JP3056931B2 - Printed circuit board dividing device - Google Patents
Printed circuit board dividing deviceInfo
- Publication number
- JP3056931B2 JP3056931B2 JP5315040A JP31504093A JP3056931B2 JP 3056931 B2 JP3056931 B2 JP 3056931B2 JP 5315040 A JP5315040 A JP 5315040A JP 31504093 A JP31504093 A JP 31504093A JP 3056931 B2 JP3056931 B2 JP 3056931B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- substrate
- divided
- dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、複数のプリント配線基
板が一体成形された大型の複合プリント基板を複数のプ
リント配線基板に分割するプリント基板分割装置に係
り、特に、プリント基板分割に際してプリント基板に歪
みを発生させないプリント基板分割装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board dividing apparatus for dividing a large-sized composite printed circuit board integrally formed with a plurality of printed circuit boards into a plurality of printed circuit boards. The present invention relates to a printed circuit board dividing apparatus that does not generate distortion.
【０００２】[0002]
【従来の技術】プリント基板に電子部品を搭載し半田付
け実装するに際しては、一般的には工数削減のため、予
め、ミシン目またはＶ字溝の設けられた大型のプリント
基板に電子部品を搭載し、半田付けした後、ミシン目ま
たはＶ字溝に沿って複数の小型プリント基板に分割する
方法が採られている。2. Description of the Related Art When electronic components are mounted on a printed circuit board and soldered, generally, the electronic components are mounted on a large printed circuit board provided with perforations or V-shaped grooves in advance in order to reduce man-hours. Then, after soldering, a method of dividing into a plurality of small printed boards along perforations or V-shaped grooves is adopted.
【０００３】図２は従来のプリント基板を示す（ａ）平
面図、（ｂ）断面図である。１はプリント基板で、予
め、分割部分にミシン目２またはＶ字溝３が設けられて
いる。ミシン目２は分割部に沿って複数の長方形の開口
部１２で構成されており、各開口部１２の間の繋ぎ部２
２でプリント基板１は１枚のプリント基板として形状を
保持している。また、Ｖ字溝３は分割部に沿ってプリン
ト基板１の両面に形成されたＶ字型の溝である。ミシン
目２の場合は繋ぎ部２２の部分を狭くすることにより、
また、Ｖ字溝３の場合は溝を深くすることにより、プリ
ント基板１を容易に分割することがでいる。しかし、過
度に繋ぎ部２２を狭くしたり、Ｖ字溝３を深くすると、
電子部品の搭載時に部品の挿入圧力でプリント基板１が
ミシン目２またはＶ字溝３の部分で割れたり、または、
半田付け時にプリント基板１が反ることがある。FIGS. 2A and 2B are a plan view and a sectional view, respectively, showing a conventional printed circuit board. Reference numeral 1 denotes a printed circuit board, which is provided with perforations 2 or V-shaped grooves 3 in divided portions in advance. The perforation 2 is composed of a plurality of rectangular openings 12 along the division, and the connecting portion 2 between the openings 12 is formed.
In 2, the printed circuit board 1 holds the shape as one printed circuit board. The V-shaped groove 3 is a V-shaped groove formed on both sides of the printed circuit board 1 along the division. In the case of perforation 2, by narrowing the connecting portion 22,
In the case of the V-shaped groove 3, the printed circuit board 1 can be easily divided by making the groove deep. However, if the connecting portion 22 is excessively narrowed or the V-shaped groove 3 is deepened,
The printed circuit board 1 is broken at the perforation 2 or the V-shaped groove 3 by the insertion pressure of the component when the electronic component is mounted, or
The printed circuit board 1 may warp during soldering.
【０００４】図３は従来のプリント基板を２つに分割す
る方法を示す図である。（ａ）は手動によるプリント基
板分割方法、（ｂ）はローラーカッターによるプリント
基板分割方法を示す図である。以下、図に従って説明す
る。１は予め分割部分にミシン目２またはＶ字溝３が設
けられたプリント基板で、電子部品４が搭載され半田付
けが完了している。５はプリント基板１に圧着して切断
するローラーカッターで、円板の中心部に回転軸１５が
挿入される孔と円周部にカッター部２５が設けられてい
る。FIG. 3 is a diagram showing a conventional method of dividing a printed circuit board into two. (A) is a figure which shows the printed-circuit board dividing method by manual, and (b) is a figure which shows the printed-circuit board dividing method by a roller cutter. Hereinafter, description will be made with reference to the drawings. Reference numeral 1 denotes a printed circuit board provided with a perforation 2 or a V-shaped groove 3 in a divided portion in advance, on which an electronic component 4 is mounted and soldering is completed. Reference numeral 5 denotes a roller cutter which presses and cuts the printed circuit board 1 and has a hole into which the rotating shaft 15 is inserted at the center of the disk and a cutter 25 at the circumference.
