JPH0738236A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH0738236A JPH0738236A JP20007893A JP20007893A JPH0738236A JP H0738236 A JPH0738236 A JP H0738236A JP 20007893 A JP20007893 A JP 20007893A JP 20007893 A JP20007893 A JP 20007893A JP H0738236 A JPH0738236 A JP H0738236A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate
- resist layer
- solder resist
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント配線板の製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板は、例えばサブトラクテ
ィブ法等により、銅張り基板をエッチング処理して回路
を形成し、製造している。そして、回路を形成した後
は、所定の回路のみにはんだメッキできるように、それ
以外の箇所にはんだレジスト層を形成している。2. Description of the Related Art A printed wiring board is manufactured by forming a circuit by etching a copper-clad substrate by, for example, a subtractive method. Then, after forming the circuit, a solder resist layer is formed at other portions so that only a predetermined circuit can be solder-plated.
【０００３】はんだレジスト層を形成するには、一般的
にスクリーン印刷法やフォト法を用いている。そして特
に高密度のプリント配線板を製造するには後者の方法を
用いている。To form the solder resist layer, a screen printing method or a photo method is generally used. The latter method is used to manufacture a printed wiring board having a particularly high density.
【０００４】後者のフォト法は、感光性液状レジストイ
ンクを用いる場合と、ドライフィルムを用いる場合の２
通りがある。感光性液状レジストインクを用いる場合に
は、回路を形成した基板面にこのインクをスクリーン印
刷法により塗布し、乾燥し、冷却した後、インクの塗布
面にネガ又はボジフィルムを密着し、このフィルムの表
面から紫外線を照射して露光し、現像し、次いで硬化処
理をしてはんだレジスト層を形成する。そしてドライフ
ィルムを用いる場合には、ドライフィルムを回路を形成
した基板面に張り付けるとともにこのドライフィルムの
表面にネガフィルムを積層し、ネガフィルムの表面から
紫外線を照射して露光し、現像し、回路表面のはんだレ
ジストを除去して、回路間等にはんだレジスト層を形成
する。In the latter photo method, two methods are used: one using a photosensitive liquid resist ink and the other using a dry film.
There is a street. When a photosensitive liquid resist ink is used, this ink is applied to the surface of the substrate on which the circuit is formed by a screen printing method, dried and cooled, and then a negative or void film is adhered to the applied surface of the ink. The surface is irradiated with ultraviolet rays to be exposed, developed, and then cured to form a solder resist layer. And when using a dry film, the dry film is attached to the surface of the substrate on which the circuit is formed, and a negative film is laminated on the surface of the dry film, and the negative film is exposed to ultraviolet rays for exposure and development. The solder resist on the circuit surface is removed, and a solder resist layer is formed between the circuits.
【０００５】[0005]
【発明が解決しようとする課題】しかし、フォト法によ
りはんだレジスト層を形成する場合には、所定の位置に
はんだレジスト層を設けるために、ネガ又はポジのフィ
ルムを基板に正確に合わせて積層しなければならない。
そしてこの作業は目視による場合には非常に困難であ
り、ＣＣＤカメラを用いて画像処理をする全自動露光タ
イプの装置では高価な設備となる欠点がある。また、基
板やネガ又はポジフィルムの寸法が変化したり、装置の
精度等を考慮し、回路とはんだレジスト層との間には約
５０〜２００μｍ程度の隙間を設けている。このため、
隙間にはんだが入り込み、回路間でははんだがブリッジ
し易い欠点がある。However, when the solder resist layer is formed by the photo method, a negative or positive film is accurately aligned and laminated on the substrate in order to provide the solder resist layer at a predetermined position. There must be.
This operation is very difficult when visually inspected, and there is a drawback in that a fully automatic exposure type apparatus that performs image processing using a CCD camera requires expensive equipment. In addition, a gap of about 50 to 200 μm is provided between the circuit and the solder resist layer in consideration of changes in the dimensions of the substrate, the negative or the positive film, and the accuracy of the device. For this reason,
There is a drawback that solder easily enters the gap and bridges between the circuits.
