KR950009958A - Board Cleaning Device - Google Patents
Board Cleaning Device Download PDFInfo
- Publication number
- KR950009958A KR950009958A KR1019940020527A KR19940020527A KR950009958A KR 950009958 A KR950009958 A KR 950009958A KR 1019940020527 A KR1019940020527 A KR 1019940020527A KR 19940020527 A KR19940020527 A KR 19940020527A KR 950009958 A KR950009958 A KR 950009958A
- Authority
- KR
- South Korea
- Prior art keywords
- disk brush
- substrate
- cleaning apparatus
- brush
- hollow shaft
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract 3
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Coating Apparatus (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
본 발명은 세정을 단시간에 효과적으로 수행하는 기판세정장치에 관한 것으로, 모터(20)의 축에 고착한 풀리(21)와 중심축(19)의 상단에 고착한 풀리(22) 사이에 벨트(23)를 장설 하여 중공축(19)을 회전시키도록 하고, 이 중공축(19)의 하단에 디스크부러쉬(24)를 부착하고, 또한 중공축(19) 내에 디스크부러쉬(24) 내에 세정액을 공급하는 파이프(25)가 접해있고, 이 파이프(25)에는 튜브(26)로부터 세정액이 공급된다. 또한 디스크부러쉬(24)에서는 측방으로 브라켓(27), (27)이 연장되고, 이들 브라켓(27), (27)에 초음파 노즐(28), (28)을 부착하고, 이들 초음파 노즐(28), (28)에는 튜브(29), (29)를 거쳐 세정액을 공급하도록 되어 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus that effectively performs cleaning in a short time. ) To rotate the hollow shaft 19, attach the disk brush 24 to the lower end of the hollow shaft 19, and supply the cleaning liquid into the disk brush 24 in the hollow shaft 19. The pipe 25 abuts, and the cleaning liquid is supplied to the pipe 25 from the tube 26. In the disk brush 24, the brackets 27 and 27 extend laterally, and the ultrasonic nozzles 28 and 28 are attached to these brackets 27 and 27, and these ultrasonic nozzles 28 , 28 are supplied to the cleaning liquid via the tubes 29 and 29.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명에 관한 기판세정장치의 전체 평면도,1 is an overall plan view of a substrate cleaning apparatus according to the present invention;
제2도는 디스크부러쉬와 초음파 노즐의 이동기구의 종단면도이고,2 is a longitudinal sectional view of the disk brush and the moving mechanism of the ultrasonic nozzle,
제3도는 디스크부러쉬와 초음파 노즐의 확대단면도이다.3 is an enlarged cross-sectional view of the disc brush and the ultrasonic nozzle.
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22975293A JP3155652B2 (en) | 1993-09-16 | 1993-09-16 | Substrate cleaning device |
JP229752/1993 | 1993-09-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950009958A true KR950009958A (en) | 1995-04-26 |
KR100299333B1 KR100299333B1 (en) | 2001-12-01 |
Family
ID=16897134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940020527A KR100299333B1 (en) | 1993-09-16 | 1994-08-19 | Board Cleaning Device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3155652B2 (en) |
KR (1) | KR100299333B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6743723B2 (en) | 1995-09-14 | 2004-06-01 | Canon Kabushiki Kaisha | Method for fabricating semiconductor device |
KR100426184B1 (en) * | 1996-11-29 | 2004-06-24 | 캐논 가부시끼가이샤 | Method for manufacturing semiconductor device |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3630524B2 (en) * | 1997-05-08 | 2005-03-16 | 大日本スクリーン製造株式会社 | Substrate cleaning device |
US6202658B1 (en) | 1998-11-11 | 2001-03-20 | Applied Materials, Inc. | Method and apparatus for cleaning the edge of a thin disc |
KR100333059B1 (en) * | 1998-11-14 | 2002-10-25 | 삼성전자 주식회사 | Method for washing of wafer and washing apparatus sane |
JP2002540623A (en) * | 1999-03-30 | 2002-11-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Semiconductor wafer cleaning apparatus and method |
KR20010054422A (en) * | 1999-12-06 | 2001-07-02 | 김광교 | Cleaning apparatus |
JP2001246331A (en) | 2000-03-08 | 2001-09-11 | Sharp Corp | Cleaning device |
KR100405449B1 (en) * | 2000-10-30 | 2003-11-15 | 삼성전자주식회사 | Cleaning apparatus for semiconducter wafer |
US6904637B2 (en) | 2001-10-03 | 2005-06-14 | Applied Materials, Inc. | Scrubber with sonic nozzle |
US20030192577A1 (en) * | 2002-04-11 | 2003-10-16 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
KR20040029578A (en) * | 2002-10-01 | 2004-04-08 | 주식회사 실트론 | A device for cleaning wafer by a megasonic cleaner |
US20050109371A1 (en) | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
US9646859B2 (en) * | 2010-04-30 | 2017-05-09 | Applied Materials, Inc. | Disk-brush cleaner module with fluid jet |
JP5955601B2 (en) * | 2012-03-27 | 2016-07-20 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
CN103386406B (en) * | 2013-08-08 | 2015-04-01 | 常州市科沛达超声工程设备有限公司 | Double-side scrubbing equipment between wafer production processes |
CN106040627A (en) * | 2015-04-17 | 2016-10-26 | 光全球半导体有限公司 | Wafer cleaning method and wafer cleaning device used therein |
JP6933448B2 (en) * | 2016-04-22 | 2021-09-08 | 株式会社荏原製作所 | Substrate cleaning equipment |
WO2017154673A1 (en) | 2016-03-08 | 2017-09-14 | 株式会社荏原製作所 | Substrate cleaning device, substrate cleaning method, substrate processing device, and substrate drying device |
US20170271145A1 (en) * | 2016-03-21 | 2017-09-21 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Method and an apparatus for cleaning substrates |
CN107470194A (en) * | 2017-09-18 | 2017-12-15 | 李刚 | A kind of Cardiological respirator cleaning device |
CN109712927A (en) * | 2018-12-28 | 2019-05-03 | 天津洙诺科技有限公司 | A kind of cleaning semiconductor chip machine |
-
1993
- 1993-09-16 JP JP22975293A patent/JP3155652B2/en not_active Expired - Fee Related
-
1994
- 1994-08-19 KR KR1019940020527A patent/KR100299333B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6743723B2 (en) | 1995-09-14 | 2004-06-01 | Canon Kabushiki Kaisha | Method for fabricating semiconductor device |
KR100426184B1 (en) * | 1996-11-29 | 2004-06-24 | 캐논 가부시끼가이샤 | Method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0786222A (en) | 1995-03-31 |
KR100299333B1 (en) | 2001-12-01 |
JP3155652B2 (en) | 2001-04-16 |
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E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20080522 Year of fee payment: 8 |
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