JP2846804B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a structure for preventing a corner of an L-shaped lead from being exposed when the lead is covered with a resin.

[0002]

2. Description of the Related Art Conventionally, a hybrid integrated circuit has a case using a plurality of elements integrally formed by transfer molding, such as a discrete Tr, and includes:
Alternatively, there is a case where a hybrid substrate as a main body is mounted as one element of the case, and a resin is injected into the case to be integrated.

[0003] In particular, the present invention is the latter, for example, Japanese Patent Application No. 5-143730, Japanese Utility Model Application Publication No. Sho 62-9730, and Japanese Patent Application No. 63-291449. FIG. 2 illustrates the positional relationship between the lead and the sealing resin. FIG. 4 illustrates the resin injection space when the lead and the resin are omitted.
It is. For example, a semiconductor chip (omitted in the drawings) is mounted on an insulating substrate (1), and leads (2) are extended outside. In addition, the frame (3) integrated with an integrally formed article or a plurality of elements and the insulating substrate (1) fitted with the frame form a case opened only at the upper side in the drawing, and the case is opened through the release portion. The resin (4) is injected to form a hybrid integrated circuit device. Further, a cover of a metal substrate or an insulating substrate may be provided in the release portion, and a chip or the like may be mounted on the cover.

Here, the insulating substrate (1) is, for example, an Al substrate whose surface is anodically oxidized and insulated, and (5)
Is an epoxy resin, and a conductive pattern (6) of Cu is formed on the surface thereof by utilizing the adhesiveness of the resin. As can be seen from FIG. 2, the lead (2) of this hybrid integrated circuit device is supported by lead supporting members (7) and (8), is disposed substantially at the center of this gap, and is provided through a corner (9). To the lead connection (10).

FIG. 2 shows a substrate (11) made of an Al substrate which is further thermally connected to the lower layer of the insulating substrate (1) in consideration of heat dissipation and dielectric breakdown due to attachment to a chassis. The substrate (11) serves as one element (bottom surface) of the resin injection space.

[0006]

As shown in FIG. 4, resin is injected from above, which is a release portion, and a gap is provided between the lead support members (7) and (8). The surface of the resin is about the height of the bottom surface of the member (7). At first, the resin is fluid and hardened. At this time, the corner (9) of the lead is exposed, and even if it is not exposed, the corner is only thinly placed, and especially the upper part is open. In this case, there is a problem in that dust or the like adheres from the outside to cause a short circuit between the leads.

[0007] The same problem has occurred in, for example, the configuration in which one substrate in FIG. 3 is the bottom surface of the case.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has an advantage in that the inner surface of the upper support member (70), which is perpendicular to the direction in which the lead (56) extends, is connected to the lead ( The problem can be solved by making the corner and the position of 56) the same or disposing them further inside.

[0009]

In FIG. 1, the right corner of the upper support member (70) is located on the right side (inside) of the corner of the lead (56), and there is a slight distance between the lead (56) and the support member. There is a gap, and this right corner almost coincides with the surface of the injected resin. Therefore, even if shrinkage occurs at the time of resin curing, the resin is disposed thicker on the corners of the leads (56) than before.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a cross-sectional view for explaining a resin injection space, which is a point of the present application, and FIG. 2 is a perspective view for explaining what parts the hybrid integrated circuit forms the resin injection space. Also, in the present application, two substrates (5
0) and (51), but one (50) or a plurality of sheets are possible, which will be described later with reference to FIG.
First, a description will be given using two substrates.

First, the first substrate (50) subjected to the insulation treatment is:
A conductive path (52) is formed on the surface, and a semiconductor chip or the like is fixed thereon, though not shown in the drawing. Here, the first substrate may be a ceramic substrate, an insulating resin substrate, for example, a printed substrate, or a metal substrate whose surface is insulated. Here, a metal substrate obtained by anodizing the surface of an Al substrate is employed, and an epoxy resin layer (53) is applied for bonding the conductive path (52). (54) is aluminum oxide.

Naturally, the semiconductor chip is a transistor chip or an LSI chip. In addition, components such as a resistor and a capacitor are mounted, and if necessary, a predetermined circuit is achieved by wire bonding. In addition, the first substrate (5
On at least one side of 0), a plurality of lead connection terminals (55) extending from the circuit are arranged, and these are electrically connected to the leads (56). Here, since the connection terminal is made of Cu, it is fixed by solder or the like. The lead (56) is formed in an L shape for convenience of connection, and is disposed substantially at the center of the side surface of the case.

The lower layer of the first insulating substrate (50) has a second size larger than that of the substrate (50) in consideration of heat dissipation and dielectric breakdown due to attachment to a chassis.
Substrate (51) is adhered. That is, depending on the circuit, a large current flows through the semiconductor chip, and a metal substrate is employed to release the heat generated thereby to the outside. Further, when the substrate (50) is directly attached to the chassis, there is a problem that a large voltage is applied through the substrate (50) and the internal semiconductor chip or the like is destroyed. The second substrate (51) is treated and coated with a polyimide resin like the first substrate. This is because an insulating film is sandwiched between the ground wiring of the first substrate (50) and the first substrate (50),
Since the parasitic capacitance is generated, the Al substrate is exposed by etching or the like, and the substrate and the ground wiring are set to the same potential to eliminate the capacitance. However, when noise is added to the chassis, the substrate (50)
This is because noise is accumulated on the semiconductor chip and the like via the ground wiring.

