JP3221130B2 - Bonding structure of mounting member to substrate and electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining structure of a mounting member to a substrate and an electronic component having a case as a mounting member.

[0002]

2. Description of the Related Art FIG. 4 is an exploded perspective view of a conventional oscillator provided with a substrate having a triplate structure as an electronic component.
FIG. 5 is a perspective view showing the assembled state. The oscillator 10 shown in these figures has an oscillation circuit component 14 constituting a strip line mounted on a substrate 12 made of glass epoxy resin or the like in which a strip line (not shown) is embedded. 14 and the like are covered with a shielding case 16.

An earth pattern not shown in the drawing is formed on the back surface of the substrate 12 so as to sandwich the strip line together with an earth pattern formed inside the substrate 12. In addition, a concave portion is formed on the opposite side surface of the substrate 12, and tin,
A metal film of copper, silver, solder, or the like is formed, and a ground electrode 20 is formed on the center of the side surface, and terminal electrodes 22 are formed on both sides of the ground electrode 20. The ground electrode 20 is provided between the ground pattern formed inside the substrate 12 and the substrate 1.
2 are electrically connected to the ground pattern formed on the back surface of the second electrode 2 and are all at the same potential. On the other hand, the terminal electrode 22 is electrically connected to a printed wiring formed on the surface of the substrate 12 and is connected to an external power supply, or is for taking out the output of the oscillator 10 to the outside.

On the other hand, on the side of the shielding case 16, a shielding plate 2 is provided.
The shield 4 covers the other side of the substrate 12 where the ground electrode 20 and the like are not formed. Further, a joining portion 26 is protrudingly provided on the other side of the shielding case 16 where the shielding plate 24 is not formed, and is engaged with the concave portion in which the ground electrode 20 is formed. 20 are electrically connected to each other by soldering or the like. For this reason, the entire shielding case 16 is set to the same potential as the ground electrode 20 and the ground pattern. The ground electrode 20 has a recess with respect to the side surface of the substrate 12, and the joint 26 of the shielding case 16 is configured to be engaged with the recess. Is not protruded from the side surface of the vehicle. Stoppers 28 are formed on both sides of the joining portion 26, and the stoppers 28 are brought into contact with the surface of the substrate 12, so that a space for accommodating the oscillation circuit component 14 is ensured and the shielding case 16 and Substrate 1
2 are positioned so that assembly is easy. Steps 30 are formed on both sides of the stopper 28 so that the shielding case 16 and the terminal electrode 22 are not short-circuited. As the shielding case 16, besides one formed of a metal plate such as copper or aluminum, a case in which a metal or the like is plated on a resin, or a case in which a conductive powder is mixed in a resin may be used.

As described above, the strip line buried in the substrate 12 has the same potential as the earth electrode 20 and the shielding plate 2.
4, and are surrounded by a ground pattern and are electromagnetically shielded. Thereby, the radiation loss of the strip line is reduced.

[0006]

By the way, in the conventional oscillator shown in FIGS. 4 and 5, when the overall size is to be reduced in size and height, the size and height are reduced. As the degree of the contact increases, the area of the ground electrode 20 on the side surface of the substrate 12 also decreases, and
As a result, the soldering area of the shield case 16 with the bonding portion 26 becomes small, and as a result, the solderability deteriorates, and it becomes impossible to secure sufficient bonding strength to the ground electrode 20 of the shielding case 16. This leads to restrictions on height and height reduction.

Therefore, in the present invention, for example, when the present invention is applied to an electronic component having a structure in which the case is bonded to the side surface of the substrate, the size of the electronic component can be reduced while sufficiently securing the bonding strength of the case to the substrate as described above. The purpose is to be able to reduce the height and height.

[0008]

Means for Solving the Problems] It is a gist of the joining structure according to the present invention, a slit is formed in the joint portion of the mounting member to be joined by soldering to one electrode of the substrate side, the substrate Solder to the top surface of the board adjacent to the electrode on the side
While the electrodes are formed, the substrate for the bonding and the mounting
The upper part of the slit is soldered when aligned with the member
That is, the slit is formed so as to be located above the electrode for use .

