JP2926589B1 - Connection structure of metal case of electric parts - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To reduce the connection space between a metal case on a board and a metal case without deteriorating connection strength when connecting a metal case to a board in an electric component, and to increase a mounting space on the board. It is an object of the present invention to provide a connection structure that enables the connection. SOLUTION: In a connection structure of a land pattern 21 of a substrate 14 on which circuit components are mounted and a metal case 13 by soldering, a metal case 13 at a connection portion 15 is provided.
Resin 16 is interposed between solder 16 and solder 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a connection structure for a metal case of an electric component.

[0002]

2. Description of the Related Art Generally, an electric component comprises a substrate constituting an electric circuit and a metal case covering the substrate. In the connection structure of the metal case of the electric component, the board and the metal case are soldered. Conventionally, this kind of soldering of a metal case and a board is performed as shown in FIG.
This was performed as shown in FIG. FIG. 5 is a diagram showing a connection structure of a metal case of the conventional electric component 1. Sign 2
Is a metal case, and 3 is a substrate. FIG. 6 shows a diagram of the electric component of FIG. 5 when disassembled into a metal case 2 and a substrate 3. The metal case 2 is provided with a solder joint 4, and the solder 5 is attached to the solder joint 4. A through hole 7 for forming a fillet when the surface is mounted on a conductive pattern on a circuit board of a device using the mounting space 6 and the electric component 1 on the substrate 3 and a back surface (not shown) via the through hole 7 And a strip line 9 connecting the land pattern 8 and a component land in the mounting space 6 are formed. A land pattern 10 for solder bonding and a strip line 11 for connecting the land pattern 10 to a ground terminal of a component land are formed on the substrate 3. The through-hole 7 formed in the substrate 3 is also a terminal for performing power supply, signal output, and electrical connection between the electric component 1 such as a ground terminal and a device to be used. In order to form the electric component, the connection between the substrate 3 and the metal case 2 requires a solder joint portion 4 for providing a solder connection between the land pattern 10 for solder bonding and the metal case 2 on the substrate 3. The attached solder 5 is soldered.

[0003]

However, the connection structure of the metal case of the electric component has the following problems. That is, the land pattern 10 for soldering is provided on the substrate 3 at a position different from the land pattern 8 constituting a part of the circuit on the substrate. In the connection structure of the metal case of the electric component, the land pattern 10 for solder bonding on the substrate 3 and the solder 5 attached to the solder bonding portion 4 for providing the solder bonding of the metal case 2 are soldered. Therefore, a space for the land pattern 10 for soldering is required on the substrate 3. Therefore, there is a problem that the mounting space 6 on the substrate 3 becomes narrow. Further, since the solder 5 is directly attached to the solder joint 4 of the metal case 2 and the solder 5 is soldered to the land pattern 10 for solder joint on the substrate 3, the electric component is used in the device. When the metal case 2 is dropped in a state where it is mounted, the weight of the metal case 2 concentrates on the connection portion between the solder 5 and the substrate 3, and thus there is a problem that cracks or the like may occur in the solder 5 or the substrate 3. . In order to increase the connection strength between the metal case 2 and the substrate 3 in order to solve the problem, many land patterns 10 for solder bonding are provided on the substrate 3. As a result, the mounting space on the board is reduced, and the board must be enlarged in order to secure the mounting space for the components. The present invention has been made in view of the above circumstances, and in an electric component, a connection space between a metal case and a metal case on a substrate is reduced without deteriorating connection strength when the metal case is connected to the substrate. It is another object of the present invention to provide a connection structure capable of expanding a mounting space on a substrate.

[0004]

Means for Solving the Problems In order to solve the above-mentioned problems, the connection means of the present invention for connecting a metal case to an electric component employs the following means. That is, according to the connection structure of the metal case of the electric component according to the first aspect, in the connection structure of the land pattern of the substrate on which the circuit component is mounted and the metal case by soldering, the connection between the metal case and the solder at the connection portion. It is characterized in that a resin is provided in an intervening state therebetween.

[0005] In the connection structure of the metal case of the electric component, since the resin is provided between the metal case and the solder, when the metal case is soldered to the solder with the land pattern, the electric component may drop. Is absorbed by the resin between the metal case and the solder.
As a result, the possibility of cracks or the like occurring in the solder or the substrate is reduced. As a result, the connection strength increases.