【０００６】本発明の目的は、以上の欠点を改良し、容
易に製造でき、製造コストを低くでき、はんだブリッジ
を防止できるプリント配線板の製造方法を提供するもの
である。An object of the present invention is to provide a method for manufacturing a printed wiring board, which improves the above-mentioned drawbacks, can be easily manufactured, can reduce the manufacturing cost, and can prevent a solder bridge.
【０００７】[0007]
【課題を解決するための手段】請求項１の発明は、上記
の目的を達成するために、基板の少なくとも片面に回路
を形成し、はんだレジスト層を形成するプリント配線板
の製造方法において、回路の形成面に感光性レジストを
積層し、反対面側から紫外線を照射して露光し、現像し
てはんだレジスト層を形成することを特徴とするプリン
ト配線板の製造方法を提供するものである。According to a first aspect of the present invention, in order to achieve the above object, a circuit is formed on at least one side of a substrate, and a solder resist layer is formed. The present invention provides a method for manufacturing a printed wiring board, which comprises laminating a photosensitive resist on the surface on which the solder resist is formed, irradiating ultraviolet rays from the opposite surface side, exposing and developing to form a solder resist layer.
【０００８】また、請求項２の発明は、基板の両面に回
路を形成し、はんだレジスト層を形成するプリント配線
板の製造方法において、一方の回路の形成面に感光性レ
ジストを積層し、反対面側から紫外線を照射して露光
し、現像して第１のはんだレジスト層を形成し、次に、
他方の回路の形成面に感光性レジストを積層し、反対面
側から紫外線を照射して露光し、現像して第２のはんだ
レジスト層を形成することを特徴とするプリント配線板
の製造方法を提供するものである。According to a second aspect of the present invention, in a method for manufacturing a printed wiring board in which a circuit is formed on both surfaces of a substrate and a solder resist layer is formed, a photosensitive resist is laminated on one circuit forming surface, It is exposed by irradiating ultraviolet rays from the surface side and developed to form a first solder resist layer, and then,
A method for manufacturing a printed wiring board, characterized by forming a second solder resist layer by laminating a photosensitive resist on the other circuit formation surface, irradiating ultraviolet rays from the opposite surface side for exposure, and developing. It is provided.
【０００９】感光性レジストには、感光性液状レジスト
インクやドライフィルム等を用いる。そしてその感光度
は１００〜２００ｍＪ／cm2 程度が好ましく、露光し易
くなる。As the photosensitive resist, a photosensitive liquid resist ink or a dry film is used. The photosensitivity is preferably about 100 to 200 mJ / cm 2, which facilitates exposure.
【００１０】なお、はんだレジスト層の表面は回路の表
面とほぼ同じ高さにする方が好ましい。これにより、は
んだブリッジを防止できる効果がより向上する。また、
接点等の複数の回路間にブラシを滑らして使用する場合
に、回路間にほとんど段差がないため、回路とブラシが
互いに摩擦して損傷するのを軽減できる。It is preferable that the surface of the solder resist layer has substantially the same height as the surface of the circuit. This further improves the effect of preventing solder bridges. Also,
When the brush is slid between a plurality of circuits such as contacts, there is almost no step between the circuits, so that the circuit and the brush are less likely to be damaged by friction.
