JP3172437B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a resin case structure for preventing leakage of resin injected into a region where external leads are provided.

[0002]

2. Description of the Related Art In general, a hybrid integrated circuit device has a hybrid integrated circuit board on which a semiconductor element or the like is fixed to achieve a predetermined circuit, and a lid for hermetically sealing the element. When moisture resistance is required, an epoxy resin or the like is injected into a space formed by the lid and the hybrid integrated circuit board.

For example, FIGS. 4, 5 and 6 show this in detail in Japanese Utility Model Laid-Open Publication No. 62-34481. FIG. 4 is a perspective view showing a state in which a lid (3) integrated with a resin-filled frame (2) is attached to the hybrid integrated circuit board (1).
FIG. 5 is a view as viewed from the arrow A in FIG. 4, and FIG. 6 is a view as viewed from the arrows A and B when the hybrid integrated circuit board (1) is removed.

First, wiring is provided on a hybrid integrated circuit board (1), and circuit elements including passive elements and active elements electrically connected thereto are mounted. Some of these wirings extend to the hybrid integrated circuit board (1) near one side (4), and pads for external leads are provided there. (5) is connected.

A lid (3) hermetically seals the circuit elements and wiring, and a resin-filled frame (2) integrally formed with the lid (3) forms an external connection for connection to an external circuit. Surrounds the lead (5). The lid (3) into which the hybrid integrated circuit board is fitted and the resin-filled frame (2) are provided with a step-like stopper in consideration of a deviation from the board. Here, for convenience of description, the lid (3) integrated with the resin-filled frame (2) is collectively referred to as a case material.

The case material is provided with a partition wall (7) for sealing the circuit element and for injecting resin into a connection portion of the external lead. In other words, the space formed by the resin-filled frame portion (2), the partition wall (7) and the hybrid integrated circuit board (1), particularly the region indicated by the crosses, is filled with epoxy resin to enhance the mechanical strength of the external leads (5). I was letting it.

[0007]

When the epoxy resin before curing is injected into the area indicated by the crosses, the epoxy resin generally has a level indicated by a dotted line a in FIG. 4 (also indicated by a dotted line in FIG. 6), that is, a hybrid integrated circuit. The resin is injected up to the side surface (4) of the substrate (1).
At this time, due to the variation in the injection amount of the injector, the injected resin flows along the interface b between the case and the hybrid integrated circuit board during the transportation up to the resin curing step, and flows out to the back surface of the hybrid integrated circuit board 1. The resin that flowed out was sometimes cured. In particular, this resin wraparound has a problem of causing poor contact with the heat sink and poor appearance.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a resin filling frame portion provided so as to protrude from a side surface of a hybrid integrated circuit board on which the external leads are provided. The problem is solved by providing a protrusion integrally with the substrate stopper between the front end of the frame portion and the side surface of the hybrid integrated circuit board.

That is, if the protruding portion is provided, the resin rises on the inner side surface, so that the amount of protruding face from the side surface of the hybrid integrated circuit board as shown in FIG. 2 can be suppressed. Can be lengthened as b and c, and the outflow of resin can be suppressed accordingly.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG.
FIG. 2 is a perspective view for explaining a main part of the configuration of the present application, showing a case where a hybrid integrated circuit board is attached to a case material. FIG. 2 is a view of FIG. 1 viewed from an arrow A, and FIG.
FIG. 2 is a view when the hybrid integrated circuit board of FIG. 1 is removed and viewed from arrows A and B.

First, a conductive path is formed on the surface of the first hybrid integrated circuit board (10) subjected to insulation treatment, and a semiconductor chip, a resistor, and the like are fixed thereon. Here, the first hybrid integrated circuit board may be a ceramic board, an insulating resin board (for example, a printed board), or a metal board whose surface is insulated. Here, a metal substrate obtained by anodizing the surface of an Al substrate is employed, and a resin layer such as polyimide is adhered for bonding conductive paths.

