JPH0785428B2 - Connection device - Google Patents
Connection deviceInfo
- Publication number
- JPH0785428B2 JPH0785428B2 JP10671387A JP10671387A JPH0785428B2 JP H0785428 B2 JPH0785428 B2 JP H0785428B2 JP 10671387 A JP10671387 A JP 10671387A JP 10671387 A JP10671387 A JP 10671387A JP H0785428 B2 JPH0785428 B2 JP H0785428B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- chip
- foil
- jumper
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、テレビジョン受像機やビデオテープレコーダ
ーのチューナ等の入力回路部分に使用される接続装置に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device used in an input circuit portion of a tuner of a television receiver or a video tape recorder.
従来の技術 近年、実装技術の進歩から、基板上に部品を配線する場
合、チップ部品を使用して基板表面上にマウントし、ク
リームハンダを使用してハンダ付する方法がよくとられ
ている。その場合、例えば、配線上、2本の導体箔を交
叉させたい場合、チップジャンパーで一方の導体箔をま
たいで、回路を交叉させる方法が用いられる。2. Description of the Related Art In recent years, due to advances in mounting technology, when wiring components on a substrate, a method of mounting them on the surface of the substrate using chip components and soldering them with cream solder is often adopted. In that case, for example, when it is desired to cross two conductor foils on the wiring, a method of crossing one circuit with a chip jumper is used.
以下、図面を参照しながら、上述したような従来の接続
装置について説明を行なう。第2図は従来の接続装置の
断面図を示すものである。第2図において、1はチップ
ジャンパー、2はチップジャンパー1と電気的に接続す
る導体箔、3は導体箔2と交叉する他の導体箔、4は基
板、5はハンダである。Hereinafter, the conventional connecting device as described above will be described with reference to the drawings. FIG. 2 is a sectional view of a conventional connecting device. In FIG. 2, 1 is a chip jumper, 2 is a conductor foil electrically connected to the chip jumper 1, 3 is another conductor foil intersecting with the conductor foil 2, 4 is a substrate, and 5 is solder.
以上のように構成された接続装置について、以下その構
成について説明する。一般にテレビジョン受像機やビデ
オテープレコーダーのチューナ等のアンテナからの入力
回路部分はフィルタ回路で構成される場合が多く、例え
ば、フィルター等の部品が基板表面側で実装されるマウ
ントタイプの場合、箔の配線も基板表面側で行う必要が
ある。その理由は、基板裏面側に配線用の導体箔をもっ
てきた場合には、基板表面側の部品との接続にはスルー
ホールを使用することになるが、この場合、アンテナ入
力に雷撃を受けると、スルーホールが雷撃により切断さ
れるという問題点があるからである。さらに、アンテナ
入力回路部分の基板裏面側はアース箔が引回されている
事が多いため、基板裏面側での箔の引廻しが困難であ
り、よって配線用の箔は基板表面側にもってくる必要が
あった。The configuration of the connection device configured as described above will be described below. Generally, the input circuit part from an antenna such as a tuner of a television receiver or a video tape recorder is often composed of a filter circuit. For example, in the case of a mount type in which parts such as a filter are mounted on the front surface side of a board, a foil is used. It is also necessary to perform wiring on the front surface side of the substrate. The reason is that if you bring a conductor foil for wiring on the back side of the board, you will use through holes to connect to the components on the front side of the board, but in this case, if you receive a lightning strike on the antenna input, This is because there is a problem that the through hole is cut by a lightning stroke. Furthermore, since the ground foil is often routed around the back side of the antenna input circuit board, it is difficult to route the foil on the back side of the board, so the foil for wiring is brought to the front side of the board. There was a need.
そこでアンテナ入力回路の配線と、他の回路の配線が基
板表面側で交叉する場合には、第2図のよう構成にな
る。第2図において、アンテナ入力回路の配線としてチ
ップジャンパー1を使用し、前記チップジャンパー1の
下の電極8の間に、他の回路の導体箔3を通している。
この場合、アンテナ入力回路側にチップジャンパー1を
使用している理由は、前述のような電撃に対して導体箔
が雷撃に耐えるためには配線用の導体箔幅として約2mm
以上の幅が必要であるが、チップジャンパー1の間を通
す導体箔3は約0.3mm幅であり、雷撃に対する箔幅が足
りないためである。Therefore, when the wiring of the antenna input circuit and the wiring of other circuits intersect on the front surface side of the substrate, the configuration is as shown in FIG. In FIG. 2, the chip jumper 1 is used as the wiring of the antenna input circuit, and the conductor foil 3 of another circuit is inserted between the electrodes 8 below the chip jumper 1.