【０００５】次に、プリント基板の分割方法について述
べる。図３（ａ）は手動によるプリント基板分割方法
で、大型のプリント基板１の両端部１１を両手で保持し
て、予め設けられたミシン目２またはＶ字溝３（図で
は、Ｖ字溝３が示されている）を支点としてプリント基
板１を折り曲げる。このようにして、プリント基板１は
２つの小型プリント基板に分割される。Next, a method of dividing a printed circuit board will be described. FIG. 3 (a) shows a manual printed circuit board dividing method, in which both ends 11 of a large printed circuit board 1 are held with both hands, and a perforation 2 or a V-shaped groove 3 (a V-shaped groove 3 in the figure) provided in advance. Is shown), and the printed circuit board 1 is bent. In this way, the printed circuit board 1 is divided into two small printed circuit boards.
【０００６】図３（ｂ）はローラーカッターによるプリ
ント基板分割方法で、プリント基板１のＶ字溝３の両側
よりローラーカッター５のカッター部２５に挟まれ、プ
リント基板１の移動とローラーカッター５のカッター部
２５の回転によって、プリント基板１はＶ字溝３に沿っ
て２つの小型プリント基板に切断される。FIG. 3B shows a method of dividing the printed circuit board using a roller cutter. The printed circuit board 1 is sandwiched between the cutter portions 25 of the roller cutter 5 from both sides of the V-shaped groove 3 to move the printed circuit board 1 and to move the roller cutter 5. By the rotation of the cutter unit 25, the printed board 1 is cut into two small printed boards along the V-shaped groove 3.
【０００７】[0007]
【発明が解決しようとする課題】プリント基板１の両端
部１１を手で保持して折り曲げると、ミシン目２または
Ｖ字溝３の分割部分に直接応力が集中せずにプリント基
板１の部品実装面も曲がる。その結果として、電子部品
の半田付け部、プリント配線の銅パターン部に力がかか
り、半田外れ、パターン断線等の不良が発生する。When the both ends 11 of the printed circuit board 1 are held and bent by hand, stress is not directly concentrated on the perforations 2 or the divided portions of the V-shaped grooves 3 and the components are mounted on the printed circuit board 1. The surface also bends. As a result, a force is applied to the soldered portion of the electronic component and the copper pattern portion of the printed wiring, and defects such as solder detachment and disconnection of the pattern occur.
【０００８】また、ローラーカッターを使用する方法で
は、特に、ガラス繊維入りプリント基板１の場合は、カ
ッター部２５の磨耗が激しくローラーカッター５の交換
頻度が高く、費用が嵩む。また、上下のローラーカッタ
ー５の位置合わせ、特に上下カッター部２５間の距離の
調整が困難であり、分割時に両者の位置がずれると切断
面が凸凹になるという問題があった。Further, in the method using a roller cutter, especially in the case of the printed circuit board 1 containing glass fiber, the cutter portion 25 is greatly worn and the frequency of replacement of the roller cutter 5 is high, which increases the cost. In addition, it is difficult to align the upper and lower roller cutters 5, particularly the distance between the upper and lower cutter portions 25, and there is a problem that if the positions of the two are shifted during the division, the cut surface becomes uneven.
【０００９】本発明は、プリント基板の分割部分に応力
を集中させて、容易に分割でき、かつ、プリント基板の
電子部品搭載部には応力がかからないようにして、電子
部品の不良、プリント配線の断線不良をなくすことを目
的とするものである。According to the present invention, the stress is concentrated on the divided portion of the printed circuit board, and the divided portion can be easily divided, and the stress is not applied to the electronic component mounting portion of the printed circuit board. The purpose is to eliminate disconnection defects.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するめた
めに本発明は、第１基板と第２基板とが分割部分に分割
加工がなされて一体に形成された複合基板を分割するプ
リント基板分割装置において、前記複合基板における分
割加工がなされた分割部分を該複合基板の両面から挟み
込んで固定する固定手段と、前記第１基板における前記
分割部分に対して隣接する両側面部を保持して固定する
基板固定手段と、前記第２基板における前記分割部分に
対して隣接する両側面部を保持する基板保持手段と、前
記基板保持手段を移動し、前記複合基板を前記分割部分
で折り曲げ切断する駆動手段とを有することを特徴とす
る。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a printed circuit board dividing method for dividing a composite substrate in which a first substrate and a second substrate are divided into divided portions and integrally formed. In the apparatus, fixing means for sandwiching and fixing the divided portion of the composite substrate from both sides of the composite substrate, and holding and fixing both side portions of the first substrate adjacent to the divided portion. Substrate fixing means, substrate holding means for holding both side surfaces adjacent to the divided portion of the second substrate, driving means for moving the substrate holding means and bending and cutting the composite substrate at the divided portion; It is characterized by having.
