JP2521576Y2 - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JP2521576Y2
JP2521576Y2 JP6217891U JP6217891U JP2521576Y2 JP 2521576 Y2 JP2521576 Y2 JP 2521576Y2 JP 6217891 U JP6217891 U JP 6217891U JP 6217891 U JP6217891 U JP 6217891U JP 2521576 Y2 JP2521576 Y2 JP 2521576Y2
Authority
JP
Japan
Prior art keywords
board
printed wiring
wiring board
positioning
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP6217891U
Other languages
Japanese (ja)
Other versions
JPH058972U (en
Inventor
幸雄 高橋
達明 関川
宏久 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP6217891U priority Critical patent/JP2521576Y2/en
Publication of JPH058972U publication Critical patent/JPH058972U/en
Application granted granted Critical
Publication of JP2521576Y2 publication Critical patent/JP2521576Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】本考案は、フレキシブル基板が接
続されるプリント配線板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board to which a flexible board is connected.

【0002】[0002]

【従来の技術】プリント配線板に他のプリント配線板や
LCD等の電子部品を接続する方法として、プリント配
線板にフレキシブル基板の一端側を接続し、フレキシブ
ル基板の他端側に他のプリント配線板等を接続する方法
がある。このような方法を用いる場合には、プリント配
線板とフレキシブル基板とは平面的なパタ−ン部どうし
の接続となるため、フレキシブル基板の端部をプリント
配線板の所定位置に治具により位置付けた状態で両者の
パタ−ン部を半田付けする必要がある。
2. Description of the Related Art As a method of connecting another printed wiring board or an electronic component such as an LCD to a printed wiring board, one end side of a flexible board is connected to the printed wiring board and another printed wiring board is connected to the other end side of the flexible board. There is a method of connecting plates and the like. When such a method is used, since the printed wiring board and the flexible board are connected to each other in a planar pattern portion, the end of the flexible board is positioned at a predetermined position of the printed wiring board by a jig. It is necessary to solder both pattern parts in this state.

【0003】図5乃至図8に位置決めピンを用いてプリ
ント配線板とフレキシブル基板の位置出しを行うように
された従来の接続方法を示す。
5 to 8 show a conventional connecting method in which a positioning pin is used to position a printed wiring board and a flexible board.

【0004】図5に示す如く、プリント配線板1の端部
近傍には、接続用パタ−ン部3が複数設けられており、
これらの接続用パタ−ン部3の両側には、図7及び図8
に示す治具台5に立設された位置決めピン7が挿入され
る位置決め用穴部9が穿設されている。一方、フレキシ
ブル基板11は、図6に示す如く、一端11a側にプリ
ント配線板1の接続用パタ−ン部3に接続される複数の
パタ−ン部13aが設けられ、これらのパタ−ン部13
aの両側には位置出しピン7が挿入される穴部15aが
穿設されている。また、フレキシブル基板11の他端1
1b側にも他のプリント配線板(図示せず)に接続され
るパタ−ン部13b及び位置出し用の穴部15bが設け
られている。
As shown in FIG. 5, a plurality of connecting pattern portions 3 are provided near the end portion of the printed wiring board 1.
7 and 8 are provided on both sides of the connecting pattern portion 3.
A jig hole 5 for positioning is provided with a positioning hole 9 into which a standing pin 7 is inserted. On the other hand, as shown in FIG. 6, the flexible substrate 11 is provided with a plurality of pattern portions 13a connected to the connecting pattern portion 3 of the printed wiring board 1 on one end 11a side. Thirteen
Holes 15a into which the positioning pins 7 are inserted are formed on both sides of a. In addition, the other end 1 of the flexible substrate 11
A pattern portion 13b connected to another printed wiring board (not shown) and a hole portion 15b for positioning are also provided on the 1b side.