In this case, the reason why the chip jumper 1 is used on the antenna input circuit side is that the conductor foil width for wiring is about 2 mm in order for the conductor foil to withstand lightning strikes as described above.
The above width is required, but the conductor foil 3 that passes between the chip jumpers 1 has a width of about 0.3 mm, and the foil width against lightning stroke is insufficient.
従って入力回路部分で線を交叉させる場合には、アンテ
ナ入力回路側に導体箔幅として約2mm以上の幅の箔を設
け、この箔にチップジャンパーを使う事が必須であるの
である。Therefore, when crossing wires in the input circuit part, it is essential to provide a foil with a width of about 2 mm or more as a conductor foil width on the antenna input circuit side and use a chip jumper for this foil.
発明が解決しようとする問題点 しかしながら、上記のような構成では、雷撃を受けた場
合、導体箔は正常であっても、チップジャンパー自体が
破壊し、その結果断線するという問題点があった。一般
に雷に対する試験として20KV〜125KVの高電圧に耐える
必要があり、従来のチップジャンパーでは数回の雷撃
で、クラックや溶断にいたってしまうものであった。Problems to be Solved by the Invention However, in the above-described configuration, when a lightning strike is performed, the chip jumper itself is broken even if the conductor foil is normal, resulting in disconnection. Generally, it is necessary to withstand a high voltage of 20KV to 125KV as a test against lightning, and with conventional chip jumpers, several lightning strokes would lead to cracking and fusing.
本発明は上記問題点に鑑み、雷撃に対しても十分に耐
え、かつ正常に動作する接続装置を提供するものであ
る。In view of the above-mentioned problems, the present invention provides a connection device that can sufficiently withstand a lightning stroke and operates normally.
問題点を解決するための手段 上記問題点を解決するために本発明の接続装置は、チッ
プ部品の両電極間に導体を設け、この導体を両電極間に
半田付して構成したものである。Means for Solving the Problems In order to solve the above problems, the connecting device of the present invention is configured by providing a conductor between both electrodes of a chip component and soldering the conductor between both electrodes. .
作用 本発明は上記した構成によって、チップ部品上の導体抵
抗が減少し雷撃による瞬間的大電流に対しても十分耐え
得る為、雷撃に対して、破壊しない接続装置が構成され
ることとなる。Action The present invention has the above-described configuration, and since the conductor resistance on the chip component is reduced and it can withstand a momentary large current due to a lightning strike, a connection device that is not destroyed by a lightning strike is configured.
実施例 以下、本発明の一実施例の接続装置について、図面を参
照しながら説明する。第1図a,b,cは本発明の一実施例
における接続装置を示すものである。第1図a,b,cにお
いて、1はチップジャンパー、2はチップジャンパー1
と接続する導体箔、3は他の導体箔、4は基板、5はチ
ップ部品装着用クリームハンダ、6は銀導体、7は銀導
体6の上にのせたクリームハンダである。Embodiment Hereinafter, a connection device according to an embodiment of the present invention will be described with reference to the drawings. FIGS. 1a, 1b and 1c show a connecting device according to an embodiment of the present invention. 1 a, b, c, 1 is a chip jumper, 2 is a chip jumper 1
Is a conductor foil to be connected to the other, 3 is another conductor foil, 4 is a substrate, 5 is a chip component mounting cream solder, 6 is a silver conductor, and 7 is a cream solder placed on the silver conductor 6.
以上のように構成された接続装置について、以下その構
成について説明する。The configuration of the connection device configured as described above will be described below.
第1図aは接続装置の断面図、第1図bはクリームハン
ダ塗布前の平面図、第1図cは5と7のクリームハンダ
を塗布し、チップジャンパー1をマウントした時の断面
図である。1a is a cross-sectional view of the connection device, FIG. 1b is a plan view before application of cream solder, and FIG. 1c is a cross-sectional view when cream solder 5 and 7 are applied and the chip jumper 1 is mounted. is there.
