (en) * | 2009-04-30 | 2010-11-09 | 주식회사 에스에프에이 | Apparatus for cleaning glass |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019110176A (en) * | 2017-12-18 | 2019-07-04 | 株式会社東京精密 | Cleaning device |
| JP7165494B2 (en) | 2017-12-18 | 2022-11-04 | 株式会社東京精密 | cleaning equipment |
| CN110838434A (en) * | 2018-08-17 | 2020-02-25 | 台湾积体电路制造股份有限公司 | Cleaning system and cleaning method |
| US11211232B2 (en) * | 2018-10-29 | 2021-12-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods for cleaning semiconductor device manufacturing apparatus |
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