According to a second aspect of the present invention, the land pattern forms a part of a circuit on a substrate, and the resin is an insulating resin. It is characterized by.

[0007] In the connection structure of the metal case of the electric component, since the insulating resin is provided between the metal case and the solder in the connection structure, the metal case and the solder are insulated. Therefore, even if the land pattern forming a part of the circuit on the substrate is soldered, the circuit is not electrically affected. As a result, the solder and the plurality of land patterns constituting a part of the circuit on the board are solder-joined to connect the metal case and the board, thereby increasing the connection strength,
Further, it is not necessary to provide a land pattern for solder bonding on the substrate. As a result, it is possible to increase the connection strength, reduce the connection space with the metal case on the board, and increase the mounting space on the board. In addition, a metal case having a resin between the metal case and the solder is soldered with the solder and the land pattern, and the impact at the time of dropping the electric component is reduced by the resin. As a result, the possibility of cracks or the like occurring in the solder or the substrate is reduced. As a result, the connection strength increases.

According to a third aspect of the present invention, the land pattern is a ground terminal, and the resin is a conductive resin.

In the connection structure of the metal case of the electric component, since the conductive resin is provided between the metal case and the solder, when the metal case is soldered to the solder by the land pattern, Is shocked, such as by dropping, is mitigated by the conductive resin between the metal case and the solder. As a result, the possibility of cracks or the like occurring in the solder or the substrate is reduced. As a result, the connection strength increases. In addition, since the resin between the metal case and the solder has conductivity, it is possible to electrically connect the metal case and the solder, and it is possible to join the through hole to a land pattern serving as a ground terminal, At that time, the metal case can function as a shield.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention is shown in FIGS.
This will be described with reference to FIG. FIG. 1 is a diagram showing a connection structure of a metal case of an electric component according to an embodiment of the present invention. In FIG. 1, reference numeral 12 denotes an electric component, 13 denotes a metal case, and 14 denotes a substrate. FIG. 2 shows a diagram when the electric component 12 shown in FIG. 1 is disassembled into a metal case 13 and a substrate 14. A connection portion 15 is provided in the metal case 13, and an insulating resin 1 is provided inside the connection portion 15.
6 is joined, and solder 17 is provided inside the insulating resin 16.
Are joined. FIG. 3 shows an enlarged view of the connection portion 15. The mounting space 18 and the electric component 1
2 through holes 19 for forming fillets when surface-mounted on a conductive pattern on a circuit board of an apparatus using
And a land pattern 21 which constitutes a part of a circuit on the substrate connected to an external connection terminal 20 on the back surface of the substrate 14 shown in FIG. Strip lines 22 are formed to connect the component lands inside. Substrate 14
The through holes 19 formed in the above are also terminals for electrically connecting the electric component 12 such as power supply, signal output, and ground terminal to a device to be used.

Next, the operation of the embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. Metal case 13 for electrical component 12
In order to form a connection structure between the circuit board and the metal case 1, the electrical component 12 shown in FIG.
3 is soldered to the inside of the connection portion 15 with solder 17 which is joined and attached to an insulating resin 16. then,
Since the board 14 and the metal case 13 are soldered with the solder 17 via the insulating resin 16, there is no electrical short circuit. Therefore, even if the metal case 13 is connected to the land pattern 21 which forms a part of the circuit on the board connected to the external connection terminal 20 via the through hole 19, each external connection terminal 20 is electrically short-circuited. I don't have to. As a result, it is not necessary to provide a land pattern for solder bonding.

As described above, the connection of the metal case 13 to the land pattern 21 constituting a part of the circuit on the substrate integrated with the through hole 19 necessary for attaching the electric component 12 to the device. Since the solder 17 of the portion is attached, it is not necessary to provide a special land pattern for solder connection, and the mounting space 18 on the substrate 14 is not unnecessarily shaved, so that the mounting space 18 can be efficiently utilized. it can. In addition, by using the insulating resin 16 between the metal case 13 and the solder 17, the shock at the time of drop is reduced by the insulating resin 16, and as a result, the connection strength can be increased. . Further, the solder 17 provided on the metal case 13 inside the connection portion 15 with the insulating resin 16 interposed therebetween can be regarded as being electrically the same as the connection terminal of the substrate 14, and a lead wire is connected to the joined solder 17. Connecting has the same meaning as connecting to the terminal,
Since the position is slightly higher than the bottom surface of the electric component 12, the connection can be easily performed. This makes the structure of the present invention most suitable for simple experiments and the like.

