JPH07164392A - Printed board dividing device - Google Patents

Abstract

PURPOSE:To carry out the dividing work of a printed board easily without generating a damage, by fixing the dividing part of the printed board, rotating the printed board making the fixed part the fulcrum while holding both side surfaces of the printed board, and concentrating a stress to the cutting part of the printed board. CONSTITUTION:When a printed board 1 the soldering is completed, on which goods are loaded, is divided at a dividing part 3 where a perforation or a V-shaped groove is provided, the printed board 1 is inserted to the grooved 38 and 48 of fixed board holding bases 18 and 28 as it is, as well as both ends of the printed board 1 are inserted to the grooves 39 and 49 of rotary board holding bases 19 and 29, so as to abut the board 1 to a board stopper 58. As a result, the dividing part 3 of the printed board 1 is made coinside to the wedges 17 and 27 of a board dividing part support mechanism. Air cylinders at the upper side and the lower side are driven under such a condition, so as to push the wedges 17 and 27 to the dividing part 3, and then the air cylinders 59 and 69 are driven to lift up the pair of rotary board holding bases 19 and 29, and by rotating the board 1 around a fulcum which consists of the wedges 17 and 27, a stress is concentrated to the fulcum so as to carry out the dividing work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board dividing device for dividing a large-sized composite printed circuit board having a plurality of printed circuit boards integrally formed into a plurality of printed circuit boards, and more particularly to a printed circuit board when dividing the printed circuit boards. The present invention relates to a printed circuit board dividing device that does not generate distortion.

[0002]

2. Description of the Related Art Generally, in order to reduce the number of steps when mounting electronic components on a printed circuit board by soldering, electronic components are mounted on a large printed circuit board having perforations or V-shaped grooves in advance. Then, after soldering, a method of dividing into a plurality of small printed boards along perforations or V-shaped grooves is adopted.

2A and 2B are a plan view and a sectional view, respectively, showing a conventional printed circuit board. Reference numeral 1 is a printed circuit board, which is provided with perforations 2 or V-shaped grooves 3 in the divided portions in advance. The perforation 2 is composed of a plurality of rectangular openings 12 along the divided portion, and the connecting portion 2 between the openings 12 is formed.
At 2, the printed circuit board 1 holds the shape as one printed circuit board. The V-shaped groove 3 is a V-shaped groove formed on both surfaces of the printed circuit board 1 along the divided portion. In the case of perforation 2, by narrowing the portion of the connecting portion 22,
Further, in the case of the V-shaped groove 3, the printed board 1 can be easily divided by making the groove deep. However, if the connecting portion 22 is excessively narrowed or the V-shaped groove 3 is deepened,
The printed circuit board 1 may be cracked at the perforations 2 or the V-shaped groove 3 due to the insertion pressure of the electronic component when it is mounted, or
The printed circuit board 1 may warp during soldering.

FIG. 3 is a diagram showing a conventional method of dividing a printed circuit board into two. (A) is a figure which shows the printed circuit board division method by manual, (b) is a printed circuit board division method with a roller cutter. Hereinafter, description will be given with reference to the drawings. Reference numeral 1 is a printed circuit board in which perforations 2 or V-shaped grooves 3 are provided in advance in divided portions, and electronic components 4 are mounted and soldering is completed. Reference numeral 5 denotes a roller cutter that is pressed against the printed board 1 to cut it, and has a hole into which the rotary shaft 15 is inserted at the center of the disk and a cutter 25 at the circumference.

Next, a method of dividing the printed circuit board will be described. FIG. 3A shows a manual printed circuit board dividing method in which both ends 11 of a large printed circuit board 1 are held by both hands, and a perforation 2 or a V-shaped groove 3 (V-shaped groove 3 in the figure) provided in advance is provided. Is shown as a fulcrum and the printed circuit board 1 is bent. In this way, the printed circuit board 1 is divided into two small printed circuit boards.

FIG. 3B shows a method of dividing the printed circuit board by using a roller cutter. The printed circuit board 1 is sandwiched by the cutter portions 25 of the roller cutter 5 from both sides of the V-shaped groove 3 of the printed circuit board 1 to move the printed circuit board 1 and the roller cutter 5. By the rotation of the cutter portion 25, the printed board 1 is cut along the V-shaped groove 3 into two small printed boards.

[0007]

When both ends 11 of the printed circuit board 1 are manually held and bent, stress is not directly concentrated on the perforations 2 or the divided portions of the V-shaped groove 3, and the component mounting of the printed circuit board 1 is performed. The surface also bends. As a result, a force is applied to the soldered portion of the electronic component and the copper pattern portion of the printed wiring, and defects such as solder detachment and pattern disconnection occur.

Further, in the method using the roller cutter, particularly in the case of the printed circuit board 1 containing glass fiber, the cutter portion 25 is heavily worn and the roller cutter 5 is frequently replaced, resulting in a high cost. Further, it is difficult to align the upper and lower roller cutters 5, especially the distance between the upper and lower cutter portions 25, and there is a problem that the cut surfaces become uneven when the positions of the upper and lower roller cutters 5 shift during division.

According to the present invention, stress is concentrated on the divided portions of the printed circuit board so that the divided portions can be easily divided, and stress is not applied to the electronic component mounting portion of the printed circuit board. The purpose is to eliminate disconnection defects.

