JP2802079B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JP2802079B2 JP2802079B2 JP63230408A JP23040888A JP2802079B2 JP 2802079 B2 JP2802079 B2 JP 2802079B2 JP 63230408 A JP63230408 A JP 63230408A JP 23040888 A JP23040888 A JP 23040888A JP 2802079 B2 JP2802079 B2 JP 2802079B2
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- photo
- conductor circuit
- printed wiring
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子機器等に使用されるプリント配線板の製
造方法に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board used for electronic equipment and the like.
従来の技術 近年電子機器の小径・軽量化にともなって、それに使
用されるプリント配線板の導体回路も細線化し、さらに
表面実装の増加によりソルダレジストも高い精度が要求
されるようになってきた。2. Description of the Related Art In recent years, as electronic devices have become smaller in diameter and lighter in weight, conductor circuits of printed wiring boards used in the devices have become finer. Further, due to the increase in surface mounting, high precision solder resists have been required.
ソルダレジストの機能は導体回路の腐食を防止すると
ともに取り扱い時や部品の実装時に外力を受けた際に導
体回路を物理的に保護する役割をはたすとともに、さら
に重要な役割は、部品実装時のはんだ付けにおいて、は
んだ付けを必要とするランドパターンやスルーホールと
はんだが付着してはならない導体回路等とを区別する必
要がある。The function of the solder resist prevents the corrosion of the conductor circuit, and at the same time serves to physically protect the conductor circuit when exposed to external force during handling and component mounting, and more importantly, the soldering at the time of component mounting. In mounting, it is necessary to distinguish between a land pattern or a through hole that requires soldering and a conductor circuit or the like to which solder must not adhere.
一般にソルダレジストの形成は高い生産性を有するス
クリーン印刷法による方法が大勢であるが、配線の高密
度化によってスクリーン印刷法での形成では印刷ズレに
よるランドパターンへのソルダレジストの乗り上げやに
じみ、さらに細線パターン部の凹凸によりパターン間に
ソルダレジストインキが入り込まないいわゆるエッチ切
れといった不具合が生じ、導体回路の露出が発生しやす
いため、高密度プリント配線板のスクリーン印刷法での
ソルダレジストの形成は困難になってきた。そこでスク
リーン印刷法にかわってフォト法によるソルダレジスト
の形成が年々増加したきた。In general, the formation of solder resist by screen printing method with high productivity is predominant, but in the formation by screen printing method due to the high density of wiring, the solder resist rides on the land pattern due to printing deviation and bleeds, Due to the irregularities of the fine line pattern part, the solder resist ink does not enter between the patterns, so-called etch break occurs, and the conductor circuit is likely to be exposed, so it is difficult to form the solder resist by the screen printing method for high density printed wiring boards It has become Therefore, the formation of solder resist by a photo method instead of the screen printing method has been increasing year by year.
従来の高密度のプリント配線板のソルダレジストの製
造方法は第２図に示すようなフォト法による形成であっ
た。つまり、基板１上に導体２の回路を形成し、その上
に、フォトレジスト３を塗布し、溶剤の一部を除去し乾
燥被膜を形成する（第２図ａ）。次に、マスクフィルム
６を密着させ紫外線４を露光した後（第２図ｂ）、所定
の現像液で未露光部分を溶解除去する（第２図ｃ）。そ
して、残分の露光部の溶剤除去及び重合硬化のため熱効
果を行う。A conventional method for manufacturing a solder resist for a high-density printed wiring board has been formed by a photo method as shown in FIG. That is, a circuit of the conductor 2 is formed on the substrate 1, a photoresist 3 is applied thereon, a part of the solvent is removed, and a dry film is formed (FIG. 2a). Next, after the mask film 6 is brought into close contact with the substrate and exposed to ultraviolet rays 4 (FIG. 2b), the unexposed portions are dissolved and removed with a predetermined developing solution (FIG. 2c). Then, a thermal effect is performed for removing the solvent and polymerizing and curing the remaining exposed portion.