【００１１】[0011]
【作用】本発明は、基板の回路の形成面に感光性液状レ
ジストインクやドライフィルム等の感光性レジストを積
層し、基板の反対面側から紫外線を照射して、この感光
性レジストを露光している。この際、紫外線は、基板を
透過するが、回路を形成した部分ではこの回路に妨げら
れてほとんど透過できない。そして紫外線が透過した部
分では、同時に熱が発生し、この熱により感光性レジス
トはラジカル反応が著しく促進する。すなわち、感光性
レジストは、紫外線が透過する部分では、その透過した
紫外線とそれにともなって発生した熱により露光処理が
進む。これにより、感光性レジストは、基板の表面に直
に積層した部分で露光し、回路の表面に積層した部分で
は露光しない。従って、その後に現像処理をすると、前
者の部分の感光性レジストははんだレジスト層として残
るが、後者の部分の感光性レジストは除去される。According to the present invention, a photosensitive liquid resist ink or a dry film or other photosensitive resist is laminated on the circuit formation surface of a substrate, and ultraviolet rays are irradiated from the opposite surface side of the substrate to expose the photosensitive resist. ing. At this time, the ultraviolet rays are transmitted through the substrate, but at the portion where the circuit is formed, the ultraviolet rays are blocked by the circuit and hardly transmitted. Then, heat is generated at the same time in the portion where the ultraviolet rays pass, and this heat significantly accelerates the radical reaction of the photosensitive resist. That is, in the photosensitive resist, in the portion where the ultraviolet ray is transmitted, the exposure processing proceeds due to the transmitted ultraviolet ray and the heat generated thereby. As a result, the photosensitive resist is exposed at the portion directly laminated on the surface of the substrate and is not exposed at the portion laminated on the surface of the circuit. Therefore, when the development process is performed thereafter, the photosensitive resist in the former part remains as a solder resist layer, but the photosensitive resist in the latter part is removed.
【００１２】従って、従来のフォト法と異なり、回路表
面以外の箇所にはんだレジスト層を形成するのに、ネガ
やポジフィルムを基板の所定の位置に正確に合わせる作
業が必要なくなり、製造が容易になる。また、全自動露
光タイプの装置も必要なく、製造コストを低くできる。
そして、ネガやポジフィルムを用いる必要がなく、基板
やこれらのフィルムの寸法の変動を考慮する必要がな
く、そのため、回路とはんだレジスト層との間の隙間を
無くすことができる。従って、はんだが回路間をはんだ
レジスト層の表面を通してブリッジする不良を防止でき
る。Therefore, unlike the conventional photo method, it is not necessary to accurately align a negative or positive film with a predetermined position on the substrate to form the solder resist layer on a portion other than the circuit surface, and the manufacturing is facilitated. Become. Further, a fully automatic exposure type device is not required, and the manufacturing cost can be reduced.
Further, it is not necessary to use a negative film or a positive film, and it is not necessary to consider the variation in the dimensions of the substrate and these films, so that the gap between the circuit and the solder resist layer can be eliminated. Therefore, it is possible to prevent a defect in which the solder bridges between the circuits through the surface of the solder resist layer.
【００１３】[0013]
【実施例】以下、本発明を実施例に基づいて説明する。
図１は、請求項１の発明の実施例を示す。この実施例で
は、先ず、基板１として、図１（イ）に示す通り、厚さ
０．８mm、銅箔２の厚さ３５μｍの片面銅張り積層板
（ＭＣＬ−Ｅ−６７ Ｓ、日立化成工業株式会社商品
名）を用いる。EXAMPLES The present invention will be described below based on examples.
FIG. 1 shows an embodiment of the invention of claim 1. In this example, first, as the substrate 1, as shown in FIG. 1A, a single-sided copper-clad laminate (MCL-E-67S, Hitachi Chemical Co., Ltd.) having a thickness of 0.8 mm and a copper foil 2 having a thickness of 35 μm was used. Product name of corporation) is used.
【００１４】次に、銅箔２の表面に回路パターン状に、
スクリーン印刷法又はフォト法によりエッチングレジス
トを積層する。エッチングレジストを積層後、エッチン
グしてエッチングレジストにより被覆した以外の銅箔を
除去する。そしてエッチングレジストを除去して、図１
（ロ）の通り、回路３を形成する。Next, a circuit pattern is formed on the surface of the copper foil 2.
An etching resist is laminated by a screen printing method or a photo method. After the etching resist is laminated, the copper foil other than the one covered with the etching resist by etching is removed. Then, the etching resist is removed, and FIG.
As shown in (b), the circuit 3 is formed.