【００１１】プリント基板の分割部分が固定手段により
プリント基板の両面から挟み込まれて固定された状態
で、保持されたプリント基板の両側面が移動され、プリ
ント基板の分割部分が折り曲げられるように切断され
る。従って、プリント基板の分割部分に応力が集中され
て容易にプリント基板が分割される。また、プリント基
板はプリント基板における前記分割部分に対して隣接す
る両側面から保持されているので、プリント基板の部品
が搭載されている部分の反りの発生を抑えることがで
き、プリント基板分割時における電子部品やプリント配
線パターンの損傷を防止できる。In a state where the divided portions of the printed circuit board are sandwiched and fixed by both sides of the printed circuit board by the fixing means, both sides of the held printed circuit board are moved, and the divided portions of the printed circuit board are cut so as to be bent. You. Accordingly, the stress is concentrated on the divided portion of the printed board, and the printed board is easily divided. Further, since the printed circuit board is held from both sides adjacent to the divided portion of the printed circuit board, it is possible to suppress the occurrence of the warpage of the portion where the components of the printed circuit board are mounted, and to reduce Damage to electronic components and printed wiring patterns can be prevented.
【００１２】[0012]
【実施例】図１は、本発明の一実施例のプリント基板分
割装置を示す図である。（ａ）は斜視図、（ｂ）は側面
図である。６はプリント基板分割装置で、基板分割部支
持機構７、基板固定機構８、基板回転機構９より構成さ
れる。７はプリント基板１の分割部に応力を集中させる
基板分割部支持機構で、プリント基板１の分割部の上下
よりミシン目２またはＶ字溝３（図では、Ｖ字溝の例が
示されている）を挟んで支持する楔１７、２７と、楔１
７、２７を上下に駆動するエアーシリンダ３７、４７に
より構成される。８は分割するプリント基板１の一方を
分割時にプリント基板１が湾曲しないように固定する基
板固定機構で、分割されるプリント基板１の一方の側面
部２１が挿入される溝３８、４８を有する一対の固定基
板保持台１８、２８と、プリント基板１の一端から分割
部までの寸法を一定に保ち、分割部のミシン目２または
Ｖ字溝３が丁度基板分割部支持機構の楔１７、２７と一
致させるための位置決めを行う基板ストッパー５８で構
成される。尚、基板ストッパー５８の位置は予めプリン
ト基板１の種類毎の調整が必要である。９は分割時にプ
リント基板１が湾曲しないように固定し応力を分割部に
集中させるとともにプリント基板１を曲げる基板回転機
構で、分割されるプリント基板１の他方の側面部３１が
挿入される溝３９、４９を有する一対の回転基板保持台
１９、２９と、プリント基板１を回転させるエアーシリ
ンダ５９、６９により構成される。尚、分割されるべき
プリント基板１の幅に対応して、一対の固定基板保持台
１８、２８の間隔および一対の回転基板保持台１９、２
９の間隔はそれぞれ可変できる。FIG. 1 is a diagram showing a printed circuit board dividing apparatus according to one embodiment of the present invention. (A) is a perspective view, (b) is a side view. Reference numeral 6 denotes a printed circuit board dividing device, which includes a substrate dividing section support mechanism 7, a substrate fixing mechanism 8, and a substrate rotating mechanism 9. Reference numeral 7 denotes a board dividing portion supporting mechanism for concentrating stress on the divided portion of the printed board 1, and a perforation 2 or a V-shaped groove 3 (an example of a V-shaped groove is shown in FIG. 17, wedges 17 and 27, and wedge 1
The air cylinders 37 and 47 drive the cylinders 7 and 27 up and down. Reference numeral 8 denotes a board fixing mechanism for fixing one of the divided printed circuit boards 1 so that the printed circuit board 1 does not bend when the divided circuit board 1 is divided. And the dimensions from one end of the printed circuit board 1 to the division are kept constant, and the perforations 2 or the V-shaped grooves 3 of the division are exactly the same as the wedges 17 and 27 of the substrate division support mechanism. It is composed of a substrate stopper 58 for performing positioning for matching. The position of the board stopper 58 needs to be adjusted in advance for each type of the printed board 1. Reference numeral 9 denotes a substrate rotating mechanism for fixing the printed circuit board 1 so as not to bend at the time of division and concentrating stress on the divided portion and bending the printed circuit board 1. The groove 39 into which the other side surface 31 of the divided printed circuit board 1 is inserted. , 49, and air cylinders 59, 69 for rotating the printed circuit board 1. In addition, according to the width of the printed circuit board 1 to be divided, the interval between the pair of fixed substrate holding stands 18 and 28 and the pair of rotating board holding stands 19 and 2 are set.
