JP3102869B2 - 超薄板圧電共振子の構造 - Google Patents
超薄板圧電共振子の構造Info
- Publication number
- JP3102869B2 JP3102869B2 JP02029935A JP2993590A JP3102869B2 JP 3102869 B2 JP3102869 B2 JP 3102869B2 JP 02029935 A JP02029935 A JP 02029935A JP 2993590 A JP2993590 A JP 2993590A JP 3102869 B2 JP3102869 B2 JP 3102869B2
- Authority
- JP
- Japan
- Prior art keywords
- edge
- resonator
- case
- ultra
- piezoelectric resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 description 8
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02029935A JP3102869B2 (ja) | 1990-02-09 | 1990-02-09 | 超薄板圧電共振子の構造 |
| US07/768,909 US5218328A (en) | 1990-02-09 | 1990-10-02 | Structure for a resonator using an ultrathin piezoelectric substrate |
| EP94118006A EP0644652A2 (en) | 1990-02-09 | 1990-10-02 | Structure for a resonator using an ultrathin piezoelectric substrate |
| PCT/JP1990/001273 WO1991012662A1 (fr) | 1990-02-09 | 1990-10-02 | Structure d'un resonateur piezoelectrique a couche ultra-mince |
| EP90914424A EP0468051B1 (en) | 1990-02-09 | 1990-10-02 | Structure of ultra-thin sheet piezoresonator |
| DE69024207T DE69024207T2 (de) | 1990-02-09 | 1990-10-02 | Struktur eines piezoelektrischen resonators aus einer ultradünnen schicht |
| KR1019900702673A KR940011487B1 (ko) | 1990-02-09 | 1990-10-02 | 초박판 압전공진자의 구조 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02029935A JP3102869B2 (ja) | 1990-02-09 | 1990-02-09 | 超薄板圧電共振子の構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03235408A JPH03235408A (ja) | 1991-10-21 |
| JP3102869B2 true JP3102869B2 (ja) | 2000-10-23 |
Family
ID=12289845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02029935A Expired - Fee Related JP3102869B2 (ja) | 1990-02-09 | 1990-02-09 | 超薄板圧電共振子の構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5218328A (enExample) |
| EP (2) | EP0468051B1 (enExample) |
| JP (1) | JP3102869B2 (enExample) |
| KR (1) | KR940011487B1 (enExample) |
| DE (1) | DE69024207T2 (enExample) |
| WO (1) | WO1991012662A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6143600A (en) | 1995-04-20 | 2000-11-07 | Nec Corporation | Method of fabricating a semiconductor memory device having bit line directly held in contact through contact with impurity region in self-aligned manner |
| US6514834B2 (en) | 1994-03-14 | 2003-02-04 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a semiconductor device having a low leakage current |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5617065A (en) * | 1995-06-29 | 1997-04-01 | Motorola, Inc. | Filter using enhanced quality factor resonator and method |
| EP1326293A1 (en) * | 2000-07-17 | 2003-07-09 | Nagaura, Kumiko | Piezoelectric device and acousto-electric transducer and method for manufacturing the same |
| JP2004080711A (ja) * | 2002-08-22 | 2004-03-11 | Nippon Dempa Kogyo Co Ltd | 水晶振動子の保持構造 |
| US7098574B2 (en) * | 2002-11-08 | 2006-08-29 | Toyo Communication Equipment Co., Ltd. | Piezoelectric resonator and method for manufacturing the same |
| RU2234186C1 (ru) * | 2003-04-24 | 2004-08-10 | Мацак Андрей Николаевич | Высокочастотный пьезоэлемент |
| US7568377B2 (en) * | 2005-07-28 | 2009-08-04 | University Of South Florida | High frequency thickness shear mode acoustic wave sensor for gas and organic vapor detection |
| JP2008078717A (ja) * | 2006-09-19 | 2008-04-03 | Nec Tokin Corp | ノイズフィルタおよびスイッチング電源 |
| US8618722B2 (en) * | 2009-09-18 | 2013-12-31 | Daishinku Corporation | Piezoelectric resonator plate and manufacturing method for piezoelectric resonator plate |
| CN116248068B (zh) * | 2022-09-28 | 2024-03-08 | 泰晶科技股份有限公司 | 一种超高频at切石英晶片及制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3453458A (en) * | 1965-04-19 | 1969-07-01 | Clevite Corp | Resonator supporting structure |
| US3694677A (en) * | 1971-03-03 | 1972-09-26 | Us Army | Vhf-uhf piezoelectric resonators |
| JPS5312292A (en) * | 1976-07-21 | 1978-02-03 | Seiko Instr & Electronics Ltd | Thickness slide crystal vibrator |
| JPS54107293A (en) * | 1978-02-10 | 1979-08-22 | Nec Corp | Crystal oscillator |
| FR2527865A1 (fr) * | 1982-06-01 | 1983-12-02 | Cepe | Resonateur piezo-electrique a haute frequence et son procede de fabrication |
| JPS60232710A (ja) * | 1984-05-01 | 1985-11-19 | Murata Mfg Co Ltd | 圧電振動子 |
| JPS613513A (ja) * | 1984-06-18 | 1986-01-09 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
| JP2643180B2 (ja) * | 1987-09-21 | 1997-08-20 | 日本電気株式会社 | モノリシック集積回路 |
-
1990
- 1990-02-09 JP JP02029935A patent/JP3102869B2/ja not_active Expired - Fee Related
- 1990-10-02 EP EP90914424A patent/EP0468051B1/en not_active Expired - Lifetime
- 1990-10-02 DE DE69024207T patent/DE69024207T2/de not_active Expired - Fee Related
- 1990-10-02 KR KR1019900702673A patent/KR940011487B1/ko not_active Expired - Fee Related
- 1990-10-02 WO PCT/JP1990/001273 patent/WO1991012662A1/ja not_active Ceased
- 1990-10-02 EP EP94118006A patent/EP0644652A2/en not_active Withdrawn
- 1990-10-02 US US07/768,909 patent/US5218328A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514834B2 (en) | 1994-03-14 | 2003-02-04 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a semiconductor device having a low leakage current |
| US6143600A (en) | 1995-04-20 | 2000-11-07 | Nec Corporation | Method of fabricating a semiconductor memory device having bit line directly held in contact through contact with impurity region in self-aligned manner |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0468051A1 (en) | 1992-01-29 |
| EP0468051B1 (en) | 1995-12-13 |
| DE69024207D1 (de) | 1996-01-25 |
| KR940011487B1 (ko) | 1994-12-19 |
| EP0644652A3 (enExample) | 1995-04-05 |
| KR920702072A (ko) | 1992-08-12 |
| EP0468051A4 (en) | 1992-05-13 |
| DE69024207T2 (de) | 1996-05-02 |
| WO1991012662A1 (fr) | 1991-08-22 |
| JPH03235408A (ja) | 1991-10-21 |
| EP0644652A2 (en) | 1995-03-22 |
| US5218328A (en) | 1993-06-08 |
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