【0005】そして、図7及び図8に示す如く、まず、
位置決め用穴部9に位置決めピン7が挿入された状態の
プリント配線板1を治具台5に載置し、ついで穴部15
aに位置決めピン7が挿入された状態のフレキシブル基
板11をプリント配線板1上に重ねて接続用パタ−ン部
3にパタ−ン部13aを位置付け、両パタ−ン部3,1
3aを半田付けする構成となっている。
Then, as shown in FIGS. 7 and 8, first,
The printed wiring board 1 with the positioning pin 7 inserted in the positioning hole 9 is placed on the jig base 5, and then the hole 15
The flexible board 11 in which the positioning pin 7 is inserted in a is placed on the printed wiring board 1 and the pattern part 13a is positioned on the connecting pattern part 3, and both pattern parts 3, 1
3a is soldered.

【0006】しかしながらこの従来のプリント配線板1
によると、プリント配線板1自体に位置決め用穴部9が
穿設されるため、プリント配線板1に形成される各種パ
タ−ン(図示せず)はこの位置決め用穴部9を避ける必
要があるためパタ−ン設計が困難になるばかりかプリン
ト配線板1、さらにはこのプリント配線板1が収納され
る電子機器が大形化するという不具合がある。
However, this conventional printed wiring board 1
According to the above, since the positioning hole 9 is formed in the printed wiring board 1 itself, various patterns (not shown) formed on the printed wiring board 1 need to avoid the positioning hole 9. Therefore, not only the pattern design becomes difficult, but also the printed wiring board 1 and the electronic equipment in which the printed wiring board 1 is housed become large in size.

【0007】また、プリント配線板1に占めるフレキシ
ブル基板11の面積を小さくするためには接続用パタ−
ン部3はプリント配線板1の端部近傍に設ける必要があ
るため、通常は位置決め用穴部9は接続用パタ−ン部3
の両側に設けられる。そのため、フレキシブル基板11
側の穴部15aもパタ−ン部13aの両側に設ける必要
があるため、フレキシブル基板11の幅が穴部15aを
形成する分だけ大きくなり、従ってフレキシブル基板1
1が高価になるという不具合も生じていた。
Further, in order to reduce the area of the flexible substrate 11 occupying the printed wiring board 1, a connecting pattern is used.
Since it is necessary to provide the switch part 3 in the vicinity of the end of the printed wiring board 1, the positioning hole 9 is normally used as the connecting pattern part 3.
It is provided on both sides of. Therefore, the flexible substrate 11
Since the holes 15a on the side also need to be provided on both sides of the pattern 13a, the width of the flexible substrate 11 is increased by the amount of forming the holes 15a.
There was a problem that 1 became expensive.

【0008】[0008]

【考案が解決しようとする課題】上述の如く、従来のプ
リント配線板では、このプリント配線板に接続されるフ
レキシブル基板を位置決めするための位置決め用穴部が
穿設されるので、パタ−ン引回しのための設計が困難に
なり、また、プリント配線板が大形化し、このプリント
配線板が収納される電子機器も大形化するという問題が
あった。
As described above, in the conventional printed wiring board, since the positioning hole for positioning the flexible board connected to this printed wiring board is formed, the pattern drawing is performed. There is a problem that the design for turning becomes difficult, the printed wiring board becomes large-sized, and the electronic equipment in which the printed wiring board is housed becomes large-sized.

【0009】本考案は、このような従来の欠点に鑑みて
なされたものであり、フレキシブル基板を位置決めする
ために必要とされる位置決め用穴部を各種パタ−ンの引
回しに影響を与えることなく設けることができるプリン
ト配線板を提供することを目的とする。
The present invention has been made in view of the above-mentioned conventional drawbacks, and the positioning hole portion required for positioning the flexible substrate affects the routing of various patterns. It is an object of the present invention to provide a printed wiring board that can be provided without any need.

【0010】[0010]

【課題を解決するための手段】本考案のプリント配線板
は、電子部品が実装される製品基板と、この製品基板と
連結されこの製品基板から切断される捨て基板とを有
し、前記製品基板にはフレキシブル基板に設けられたパ
タ−ン部が接続される接続用パタ−ン部が設けられ、前
記捨て基板には前記フレキシブル基板の位置決めとなる
位置決めピンが挿入される位置決め用穴部が設けられた
構成となっている。
A printed wiring board according to the present invention has a product substrate on which electronic components are mounted, and a waste substrate connected to the product substrate and cut from the product substrate. Is provided with a connecting pattern portion to which a pattern portion provided on the flexible substrate is connected, and the discarding substrate is provided with a positioning hole portion into which a positioning pin for positioning the flexible substrate is inserted. It has been configured.

