JP2887773B2 - 位相反転マスクの製造方法 - Google Patents
位相反転マスクの製造方法Info
- Publication number
- JP2887773B2 JP2887773B2 JP10027992A JP10027992A JP2887773B2 JP 2887773 B2 JP2887773 B2 JP 2887773B2 JP 10027992 A JP10027992 A JP 10027992A JP 10027992 A JP10027992 A JP 10027992A JP 2887773 B2 JP2887773 B2 JP 2887773B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- phase inversion
- light
- mask
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 17
- 239000011651 chromium Substances 0.000 claims description 25
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 24
- 229910052804 chromium Inorganic materials 0.000 claims description 24
- 230000010363 phase shift Effects 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 17
- 239000010453 quartz Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000000059 patterning Methods 0.000 claims description 8
- 238000001312 dry etching Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910007494A KR940005606B1 (ko) | 1991-05-09 | 1991-05-09 | 측벽 식각을 이용한 위상 반전 마스크 제조방법 |
| KR7494/1991 | 1991-05-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06222547A JPH06222547A (ja) | 1994-08-12 |
| JP2887773B2 true JP2887773B2 (ja) | 1999-04-26 |
Family
ID=19314244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10027992A Expired - Fee Related JP2887773B2 (ja) | 1991-05-09 | 1992-03-27 | 位相反転マスクの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5300377A (cg-RX-API-DMAC7.html) |
| JP (1) | JP2887773B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR940005606B1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE4215210C2 (cg-RX-API-DMAC7.html) |
| TW (1) | TW240323B (cg-RX-API-DMAC7.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5465220A (en) * | 1992-06-02 | 1995-11-07 | Fujitsu Limited | Optical exposure method |
| US5281500A (en) * | 1991-09-04 | 1994-01-25 | Micron Technology, Inc. | Method of preventing null formation in phase shifted photomasks |
| US5382483A (en) * | 1992-01-13 | 1995-01-17 | International Business Machines Corporation | Self-aligned phase-shifting mask |
| EP0553543B1 (en) * | 1992-01-31 | 1997-12-29 | Mitsubishi Denki Kabushiki Kaisha | Phase shift mask and method for forming resist pattern using said mask |
| US5789118A (en) * | 1992-08-21 | 1998-08-04 | Intel Corporation | Method and apparatus for precision determination of phase-shift in a phase-shifted reticle |
| KR970005675B1 (en) * | 1994-01-19 | 1997-04-18 | Hyundai Electronics Ind | Fabrication method of phase shift mask |
| KR0136630B1 (ko) * | 1994-03-21 | 1998-04-29 | 김주용 | 위상반전 마스크 제조방법 |
| US5595843A (en) * | 1995-03-30 | 1997-01-21 | Intel Corporation | Layout methodology, mask set, and patterning method for phase-shifting lithography |
| KR0157883B1 (ko) * | 1995-05-19 | 1998-12-15 | 문정환 | 위상반전 마스크 및 그 제조방법 |
| KR0186190B1 (en) * | 1995-09-25 | 1999-04-01 | Hyundai Micro Electronics Co | Phase shift mask and its manufacture |
| US7282306B2 (en) * | 2004-03-26 | 2007-10-16 | Intel Corporation | Continuous sloped phase edge architecture fabrication technique using electron or optical beam blur for single phase shift mask ret |
| US20070012335A1 (en) * | 2005-07-18 | 2007-01-18 | Chang Hsiao C | Photomask cleaning using vacuum ultraviolet (VUV) light cleaning |
| US7759023B2 (en) * | 2006-12-29 | 2010-07-20 | Sandisk 3D Llc | Hybrid mask and method of making same |
| CN115826348B (zh) * | 2023-02-13 | 2023-10-24 | 上海传芯半导体有限公司 | 掩模版及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5079113A (en) * | 1988-09-29 | 1992-01-07 | Sharp Kabushiki Kaisha | Photo-mask |
| JP2710967B2 (ja) * | 1988-11-22 | 1998-02-10 | 株式会社日立製作所 | 集積回路装置の製造方法 |
| JP2783582B2 (ja) * | 1989-03-22 | 1998-08-06 | 株式会社東芝 | フォトマスク |
| JP2776912B2 (ja) * | 1989-09-19 | 1998-07-16 | 富士通株式会社 | 光学マスクの製造方法及び光学マスクの修正方法 |
| JP2864570B2 (ja) * | 1989-10-27 | 1999-03-03 | ソニー株式会社 | 露光マスク及び露光方法 |
| JPH0476550A (ja) * | 1990-07-18 | 1992-03-11 | Oki Electric Ind Co Ltd | ホトマスク及びその製造方法 |
| JP2967150B2 (ja) * | 1990-10-31 | 1999-10-25 | ホーヤ株式会社 | 位相シフトマスク及びその製造方法並びに露光装置 |
| JPH04254855A (ja) * | 1991-02-07 | 1992-09-10 | Hitachi Ltd | ホトマスクおよびその製造方法 |
-
1991
- 1991-05-09 KR KR1019910007494A patent/KR940005606B1/ko not_active Expired - Fee Related
-
1992
- 1992-01-07 TW TW081100088A patent/TW240323B/zh active
- 1992-03-27 JP JP10027992A patent/JP2887773B2/ja not_active Expired - Fee Related
- 1992-05-07 US US07/879,481 patent/US5300377A/en not_active Expired - Lifetime
- 1992-05-08 DE DE4215210A patent/DE4215210C2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE4215210A1 (de) | 1992-11-12 |
| DE4215210C2 (de) | 1998-02-12 |
| KR940005606B1 (ko) | 1994-06-21 |
| TW240323B (cg-RX-API-DMAC7.html) | 1995-02-11 |
| JPH06222547A (ja) | 1994-08-12 |
| US5300377A (en) | 1994-04-05 |
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