The intervals 9 can be varied.
【００１３】次に、プリント基板分割方法について述べ
る。部品が搭載され半田付けの完了したプリント基板１
は回転基板保持台１９、２９の溝３９、４９から挿入さ
れ、他方の固定基板保持台１８、２８の溝３８、４８を
通過して、予め位置調整の完了した基板ストッパー５８
に当接される。このことにより、プリント基板１の分割
部のミシン目２またはＶ字溝３が丁度基板分割部支持機
構の楔１７、２７と一致する。Next, a printed circuit board dividing method will be described. Printed circuit board 1 with components mounted and soldered
Are inserted from the grooves 39 and 49 of the rotary substrate holders 19 and 29, and pass through the grooves 38 and 48 of the other fixed substrate holders 18 and 28, and the substrate stopper 58 whose position adjustment is completed in advance is performed.
Contacted. As a result, the perforations 2 or V-shaped grooves 3 at the divisions of the printed circuit board 1 exactly coincide with the wedges 17 and 27 of the substrate division part support mechanism.
【００１４】次に、基板分割部支持機構７の上下のエア
ーシリンダ３７、４７が駆動され、楔１７、２７がプリ
ント基板１の分割部のミシン目２またはＶ字溝３を両側
から挟み込む。続いて、エアーシリンダ５９、６９が駆
動され、一対の回転基板保持台１９、２９が上部に引き
上げられプリント基板１は楔１７、２７で支持された部
分を支点として、回転され応力は楔１７、２７部分に集
中され容易に切断される。この時、プリント基板１の固
定側は一対の固定基板保持台１８、２８の溝３８、４８
と楔１７、２７により固定されているため、平面が保持
されプリント基板１には応力はかからない。また、プリ
ント基板１の回転側は一対の回転基板保持台１９、２９
の溝３９、４９と楔１７、２７により固定されているた
め、平面が保持されプリント基板１には同様に応力はか
からない。Next, the upper and lower air cylinders 37, 47 of the substrate dividing portion support mechanism 7 are driven, and the wedges 17, 27 sandwich the perforation 2 or the V-shaped groove 3 of the dividing portion of the printed circuit board 1 from both sides. Subsequently, the air cylinders 59 and 69 are driven, and the pair of rotating board holding stands 19 and 29 are lifted up. The printed board 1 is rotated with the portion supported by the wedges 17 and 27 as a fulcrum, and the stress is reduced. It is concentrated on 27 parts and easily cut. At this time, the fixed side of the printed circuit board 1 is in the grooves 38, 48 of the pair of fixed board holding tables 18, 28.
And the wedges 17 and 27, the flat surface is maintained, and no stress is applied to the printed circuit board 1. The rotating side of the printed circuit board 1 is mounted on a pair of rotating board holding stands 19, 29
Are fixed by the grooves 39, 49 and the wedges 17, 27, the flat surface is maintained, and no stress is applied to the printed circuit board 1 similarly.
【００１５】本実施例によると、プリント基板１の分割
部（ミシン目２またはＶ字溝３）にのみ応力が集中して
容易に切断されるとともに、プリント基板は常に平面に
保たれているので、プリント基板に搭載された電子部品
や半田付け部には全く力がかからず、プリント配線パタ
ーンの断線も生じない。According to the present embodiment, stress is concentrated only on the divided portion (perforation 2 or V-shaped groove 3) of the printed circuit board 1 and easily cut, and the printed circuit board is always kept flat. In addition, no force is applied to the electronic components and the soldered portions mounted on the printed circuit board, and no break in the printed wiring pattern occurs.