[0010]

In order to solve the above-mentioned problems, the present invention provides a printed circuit board dividing device for dividing a composite substrate in which a first substrate and a second substrate are integrally formed, and a divided portion of the composite substrate. Fixing means for fixing the first and the first,
A substrate holding means for holding both side surface portions of the second substrate adjacent to the divided portion, and a rotating means for rotating the substrate holding means of the first substrate with the divided portion as a fulcrum. is there.

[0011]

The divided portion of the printed circuit board is fixed, and the printed circuit board is rotated at the fixed part as a fulcrum with both side surfaces of the printed circuit board being held, not at the tip end. Are concentrated and can be easily divided. In addition, since the part on which the electronic component is mounted is held from both side surfaces of the printed circuit board, it remains flat and does not warp. Therefore, the electronic parts and the printed wiring pattern are not damaged.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a printed circuit board dividing apparatus according to an embodiment of the present invention. (A) is a perspective view and (b) is a side view. A printed circuit board dividing device 6 is composed of a board dividing portion supporting mechanism 7, a board fixing mechanism 8 and a board rotating mechanism 9. Reference numeral 7 denotes a board dividing portion supporting mechanism for concentrating stress on the dividing portion of the printed circuit board 1, which is a perforation 2 or a V-shaped groove 3 from above and below the divided portion of the printed circuit board 1 (in the figure, an example of a V-shaped groove is shown. Wedges 17 and 27 for sandwiching and supporting
It is composed of air cylinders 37 and 47 that drive the actuators 7 and 27 up and down. Reference numeral 8 denotes a board fixing mechanism that fixes one of the divided printed boards 1 so that the printed board 1 does not bend when divided, and has a pair of grooves 38 and 48 into which one side surface portion 21 of the divided printed board 1 is inserted. Of the fixed board holding bases 18 and 28 and the dimension from the one end of the printed circuit board 1 to the divided portion are kept constant, and the perforation 2 or the V-shaped groove 3 of the divided portion is exactly the wedges 17 and 27 of the substrate divided portion supporting mechanism. It is composed of a substrate stopper 58 that performs positioning for matching. The position of the board stopper 58 needs to be adjusted in advance for each type of the printed board 1. Reference numeral 9 denotes a board rotating mechanism that fixes the printed circuit board 1 so as not to bend when dividing and concentrates stress on the divided parts and bends the printed circuit board 1. The groove 39 into which the other side surface part 31 of the divided printed circuit board 1 is inserted. , 49, and air cylinders 59, 69 for rotating the printed circuit board 1. The space between the pair of fixed substrate holders 18 and 28 and the pair of rotatable substrate holders 19 and 2 corresponding to the width of the printed board 1 to be divided.
The intervals of 9 can be varied.

Next, a method of dividing the printed circuit board will be described. Printed circuit board 1 with parts mounted and soldering completed
Is inserted from the grooves 39 and 49 of the rotary substrate holders 19 and 29, passes through the grooves 38 and 48 of the other fixed substrate holders 18 and 28, and the substrate stopper 58 whose position adjustment has been completed in advance.
Abutted against. As a result, the perforation 2 or the V-shaped groove 3 of the divided portion of the printed circuit board 1 exactly coincides with the wedges 17 and 27 of the substrate divided portion support mechanism.

Next, the upper and lower air cylinders 37 and 47 of the board division supporting mechanism 7 are driven, and the wedges 17 and 27 sandwich the perforation 2 or the V-shaped groove 3 of the division of the printed board 1 from both sides. Subsequently, the air cylinders 59 and 69 are driven, the pair of rotary substrate holders 19 and 29 are pulled up, and the printed circuit board 1 is rotated about the portion supported by the wedges 17 and 27 as a fulcrum, and the stress is wedged to the wedge 17. It is concentrated in 27 parts and easily cut. At this time, the fixed side of the printed board 1 has grooves 38, 48 of the pair of fixed board holding bases 18, 28.
Since it is fixed by the wedges 17 and 27, the flat surface is held and the printed circuit board 1 is not stressed. The rotating side of the printed circuit board 1 is provided with a pair of rotating substrate holders 19, 29.
Since it is fixed by the grooves 39, 49 and the wedges 17, 27, the flat surface is held and the printed circuit board 1 is not stressed similarly.

According to this embodiment, stress concentrates only on the divided portions (perforations 2 or V-shaped grooves 3) of the printed board 1 and is easily cut, and the printed board is always kept flat. No force is applied to the electronic components or the soldered parts mounted on the printed circuit board, and the printed wiring pattern is not broken.

[0016]

As described above in detail, according to the present invention, the cutting portion is fixed by the fixing means when the printed circuit board is cut, and the printed circuit board is always kept flat. There is no damage to the printed wiring pattern.

[Brief description of drawings]

FIG. 1A is a perspective view and FIG. 1B is a side view showing a printed circuit board dividing device according to an embodiment of the present invention.

FIG. 2A is a plan view showing a divided portion of a printed circuit board,
(B) Sectional drawing.

FIG. 3 is a diagram showing a method of dividing a conventional printed circuit board into two.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 7 ... Board | substrate division part support mechanism 8 ... Fixed board | substrate holding mechanism 9 ... Rotating board | substrate holding mechanism

Claims (1)

[Claims] 1. A printed circuit board dividing device for dividing a composite substrate in which a first substrate and a second substrate are integrally formed, a fixing means for fixing a divided portion of the composite substrate, and the first and second substrates. A printed circuit board dividing device comprising: a substrate holding means for holding both side surfaces adjacent to the divided portion; and a rotating means for rotating the substrate holding means of the first substrate with the divided portion as a fulcrum.