JPH09115575A - Mounting structure of connector and its mounting method - Google Patents
Mounting structure of connector and its mounting methodInfo
- Publication number
- JPH09115575A JPH09115575A JP7269878A JP26987895A JPH09115575A JP H09115575 A JPH09115575 A JP H09115575A JP 7269878 A JP7269878 A JP 7269878A JP 26987895 A JP26987895 A JP 26987895A JP H09115575 A JPH09115575 A JP H09115575A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- solder
- solder supply
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、コネクタの実装構
造及びその実装方法に関する。複数の集積回路を搭載し
た基板の両面に外部ケーブルと接続するためのＩＭＤ
（Ｉｎｓｅｒｔ Ｍｏｕｎｔｅｄ Ｄｅｖｉｃｅ）型の
コネクタをリフローはんだ付けにより実装する。基板の
表裏両面に実装するコネクタは、リード端子を基板に貫
通挿入する関係上、挿抜方向に互いにずらして配列しは
んだ付けするが、片面実装のようにはんだディッピング
による実装が困難なため、一括はんだ付けできる実装構
造とその実装方法が要望されている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a connector and a mounting method thereof. IMDs for connecting external cables on both sides of a board with multiple integrated circuits
A (Insert Mounted Device) type connector is mounted by reflow soldering. The connectors to be mounted on both the front and back sides of the board are arranged so that the lead terminals are inserted into the board and are displaced from each other in the insertion / removal direction and then soldered.However, it is difficult to mount by solder dipping like single-sided mounting. A mounting structure that can be attached and a mounting method therefor are desired.
【０００２】[0002]
【従来の技術】図７(a),(b) の要部側断面図に示すよう
に、従来のコネクタの実装構造及びその実装方法は、同
図(a) に示す基板の一方の面（表面）にコネクタ（図２
の単体斜視図参照）を実装する場合には、コネクタ１０
を基板１１の表面の紙面に垂直な方向に１列に配設し、
コネクタ１０の両端を他方の反対面（裏面）から貫通し
た取付ねじ１２で固定している。2. Description of the Related Art As shown in FIGS. 7 (a) and 7 (b), which are side sectional views of a main part, a conventional connector mounting structure and its mounting method are shown in FIG. Connector (Fig. 2) on the surface
Connector 10), the connector 10
Are arranged in a line in a direction perpendicular to the paper surface of the substrate 11,
Both ends of the connector 10 are fixed by mounting screws 12 penetrating from the opposite surface (rear surface) of the other.
【０００３】そうして、その実装方法は、スルーホール
１１ａから裏面に突出したリード端子１０ａをはんだデ
ィッピングによりはんだ付け実装している。これに対
し、同図(b) に示す基板の表裏両面にコネクタを実装す
る場合は、裏面の同じ位置では表面に実装したコネクタ
１０−１のリード端子１０ａが突出していて邪魔になる
（コネクタ１０−１の取付ねじ１２は、コネクタ１０−
１の両端にあるため干渉しない）ため、基板１１を挟む
表裏両面のコネクタ１０−１，１０−２は互いに矢印挿
抜方向にずらして表裏両面のそれぞれ紙面に垂直な方向
に１列（平面透視で２列になる）に配設する。Thus, in the mounting method, the lead terminal 10a protruding from the through hole 11a to the back surface is soldered and mounted by solder dipping. On the other hand, when the connectors are mounted on both the front and back surfaces of the board shown in FIG. 1B, the lead terminals 10a of the connector 10-1 mounted on the front surface are protruding at the same position on the back surface, which is an obstacle (connector 10). -1 mounting screw 12 is a connector 10-
Therefore, the connectors 10-1 and 10-2 on both the front and back sides sandwiching the substrate 11 are offset from each other in the insertion / removal direction of the arrow so as to form one row in a direction perpendicular to the paper surface of each of the front and back sides (in plan view perspective). 2 rows).