【0011】[0011]

【作用】本考案では、捨て基板の位置決め用穴部に挿入
された位置決めピンにより、フレキシブル基板が位置決
めされて、製品基板の接続用パタ−ン部と一致する状態
にフレキシブル基板のパタ−ン部が位置付けられ、接続
用パタ−ン部とフレキシブル基板のパタ−ン部が半田付
けされた後に捨て基板が製品基板から取り除かれる。
In the present invention, the flexible board is positioned by the positioning pins inserted in the positioning holes of the waste board, and the flexible board pattern section is aligned with the connecting pattern section of the product board. Is positioned and after the connection pattern part and the pattern part of the flexible board are soldered, the discarded board is removed from the product board.

【0012】[0012]

【実施例】以下、本考案の一実施例を図1乃至図4を参
照して詳述する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS.

【0013】図1は本考案に係るプリント配線板の平面
図、図2は図1のプリント配線板に接続されるフレキシ
ブル基板の平面図、図3及び、図4は上記プリント配線
板及びフレキシブル基板を治具に載置した状態の側面図
及び平面図である。
FIG. 1 is a plan view of a printed wiring board according to the present invention, FIG. 2 is a plan view of a flexible board connected to the printed wiring board of FIG. 1, and FIGS. 3 and 4 are the printed wiring board and flexible board. FIG. 3 is a side view and a plan view showing a state in which is mounted on a jig.

【0014】本考案に係るプリント配線板21は、図1
に示す如く、電子部品が実装される製品基板23と、こ
の製品基板23を複数連結する捨て基板25とで構成さ
れている。このプリント配線板21では、製品基板23
と捨て基板25との間に切断用の溝27が設けられてい
るので、電子部品が実装された製品基板23からこの捨
て基板25を容易に切断することができる。従って、こ
のプリント配線板21によれば、電子部品を実装する際
には、取扱の容易な大形のプリント配線板21の状態で
小形の製品基板23に電子部品を実装でき、実装後は捨
て基板25を取り去ることにより、製品基板23を基板
とする電子回路部を複数得ることができる。
The printed wiring board 21 according to the present invention is shown in FIG.
As shown in FIG. 3, the product board 23 on which electronic components are mounted and the discard board 25 that connects a plurality of the product boards 23 are configured. In this printed wiring board 21, the product substrate 23
Since the groove 27 for cutting is provided between the waste substrate 25 and the waste substrate 25, the waste substrate 25 can be easily cut from the product substrate 23 on which the electronic component is mounted. Therefore, according to this printed wiring board 21, when mounting an electronic component, the electronic component can be mounted on the small product board 23 in the state of the large printed wiring board 21 which is easy to handle, and after mounting, it is discarded. By removing the substrate 25, it is possible to obtain a plurality of electronic circuit parts using the product substrate 23 as a substrate.

【0015】さて、このプリント配線板21において
は、図2に示すフレキシブル基板29を接続するための
接続用パタ−ン部31が各製品基板23に複数設けられ
ている。この接続用パタ−ン部31は、製品基板23に
占めるフレキシブル基板29の面積が小さくなるよう
に、製品基板23の端部に設けられている。また、捨て
基板25には、図3及び図4に示す治具台33に立設さ
れた位置決めピン34が挿入される位置決め用穴部35
が穿設されている。この位置決め用穴部35は、各製品
基板23に設けられた接続用パタ−ン部31に対応する
位置に2個づつ設けられている。また、各製品基板23
ごとに対応させて設けられている2個の位置決め用の穴
部の間隔Lは複数の接続用パタ−ン部31が製品基板2
3に占める部分の横幅と同程度となっている。
In this printed wiring board 21, each product board 23 is provided with a plurality of connection pattern portions 31 for connecting the flexible board 29 shown in FIG. The connecting pattern portion 31 is provided at the end portion of the product substrate 23 so that the area of the flexible substrate 29 occupying the product substrate 23 becomes small. In addition, the discarding board 25 has a positioning hole portion 35 into which a positioning pin 34 provided upright on a jig base 33 shown in FIGS. 3 and 4 is inserted.
Has been drilled. Two positioning holes 35 are provided at positions corresponding to the connection pattern parts 31 provided on each product board 23. In addition, each product board 23
The distance L between the two positioning holes provided corresponding to each of the plurality of connection pattern portions 31 is equal to that of the product substrate 2.
The width is about the same as the width of the portion occupied by 3.