発明が解決しようとする課題 このようなプリント配線板の製造方法においては、露
光の際、マスクフィルム６と基板１との位置合せが通常
片側0.05〜1.0mmと極めて高い精度を要する工程であ
り、また、光の回り込み及び解像性向上のため、マスク
フィルム６と基板１とを密着させるのに、一般には真空
吸着を用いており、露光前のセッティングに30〜60秒、
真空密着に10〜20秒、露光に20〜40秒の時間を要し、生
産性を著しく悪くするものであった。Problems to be Solved by the Invention In such a method for manufacturing a printed wiring board, during exposure, the alignment between the mask film 6 and the substrate 1 is a process that requires extremely high precision, usually 0.05 to 1.0 mm on one side, Further, in order to wrap around the light and improve the resolution, the mask film 6 and the substrate 1 are in close contact with each other by generally using vacuum suction, and the setting before the exposure is performed for 30 to 60 seconds.
It took 10 to 20 seconds for vacuum adhesion and 20 to 40 seconds for exposure, which significantly reduced productivity.
本発明はこれらの課題を解決するため、露光の際マス
クフィルム９を必要とせず、マスクフィルムと基板の位
置合せ及び真空吸着を省略し、さらにスクリーン印刷法
によるソルダレジスト形成とフォト法によるソルダレジ
スト形成を組み合せることによって、生産性、精度を飛
躍的に向上させることを目的としたものである。In order to solve these problems, the present invention does not require the mask film 9 at the time of exposure, omits the alignment between the mask film and the substrate and the vacuum suction, furthermore, forms a solder resist by a screen printing method and a solder resist by a photo method. The purpose is to dramatically improve the productivity and accuracy by combining the formations.
課題を解決するための手段 この課題を解決するために本発明は、紫外線が透過可
能な絶縁基板の片面に導体回路を形成する工程と、絶縁
基板および導体回路上に光硬化性および熱硬化性を有す
るフォトソルダレジストを塗布形成し仮乾燥する工程
と、その形成面の反対面から絶縁基板を介してフォトソ
ルダレジストと適性露光量の２倍以上の露光量で紫外線
硬化する工程と、導体回路のみフォトソルダレジストを
現像・除外する工程と、露光した導体回路の一部を除い
て前記導体回路およびフォトソルダレジスト上にスクリ
ーン印刷法を用いて熱硬化型ソルダレジストを形成する
工程と、前記フォトソルダレジストと熱硬化型ソルダレ
ジストを熱により同時に重合硬化することを特徴とする
プリント配線板の製造方法を用いてソルダレジストを形
成することである。Means for Solving the Problems In order to solve this problem, the present invention comprises a step of forming a conductor circuit on one surface of an insulating substrate through which ultraviolet light can pass, and a step of forming a photocurable and thermosetting resin on the insulating substrate and the conductor circuit. Applying a photo-solder resist having a coating and pre-drying; curing the photo-solder resist with ultraviolet light from a surface opposite to the formation surface through an insulating substrate with an exposure amount of twice or more an appropriate exposure amount; Developing and excluding only the photo solder resist, forming a thermosetting solder resist using a screen printing method on the conductor circuit and the photo solder resist except for a part of the exposed conductor circuit, Solder resist using a method for manufacturing a printed wiring board, wherein a solder resist and a thermosetting solder resist are simultaneously polymerized and cured by heat. Is to form
作用 この製造方法によれば、フォトソルダレジスト塗布面
の導体回路が従来のマスクフィルムの遮光部の役目をな
し、導体回路が形成されていない部分に塗布されたフォ
トソルダレジストを反対面からの露光により硬化させ、
現像することにより導体回路上の未露光のフォトソルダ
レジストを除去した後、露光した導体回路の一部を除い
て前記導体回路およびフォトソルダレジスト上にスクリ
ーン印刷法により重ねてソルダレジストを印刷形成する
ことによって、マスクフィルムを必要としないフォト法
と、高い生産性を有するスクリーン印刷法を組み合せる
ことによって、印刷にじみエッジ切れのない高精度なソ
ルダレジストを高速で形成することができ、さらにフォ
トソルダレジストと熱硬化型ソルダレジストを同時に重
合硬化することにより、両ソルダレジストの密着性を向
上させることもできる。According to this manufacturing method, the conductor circuit on the photo solder resist-coated surface serves as a light-shielding portion of the conventional mask film, and the photo solder resist applied to the portion where the conductor circuit is not formed is exposed from the opposite surface. Cured by
After removing the unexposed photo solder resist on the conductor circuit by developing, the solder resist is printed and formed on the conductor circuit and the photo solder resist by a screen printing method except for a part of the exposed conductor circuit. Thus, by combining a photo method that does not require a mask film and a screen printing method that has high productivity, a high-precision solder resist with no printing bleed and no edge cut can be formed at a high speed. By simultaneously polymerizing and curing the resist and the thermosetting solder resist, the adhesion between the two solder resists can be improved.