【０００４】そうして、先に実装する表面側のコネクタ
１０−１のスルーホール１１ａから突出したリード端子
１０ａをはんだディッピングによりはんだ付けし、裏面
側のコネクタ１０−２のリード端子１０ａは既にコネク
タ１０−１が実装されていてはんだディップできないた
め、はんだごてによりはんだ付け実装している。Then, the lead terminal 10a protruding from the through hole 11a of the front surface side connector 10-1 to be mounted first is soldered by solder dipping, and the lead terminal 10a of the rear surface side connector 10-2 is already a connector. Since 10-1 is mounted and solder dipping cannot be performed, soldering is performed using a soldering iron.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、極厚基
板の場合、基板厚さのばらつきが大きく、例えば４０層
で７ｍｍ厚さの積層基板の場合、０．３ｍｍ前後の許容
公差があって、反対面に突出するリード端子の長さに同
様のばらつきを生じる。However, in the case of an extremely thick substrate, there is a large variation in substrate thickness. For example, in the case of a laminated substrate having 40 layers and a thickness of 7 mm, there is a tolerance of about 0.3 mm, which is the opposite. The same variation occurs in the length of the lead terminal protruding on the surface.
【０００６】すると、図７(b) に示した、表面側のコネ
クタ１０−１に外部ケーブルの２点鎖線で示すコネクタ
１３を矢印方向に抜き差しするとき、リード端子１０ａ
が長く突出していれば、それに引っ掛かるという問題が
ある。Then, when the connector 13 shown by the chain double-dashed line of the external cable is inserted / removed in / from the connector 10-1 on the front side shown in FIG.
If there is a long protrusion, there is a problem that it will get caught in it.
【０００７】また、リード端子の基板面からの突出長さ
は、はんだ付けのために１ｍｍ以上を確保する必要があ
るが、基板の厚さに合わせてリード端子の長さを予め、
規定することは面倒で作業工数の点からできないといっ
た問題があった。Further, the protruding length of the lead terminal from the substrate surface needs to be 1 mm or more for soldering. However, the length of the lead terminal is previously set in accordance with the thickness of the substrate.
There is a problem that it is difficult to specify, and it cannot be done from the viewpoint of man-hours.
【０００８】上記問題点に鑑み、本発明はコネクタのリ
ード端子の基板面から突出する長さのばらつきを吸収す
ると共に、基板の表裏両面に実装するコネクタの一括リ
フローはんだ付けを可能にするコネクタの実装構造及び
その実装方法を提供することを目的とする。In view of the above problems, the present invention absorbs variations in the length of the lead terminals of the connector projecting from the board surface, and at the same time provides a connector which enables collective reflow soldering of connectors to be mounted on both front and back surfaces of the board. An object is to provide a mounting structure and a mounting method thereof.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明のコネクタの実装構造においては、基板の表
裏両面に互いに実装位置をずらして該基板のスルーホー
ルにリード端子が接続される複数のコネクタと、前記基
板の一方の面から実装される該コネクタのリード端子が
挿通する貫通孔及び前記基板の他方の面から実装される
該コネクタの、前記スルーホールから突出したリード端
子の先端部を収容するはんだ供給孔と該はんだ供給孔か
ら連通する空気抜き孔とを備えて前記コネクタと基板と
のそれぞれの間に介在されるはんだ供給間隔部材とで構
成する。In order to achieve the above object, in the mounting structure of the connector of the present invention, the lead terminals are connected to the through holes of the board by displacing the mounting positions on the front and back surfaces of the board. A plurality of connectors, a through hole through which a lead terminal of the connector mounted from one surface of the board is inserted, and a tip of a lead terminal protruding from the through hole of the connector mounted from the other surface of the board And a solder supply spacing member interposed between the connector and the board, the solder supply hole accommodating the parts and the air vent hole communicating with the solder supply hole.