【0016】一方、フレキシブル基板29は、図2に示
す如く、一端29a側に製品基板23の接続用パタ−ン
部31に接続される複数のパタ−ン部37aが設けら
れ、これらのパタ−ン部37aから所定の距離を開け
て、位置決めピン34が挿入される一対の穴部39aが
穿設されている。この一対の穴部39aは前記した位置
決め用穴部35と対応させて設けられており、この穴部
39aを位置決め用穴部35に一致させると接続用パタ
−ン部31上にパタ−ン部37aが位置付けられる構成
となっている。また、フレキシブル基板29の他端29
b側にも他のプリント配線板(図示せず)に接続される
パタ−ン37部b及び位置出し用の穴部39bが設けら
れている。
On the other hand, as shown in FIG. 2, the flexible substrate 29 is provided with a plurality of pattern portions 37a connected to the connecting pattern portion 31 of the product substrate 23 on one end 29a side, and these pattern portions 37a are provided. A pair of holes 39a, into which the positioning pins 34 are inserted, are provided at a predetermined distance from the connection portion 37a. The pair of holes 39a are provided so as to correspond to the above-described positioning holes 35. When the holes 39a are aligned with the positioning holes 35, the pattern part is formed on the connecting pattern part 31. 37a is positioned. In addition, the other end 29 of the flexible substrate 29
A pattern 37 portion b connected to another printed wiring board (not shown) and a hole portion 39b for positioning are also provided on the side b.

【0017】次に上記プリント配線板21に対するフレ
キシブル基板29の接続工程につき説明する。
Next, the process of connecting the flexible board 29 to the printed wiring board 21 will be described.

【0018】まず、図3及び図4に示す如く、上部に位
置する製品基板23に対応する位置決め用穴部35に位
置決めピン34が挿入された状態のプリント配線板21
を治具台33に載置し、ついで穴部39aに位置決め用
ピン34が挿入された状態のフレキシブル基板29をプ
リント配線板21上に重ね、接続用パタ−ン部31上に
パタ−ン部37aを位置付けて両パタ−ン部31、37
aを半田付けする。
First, as shown in FIGS. 3 and 4, the printed wiring board 21 in which the positioning pins 34 are inserted into the positioning holes 35 corresponding to the upper product substrate 23 is located.
Is placed on the jig stand 33, and then the flexible board 29 in which the positioning pins 34 are inserted into the holes 39a is placed on the printed wiring board 21, and the pattern part is formed on the connection pattern part 31. 37a is positioned so that both pattern parts 31, 37
Solder a.

【0019】これで、プリント配線板21の上部に位置
する製品基板23とフレキシブル基板29との接続が完
了する。同様にして、プリント配線板21の中間部及び
下部に位置する製品基板23とフレキシブル基板29を
接続し、接続が完了した段階で製品基板23から捨て基
板25を取り去る。これで、接続工程は終了する。
This completes the connection between the product substrate 23 located above the printed wiring board 21 and the flexible substrate 29. Similarly, the product substrate 23 located in the middle and the lower part of the printed wiring board 21 and the flexible substrate 29 are connected, and when the connection is completed, the discarded substrate 25 is removed from the product substrate 23. This completes the connection process.