【００１５】回路３を形成後、図１（ハ）に示す通り、
この回路３を含む基板１の表面４にカーテンコータによ
り、感光性液状レジストインク５（ＰＳＲ−４０００，
太陽インキ製造株式会社商品名）を塗布する。カーテン
コータの塗布条件は、カーテン部スリット幅０．５mmと
し、コンベアー速度を６ｍ／min とする。また、感光性
液状レジストインク５は、粘度が１．５〜６．０ポイ
ズ、チタソトロピーが１．１〜３．０の低粘度のものを
用いる。これによって、感光性液状レジストインク５の
回路３間の乾燥後の厚さを回路３とほぼ同一にできる。
なお、感光性液状レジストインク５は他に、スクリーン
印刷やスプレーコータ等の方法により塗布してもよい。
感光性液状レジストインク５を塗布後、これを温度８０
℃で２０分間乾燥する。乾燥後、基板１を室温近くまで
冷却する。After forming the circuit 3, as shown in FIG.
On the surface 4 of the substrate 1 including the circuit 3, a photosensitive liquid resist ink 5 (PSR-4000,
TAIYO INK MFG. CO., LTD. Product name) is applied. The coating conditions of the curtain coater are that the slit width of the curtain is 0.5 mm and the conveyor speed is 6 m / min. The photosensitive liquid resist ink 5 has a low viscosity with a viscosity of 1.5 to 6.0 poise and a titassotropy of 1.1 to 3.0. As a result, the thickness of the photosensitive liquid resist ink 5 after drying between the circuits 3 can be made substantially the same as that of the circuits 3.
Alternatively, the photosensitive liquid resist ink 5 may be applied by a method such as screen printing or a spray coater.
After applying the photosensitive liquid resist ink 5, apply this to a temperature of 80
Dry at 20 ° C. for 20 minutes. After drying, the substrate 1 is cooled to near room temperature.
【００１６】基板１を冷却後、基板１をＵＶコンベア機
に載せ、図１（ニ）に示す通り、基板１の感光性液状レ
ジストインク５を塗布した面とは反対面側から紫外線６
を照射する。この際のＵＶコンベア機の条件は、７．５
ＫＷメタルハライドランプ３灯で、コンベアの速度５ｍ
／minであり、感光量を約６００ｍＪ／cm2とする。この
条件により、紫外線６が基板１の回路３を形成していな
い部分を透過する透過率は約８％となる。そしてこの透
過した紫外線６と、これにより発生した熱により、感光
性液状レジストインク５を露光処理する。なお、ＵＶコ
ンベア機の搬送ベルトは、紫外線６を反射しない材質と
するかあるいは、載せた基板１との間に紫外線６を反射
しない材質のシートや板等を介在させる。すなわち、搬
送ベルト７が紫外線６を反射すると、その反射光によっ
て、回路３の表面に塗布した露光する必要のない感光性
液状レジストインク５も露光してしまう。After cooling the substrate 1, the substrate 1 is placed on a UV conveyor machine, and as shown in FIG. 1D, ultraviolet rays 6 are applied from the side opposite to the side of the substrate 1 coated with the photosensitive liquid resist ink 5.
Irradiate. The condition of the UV conveyor machine at this time is 7.5.
3 KW metal halide lamps, conveyor speed 5m
/ Min, and the exposure amount is about 600 mJ / cm 2 . Under this condition, the transmittance of the ultraviolet rays 6 through the portion of the substrate 1 where the circuit 3 is not formed is about 8%. Then, the photosensitive liquid resist ink 5 is exposed by the transmitted ultraviolet rays 6 and the heat generated thereby. The conveyor belt of the UV conveyor machine is made of a material that does not reflect the ultraviolet rays 6, or a sheet or plate made of a material that does not reflect the ultraviolet rays 6 is interposed between the conveyor belt and the mounted substrate 1. That is, when the conveyor belt 7 reflects the ultraviolet rays 6, the reflected light also exposes the photosensitive liquid resist ink 5 applied to the surface of the circuit 3, which does not need to be exposed.