【００１０】また、このコネクタの実装方法において
は、前記はんだ供給間隔部材のはんだ供給孔にはんだク
リームを充填し、次いで前記基板の表裏から挟んだはん
だ供給間隔部材を介して前記コネクタのリード端子をそ
れぞれ挿入し一括してリフローはんだ付けにより実装す
るように構成する。Further, in this connector mounting method, the solder supply holes of the solder supply spacing member are filled with solder cream, and then the lead terminals of the connector are connected via the solder supply spacing members sandwiched from the front and back of the substrate. It is configured so that they are individually inserted and are collectively mounted by reflow soldering.
【００１１】このように、基板とコネクタとの間にはん
だ供給間隔部材を介在させたため、コネクタを基板面か
ら離間して実装することができる。また、スルーホール
から突出した反対側コネクタのリード端子の先端部をは
んだ供給間隔部材の厚さ以内、即ちはんだ供給孔内に収
めたために、リード端子の基板厚さのばらつきによって
生じる基板面からの突出長さのばらつきを吸収できると
ともに、はんだ供給間隔部材の上に実装されたコネクタ
に対し外部ケーブルのコネクタは円滑に抜き差しするこ
とができる。Since the solder supply spacing member is interposed between the board and the connector as described above, the connector can be mounted separately from the board surface. Further, since the tip of the lead terminal of the opposite connector protruding from the through hole is accommodated within the thickness of the solder supply spacing member, that is, in the solder supply hole, the lead terminal from the board surface caused by the variation in the board thickness of the lead terminal The variation in the protruding length can be absorbed, and the connector of the external cable can be smoothly inserted into and removed from the connector mounted on the solder supply spacing member.
【００１２】また、はんだ供給間隔部材を基板両面のそ
れぞれに取着する前に、はんだ供給孔に適量のはんだク
リームを充填しておくことにより、はんだ供給間隔部材
の貫通孔と基板のスルーホールとを貫通したリード端子
の先端部は、はんだ供給孔に充填されたはんだクリーム
の中に差し込まれることとなり、それをリフロー加熱す
ることによって基板両面のすべてのコネクタを一括して
リフローはんだ付けすることができる。In addition, before attaching the solder supply spacing member to each of both surfaces of the board, by filling an appropriate amount of solder cream in the solder supply holes, the through holes of the solder supply spacing member and the through holes of the board are formed. The tip of the lead terminal that has penetrated through will be inserted into the solder cream filled in the solder supply hole, and by reflow heating it, all the connectors on both sides of the board can be reflow soldered collectively. it can.
【００１３】[0013]
【発明の実施の形態】以下、図面に示した実施例に基づ
いて本発明の要旨を詳細に説明する。図１(a),(b) の要
部平面図及び一部破断を含む要部側面図に示すように、
コネクタの実装構造は、多数の大規模集積回路（図示
略）を高密度に搭載した基板１の表裏両面のそれぞれに
実装される複数のコネクタ１０（図２に示す単体斜視図
参照）と、表面側のコネクタ１０−１及び裏面側のコネ
クタ１０−２のそれぞれと基板１との間に介在するはん
だ供給間隔部材２、即ち表面側の２−１，裏面側の２−
２とで構成する。BEST MODE FOR CARRYING OUT THE INVENTION The gist of the present invention will be described in detail below with reference to the embodiments shown in the drawings. As shown in Fig. 1 (a) and (b), which is a plan view of the main part and a side view of the main part including a partial breakage,
The mounting structure of the connector includes a plurality of connectors 10 (see a perspective view of a single unit shown in FIG. 2) mounted on each of the front and back surfaces of the substrate 1 on which a large number of large-scale integrated circuits (not shown) are mounted at high density, Side connector 10-1 and rear surface side connector 10-2 and the solder supply spacing member 2 interposed between the board 1 and the board 1, that is, front surface side 2-1 and rear surface side 2-.
And 2.