【0020】このように、本例のプリント配線板21に
おいては、各種パタ−ン(図示せず)が形成される製品
基板23には位置決め用穴部35を形成する必要がない
ので、この位置決め用穴部35に影響されないで、各種
パタ−ンを製品基板23に引き回すことができる。従っ
て、製品基板23の小形化、従って、これが用いられる
電子機器の小形化を図れる。また、一対の位置決め用穴
部35,35の間隔Lを複数の接続用パタ−ン部31を
配置するために必要とされるスペ−スの横幅よりも小さ
くできるので、製品基板23に接続されるフレキシブル
基板29の幅はパタ−ン部37aを設けるために必要と
される大きさであれば良く、従って、穴部 39aを設
けることにより、フレキシブル基板29の幅が大きくな
ることもない。この場合に、穴部39a,39bはパタ
−ン部37aとパタ−ン部37bとの間に位置すること
になるが、パタ−ン部37aとパタ−ン部37bを接続
するパタ−ン(図示せず)を穴部39a,39bを避け
る状態に引き回すことは容易であるので何等問題はな
い。
As described above, in the printed wiring board 21 of this embodiment, it is not necessary to form the positioning holes 35 in the product substrate 23 on which various patterns (not shown) are formed, so that the positioning is performed. Various patterns can be routed to the product substrate 23 without being affected by the use hole portion 35. Therefore, it is possible to reduce the size of the product board 23, and thus the electronic equipment in which the product board 23 is used. Further, since the space L between the pair of positioning holes 35, 35 can be made smaller than the lateral width of the space required for arranging the plurality of connection pattern parts 31, it is connected to the product substrate 23. The width of the flexible substrate 29 may be any size required to provide the pattern portion 37a. Therefore, the width of the flexible substrate 29 does not become large by providing the hole portion 39a. In this case, the holes 39a and 39b are located between the pattern portions 37a and 37b, but the pattern (that connects the pattern portions 37a and 37b) is formed. Since it is easy to draw (not shown) around the holes 39a and 39b, there is no problem.

【0021】尚、本例では、複数の製品基板23を有す
るプリント配線板21につき説明したが、一個の製品基
板に捨て基板を設け、この捨て基板に位置決め用穴部を
形成する構成としても良い。
In this example, the printed wiring board 21 having a plurality of product substrates 23 has been described, but it is also possible to dispose a waste substrate on one product substrate and form a positioning hole in this waste substrate. .

【0022】[0022]

【考案の効果】以上、説明したように、本考案のプリン
ト配線板では、フレキシブル基板を位置決めするための
位置決めピンが挿入される位置決め用穴部が捨て基板に
設けられており、各種パタ−ンが形成される製品基板側
には位置決め用穴部を形成する必要がないので、位置決
め用穴部が各種パタ−ンの引回しに影響を与えることが
ない。従って、製品基板の小形化、さらには、この製品
基板が用いられる電子機器の小形化を図れる。
As described above, in the printed wiring board of the present invention, the discarding board is provided with the positioning hole into which the positioning pin for positioning the flexible board is inserted, and various patterns are provided. Since it is not necessary to form the positioning holes on the side of the product substrate where the holes are formed, the positioning holes do not affect the routing of various patterns. Therefore, it is possible to miniaturize the product board and further miniaturize the electronic device using the product board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例に係るプリント配線板の平面
図。
FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention.

【図2】図1のプリント配線板の製品基板に接続される
フレキシブル基板の平面図。
FIG. 2 is a plan view of a flexible board connected to the product board of the printed wiring board of FIG.

【図3】上記プリント配線板及びフレキシブル基板を位
置決め治具に載置した状態の側面図。
FIG. 3 is a side view showing a state in which the printed wiring board and the flexible board are placed on a positioning jig.

【図4】図3の平面図。FIG. 4 is a plan view of FIG. 3;

【図5】従来のプリント配線板の平面図。FIG. 5 is a plan view of a conventional printed wiring board.

【図6】図5のプリント配線板に接続されるフレキシブ
ル基板の平面図。
6 is a plan view of a flexible board connected to the printed wiring board of FIG.

【図7】図5のプリント配線板及び図6のフレキシブル
基板を位置決め治具に載置した状態の側面図。
7 is a side view of the printed wiring board of FIG. 5 and the flexible substrate of FIG. 6 placed on a positioning jig.