実施例 以下、本発明の実施例を第１図ａ〜ｄの添付図面にも
とづいて説明する。Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings of FIGS.
365nmの波長の紫外線透過率が40％〜50％で一定の厚
みを保ったガラス−エポキシからなる絶縁基板11上の片
面に導体回路12を形成する。その絶縁基板11の回路形成
面側に適性露光量500〜600mJ/cm2（塗膜厚:20〜30μ
ｍ）で、しかも、365nmの感光波長ピークの光硬化性お
よび熱硬化性を有するフォトソルダレジスト13をスクリ
ーン印刷法やカーテンコーターの公知の方法で塗布し、
仮乾燥等の所定の処理を行う（第１図ａ）。その後、塗
布面の反対面から、1000〜1500mJ/cm2の露光量で、365n
mの波長を有する紫外線14を用いて露光し、絶縁基板11
を透過して、フォトソルダレジスト13を光重合により硬
化させる（第１図ｂ）。このときの露光は従来用いたマ
スクフィルムを必要としないことからコンベア式のUV照
射炉を用いてもよい。次に、硬化後の絶縁基板11を所定
の現像液（変性１−１−１トリクロロエタン）を有する
現像槽にて、1.5〜2.5kg/cm2のスプレー圧力で30〜60秒
の条件で現像すると、導体回路12上のフォトソルダレジ
スト13は導体回路12に遮光されて未硬化となるため、現
像にて溶解除去され、第１図ｃに示したようなフォトソ
ルダレジスト13のパターンを形成することができる。そ
して、露光した導体回路12を被覆するため、スクリーン
印刷法を用いて、第１図ｄに示したような、熱硬化型ソ
ルダレジスト15を形成し、フォトソルダレジスト13と同
時に熱により重合硬化を行い、両ソルダレジストの密着
性を向上させる。A conductor circuit 12 is formed on one surface of an insulating substrate 11 made of glass-epoxy having a transmittance of 40% to 50% at a wavelength of 365 nm and maintaining a constant thickness. An appropriate exposure dose of 500 to 600 mJ / cm 2 (coating thickness: 20 to 30 μm)
m), and apply a photo solder resist 13 having photo-curing and thermo-curing properties with a 365 nm photosensitive wavelength peak by a screen printing method or a known method of a curtain coater,
A predetermined process such as temporary drying is performed (FIG. 1a). Then, from the opposite surface of the application surface, an exposure amount of 1000~1500mJ / cm 2, 365n
Exposure using ultraviolet light 14 having a wavelength of m
And the photo solder resist 13 is cured by photopolymerization (FIG. 1B). The exposure at this time may use a conveyor-type UV irradiation furnace since a conventionally used mask film is not required. Next, the cured insulating substrate 11 is developed in a developing tank having a predetermined developing solution (modified 1-1-1 trichloroethane) at a spray pressure of 1.5 to 2.5 kg / cm 2 for 30 to 60 seconds. Since the photo solder resist 13 on the conductor circuit 12 is uncured by being shielded from light by the conductor circuit 12, it is dissolved and removed by development to form a pattern of the photo solder resist 13 as shown in FIG. 1c. Can be. Then, in order to cover the exposed conductor circuit 12, a thermosetting solder resist 15 as shown in FIG. 1d is formed by using a screen printing method, and polymerization curing is performed simultaneously with the photo solder resist 13 by heat. To improve the adhesion between both solder resists.
