JP2818392B2 - 無線周波数識別タグの作成方法 - Google Patents

無線周波数識別タグの作成方法

Info

Publication number
JP2818392B2
JP2818392B2 JP7269856A JP26985695A JP2818392B2 JP 2818392 B2 JP2818392 B2 JP 2818392B2 JP 7269856 A JP7269856 A JP 7269856A JP 26985695 A JP26985695 A JP 26985695A JP 2818392 B2 JP2818392 B2 JP 2818392B2
Authority
JP
Japan
Prior art keywords
wire
chip
bonding machine
attaching
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7269856A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08213419A (ja
Inventor
マイケル・ジョン・ブレディ
トーマス・アンソニー・コフィーノ
ハーレイ・ケント・ハインリッヒ
グレン・ウォールデン・ジョンソン
ポール・アンドリュー・モスコウィッツ
フィリップ・マーフィ
ジョージ・フレデリック・ウォーカー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH08213419A publication Critical patent/JPH08213419A/ja
Application granted granted Critical
Publication of JP2818392B2 publication Critical patent/JP2818392B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
    • G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
    • G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
    • G06K7/086—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive sensing passive circuit, e.g. resonant circuit transponders
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/071—
    • H10W72/07141—
    • H10W72/07163—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/5363—
    • H10W72/5434—
    • H10W72/5445—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/931—
    • H10W72/932—
    • H10W72/952—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Details Of Aerials (AREA)
JP7269856A 1994-10-27 1995-10-18 無線周波数識別タグの作成方法 Expired - Lifetime JP2818392B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33028894A 1994-10-27 1994-10-27
US330288 1994-10-27

Publications (2)

Publication Number Publication Date
JPH08213419A JPH08213419A (ja) 1996-08-20
JP2818392B2 true JP2818392B2 (ja) 1998-10-30

Family

ID=23289095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7269856A Expired - Lifetime JP2818392B2 (ja) 1994-10-27 1995-10-18 無線周波数識別タグの作成方法

Country Status (6)

Country Link
JP (1) JP2818392B2 (enExample)
KR (1) KR100192728B1 (enExample)
HU (1) HUT76992A (enExample)
TW (1) TW280897B (enExample)
WO (1) WO1996013793A1 (enExample)
ZA (1) ZA957085B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005112195A1 (ja) * 2004-05-18 2005-11-24 Hitachi, Ltd. 無線ｉｃタグ及びその製造方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP2000216188A (ja) 1999-01-22 2000-08-04 Seiko Epson Corp ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置
US6472747B2 (en) * 2001-03-02 2002-10-29 Qualcomm Incorporated Mixed analog and digital integrated circuits
US6732923B2 (en) * 2001-04-04 2004-05-11 Ncr Corporation Radio frequency identification system and method
US7295161B2 (en) 2004-08-06 2007-11-13 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR101038493B1 (ko) * 2004-11-12 2011-06-01 삼성테크윈 주식회사 극초단파용 라디오 주파수 인식태그 제조방법
WO2006103981A1 (ja) 2005-03-25 2006-10-05 Toray Industries, Inc. 平面アンテナおよびその製造方法
US7586193B2 (en) 2005-10-07 2009-09-08 Nhew R&D Pty Ltd Mm-wave antenna using conventional IC packaging
JP4316607B2 (ja) 2006-12-27 2009-08-19 株式会社東芝 アンテナ装置及び無線通信装置
WO2011083502A1 (ja) 2010-01-05 2011-07-14 株式会社 東芝 アンテナ及び無線装置
JP5172925B2 (ja) 2010-09-24 2013-03-27 株式会社東芝 無線装置
JP5417389B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
JP5414749B2 (ja) 2011-07-13 2014-02-12 株式会社東芝 無線装置
TW201325842A (zh) * 2011-12-16 2013-07-01 hong-ren Li 工具盒結構
JP6121705B2 (ja) 2012-12-12 2017-04-26 株式会社東芝 無線装置
US10304810B2 (en) * 2014-12-19 2019-05-28 Glo Ab Method of making a light emitting diode array on a backplane
FR3047101B1 (fr) * 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
US11233017B2 (en) * 2019-10-03 2022-01-25 Texas Instruments Incorporated Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2519054C3 (de) * 1974-04-30 1978-08-03 Central Glass Co., Ltd., Ube, Yamaguchi (Japan) Vorrichtung zum Aufbringen eines Drahtes auf eine Trägerfolie aus thermoplastischem Kunststoff nach einem vorgegebenen Muster
NL9200396A (nl) * 1992-03-03 1993-10-01 Nedap Nv Radiofrequente identificatielabel met relatief grote detectie-afstand en een minimum aantal electronische componenten.
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005112195A1 (ja) * 2004-05-18 2005-11-24 Hitachi, Ltd. 無線ｉｃタグ及びその製造方法

Also Published As

Publication number Publication date
JPH08213419A (ja) 1996-08-20
WO1996013793A1 (en) 1996-05-09
HUT76992A (hu) 1998-01-28
KR100192728B1 (ko) 1999-06-15
TW280897B (enExample) 1996-07-11
KR960016656A (ko) 1996-05-22
ZA957085B (en) 1996-03-11

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