【図8】図7の平面図。FIG. 8 is a plan view of FIG.

【符号の説明】[Explanation of symbols]

21…プリント配線板 23…製品基板 25…捨て基板 29…フレキシブル基板 31…接続用パタ−ン部 34…位置決めピン 35…位置決め用穴部 37a…パタ−ン部 21 ... Printed wiring board 23 ... Product board 25 ... Waste board 29 ... Flexible board 31 ... Connection pattern part 34 ... Positioning pin 35 ... Positioning hole part 37a ... Pattern part

───────────────────────────────────────────────────── フロントページの続き (72)考案者 藤井 宏久 東京都日野市旭が丘3丁目1番地の1 東芝エー・ブイ・イー株式会社 日野事 業所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirohisa Fujii 1-1, 3-1, Asahigaoka, Hino City, Tokyo TOSHIBA A ・ V ・ E ・ E Co., Ltd. Hino Office

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of utility model registration request] 【請求項1】 電子部品が実装される製品基板と、この
製品基板と連結されこの製品基板から切断される捨て基
板とを有し、前記製品基板にはフレキシブル基板に設け
られたパタ−ン部が接続される接続用パタ−ン部が設け
られ、前記捨て基板には前記フレキシブル基板の位置決
めとなる位置決めピンが挿入される位置決め用穴部が設
けられていることを特徴とするプリント配線板。
1. A pattern section provided on a flexible board, the product board having an electronic component mounted thereon, and a waste board connected to the product board and cut from the product board. The printed wiring board is characterized in that a connecting pattern portion for connecting the connector is provided, and the discarding board is provided with a positioning hole into which a positioning pin for positioning the flexible board is inserted.
JP6217891U 1991-07-12 1991-07-12 Printed wiring board Expired - Fee Related JP2521576Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6217891U JP2521576Y2 (en) 1991-07-12 1991-07-12 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6217891U JP2521576Y2 (en) 1991-07-12 1991-07-12 Printed wiring board

Publications (2)

Publication Number Publication Date
JPH058972U JPH058972U (en) 1993-02-05
JP2521576Y2 true JP2521576Y2 (en) 1996-12-25

Family

ID=13192615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6217891U Expired - Fee Related JP2521576Y2 (en) 1991-07-12 1991-07-12 Printed wiring board

Country Status (1)

Country Link
JP (1) JP2521576Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5184044B2 (en) * 2007-10-19 2013-04-17 矢崎総業株式会社 Printed wiring board unit
US20130186678A1 (en) * 2010-02-17 2013-07-25 Sharp Kabushiki Kaisha Substrate set, electronic device, and method for manufacturing substrate set

Also Published As

Publication number Publication date
JPH058972U (en) 1993-02-05

Similar Documents

Publication Publication Date Title
US5920465A (en) Connecting structure between flexible printed circuit board and hard printed circuit board
JP2002290021A (en) Circuit board, circuit board module, and electronic apparatus
JPH10190186A (en) Unit parts mounting structure
JP2521576Y2 (en) Printed wiring board
JPH08116147A (en) Connection structure of rigid substrate
JPS59186387A (en) Method of bonding printed board
JP2687798B2 (en) connector
JP2001308503A (en) Electrode structure for soldering
JPH04105390A (en) Substrate mechanism
US6518512B2 (en) Structure for inspecting electrical component alignment
JPH0983093A (en) Printed wiring board
JPH0823163A (en) Mounting method for substrate
JP2000294893A (en) Structure and method for mounting chip component
JP2636332B2 (en) Printed board
JPH0439668Y2 (en)
JPH031893Y2 (en)
JP2569101Y2 (en) Terminal pin mounting structure on circuit board
JPS6020300Y2 (en) printed wiring board
JPH04369893A (en) Electronic part support device
JPS6236300Y2 (en)
JPH0724332B2 (en) Printed circuit board
US6392161B1 (en) Mounting substrate
JPH06268342A (en) Circuit board
JPH04186665A (en) Integrated circuit package
JPH08321664A (en) Printed wiring board

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19960723

LAPS Cancellation because of no payment of annual fees