熱硬化型ソルダレジスト15の形成においては、本発明
のフォトソルダレジスト13によって、高密度部分の形成
がクリアランスが０の状態で終了しているため、スクリ
ーンと絶縁基板11の合致精度（クリアランス）は、片側
0.15〜0.25mm程度の印刷精度となり、比較的低密度のプ
リント配線板のソルダレジストの印刷条件で容易に形成
することができる。また、導体回路12の回路間にはフォ
トソルダレジスト13ご形成され平滑面となっていること
からスクリーン印刷時に熱硬化型ソルダレジスト15を回
路間に埋め込む必要がなく、通常のスクリーン印刷より
も低い印刷圧力で熱硬化型ソルダレジスト15を印刷形成
することができることから、印刷時の印刷画像の伸びや
歪みを最小限にすることができる。In the formation of the thermosetting solder resist 15, since the formation of the high-density portion is completed with the clearance of 0 by the photo solder resist 13 of the present invention, the matching accuracy (clearance) between the screen and the insulating substrate 11 is improved. ,one side
The printing accuracy is about 0.15 to 0.25 mm, and it can be easily formed under the printing conditions of the solder resist of a relatively low-density printed wiring board. Also, since the photo solder resist 13 is formed between the circuits of the conductor circuit 12 and has a smooth surface, it is not necessary to embed the thermosetting solder resist 15 between the circuits at the time of screen printing, which is lower than normal screen printing. Since the thermosetting solder resist 15 can be formed by printing at a printing pressure, the elongation and distortion of a printed image during printing can be minimized.
以上の本発明の製造方法により、導体回路を保護し、
はんだ付けの必要な導体と必要でない導体とを明確に区
分することがきるというソルダレジストとしての本来の
機能を充分果すことのできるソルダレジストを提供する
ことができる。By the above manufacturing method of the present invention, the conductor circuit is protected,
It is possible to provide a solder resist that can sufficiently perform its original function as a solder resist that can clearly distinguish conductors that need to be soldered from conductors that do not.
さらに両ソルダレジストを同時に重合硬化させること
により、密着性の向上を図り、耐熱性等の信頼性を向上
させることもできる。Further, by simultaneously polymerizing and curing both solder resists, adhesion can be improved and reliability such as heat resistance can be improved.
なお、本発明に使用するフォトソルダレジスト13は、
従来のものよりも露光感度を高くしたものを用いること
が望ましく、また、絶縁基板11の紫外線透過率を高くす
ることによって一層生産性の向上を図ることができる。Incidentally, the photo solder resist 13 used in the present invention,
It is desirable to use one having a higher exposure sensitivity than the conventional one, and the productivity can be further improved by increasing the ultraviolet transmittance of the insulating substrate 11.
発明の効果 以上のように本発明によれば、フォト法とスクリーン
印刷法を組み合わせることによって、従来使用したマス
クフィルムや絶縁基板との位置合わせを必要とせず、ま
た接触露光型における真空吸着も必要としないことか
ら、生産性は２倍以上に向上させることができる。ま
た、導体回路が露光の際に遮光部を形成していることか
ら、エッチ切れによる導体回路の露出や導体回路とソル
ダレジストの合わせズレは皆無となり、極めて精度の高
く、かつ信頼性の高いソルダレジストを容易に形成する
ことができる。Effect of the Invention As described above, according to the present invention, by combining the photo method and the screen printing method, it is not necessary to perform the alignment with the mask film or the insulating substrate used conventionally, and the vacuum suction in the contact exposure type is also required. , The productivity can be more than doubled. In addition, since the conductor circuit forms a light-shielding part during exposure, there is no exposure of the conductor circuit due to cut-off of the etching or misalignment of the conductor circuit and the solder resist, and the solder is extremely accurate and highly reliable. A resist can be easily formed.