【００１６】[0016]
【発明の効果】以上詳細に説明したように、本発明によ
れば、プリント基板の切断時には切断部が固定手段で固
定され、プリント基板は常に平面に保たれるので電子部
品、半田付け部、プリント配線パターンへの損傷は全く
ない。As described above in detail, according to the present invention, when the printed circuit board is cut, the cut portion is fixed by the fixing means, and the printed circuit board is always kept flat. There is no damage to the printed wiring pattern.
【図１】本発明の一実施例のプリント基板分割装置を示
す（ａ）は斜視図、（ｂ）は側面図。FIG. 1A is a perspective view and FIG. 1B is a side view showing a printed circuit board dividing apparatus according to an embodiment of the present invention.
【図２】プリント基板の分割部を示す（ａ）平面図、
（ｂ）断面図。FIG. 2A is a plan view showing a divided portion of a printed circuit board;
(B) Sectional view.
【図３】従来のプリント基板を２つに分割する方法を示
す図。FIG. 3 is a diagram showing a conventional method of dividing a printed circuit board into two.
１・・・プリント基板 ７・・・基板分割部支持機構 ８・・・固定基板保持機構 ９・・・回転基板保持機構 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 7 ... Board division part support mechanism 8 ... Fixed board holding mechanism 9 ... Rotating board holding mechanism
Claims (1)
加工がなされて一体に形成された複合基板を分割するプ
リント基板分割装置において、 前記複合基板における分割加工がなされた分割部分を該
複合基板の両面から挟み込んで固定する固定手段と、 前記第１基板における前記分割部分に対して隣接する両
側面部を保持して固定する基板固定手段と、 前記第２基板における前記分割部分に対して隣接する両
側面部を保持する基板保持手段と、 前記基板保持手段を移動し、前記複合基板を前記分割部
分で折り曲げ切断する駆動手段とを有することを特徴と
するプリント基板分割装置。1. A printed circuit board dividing apparatus for dividing a composite substrate formed by integrally dividing a first substrate and a second substrate into divided portions, wherein the divided portion of the composite substrate is divided. Fixing means for sandwiching and fixing from both sides of the composite substrate; substrate fixing means for holding and fixing both side surfaces adjacent to the divided portion of the first substrate; and for the divided portion of the second substrate. A printed circuit board dividing device, comprising: a substrate holding means for holding both side portions adjacent to each other; and a driving means for moving the substrate holding means and bending and cutting the composite substrate at the divided portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5315040A JP3056931B2 (en) | 1993-12-15 | 1993-12-15 | Printed circuit board dividing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5315040A JP3056931B2 (en) | 1993-12-15 | 1993-12-15 | Printed circuit board dividing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07164392A JPH07164392A (en) | 1995-06-27 |
| JP3056931B2 true JP3056931B2 (en) | 2000-06-26 |
Family
ID=18060708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5315040A Expired - Fee Related JP3056931B2 (en) | 1993-12-15 | 1993-12-15 | Printed circuit board dividing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3056931B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573300A (en) * | 2010-12-29 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Board splitting method of circuit board |
Families Citing this family (6)
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|---|---|---|---|---|
| KR100740627B1 (en) * | 2006-04-18 | 2007-07-18 | 이주영 | Auto fixed jig of printed circuit board |
| JP2008053633A (en) * | 2006-08-28 | 2008-03-06 | Mitsubishi Electric Corp | Printed wiring board and dividing method |
| JP4991339B2 (en) * | 2006-12-25 | 2012-08-01 | 株式会社フジクラ | Bending method and bending apparatus for bending type rigid printed wiring board |
| CN106132093B (en) * | 2016-08-19 | 2018-11-27 | 潍坊歌尔电子有限公司 | A kind of scoreboard tooling |
| CN106132100A (en) * | 2016-08-26 | 2016-11-16 | 百色学院 | A kind of automatic corrosion PCB device |
| CN108012419B (en) * | 2017-10-31 | 2020-04-03 | 广德博亚新星电子科技有限公司 | Zero-distance V-CUT processing method for PCB |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042599U (en) * | 1983-09-01 | 1985-03-26 | パイオニア株式会社 | Board splitting device |
| JPH01166097U (en) * | 1988-05-11 | 1989-11-21 |
-
1993
- 1993-12-15 JP JP5315040A patent/JP3056931B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573300A (en) * | 2010-12-29 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Board splitting method of circuit board |
| CN102573300B (en) * | 2010-12-29 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | Board splitting method of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07164392A (en) | 1995-06-27 |
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