[0009]

On the other hand, the gist of the electronic component according to the present invention is that a circuit component is mounted on a substrate, the circuit component is covered with an upper surface and a side surface of a case, and at least one side surface of the case has Is provided with a joining portion extending below the side surface, and the joining portion and one substrate side surface electrode are joined by soldering, and a slit is formed in the joining portion.
The upper surface of the substrate is adjacent to the side electrode of the substrate.
The soldering electrode is formed at the position where
When the board and case for bonding are aligned
Shape so that the upper part is located above the soldering electrode
Lies in the fact that has been formed.

[0011]

[0012]

According to this joint structure, since the slit is formed at the joint of the mounting member to be joined to the electrode on the side of the substrate by soldering, the soldering boundary between the joint and the electrode on the side of the substrate increases. As a result, the solderability between the joint and the side electrode is improved, and on the substrate adjacent to the electrode on the side of the substrate.
The electrodes for soldering are formed on the surface, while the substrate for bonding
The upper part of the slit is solder
The slit is formed so that it is located above the
The substrate in alignment for bonding.
A hole is formed in the area surrounded between the upper surface and the upper part of the slit
And solder is poured through the hole.
The soldering electrode on the top of the board and the mounting member
Soldering, and as a result, the strength of the joint
improves.

[0013]

On the other hand, according to such an electronic component, since the joint is formed with the slit, the soldering boundary between the joint and the side electrode of the substrate increases, and as a result, the connection between the joint and the side electrode is increased. The solderability between them is improved, and the area of the side electrodes can be reduced, that is, the electronic components can be reduced in size and height , and the upper surface of the board can be soldered to a position adjacent to the board side electrodes.
Electrodes are formed, and the slits are
The upper part is higher than the electrode for soldering
Because it is formed to be located above,
Between the top surface of the substrate and the top of the slit
A hole is formed in the enclosed area, and through the hole
By pouring in the solder, the solder
The pole and the case will be soldered from the inside,
As a result, the strength of the joint is improved, and the area of the side electrode is increased.
It is possible to make electronic components even smaller,
Wear.

[0015]

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an exploded perspective view of an oscillator when the embodiment of the present invention is applied to the oscillator, FIG. 2 is a view showing an assembled state thereof, and FIG. 3 is a line AA in FIG. FIG. 4 is a cross-sectional view taken along the line A in FIG.
The same reference numerals are given to the portions corresponding to FIG. 5 and FIG. 5, and the detailed description of the portions related to the same reference numerals is omitted.

Referring to these drawings, an embodiment of the present invention will be described. In this embodiment, a soldering electrode 32 is formed on the upper surface of a substrate 12 adjacent to a ground electrode 20 as a substrate side surface electrode. Further, a slit 34 is formed in the joint 26 of the shielding case 16 as an attachment member. Then, the joining portion 26 is formed by the slit 34.
As a result, the solderability between the joint 26 and the ground electrode 20 is improved, and the area of the ground electrode 20 is reduced.
0 can be reduced in size and height.

In the state of FIG. 2 in which the substrate 12 and the shielding case 16 for joining the substrate 12 and the shielding case 16 are aligned with each other with the stopper 28, the upper part of the slit 34 is closer to the stopper 28. Is formed above the soldering electrode 32, thereby forming a hole 36 at a location surrounded between the upper surface of the substrate and the upper portion of the slit 34.
By flowing the solder 38 through 6, the soldering electrode 32 on the upper surface of the substrate 12 and the shielding case 16 are firmly joined by the solder 38 from the inside.
The strength of the bonding is improved, and the area of the ground electrode 20 is made smaller, that is, the oscillator 10 can be further reduced in size and height.

In the above-described embodiment, the number of the slits 34 is singular. However, the number of slits 34 is not limited to one, and may be plural. The slit 32 has a shape extending linearly in the vertical direction, but is not limited thereto.
For example, it is needless to say that the shape may be such that the shape extends in the vertical direction in an oblique or bent shape.