In the above embodiment, an insulating resin is used. However, in the land pattern 21 in which the through hole 19 is a ground terminal, a conductive resin is provided inside the connection portion 15 of the metal case 13. You may solder with the solder 17 joined and attached. At this time, if the electric component 12 falls while being mounted on the device, since the conductive resin is present between the metal case 13 and the solder 17, the weight of the metal case 13 may be applied to the solder 17 and the substrate 14. As a result, the possibility of cracks or the like occurring in the solder 17 or the substrate 14 is reduced. Also, since the resin between the metal case 13 and the solder 17 has conductivity, the metal case 13
And the solder 17 are electrically connected, and the through hole 19 is joined to a land pattern serving as a ground terminal, so that the metal case 13 functions as a shield. Further, in order for the metal case 13 to have a function as a shield, the portion where the through hole 19 is a ground terminal does not have the resin 5 but has the solder joint 15.
May be a part of the metal case 13. Also at this time, since it is not necessary to provide a special land pattern for solder bonding, the mounting space can be efficiently utilized.

[0014]

As described above, according to the connection structure of the metal case of the electric component according to the first aspect, the resin is interposed between the metal case and the solder. When a component receives an impact such as dropping, the impact is mitigated by the resin between the metal case and the solder, and the possibility of cracks or the like occurring in the solder or the substrate is reduced, resulting in a high connection strength. Is obtained.

According to the connection structure of the metal case of the electric component according to the second aspect, since the insulating resin is interposed between the metal case and the solder, the land for soldering is provided on the substrate. Since it is not necessary to provide a special pattern, the mounting space on the substrate is not unnecessarily cut away, and the effect that the mounting space can be efficiently utilized can be obtained. In addition, since the insulating resin is provided between the metal case and the solder, an effect is obtained that the impact can be reduced by the resin at the time of falling. Furthermore, considering the case of mounting and using in a device or the like that needs to be miniaturized, the solder joint provided in the shield case can be regarded as being electrically the same as the connection terminal of the board, and Connecting a conducting wire to the portion has the same meaning as connecting to the terminal, and since it is located at a slightly higher position, the connection can be made easily. As a result, the effect of being optimal for simple experiments and the like is obtained.

According to the third aspect of the present invention, since the conductive resin is provided between the metal case and the solder, the impact of the electric component such as dropping can be prevented. When it is received, the impact is reduced by the conductive resin between the metal case and the solder, and the possibility of cracks or the like occurring in the solder or the substrate is reduced. In addition, the through hole can be joined to a land pattern serving as a ground terminal. As a result, an effect that the metal case can function as a shield can be obtained.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of the present invention, and is a side perspective view showing an overall image of an electric component.

FIG. 2 is a view showing an embodiment of the present invention, and is a side perspective view when an electric component is disassembled into a metal case and a substrate.

FIG. 3 is an enlarged view of the vicinity of a connection portion of a metal case of the electric component of the present invention.

FIG. 4 is a view showing an embodiment of the present invention, and is a rear perspective view of a substrate of an electric component.

FIG. 5 is a side perspective view of a conventional electric component.

FIG. 6 is a side perspective view when a conventional electric component is disassembled into a metal case and a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Electric component 13 Metal case 14 Substrate 15 Connection part 16 Insulating resin 17 Solder 18 Mounting space 19 Through hole 21 Land pattern

Claims (3)

(57) [Claims] 1. A connection structure in which a land pattern of a board on which a circuit component is mounted and a metal case is joined by soldering, wherein a resin is provided between the metal case and the solder at the connection portion. The connection structure of the metal case of the electrical component. 2. The electric component metal case according to claim 1, wherein the land pattern forms a part of a circuit on a substrate, and the resin is an insulating resin. Connection structure. 3. The connection structure according to claim 1, wherein the land pattern is a ground terminal, and the resin is a conductive resin.