【００１４】表面側のコネクタ１０−１と裏面側のコネ
クタ１０−２とは、双方のリード端子が機械的に干渉し
ないように、その実装位置を互いに外部ケーブルのコネ
クタ１３の挿抜方向にずらして基板１の端部に沿って１
列（平面透視では２列）に配設する。The mounting positions of the front side connector 10-1 and the rear side connector 10-2 are deviated from each other in the insertion / removal direction of the connector 13 of the external cable so that their lead terminals do not mechanically interfere with each other. 1 along the edge of substrate 1
They are arranged in rows (two rows in plan perspective).
【００１５】これらのコネクタ１０（１０−１，１０−
２）と、基板１の両面に介在したはんだ供給間隔部材２
（２−１，２−２）と、基板１は、それらを貫通する取
付ねじ３で共締めする。These connectors 10 (10-1, 10-
2) and the solder supply spacing member 2 interposed on both sides of the substrate 1.
The (2-1, 2-2) and the board 1 are fastened together with a mounting screw 3 penetrating them.
【００１６】コネクタ１０−１，１０−２のそれぞれの
リード端子１０ａは０．４×０．２ｍｍの方形断面で対
角寸法０．４２ｍｍの５０端子が千鳥形に並んでおり、
各リード端子１０ａは、はんだ供給間隔部材２−１，２
−２を貫通して基板１のスルーホール１ａに後述の実装
方法によりはんだ付け接続する。Each of the lead terminals 10a of the connectors 10-1 and 10-2 has a square cross section of 0.4 × 0.2 mm, and 50 terminals having a diagonal dimension of 0.42 mm are arranged in a staggered pattern.
Each lead terminal 10a is provided with a solder supply spacing member 2-1 and 2-2.
-2 and is soldered to the through hole 1a of the substrate 1 by a mounting method described later.
【００１７】基板１は、積層厚さ７ｍｍで、コネクタ１
０−１，１０−２の実装位置にリード端子１０ａを接続
する直径０．６ｍｍのスルーホール１ａと、表裏両面に
実装されるコネクタ１０のねじ呼び径２ｍｍの取付ねじ
３が貫通する直径２．３ｍｍのばか孔（図示略）とを備
える。The substrate 1 has a laminated thickness of 7 mm and has a connector 1
1. Through holes 1a having a diameter of 0.6 mm for connecting the lead terminals 10a to the mounting positions of 0-1 and 10-2, and a diameter through which the mounting screw 3 having a nominal screw diameter of 2 mm of the connector 10 mounted on both front and back surfaces penetrates. It has a 3 mm fool hole (not shown).
【００１８】はんだ供給間隔部材２（２−１，２−２）
は、耐熱性樹脂材、例えば厚さ３ｍｍのガラスエポキシ
樹脂積層板からなり、図３(a),(b) に示す単体斜視図及
びそのＡ−Ａ側断面図のように、基板の一方の面（表
面）に実装されるコネクタのリード端子を挿通するた
め、基板のスルーホールと同じ直径か、あるいは僅かに
大きな直径０．６乃至０．７ｍｍの貫通孔２ａと、スル
ーホールから突出した他方の反対面（裏面）側コネクタ
のリード端子の先端部を収納し、かつはんだ付けに必要
な量のはんだクリームが充填可能な深さ２ｍｍに座ぐり
したはんだ供給孔２ｂ〔同図(b) 参照〕と、このはんだ
供給孔２ｂの底から外部に貫通する直径０．３ｍｍの空
気抜き孔２ｃと、コネクタの取付ねじを挿通する直径
２．３ｍｍのばか孔２ｄとを備える。Solder supply spacing member 2 (2-1, 2-2)
Is made of a heat-resistant resin material, for example, a glass-epoxy resin laminated plate having a thickness of 3 mm. As shown in FIGS. In order to insert the lead terminal of the connector mounted on the surface (front surface), the through hole 2a having the same diameter as the through hole of the board or slightly larger than the through hole 2a having a diameter of 0.6 to 0.7 mm and the other protruding from the through hole Solder supply hole 2b with a counterbore on the opposite side (rear side) of the connector and a counterbore with a depth of 2 mm that can be filled with the amount of solder cream required for soldering [Refer to Figure (b)]. ], And an air vent hole 2c having a diameter of 0.3 mm penetrating from the bottom of the solder supply hole 2b to the outside, and a fool hole 2d having a diameter of 2.3 mm into which a mounting screw of the connector is inserted.