Naturally, the semiconductor chip is a diode, a transistor chip and an LSI chip. In addition, components such as a transformer, a chip resistor or a capacitor are mounted.
If necessary, a thin metal wire is wire-bonded to achieve a predetermined circuit. A plurality of lead connection terminals extending from the circuit are arranged on a surface near at least one side of the first hybrid integrated circuit board (10), and these and the external leads (12) are electrically connected. It is connected. The external lead (12) may be L-shaped for convenience of connection.

Although not shown in the figure, the second hybrid integrated circuit board may be bonded to the lower layer of the first hybrid integrated circuit board in consideration of heat dissipation and dielectric breakdown due to attachment to a chassis. Good. In some circuits, a large current flows through the semiconductor chip, and a metal substrate is used to release the heat generated thereby to the outside. Further, when the chassis is directly attached to the substrate, there is a problem that a large voltage is applied through the substrate and the internal semiconductor chip or the like is destroyed. A structure in which a polyimide resin is applied similarly to a hybrid integrated circuit board is referred to as a second hybrid integrated circuit board, and the insulating film is sandwiched between the first hybrid integrated circuit board and the second hybrid integrated circuit board. And

Next, a case material (2) for resin molding is used.
0) will be described. As can be seen from FIG. 1, the case material (20) is mainly used to divide the semiconductor chip into two regions, that is, a region where a semiconductor chip is mounted and a region where leads are fixed.
Is provided with a partition wall (21) crossing the first hybrid integrated circuit board (10). The partition wall (21) separates the mounting region of the semiconductor chip and the fixing region of the lead, and extends from the left side L to the right side R of the first hybrid integrated circuit board. . The partition walls (22, 2)
3) is in contact with the sides L and R. In addition, partition wall (2
4) extends along the lower side U of the hybrid integrated circuit substrate 10. Therefore, the space of the semiconductor chip mounting area is surrounded by the partition walls (21, 22, 23, 24) and the partition wall (2
1, 2, 23, 24) and a lid (2) for sealing the first hybrid integrated circuit board (10) with the case material upper surface (25).
Construct 6). Also, for filling the resin that surrounds the fixing portion of the external lead (12) and increases the strength of the external lead,
A resin-filled frame (27) integral with the lid (26) is provided. The resin-filled frame part (27) forms a case material (20) integrally with the lid (26), and forms a container for resin injection with the hybrid integrated circuit board (10).
That is, the resin is provided in the region indicated by the mark X by the resin injection. In FIG. 1, the partition walls (21, 22, 2
3) The portion where the face is exposed on the inner surface (the portion corresponding to the projecting portion described later) is the resin-filled portion.

On the other hand, in the upper diagram of FIG.
2, 23, 24), there is a step-like step (28, 2).
9, 30) are provided. Partition walls (22, 23, 24) protruding forward from the step from the step
The protrusions (31, 32) bent inwardly from the partition walls (22, 23) in an L-shape constitute a substrate stopper for preventing the displacement of the substrate. When the hybrid integrated circuit board (10) is disposed on the substrate stopper portion, the surface of the hybrid integrated circuit board (10) viewed from the arrow A and the surface of the partition wall viewed from the arrow A coincide as shown in FIG. Have been.

Further, the protrusion (3) which is a feature of the present invention.
3, 34) are provided. This protrusion (33, 3)
4) are integrated with the steps (28, 29) and have the same height extending forward with respect to the paper surface of FIG. 2, and are provided as shown in FIG. 1 on three surfaces inside the resin filling frame. In FIG. 1, the surface (36) of the protruding portion (33, 34) viewed from the arrow B protrudes upward from the side surface (35) of the hybrid integrated circuit board (10) viewed from the arrow B. It is located below the surface (37) of the resin-filled frame portion viewed from above. That is, in FIG. 2, the step (28, 29) is located between the resin-filled frame part surface (37) projecting from the hybrid integrated circuit board side surface (35) and the hybrid integrated circuit board side surface (35). It is provided integrally with.