第1図bの銀導体6の部分に示すようにチップジャンパ
ー1の電極8の間に銀導体6をメタライズしておき、第
1図cに示すように、チップジャンパー1をのせる導体
箔2の上にチップ部品装着用クリームハンダ5の銀導体
6のメタライズの上にクリームハンダ7を塗布し、ディ
ップ、又はリフローハンダにより、ハンダ付すれば、第
1図aに如く、銀導体6のメタライズの上にハンダメッ
キされることになる。As shown in the portion of the silver conductor 6 in FIG. 1b, the silver conductor 6 is metallized between the electrodes 8 of the chip jumper 1 and, as shown in FIG. 1c, the conductor foil 2 on which the chip jumper 1 is placed. If the cream solder 7 is applied on the metallization of the silver conductor 6 of the cream solder 5 for mounting chip parts and soldered by dipping or reflow soldering, the metallization of the silver conductor 6 is performed as shown in FIG. 1a. Will be solder plated.
以上のように本実施例によれば、チップジャンパー1の
両電極8の間に銀導体6をメタライズし、さらにその上
にクリームハンダ7によるハンダメッキをほどこすこと
によって、チップジャンパー1による導体抵抗を下げる
ことができ、雷撃に対し、十分耐えうる構造となる。As described above, according to this embodiment, the metal conductor 6 is metalized between the electrodes 8 of the chip jumper 1 and solder plating with the cream solder 7 is applied on the silver conductor 6, so that the conductor resistance of the chip jumper 1 is reduced. Can be lowered, and the structure will be sufficient to withstand lightning strikes.
また、クリームハンダ塗布は、ハンダ自動塗布機等を使
用できる為、後で人の手によるハンダ作業が不要であ
り、自動化できる為、手半田作業による、チップジャン
パー損傷等の問題もなくなる。Further, since cream solder coating can be performed by using a solder automatic coating machine or the like, there is no need for a manual soldering work later, and since it can be automated, there is no problem such as damage to the chip jumper due to manual soldering work.
発明の効果 以上のように本発明によれば、チップ部品の両電極間に
導体を設け、この導体を両電極間に半田付する事によ
り、雷撃に対し、十分耐えることができ、その実用的効
果は大なるものがある。As described above, according to the present invention, by providing a conductor between both electrodes of a chip component and soldering this conductor between both electrodes, it is possible to sufficiently withstand a lightning strike, and the practical The effect is great.
第1図aは本発明の一実施例における接続装置の断面
図、第1図bはそのハンダ塗布前の平面図、第1図cは
クリームハンダ塗布時の断面図、第2図は従来例の断面
図である。 1……チップジャンパー、2……ジャンパーと接続する
導体箔、3……他の導体箔、4……基板、5……チップ
部品装着用クリームハンダ、6……銀導体、7……導体
の上にのせるクリームハンダ、8……電極。FIG. 1a is a sectional view of a connecting device in an embodiment of the present invention, FIG. 1b is a plan view before solder application, FIG. 1c is a sectional view during cream solder application, and FIG. 2 is a conventional example. FIG. 1 ... Chip jumper, 2 ... Conductor foil to be connected to jumper, 3 ... Other conductor foil, 4 ... Board, 5 ... Cream solder for mounting chip parts, 6 ... Silver conductor, 7 ... Conductor Cream solder on top, 8 ... Electrode.
Claims (1)
ップ部品を載置し、上記チップ部品の両電極間に導体を
設け、この導体と上記両電極とをハンダ付してなる接続
装置。1. A connecting device in which a chip component for a jumper is placed between conductor foils on a surface of a substrate, a conductor is provided between both electrodes of the chip component, and the conductor and the both electrodes are soldered. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10671387A JPH0785428B2 (en) | 1987-04-30 | 1987-04-30 | Connection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10671387A JPH0785428B2 (en) | 1987-04-30 | 1987-04-30 | Connection device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63271868A JPS63271868A (en) | 1988-11-09 |
JPH0785428B2 true JPH0785428B2 (en) | 1995-09-13 |
Family
ID=14440602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10671387A Expired - Lifetime JPH0785428B2 (en) | 1987-04-30 | 1987-04-30 | Connection device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0785428B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01142172U (en) * | 1988-03-25 | 1989-09-28 |
-
1987
- 1987-04-30 JP JP10671387A patent/JPH0785428B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63271868A (en) | 1988-11-09 |
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