【００１９】なお、貫通孔２ａ及びはんだ供給孔２ｂの
リード端子が挿入される入口側には、リード端子が引っ
掛からず、かつはんだブリッジを引き起こさない程度の
面取り２ｅを施しておく。また、はんだ供給間隔部材２
−１，２−２は基板の表裏両面共に同じものを使用し、
反対側から挿通した取付ねじでコネクタと共締めする。The inlet side of the through hole 2a and the solder supply hole 2b into which the lead terminal is inserted is chamfered 2e to the extent that the lead terminal is not caught and does not cause a solder bridge. Also, the solder supply interval member 2
-1, 2-2 use the same for both front and back sides of the board,
Tighten together with the connector using the mounting screw inserted from the opposite side.
【００２０】このように構成することにより、はんだ供
給間隔部材は、貫通孔にリード端子を挿通してコネクタ
を基板面から離間させて実装することができ、スルーホ
ールから突出した反対側コネクタのリード端子の先端部
ははんだ供給孔の中に収納されるため、基板厚さのばら
つきから生じる基板面からの突出長さのばらつきを吸収
することができる。According to this structure, the solder supply spacing member can be mounted by separating the connector from the board surface by inserting the lead terminal into the through hole, and the lead of the opposite connector protruding from the through hole. Since the tip portions of the terminals are housed in the solder supply holes, it is possible to absorb variations in the protrusion length from the substrate surface caused by variations in the substrate thickness.
【００２１】その結果、はんだ供給間隔部材は基板面か
ら突出したリード端子を覆うこととなり、はんだ供給間
隔部材の上に実装されたコネクタに抜き差しする外部ケ
ーブルのコネクタは、反対面からのコネクタのリード端
子の突出部に引っ掛かることは全くなくなり、円滑に抜
き差しすることができる。As a result, the solder supply spacing member covers the lead terminals protruding from the board surface, and the connector of the external cable to be inserted into and removed from the connector mounted on the solder supply spacing member has the lead of the connector from the opposite surface. It can be inserted and removed smoothly without being caught on the protruding part of the terminal.
【００２２】つぎに、コネクタを基板に実装する方法に
ついて、図４(a),(b) 、図５(a),(b) 及び図６のはんだ
付けを工程順に示す要部側断面図を用いて説明する。図
４(a) において、はんだ供給間隔部材２を印刷台６の上
にセットし、スクリーン印刷法により、はんだ供給間隔
部材２のはんだ供給孔２ｂにメタルスクリーン７を用い
てスキージ４により適量のはんだクリーム５を充填す
る。そのとき、はんだ供給孔２ｂの内部の空気は、空気
抜き孔２ｃから印刷台６面の図示しない溝を通して追い
出されるため、はんだクリーム５は容易に充填される。
はんだ供給間隔部材２は、基板１の表裏両面に共通に使
用できるため、２枚のはんだ供給間隔部材２−１，２−
２を用意する。Next, regarding the method of mounting the connector on the substrate, the side sectional views of the essential parts showing the soldering steps of FIGS. 4 (a), 5 (b), 5 (a), 5 (b) and 6 are shown in the order of steps. It demonstrates using. In FIG. 4 (a), the solder supply spacing member 2 is set on the printing table 6, and the squeegee 4 is used to make an appropriate amount of solder by the screen printing method using the metal screen 7 in the solder supply hole 2b of the solder supply spacing member 2. Fill with cream 5. At this time, the air inside the solder supply hole 2b is expelled from the air vent hole 2c through a groove (not shown) on the surface of the printing table 6, so that the solder cream 5 is easily filled.