第１図ａ〜ｄは、本発明の一実施例におけるプリント配
線板の製造方法を示す断面図、第２図ａ〜ｃは、従来の
プリント配線板の製造方法を示す断面図である。 11……入射光が透過可能な基板、12……導体回路、13…
…フォトソルダレジスト、14……紫外光、15……熱硬化
型ソルダレジスト。1A to 1D are cross-sectional views illustrating a method for manufacturing a printed wiring board according to an embodiment of the present invention, and FIGS. 2A to 2C are cross-sectional views illustrating a conventional method for manufacturing a printed wiring board. 11 ... substrate through which incident light can be transmitted, 12 ... conductor circuit, 13 ...
... Photo solder resist, 14 ... Ultraviolet light, 15 ... Thermosetting solder resist.
Claims (1)
回路を形成する工程と、絶縁基板および導体回路上に光
硬化性および熱硬化性を有するフォトソルダレジストを
塗布形成し仮乾燥する工程と、その形成面の反対面から
絶縁基板を介してフォトソルダレジストの適性露光量の
２倍以上の露光量で紫外線硬化する工程と、導体回路上
のみのフォトソルダレジストを現像・除去する工程と、
露出した導体回路の一部を除いて前記導体回路およびフ
ォトソルダレジスト上にスクリーン印刷法を用いて熱硬
化型ソルダレジストを形成する工程と、前記フォトソル
ダレジストと熱硬化型ソルダレジストを熱により同時に
重合硬化することを特徴とするプリント配線板の製造方
法。1. A step of forming a conductive circuit on one surface of an insulating substrate through which ultraviolet light can pass, and a step of applying a photo-curable and thermosetting photo-solder resist on the insulating substrate and the conductive circuit and temporarily drying the same. And a step of ultraviolet curing from the opposite side of the formation surface with an exposure amount of twice or more the appropriate exposure amount of the photo solder resist through an insulating substrate, and a step of developing and removing the photo solder resist only on the conductor circuit. ,
A step of forming a thermosetting solder resist using a screen printing method on the conductor circuit and the photo solder resist except for a part of the exposed conductor circuit, and simultaneously applying the photo solder resist and the thermosetting solder resist by heat. A method for producing a printed wiring board, comprising polymerizing and curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63230408A JP2802079B2 (en) | 1988-09-14 | 1988-09-14 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63230408A JP2802079B2 (en) | 1988-09-14 | 1988-09-14 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0278295A JPH0278295A (en) | 1990-03-19 |
| JP2802079B2 true JP2802079B2 (en) | 1998-09-21 |
Family
ID=16907419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63230408A Expired - Fee Related JP2802079B2 (en) | 1988-09-14 | 1988-09-14 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2802079B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252287A (en) * | 1989-03-27 | 1990-10-11 | Tamura Kaken Kk | Formation of solder mask for printed-wiring board |
| JPH0738236A (en) * | 1993-07-19 | 1995-02-07 | Hitachi Aic Inc | Manufacture of printed wiring board |
| CN106028669A (en) * | 2016-07-13 | 2016-10-12 | 广德新三联电子有限公司 | Novel circuit board solder mask PIN alignment method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583399A (en) * | 1981-06-29 | 1983-01-10 | Toshiba Corp | Manufacture for piezoelectric oscillator |
-
1988
- 1988-09-14 JP JP63230408A patent/JP2802079B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0278295A (en) | 1990-03-19 |
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