Next, the frame (3) for resin molding will be described. As can be seen from FIG. 4, the entire area where the semiconductor chip is mounted, or the partition wall (60) shown by the dashed line in FIG. The resin is filled into two regions, the region and the region where the leads are fixed. Therefore, the frame (3)
Forms a resin injection space by the side walls (61), (62) and (63). In addition, the partition wall (6
0) partially connects the side walls (61) and (63) and extends from the side wall (61).

[0015] Even if the partition wall (61) is provided,
Even if it is not provided, the support members (70) and (71) become the side walls on the near side, and the injection space is formed. In FIG. 1, the partition wall (60) separates the mounting region of the semiconductor chip from the fixing region of the lead, and is in contact with the first substrate (50). Resin can be injected.

On the other hand, the space above the lead fixing area is composed of the substrates (50) and (51), the partition wall (60), the side wall (61),
(63) and support lead members (70), (71). Here, the lead support member (70) is formed integrally with the frame (3), and the support member (7) is easily attached when the substrate (50) is fitted to the frame (3).
1) is separate. But the support member (70)
May be integrated as in (71). Therefore, FIG.
Is formed in the hatched area.

A feature of the present invention is that the right side of the support member (70) is shifted to the right in FIG. When the resin is injected into this space from the resin injection nozzle, the resin becomes a support member (70),
The resin is slightly pushed out through a gap between the lead (56) and the lead (56).
The resin is injected to a height of about. Here, even if the resin injection pressure from the nozzle is high to some extent, the injection is substantially at atmospheric pressure because the injection port is open. From the bottom surface (72) of the support member and its corners, the partition wall (6)
The surface of the resin extending to 0) stops in a convex or almost flat state due to surface tension. Therefore, the resin interface is
A force is applied downward by its own weight during the fixing process, or a surface having a concave shape as shown by C is formed by contraction. However, since the inner side surface of the support member (70) is disposed inside the corner of the lead (56), the corner is not exposed. Therefore, the lead (56)
Since it is completely covered with the resin, even if conductive dust or the like adheres from above, there is no short circuit between the leads. Further, when the left side of the support member (70) is shifted inward, the left side surface of the support member (71) protrudes outward by that amount, so that it becomes a tray for the resin that flows out, and resin dripping can be prevented.

This structure can be applied to other than the two-substrate of the present embodiment. The lead is a faston terminal, but can be applied to other leads. Next, the case of a single substrate structure will be briefly described. FIG. 3 shows an example of the single-substrate structure.
The problem is solved by providing the supporting member of the above and shifting the right side surface of the upper supporting member (70) inward.

Returning to the previous embodiment, as shown in FIG. 2, even though the partition wall (60) is omitted and the whole is an injection region of one space, the concave surface C becomes more concave, but the same effect is produced. .

[0020]

As is clear from the above description, the injected resin is depressed by the atmospheric pressure or its own weight, but by providing the inner side surface of the upper supporting member inside the corner of the lead, Since the surface extends from the corner portion of the inner side surface, a resin is always provided above the corner portion of the lead, so that exposure of the lead can be prevented. Therefore, even if dust or the like adheres to the resin injection, a short circuit between the leads can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view illustrating an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a conventional structure.

FIG. 3 is a cross-sectional view illustrating a single-substrate structure according to the present invention.

FIG. 4 is a perspective view of a frame forming a resin injection space.

[Explanation of symbols]

 3 Frame 50 First substrate 51 Second substrate 56 Lead 60 Partition wall 70 Support member 71 Support member C Resin interface

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/00-23/26 H01L 23/28-23/30 H01L 21/56 H01L 23/50 H05K 1 / 02

Claims (2)

(57) [Claims] 1. A plurality of leads extending outward from the sides of a substrate to which a semiconductor chip is fixed and connected in an L-shape at a lower fixing portion from the corner, and the plurality of leads are connected to an upper portion. And a support member for supporting the resin from below, and the support member becomes a part of a resin injection space, and at least the resin injected into the space. A hybrid integrated circuit device, wherein the inner side surface of the upper supporting member is located at the same position as the corner of the lead or further inside. 2. A plurality of leads extending outward from the side of the substrate to which the semiconductor chip is fixed and connected in an L-shape to a lower fixing portion from the corner, and the plurality of leads are moved upward. And a supporting member for supporting the resin from below, a frame body fitted with the supporting member and in contact with the substrate to form a resin injection space, and a resin injected into the space. The inner surface of the upper support member, which is orthogonal to the extending direction of the lead, is positioned at the same position as the corner of the lead or further inside, and the resin is formed at the lower end of the inner surface. A hybrid integrated circuit device, characterized in that the surface thereof completely covers the corners of the leads by surface tension via the frame and the frame.