Although it is easy to see from FIG. 1, the inner surface of the resin-filled frame portion is composed of the inner surface of the partition wall (21), the inner surface of the protrusion, and the inner surface of the hybrid integrated circuit board. The resin is filled. This epoxy resin is injected until it coincides with the side surface (35) of the hybrid integrated circuit board, as indicated by the portion indicated by the mark x in FIG. However, the epoxy resin also rises on the inner surface of the protruding portions (33, 34) in a black-out form as shown in FIG.

The present invention is characterized by the amount of swelling, and is characterized by the way of swelling of the resin filled in black in FIG. 2 and FIG. That is, if the protruding surface (36) is arranged between the resin-filled frame portion surface (37) and the side surface (35) of the hybrid integrated circuit board, the height of the resin rising in FIG. It is possible to reduce the amount of the resin rising in the filled portion from the rising amount. Further, the route through which the resin is transmitted to the back surface of the hybrid integrated circuit board is the contact portion b between the side surface of the hybrid integrated circuit board and the case material in FIG. 4, but in this embodiment, in addition to the contact portion b, a protruding portion ( 33, 34) can be provided. Accordingly, the height of the raised resin can be reduced, the amount thereof can be reduced, and the length of the route transmitted to the back surface of the hybrid integrated circuit board can be lengthened, so that the amount of resin transmitted to the back surface of the hybrid integrated circuit board can be suppressed.

Finally, outside the partition walls (22, 23) in FIG. 2, mounting holes are formed integrally with the case material for mounting the present apparatus. As described above, the surface of the hybrid integrated circuit board (the portion hatched with dots) and the surface of the corresponding case material match, and the resin does not flow around the back of the hybrid integrated circuit board. Can be mounted flat.

[0020]

As is apparent from the above description, the resin-filled frame portion is provided so as to protrude from the side of the hybrid integrated circuit board on which the external leads are provided, and the tip of the protruded resin-filled frame portion and the hybrid integrated circuit are provided. By providing a protruding portion between the substrate and the side surface of the substrate, the amount of resin protruding from the side surface of the hybrid integrated circuit substrate can be suppressed as shown in FIG. 2, and by providing the protruding portion, the route of resin transmission can be lengthened. The amount of resin flowing to the back surface of the integrated circuit board can be suppressed.

Therefore, even if the transfer step is introduced from the resin injection to the resin curing step, the resin does not flow around the back surface of the hybrid integrated circuit board, so that the appearance defect after curing does not occur, and the hybrid integrated circuit board is also provided with a gap between the heat dissipation board and the heat sink. The contact can be made without any heat, and the heat dissipation can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an essential part for explaining an embodiment of the present invention.

FIG. 2 is a drawing viewed from an arrow A in FIG. 1;

FIG. 3 shows the hybrid integrated circuit board removed in FIG.
It is the drawing seen from arrows A and B.

FIG. 4 is a perspective view of a main part for explaining a conventional hybrid integrated circuit device.

FIG. 5 is a drawing viewed from an arrow A in FIG. 4;

FIG. 6 shows the hybrid integrated circuit board removed in FIG.
It is the drawing seen from arrows A and B.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Hybrid integrated circuit board 12 External lead 20 Case material 21 Partition wall 22 Partition wall 23 Partition wall 24 Partition wall 26 Lid 27 Resin filling frame 33 Projection 34 Projection 35 Side of composite integrated circuit board

Claims (1)

(57) [Claims] A cover for sealing a circuit element provided on a hybrid integrated circuit board having at least a surface having an insulating property;
A container is formed integrally with the lid, surrounds external leads provided on one side of the hybrid integrated circuit board, and in which resin is injected with the hybrid integrated circuit board. A resin-filled frame portion provided with a stepped substrate stopper for regulating the position of the substrate, wherein the resin-filled frame portion is a side surface of the hybrid integrated circuit board on which the external leads are provided. A hybrid integrated circuit device, further comprising: a protruding portion provided between the substrate stopper and a protruding portion provided between the tip of the protruding resin-filled frame portion and the side surface of the hybrid integrated circuit substrate.