JPH01166097U - - Google Patents
Info
- Publication number
- JPH01166097U JPH01166097U JP6266688U JP6266688U JPH01166097U JP H01166097 U JPH01166097 U JP H01166097U JP 6266688 U JP6266688 U JP 6266688U JP 6266688 U JP6266688 U JP 6266688U JP H01166097 U JPH01166097 U JP H01166097U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- outside
- exposed
- divided portion
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の基板カツト治具を
示す斜視図、第２図は同実施例において上型を開
放した場合の構成図、第３図は第１図中のＡ―Ａ
′線で切断した断面図、第４図は位置決め押えピ
ンと基板との係合状態を示す断面図、第５図は切
断具の詳細構成を示す斜視図、第６図は基板を示
す図である。
１……基板、２……分割溝、３……上型、４…
…下型、５……クランプ、６……蝶番、７……回
転台、８，８′……位置決め押えピン、９……切
断具。
Fig. 1 is a perspective view showing a substrate cutting jig according to an embodiment of the present invention, Fig. 2 is a configuration diagram of the same embodiment when the upper die is opened, and Fig. 3 is an A-A in Fig. 1.
4 is a sectional view showing the state of engagement between the positioning presser pin and the board, FIG. 5 is a perspective view showing the detailed configuration of the cutting tool, and FIG. 6 is a diagram showing the board. . 1...Substrate, 2...Dividing groove, 3...Upper mold, 4...
...lower mold, 5...clamp, 6...hinge, 7...rotating table, 8, 8'...positioning presser pin, 9...cutting tool.
Claims (1)
溝を有する基板をこの基板の分割部分が外方に露
出するように位置決め挾持する上型及び下型と、
前記基板の外方に露出した分割部分を挾持し前記
分割溝に沿つて切断する切断具とを備えることを
特徴とする基板カツト治具。 Upper and lower dies for positioning and holding a substrate on which chip parts are mounted and having dividing grooves at the locations to be cut, so that the divided portions of the substrate are exposed to the outside;
A substrate cutting jig comprising: a cutting tool that holds the divided portion exposed to the outside of the substrate and cuts the divided portion along the dividing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266688U JPH01166097U (en) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266688U JPH01166097U (en) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01166097U true JPH01166097U (en) | 1989-11-21 |
Family
ID=31288237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6266688U Pending JPH01166097U (en) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01166097U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07164392A (en) * | 1993-12-15 | 1995-06-27 | Fujitsu Ten Ltd | Printed board dividing device |
-
1988
- 1988-05-11 JP JP6266688U patent/JPH01166097U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07164392A (en) * | 1993-12-15 | 1995-06-27 | Fujitsu Ten Ltd | Printed board dividing device |
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