JP3150931U - 放熱装置 - Google Patents
放熱装置 Download PDFInfo
- Publication number
- JP3150931U JP3150931U JP2009001655U JP2009001655U JP3150931U JP 3150931 U JP3150931 U JP 3150931U JP 2009001655 U JP2009001655 U JP 2009001655U JP 2009001655 U JP2009001655 U JP 2009001655U JP 3150931 U JP3150931 U JP 3150931U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- plate
- protrusions
- convex portions
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 15
- 238000013459 approach Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002918 waste heat Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
10、10a 第1凸部
100 V字型凹溝
101 ブランチ
12、12a 貫通孔
2、2a 第2熱伝導プレート
21、21a 第2凸部
210、210a 面取り
3 放熱フィンセット
30 放熱プレート
4 部材
5 回路版
6 背板
7 バッフルプレート
8、8a 鋳型
Claims (5)
- 複数個の同一側にある第1凸部および第1凸部と交錯して排列する複数個の貫通孔とを有する第1熱伝導プレートと、
前記第1熱伝導プレートと積層し、且つ同一側にある複数個の第2凸部を有し、且つ前記第2凸部をそれぞれ前記第1熱伝導プレート上の貫通孔に押し込み、前記第1凸部と交錯して排列する第2熱伝導プレートと、
それぞれ前記第1、第2熱伝導プレート上に直立させた複数の放熱プレートを有し、且つ各放熱プレートがそれぞれその一部が、交錯した第1凸部と第2凸部の間にぴったり挟まれる放熱フィンセットと、
からなることを特徴とする放熱装置。 - 各第2凸部の頂部の2つの対向する長辺には各々面取りを有することを特徴とする請求項1に記載する放熱装置。
- 各第1凸部が何れも各々V字型凹溝を形成し、前記V字型凹溝の長さと前記第1凸部は同様で、深さは前記第1凸部の底部に接近していることを特徴とする請求項1に記載する放熱装置。
- 各第1凸部の底部の2つの対向する長辺には各々面取りを有することを特徴とする請求項3に記載する放熱装置。
- 各第2凸部の幅がその底部から頂部に向かって小幅に次第に縮小し、且つ各第2凸部の頂部の2つの対向する長辺には各々面取りを有することを特徴とする請求項4に記載する放熱装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098201904U TWM360549U (en) | 2009-02-10 | 2009-02-10 | Heat-dissipating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3150931U true JP3150931U (ja) | 2009-06-04 |
Family
ID=42167248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009001655U Expired - Lifetime JP3150931U (ja) | 2009-02-10 | 2009-03-19 | 放熱装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2216807A3 (ja) |
JP (1) | JP3150931U (ja) |
KR (1) | KR101057595B1 (ja) |
TW (1) | TWM360549U (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2965699B1 (fr) * | 2010-10-05 | 2013-03-29 | Commissariat Energie Atomique | Dispositif pour la dissipation thermique destine a au moins un composant electronique et procede correspondant |
TW201606256A (zh) * | 2014-08-12 | 2016-02-16 | Shuan Da Prec Industry Co Ltd | 散熱器緊配固定構成及其方法 |
CN112306205B (zh) * | 2020-11-30 | 2021-06-08 | 深圳市高昱电子科技有限公司 | 一种用于计算机的散热器及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518310A1 (de) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung |
US6237222B1 (en) * | 1999-05-14 | 2001-05-29 | Yun-Ching Chen | Method of producing a radiator and product thereof |
JP3273505B2 (ja) * | 1999-08-18 | 2002-04-08 | 古河電気工業株式会社 | 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法 |
JP2001110958A (ja) | 1999-10-13 | 2001-04-20 | Mizutani Denki Kogyo Kk | 電子部品の放熱器 |
JP2004022830A (ja) * | 2002-06-17 | 2004-01-22 | Fujikura Ltd | ヒートシンク |
JP4337441B2 (ja) | 2003-07-30 | 2009-09-30 | 日本軽金属株式会社 | 放熱部材及びその製造方法並びにヒートシンク |
FR2898668B1 (fr) * | 2006-03-15 | 2008-06-27 | Ferraz Date Ind Soc Par Action | Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication |
-
2009
- 2009-02-10 TW TW098201904U patent/TWM360549U/zh not_active IP Right Cessation
- 2009-03-19 JP JP2009001655U patent/JP3150931U/ja not_active Expired - Lifetime
- 2009-04-02 EP EP09004869.5A patent/EP2216807A3/en not_active Withdrawn
- 2009-04-16 KR KR1020090033188A patent/KR101057595B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP2216807A2 (en) | 2010-08-11 |
TWM360549U (en) | 2009-07-01 |
EP2216807A3 (en) | 2015-11-18 |
KR20100091865A (ko) | 2010-08-19 |
KR101057595B1 (ko) | 2011-08-18 |
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