Since the solder supply spacing member 2 can be commonly used on both front and back surfaces of the substrate 1, two solder supply spacing members 2-1 and 2-
Prepare 2
【００２３】図４(b) において、はんだクリーム５充填
済みのはんだ供給間隔部材２−２を基板１の裏面Ｌ2 に
載せ位置決めする。そのはんだ供給間隔部材２−２の貫
通孔２ａ（はんだクリーム５は充填されてない）及び基
板１のスルーホール１ａにコネクタ１０−２のリード端
子１０ａを挿入する。In FIG. 4B, the solder supply spacing member 2-2 filled with the solder cream 5 is placed on the back surface L 2 of the substrate 1 and positioned. The lead terminal 10a of the connector 10-2 is inserted into the through hole 2a (not filled with the solder cream 5) of the solder supply spacing member 2-2 and the through hole 1a of the substrate 1.
【００２４】図５(a) において、既に挿入したコネクタ
１０−２を図示しない治具で押さえ、基板１を表裏反転
する。基板１の表面Ｌ1 に、はんだクリーム５充填済み
のはんだ供給間隔部材２−１を載せ位置決めする。さら
に、裏面Ｌ2 のコネクタ１０−２の両端を、はんだ供給
間隔部材２−１、基板１及びはんだ供給間隔部材２−２
を表面Ｌ1 側から貫通した取付ねじ３で共締め固定す
る。In FIG. 5 (a), the already inserted connector 10-2 is pressed by a jig (not shown), and the board 1 is turned upside down. The solder supply interval member 2-1 filled with the solder cream 5 is placed and positioned on the surface L 1 of the substrate 1. Further, both ends of the connector 10-2 on the back surface L 2 are connected to the solder supply spacing member 2-1, the board 1 and the solder supply spacing member 2-2.
Together with the mounting screw 3 that penetrates from the front surface L 1 side.
【００２５】図５(b) において、続いて基板１の表面Ｌ
1 よりコネクタ１０−１のリード端子１０ａを同様に挿
入し、そのコネクタ１０−１の両端を、裏面Ｌ2 から貫
通した取付ねじ３で共締め固定する。In FIG. 5 (b), the surface L of the substrate 1 is continued.
1 by inserting the lead terminals 10a of the connector 10-1 Similarly, both ends of the connector 10-1, to fastened together with the mounting screws 3 which penetrate from the back surface L 2.
【００２６】図６において、上記組み立てた基板１をＶ
ＰＤ（Ｖａｐｏｒ Ｐｈａｓｅ Ｓｏｌｄｅｒｉｎｇ
Ｄｅｖｉｃｅ，蒸気相はんだ付け装置）にてリフロー加
熱し、はんだ供給間隔部材２のはんだ供給孔２ｂに充填
されたはんだクリームを溶融して、基板１のスルーホー
ル１ａ内に溶融はんだ５−１を毛細管作用により吸い込
みリード端子１０ａをスルーホール１ａにはんだ付けし
完成する。In FIG. 6, the assembled substrate 1 is connected to V
PD (Vapor Phase Soldering)
Device, vapor-phase soldering device) to reflow heat to melt the solder cream filled in the solder supply holes 2b of the solder supply interval member 2 and to cap the molten solder 5-1 in the through holes 1a of the substrate 1. By action, the suction lead terminal 10a is soldered to the through hole 1a to complete the process.
