JP2883526B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device and, more particularly, to a hybrid integrated circuit device which prevents resin dripping from a gap between a case and a lead.

[0002]

2. Description of the Related Art Conventionally, a hybrid integrated circuit has a case using a plurality of elements integrally formed by transfer molding, such as a discrete Tr, and includes:
Alternatively, there is a case where a hybrid substrate as a main body is mounted as one element of the case, and a resin is injected into the case to be integrated.

FIG. 4 showing the latter, in particular, Japanese Patent Application No. 5-143730, Japanese Utility Model Application Publication No. Sho 62-9730, and Japanese Patent Application No. 63-291449, is an example of such a case. A semiconductor chip (2) is mounted on (1), and leads (3) are extended to the outside. In the drawing, the integrated body of (4) and (5) and the insulating substrate (1) fitted thereto constitute a case which is opened only on the right side, and the resin (6) is released through the release portion here. Injected into the hybrid integrated circuit device. Also (5)
May be separately formed of a metal substrate or an insulating substrate, and may have a semiconductor chip mounted thereon.

Here, the insulating substrate (1) is, for example, an Al substrate whose surface has been anodized and insulated, and (7)
Is an epoxy resin, and a Cu conductive pattern (8) is formed on the surface thereof by utilizing the adhesiveness of the resin. (9) is a heat sink. As can be seen from FIG. 4, the lead (3) of the hybrid integrated circuit device is disposed substantially at the center of the release portion. Therefore, when a force is externally applied to the lead (3), this force is also applied to the lead connection portion. In addition, there is a problem that electrical connection failure occurs.

For this reason, lead supporting members (10) and (11) as shown in FIG. 3 are brought into contact with the lead (3) to prevent a connection failure due to an external force applied to the lead. FIG. 3 shows that a substrate (12) made of an Al substrate is further bonded to the lower layer of the insulating substrate (1) so as to be thermally bonded in consideration of heat dissipation and dielectric breakdown due to attachment to a chassis. This substrate (12) is one element constituting a resin injection space.

[0006]

In the configuration shown in FIG. 3, the resin injection nozzle (13) is connected to the resin injection hole (14).
When the resin is injected into the injection space and there is a gap between the lead (3) and the support members (10) and (11), there is a problem that the resin sags as shown by the arrow. This gap is positively supported by the support members (10), (11).
Even if the support surfaces (15) and (16) are brought into contact with the leads, the problem was not solved because of the following gaps.

That is, the contact surfaces (15) and (16) of the support members (10) and (11) are formed on one plane as shown in FIG. Since the surface comes into contact with the upper and lower surfaces of the leads, a space is created between the leads and between the lower surface (15) of the support member (10) and the upper surface (16) of the support member (11). Therefore, there is a problem that the resin leaks from this space. Further, even if a projecting portion is provided on one side of the support member to eliminate this space, and this fills the space between the leads, the problem has not been solved, because only the leakage is small. Also, since the pitch of the lead differs depending on each model, if this protrusion is provided on the support member, there is a problem that this support member cannot be used on other models and the cost increases, and this protrusion may be employed. was difficult.

This problem is the same in FIG. 4 for example.
Further, even if the support member is provided in FIG. 4, the same problem occurs.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has opposite surfaces of a frame (60) and a plurality of leads (56) supported by the same surfaces (71) and (72). A first support member (64) and a second support member (65),
And the heat-radiating substrate (51) forms one space for storing the injected resin, and the two support members (64),
(65) is solved by shifting the position along the length direction of the lead (56).

A frame (60) and a plurality of leads (56)
The first support member (64) and the second support member (6) supporting the opposite surfaces of the same on the same surface (71), (72).
5) and the substrate (50), (51) to form one space for the injected resin reservoir, and the two support members (6
4) and (65) are solved by shifting the position along the length direction of the lead (56).