【００１７】露光処理後、温度３０℃の１％無水炭酸ナ
トリウムにより６０秒間現像処理をし、硬化して、図１
（ホ）に示す通り、露光していない回路３表面上の感光
性液状レジストインクを除去する。しかし、この状態で
は、感光性液状レジストインク５に回路３の側面に沿っ
て、数μｍ程度のバリ７が生じる。そのため、バフやベ
ルトサンダー等により、このバリ７を除去して、感光性
液状レジストインク５を平滑にする。After the exposure treatment, a development treatment was carried out for 60 seconds with 1% anhydrous sodium carbonate at a temperature of 30 ° C., followed by curing.
As shown in (e), the photosensitive liquid resist ink on the surface of the unexposed circuit 3 is removed. However, in this state, burrs 7 of about several μm are formed on the photosensitive liquid resist ink 5 along the side surface of the circuit 3. Therefore, the burr 7 is removed by a buff, a belt sander or the like to smooth the photosensitive liquid resist ink 5.
【００１８】バリ７を除去後、感光性液状レジストイン
ク５を温度１５０℃で３０分間加熱して硬化し、図１
（ヘ）に示す通り、平滑で回路３とほぼ同じ厚さのはん
だレジスト層８を形成する。After removing the burr 7, the photosensitive liquid resist ink 5 is heated at a temperature of 150 ° C. for 30 minutes to be cured,
As shown in (f), the solder resist layer 8 which is smooth and has substantially the same thickness as the circuit 3 is formed.
【００１９】この実施例により製造したプリント配線板
９は、回路３の側面にもはんだレジスト層８が密着して
いて、回路３とはんだレジスト層８との間に隙間が無
く、はんだブリッジを防止できる。また、回路３の表面
１０とはんだレジスト層９の表面１１の高さはほぼ同一
であるため、回路３の側面にはんだが付着することな
く、はんだブリッジをより効果的に防止できる。そして
回路３間に段差がないため、ブラシを滑らした場合に、
回路３とブラシが互いに損傷するのを防止できる。In the printed wiring board 9 manufactured according to this embodiment, the solder resist layer 8 is adhered to the side surface of the circuit 3 as well, and there is no gap between the circuit 3 and the solder resist layer 8 to prevent solder bridge. it can. Further, since the surface 10 of the circuit 3 and the surface 11 of the solder resist layer 9 have almost the same height, solder does not adhere to the side surface of the circuit 3 and the solder bridge can be more effectively prevented. And since there is no step between the circuits 3, when sliding the brush,
It is possible to prevent the circuit 3 and the brush from being damaged.
【００２０】また、図２は、請求項１の発明の他の実施
例を示し、図１と同一のものは同一の符号で示してい
る。この実施例では、図２（イ）に示す通り、図１と同
じ片面銅張り積層板の基板１を用いる。FIG. 2 shows another embodiment of the invention of claim 1, and the same parts as those in FIG. 1 are designated by the same reference numerals. In this embodiment, as shown in FIG. 2A, the same single-sided copper-clad laminate board 1 as that shown in FIG. 1 is used.
【００２１】そして、この基板１の銅箔２表面にスクリ
ーン印刷法等によりエッチングレジストを積層し、エッ
チング処理をして、図２（ロ）に示す通り回路３を形成
する。Then, an etching resist is laminated on the surface of the copper foil 2 of the substrate 1 by a screen printing method or the like, and an etching process is performed to form a circuit 3 as shown in FIG.
【００２２】回路３を形成後、図２（ハ）に示す通り、
基板１の表面４にカーテンコータにより、感光性液状レ
ジストインク５を塗布する。塗布後、温度８０℃で２０
分間乾燥し、さらに室温近くまで冷却する。After forming the circuit 3, as shown in FIG.
A photosensitive liquid resist ink 5 is applied to the surface 4 of the substrate 1 with a curtain coater. After coating, the temperature is 80 ° C for 20
Dry for minutes, then cool to near room temperature.