【００２７】このように、はんだ供給間隔部材を基板両
面のそれぞれに固定する前に、はんだ供給孔に適量のは
んだクリームを充填したことにより、実装するコネクタ
のリード端子の先端部は、反対面に備えたはんだ供給間
隔部材のはんだ供給孔に充填されたはんだクリームの中
に差し込まれる。それをリフロー加熱することによって
溶融はんだが、毛細管作用によりリード端子を伝わって
スルーホールに流れ込み確実にはんだ付けすることがで
きる。As described above, the solder supply holes are filled with an appropriate amount of solder cream before the solder supply spacing members are fixed to the both surfaces of the board. It is inserted into the solder cream filled in the solder supply hole of the provided solder supply interval member. By reflow heating the molten solder, the molten solder flows through the lead terminals by the capillary action and flows into the through holes, so that the solder can be reliably soldered.
【００２８】更にまた、基板両面に実装するすべてのコ
ネクタの一括リフローはんだ付けができるため、はんだ
付け工数も低減することができる。なお、上記実施例は
コネクタを基板の表裏両面共に実装する場合について説
明したが、片面実装の場合もはんだクリームを充填した
はんだ供給間隔部材を基板に位置決めして治具で固定
し、コネクタのリード端子をスルーホールに挿入して上
記説明と同様に一括リフローはんだ付けし、はんだ付け
後はこのはんだ供給間隔部材は不要となるので取り外す
ことで片面実装も可能である。Furthermore, since all the connectors mounted on both sides of the board can be collectively reflow-soldered, the number of soldering steps can be reduced. In the above embodiment, the case where the connector is mounted on both the front and back surfaces of the board has been described.However, even in the case of single-sided mounting, the solder supply interval member filled with the solder cream is positioned on the board and fixed by the jig, and the lead of the connector is attached. The terminals are inserted into the through holes and soldered together by reflow soldering as in the above description. After soldering, the solder supply interval member is no longer necessary, so that it can be mounted on one side by removing it.
【００２９】また、片面実装、両面実装が混在する場合
でも同様に一括リフローはんだ付けできることは言うま
でもない。Needless to say, batch reflow soldering can be performed in the same manner even when single-sided mounting and double-sided mounting are mixed.
【００３０】[0030]
【発明の効果】以上、詳述したように本発明によれば、
基板とコネクタとの間にはんだ供給間隔部材を介在する
ことにより、基板の厚さのばらつきによって生じるリー
ド端子の基板面から突出する長さのばらつきをはんだ供
給間隔部材の中に吸収できるため、外部ケーブルコネク
タを支障なく円滑に抜き差しすることができる。As described in detail above, according to the present invention,
By interposing the solder supply spacing member between the board and the connector, the variation in the length of the lead terminal protruding from the board surface caused by the variation in the thickness of the board can be absorbed in the solder supply spacing member. The cable connector can be smoothly inserted and removed without any trouble.
【００３１】更にまた、はんだ供給間隔部材にはんだク
リームを充填することにより、基板の片面、両面実装の
コネクタの一括リフローはんだ付けが可能になるため、
コネクタのはんだ付けコストも低減できるといった産業
上極めて有用な効果を発揮する。Furthermore, by filling the solder supply spacing member with solder cream, it is possible to carry out batch reflow soldering of connectors on one side or both sides of the board.
It has an extremely useful effect in the industry such that the soldering cost of the connector can be reduced.
【図１】 本発明による一実施例の要部平面図及び一部
破断を含む要部側面図FIG. 1 is a plan view of a main part and a side view of the main part including a partial break according to an embodiment of the present invention.
【図２】 図１のコネクタの単体斜視図FIG. 2 is a perspective view of the connector of FIG.
【図３】 図１のはんだ供給間隔部材の単体斜視図及び
そのＡ−Ａ側断面図3 is a perspective view of the solder supply spacing member of FIG. 1 and a sectional view taken along the line AA thereof.
【図４】 図１のはんだ付けを工程順に示す要部側断面
図FIG. 4 is a side sectional view of a main part showing the soldering process of FIG. 1 in process order.