[0011]

According to the present invention, one of the support members is shifted as shown in the drawing. In FIG. 1, the upper support member (64) is shifted to the right. The reason why the resin does not sag due to this shift cannot be clearly explained, but the following reasons are considered. That is, the area (planar area viewed from the direction of arrow A) formed by the support members (64) and (65) and the frame (60) is increased by shifting the support member (64) as shown in FIG. can do. Stated another way, the area of the resin exposed portion C of the portion composed of the support members (64) and (65), the frame (60) and the leads (56) is the corresponding area in FIG. (Hatched area). As a result, on the surface C, since the resin is in contact with the support member and the resin injection port is open, the surface tension of the resin is increased by the increased area, and the interface is bulged to some extent in a convex shape. Stop. In this state, the swollen resin tries to fall down due to the weight of the resin,
Since the support member (65) protrudes, this protruding portion serves as a receiving tray, and resin dripping can be prevented.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a cross-sectional view for explaining a resin injection space which is a point of the present application, and FIG. 2 is a perspective view for explaining what parts the hybrid integrated circuit is composed of. Also, in the present application, two substrates (50), (5
1), one (50) or a plurality of sheets can be used. Here, the description will be made with two substrates.

First, the first substrate (50) subjected to the insulation treatment is
A conductive path (52) is formed on the surface, on which a semiconductor chip (53) and the like are fixed. Here, the first substrate is
A ceramic substrate, an insulating resin substrate, for example, a printed substrate, or a metal substrate whose surface is insulated may be used. Here, Al
A metal substrate whose surface is anodized is adopted, and a resin layer (5
4) is attached.

The semiconductor chip (53) is, of course, a transistor chip or an LSI chip. In addition, components such as a resistor and a capacitor are mounted, and if necessary, wire-bonded to achieve a predetermined circuit. A plurality of lead connection terminals (55) extending from the circuit are arranged on at least one side of the first substrate (50), and these are electrically connected to the leads (56). . The lead (56) is L-shaped for convenience of connection.

The lower layer of the first insulating substrate (50) has a second size larger than that of the substrate (50) in consideration of heat dissipation and dielectric breakdown due to attachment to a chassis.
Substrate (51) is adhered. That is, depending on the circuit, a large current flows through the semiconductor chip (53), and a metal substrate is employed to release the heat generated thereby to the outside. Further, when the chassis is directly attached to the substrate (50), there is a problem that a large voltage is applied through the substrate (50) and the internal semiconductor chip or the like is broken.
The second substrate (51) is obtained by anodizing the Al substrate and performing an insulating process, and applying a polyimide resin like the first substrate. This is because an insulating film is sandwiched between the ground wiring of the first substrate (50) and the first substrate (50), and the Al substrate is exposed by etching or the like to maintain a parasitic capacitance. Although the earth wiring has the same potential to eliminate the capacitance, when noise is added to the chassis, the board (5
0), because noise is accumulated on the semiconductor chip and the like via the ground wiring.

Next, a frame (60) for resin molding
Will be described. As can be seen from FIG. 2, the two areas of the area where the semiconductor chip is mounted and the area where the leads are fixed
In order to fill the area with resin, the frame (60) comprises partition walls (61), (6) traversing the first substrate (50).
2) and (63) make multiple rooms. First, the partition wall (61) separates the semiconductor chip mounting area and the lead fixing area, and the partition wall (63) is in contact with the side of the first substrate indicated by L and R. In addition, partition wall (6
2) is in contact with the side U. Therefore, the space above the mounting area of the semiconductor chip is composed of the partition walls (61) and (62) and the first substrate (50), and a resin such as epoxy silicon can be injected from above.

On the other hand, the space above the lead fixing area is composed of the substrates (50) and (51), the partition walls (61) and (63), and the support lead members (64) and (65).
Here, the lead support member (64) is formed integrally with the frame (60), and the support member (65) is separate from the frame (60) because of the ease of attachment when the substrate (50) is fitted to the frame (60). Body. However, the support member (65) may be integral as in (64). Therefore, the space of the hatched area in FIG. 1 is configured. Here, the support member (65) may be in contact with the side D of the first substrate (50).

The feature of the present invention resides in that the support member (64) is shifted to the right in the space of the lead fixing region. When resin is injected into this space from the resin injection nozzle (70) of FIG. 1, the resin is transferred to the upper surface (72) of the support member (65).
From the height of the support member (64) to the height of the bottom surface (71) of the support member (64). Here, even if the resin injection pressure from the nozzle is high to some extent, the injection is substantially at atmospheric pressure because the injection port is open. At this time, the resin is pushed out through the gap between the support members (64) and (65) and the lead (56). The bottom surface (71) of the support member and the upper surface (72) of the support member (65) stop at a convex shape due to surface tension at the left corner of the bottom surface and the upper surface of FIG.
Therefore, the interface of the resin forms a slope having a concave shape as shown by C due to the application of a downward force due to its own weight during the fixing process or the contraction. However, the upper surface (7) of the support member (65)
2) is a tray for the resin to move downward (fall) in order to move the upper supporting member inward and move outward, and
Resin dripping can be prevented.