【００２３】冷却後、基板１をＵＶコンベア機に載せ、
図２（ニ）に示す通り、基板１の感光性液状レジストイ
ンク５を塗布した面と反対側から紫外線６を図１の実施
例と同一の条件で照射する。また、感光性液状レジスト
インク５の表面にはネガフィルム１２を被せる。そし
て、両面同時露光機を用いて、反対面側から紫外線６を
照射するのとほぼ同時に、ネガフィルム１２に紫外線１
３を照射し、任意の回路３表面の感光性液状レジストイ
ンク５等を露光する。この紫外線１３は回路３表面の感
光性液状レジストインク５だけを露光すればよく、従っ
て、その露光量は、従来の回路間等の感光性液状レジス
トインクを露光する場合の約３０〜８０％程度低くす
る。なお、ネガフィルム１２を被せこれに紫外線１３を
照射する処理は、反対面側から紫外線６を照射するより
も前あるいは後に行ってもよい。After cooling, the substrate 1 is placed on the UV conveyor machine,
As shown in FIG. 2D, ultraviolet rays 6 are irradiated from the side opposite to the surface of the substrate 1 coated with the photosensitive liquid resist ink 5 under the same conditions as in the embodiment of FIG. The surface of the photosensitive liquid resist ink 5 is covered with a negative film 12. Then, using the double-sided simultaneous exposure machine, the negative film 12 is irradiated with the ultraviolet rays 1 at about the same time as the irradiation of the ultraviolet rays 6 from the opposite surface side.
3 is irradiated to expose the photosensitive liquid resist ink 5 or the like on the surface of an arbitrary circuit 3. The ultraviolet rays 13 need only expose the photosensitive liquid resist ink 5 on the surface of the circuit 3, and therefore the exposure amount is about 30 to 80% of that in the case of exposing the photosensitive liquid resist ink in the conventional circuit. make low. The process of covering the negative film 12 and irradiating it with the ultraviolet ray 13 may be performed before or after irradiating the ultraviolet ray 6 from the opposite surface side.
【００２４】露光処理後、図１と同一条件で現像処理
し、硬化して、図２（ホ）に示す通り、回路３間及び回
路３の一部の表面にははんだレジスト層１４を形成す
る。After the exposure processing, development processing is performed under the same conditions as in FIG. 1 and curing is performed to form a solder resist layer 14 between the circuits 3 and on a part of the surface of the circuit 3 as shown in FIG. .
【００２５】この実施例によって製造したプリント配線
板１５も、回路３とはんだレジスト層１４との間に隙間
が無く、はんだブリッジを防止できる。また、この実施
例では、感光性液状レジストインク５の表面にネガフィ
ルム１２を被せて紫外線１３を照射し露光しているた
め、任意の回路３の表面にもはんだレジスト層１４を形
成できる。そして少なくとも回路３表面の感光性液状レ
ジストインク５だけを露光すればよく、露光量を低くで
きる。さらに、回路３以外の箇所にも紫外線１３を照射
しているため、反対面側から照射する紫外線６と合わせ
て露光でき、その処理時間を短縮できる。Also in the printed wiring board 15 manufactured according to this embodiment, there is no gap between the circuit 3 and the solder resist layer 14, and the solder bridge can be prevented. Further, in this embodiment, since the surface of the photosensitive liquid resist ink 5 is covered with the negative film 12 and irradiated with the ultraviolet rays 13 for exposure, the solder resist layer 14 can be formed on the surface of any circuit 3. Then, at least only the photosensitive liquid resist ink 5 on the surface of the circuit 3 is exposed, and the exposure amount can be reduced. Further, since the ultraviolet rays 13 are also applied to the parts other than the circuit 3, it can be exposed together with the ultraviolet rays 6 applied from the opposite surface side, and the processing time can be shortened.
【００２６】そして図３は、請求項２の発明の実施例を
示す。先ず、図３（イ）に示す通り、基板１６として厚
さ０．８mmで、銅箔１７及び１８の厚さ１８μｍの両面
銅張り積層板（ＭＣＬ−Ｅ−６７ Ｗ，日立化成工業株
式会社商品名）を用いる。FIG. 3 shows an embodiment of the invention of claim 2. First, as shown in FIG. 3A, a double-sided copper-clad laminate (MCL-E-67 W, product of Hitachi Chemical Co., Ltd.) having a thickness of 0.8 mm as a substrate 16 and a copper foil 17 and 18 having a thickness of 18 μm. Name) is used.