Although the present invention has been described by applying the junction structure to the oscillator as in the above embodiment, the present invention is not limited to this. Further, for example, the case is such that the case is joined to the circuit board by soldering. However, the present invention is not limited to the case. It goes without saying that it can be done.

[0022]

As described above, according to the joint structure of the present invention, the slit is formed at the joint of the mounting member to be joined to the electrode on the side of the board by soldering, so that the joint and the side of the board are formed. When the soldering boundary between the electrodes is increased, as a result, the solderability between the joint and the side electrode is improved.If this joint structure is applied to, for example, an electronic component having a mounting member as a case, The size and height of the electronic component can be reduced. Further, in such a bonding structure, an electrode for soldering is formed on the upper surface of the substrate adjacent to the electrode on the side surface of the substrate, and the upper portion of the slit is soldered in a state where the substrate for bonding and the mounting member are aligned. Since the slit is formed so as to be located above the electrode for use, a hole is formed at a position surrounded between the upper surface of the substrate and the upper portion of the slit in the alignment state for bonding, and the hole is formed. By flowing the solder through the soldering electrode, the soldering electrode on the upper surface of the substrate and the mounting member are soldered from the inside, and as a result, the bonding strength is improved. Is applied, the size and height can be further reduced.

On the other hand, according to the electronic component of the present invention, since the slit is formed in the joint, the soldering boundary between the joint and the side electrode of the substrate increases, and as a result, the joint and the side electrode Can be improved, and the area of the side electrode can be reduced, that is, the electronic component can be reduced in size and height. In this electronic component, an electrode for soldering is formed on the upper surface of the substrate at a position adjacent to the electrode on the side surface of the substrate, and the upper portion of the slit is provided with the soldering electrode when the substrate and the case for bonding are aligned with each other. Since it is formed so as to be located above the electrode for use, a hole is formed at a location surrounded between the upper surface of the substrate and the upper portion of the slit in the above-described alignment state for bonding, and solder is formed through the hole. , The soldering electrode on the upper surface of the substrate and the case are soldered from the inside. As a result, the bonding strength is improved, and the area of the side electrode is reduced, that is, the electronic component. More compact,
The height can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an oscillator to which a bonding structure according to an embodiment of the present invention is applied.

FIG. 2 is a perspective view showing an assembled state of the oscillator shown in FIG. 1;

FIG. 3 is a cross-sectional view of the oscillator of FIG. 2 taken along line AA.

FIG. 4 is an exploded perspective view of a conventional oscillator.

5 is a perspective view showing a conventional example of assembling the oscillator of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Oscillator 12 Substrate 14 Oscillation circuit component 16 Shielding case 20 Earth electrode 26 Joining part 28 Stopper part 32 Electrode for soldering 34 Slit 36 Hole

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H03B 1/00 H05K 7/14

Claims (2)

(57) [Claims] 1. A bonding structure for a mounting member, wherein a slit is formed at a bonding portion of the mounting member to be bonded to one electrode on a side surface of the substrate by soldering, the structure being adjacent to an electrode on the side surface of the substrate. Electrodes for soldering on the upper surface of the substrate to be soldered
Is formed, and the substrate and the mounting member for the bonding are
In the alignment state, the upper part of the slit is an electrode for soldering
The slit is formed so as to be located above
Junction structure to the substrate of the mounting member, characterized in that that. 2. A circuit component mounted on a substrate, wherein the circuit
The product is covered by the top and sides of the case,
Extend below at least one side of the
Joints are provided.
In the electronic component in which the poles are joined by soldering , a slit is formed in the joining portion, and the slit is formed on the substrate.
Electrode for soldering on the surface adjacent to the side electrode of the substrate
Is formed, and the slit is connected to the substrate for bonding.
In the state of alignment with the base, the upper part is the electrode for soldering.
It is formed so that it is located above
And electronic components.