This principle can be applied to other than the two-substrate of the present embodiment, and the lead is a faston terminal, but can be applied to other leads. Next, the case of a single substrate structure will be briefly described. FIG. 4 shows an example of this single-substrate structure, which can be solved by providing the support members of FIG. 1 above and below the leads (3) and shifting the upper support member inward. Here, for example, a hole provided in the case (5) may be used as the resin injection port.

Returning to the previous embodiment, the same effect can be obtained even if the partition wall (61) is omitted as shown in FIG. 4 and the entire region is used as an injection region as shown in FIG.

[0021]

As is clear from the above description, the upper supporting member is shifted inward, and as a result, the lower supporting member is shifted outward, and the injected resin is caused by the atmospheric pressure or its own weight. It becomes convex outward from between the support members, but suppresses dripping due to surface tension. On the other hand, since the lower support member protrudes outward, the upper surface of the support member serves as a tray for the resin to fall downward. Therefore, the resin does not drip out of the gap. Therefore, it is not necessary to remove the dripped resin later, and it is not necessary to fill the space between the leads by projecting the supporting member, and to support the upper surface of each of the leads by one surface. It is possible to apply to various models having different lead pitches by simply preparing one support substrate having no unevenness, and it is possible to use a common support member.

[Brief description of the drawings]

FIG. 1 is a sectional view illustrating an embodiment of the present invention.

FIG. 2 is a perspective view illustrating an assembly structure of the present invention.

FIG. 3 is a cross-sectional view illustrating a conventional structure.

FIG. 4 is a cross-sectional view illustrating a single-substrate structure.

FIG. 5 is a cross-sectional view illustrating a resin sagging portion of the present invention.

[Explanation of symbols]

 Reference Signs List 50 first substrate 51 second substrate 56 lead 60 frame 61 partition wall 62 partition wall 63 partition wall 64 support member 65 support member 70 resin injection nozzle

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/28-23/30 H01L 23/00-23/10 H01L 23/50

Claims (4)

(57) [Claims] 1. A lead extending outward from a side of a substrate to which a semiconductor chip is fixed, a support member for supporting the lead from above and below with a contact or a slight gap, and a lead. And a sealing resin whose surface is exposed from a gap between the support member and a sealing resin injected substantially at atmospheric pressure, wherein the upper support member is shifted inward, and the upper support member is shifted to the outside by shifting. Wherein the upper surface of the lower supporting member is a tray for receiving the resin moving downward by the weight of the resin. 2. A rectangular substrate having an insulating property, a conductive path formed on the substrate, a semiconductor element electrically connected to the conductive path to achieve a predetermined circuit, and at least one of the substrates. A series of a plurality of lead connection terminals extending from the circuit on the side, a series of a plurality of leads connected to the lead connection terminal and extending out of the substrate, and thermally contacting the substrate; Heat dissipating substrate, and a frame that forms a box-shaped case integrally with at least a part of this heat dissipating substrate,
In the hybrid integrated circuit device having at least the resin injected into the case, the frame, an upper support member and a lower support member that support opposite surfaces of the plurality of leads on the same surface, and the heat radiation. A space for the resin reservoir injected with the conductive substrate is formed, and the upper support member is shifted inward, and
The lower support member upper surface arranged outside by
A resin pan that moves downward due to its own weight.
A hybrid integrated circuit device characterized by the following. 3. A rectangular substrate having an insulating property, a conductive path formed on the substrate, a semiconductor element electrically connected to the conductive path to achieve a predetermined circuit, and at least one of the substrates. A series of a plurality of lead connection terminals extended from the circuit on the side, a series of a plurality of leads connected to the lead connection terminal and extending out of the substrate, and at least a part of the substrate. In a hybrid integrated circuit device having at least a frame body integrally forming a box-shaped case and a resin injected into the case, the frame body and an upper portion supporting opposite surfaces of the plurality of leads on the same surface. Forming one space for the resin reservoir injected with the supporting member, the lower supporting member, and the substrate, and displacing the upper supporting member inward,
The upper surface of the lower support member, which is located outside,
Characterized as a tray for resin that moves downward due to weight
Hybrid integrated circuit device. 4. The hybrid integrated circuit device according to claim 2, wherein said leads are faston terminals having a rectangular cross section.