【図５】 図１のはんだ付けを工程順に示す要部側断面
図FIG. 5 is a side sectional view of an essential part showing the soldering of FIG. 1 in process order.
【図６】 図１のはんだ付けを工程順に示す要部側断面
図6 is a side sectional view of a main part showing the soldering of FIG. 1 in the order of steps.
【図７】 従来技術によるコネクタの実装構造を示す要
部側断面図FIG. 7 is a side sectional view of an essential part showing a mounting structure of a connector according to a conventional technique.
１ :基板 ２ :はんだ供給間隔部材 ２ａ :貫通孔 ２ｂ :はんだ供給孔 ２ｃ :空気抜き孔 １０ :コネクタ １０ａ :リード端子 1: Board 2: Solder supply spacing member 2a: Through hole 2b: Solder supply hole 2c: Air vent hole 10: Connector 10a: Lead terminal
Claims (2)
して該基板のスルーホールにリード端子が接続される複
数のコネクタと、 前記基板の一方の面から実装される該コネクタのリード
端子が挿通する貫通孔と、前記基板の他方の面から実装
される該コネクタの、前記スルーホールから突出したリ
ード端子の先端部を収容するはんだ供給孔と該はんだ供
給孔から連通する空気抜き孔とを備えて前記コネクタと
基板とのそれぞれの間に介在されるはんだ供給間隔部材
と、 からなることを特徴とするコネクタの実装構造。1. A plurality of connectors in which lead terminals are connected to through-holes of the board by displacing mounting positions from each other on both front and back surfaces of the board, and lead terminals of the connector mounted from one surface of the board are inserted. Through hole, a solder supply hole for accommodating the tip of the lead terminal protruding from the through hole of the connector mounted from the other surface of the substrate, and an air vent hole communicating with the solder supply hole. A solder mounting space member interposed between each of the connector and the board, and a mounting structure of the connector.
孔にはんだクリームを充填し、次いで前記基板の表裏か
ら挟んだはんだ供給間隔部材を介して前記コネクタのリ
ード端子をそれぞれ挿入し、次いで一括してリフローは
んだ付けにより実装することを特徴とするコネクタの実
装方法。2. The solder supply spacing member has a solder supply hole filled with solder cream, and then the lead terminals of the connector are respectively inserted through the solder supply spacing members sandwiched from the front and back of the substrate, and then collectively. Connector mounting method characterized by mounting by reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7269878A JPH09115575A (en) | 1995-10-18 | 1995-10-18 | Mounting structure of connector and its mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7269878A JPH09115575A (en) | 1995-10-18 | 1995-10-18 | Mounting structure of connector and its mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09115575A true JPH09115575A (en) | 1997-05-02 |
Family
ID=17478475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7269878A Pending JPH09115575A (en) | 1995-10-18 | 1995-10-18 | Mounting structure of connector and its mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09115575A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004107827A2 (en) * | 2003-05-22 | 2004-12-09 | Powerwave Technologies, Inc. | Circuit board assembly employing solder vent hole |
| US7156678B2 (en) | 2005-04-07 | 2007-01-02 | 3M Innovative Properties Company | Printed circuit connector assembly |
-
1995
- 1995-10-18 JP JP7269878A patent/JPH09115575A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004107827A2 (en) * | 2003-05-22 | 2004-12-09 | Powerwave Technologies, Inc. | Circuit board assembly employing solder vent hole |
| WO2004107827A3 (en) * | 2003-05-22 | 2005-06-09 | Powerwave Technologies Inc | Circuit board assembly employing solder vent hole |
| US6954987B2 (en) | 2003-05-22 | 2005-10-18 | Powerwave Technologies, Inc. | Method of interconnecting a circuit board to a substrate |
| US7156678B2 (en) | 2005-04-07 | 2007-01-02 | 3M Innovative Properties Company | Printed circuit connector assembly |
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