【００２７】次に、図３（ロ）に示す通り、基板１６に
孔１９を形成する。Next, as shown in FIG. 3B, holes 19 are formed in the substrate 16.
【００２８】孔１９を形成後、図３（ハ）に示す通り、
電気銅めっき処理及び無電解銅めっき処理をして、銅箔
１７及び１８の表面に厚さ２０μｍの銅めっき層２０及
び２１を形成する。After forming the holes 19, as shown in FIG.
An electrolytic copper plating process and an electroless copper plating process are performed to form copper plating layers 20 and 21 having a thickness of 20 μm on the surfaces of the copper foils 17 and 18.
【００２９】この後、銅めっき層２０及び２１の表面に
エッチングレジストを塗布し、次いでエッチング処理
し、図３（ニ）に示す通り、回路２２及び２３を形成す
る。After this, an etching resist is applied to the surfaces of the copper plating layers 20 and 21, and then an etching treatment is performed to form circuits 22 and 23 as shown in FIG. 3D.
【００３０】回路２２及び２３を形成後、図３（ホ）に
示す通り、基板１６の回路２２側の表面に感光性液状レ
ジストインク２４を塗布する。この際、感光性液状レジ
ストインク２４が孔１９内に入らないように、孔１９の
径よりも大きめのパット付きスクリーンを用いて印刷
し、塗布する。塗布後、温度８０℃で２０分間乾燥し、
さらに、室温付近まで冷却する。After forming the circuits 22 and 23, as shown in FIG. 3E, a photosensitive liquid resist ink 24 is applied to the surface of the substrate 16 on the circuit 22 side. At this time, printing is performed using a screen with a pad having a diameter larger than the diameter of the hole 19 so that the photosensitive liquid resist ink 24 does not enter the hole 19 and is applied. After coating, dry at 80 ℃ for 20 minutes,
Further, it is cooled to near room temperature.
【００３１】冷却後、基板１６をＵＶコンベア機に載
せ、図３（ヘ）に示す通り、基板１６の反対側の回路２
３を形成した面の方から紫外線２５を照射して感光性液
状レジストインク２４を露光する。ＵＶコンベア条件
は、７．５ＫＷメタルハライドランプ３灯で、コンベア
速度５ｍ／min とする。また、感光性液状レジストイン
ク２４の表面にネガフィルム２６を被せる。そしてこの
ネガフィルム２６に紫外線２７を照射し、主として所定
の回路２３上の感光性液状レジストインク２４を露光す
る。なお、この後者の露光処理は前者の同処理と同時で
もよくあるいはその前後でもよい。同時に行なう場合に
は、両面同時露光機を用いる。After cooling, the substrate 16 is placed on the UV conveyor machine, and as shown in FIG.
The photosensitive liquid resist ink 24 is exposed by irradiating ultraviolet rays 25 from the surface on which 3 is formed. The UV conveyor conditions are 7.5 KW metal halide lamps and a conveyor speed of 5 m / min. In addition, the surface of the photosensitive liquid resist ink 24 is covered with the negative film 26. Then, the negative film 26 is irradiated with ultraviolet rays 27 to mainly expose the photosensitive liquid resist ink 24 on a predetermined circuit 23. The latter exposure process may be performed simultaneously with the former process or before or after the same process. When performing simultaneously, a double-sided simultaneous exposure machine is used.
【００３２】露光処理後、図１の実施例と同一の条件で
現像処理し、硬化処理して、図３（ト）に示す通り、基
板１６の回路２２側の表面に第１のはんだレジスト層２
８を形成する。After the exposure process, a development process and a curing process are performed under the same conditions as in the embodiment of FIG. 1, and as shown in FIG. 3G, the first solder resist layer is formed on the surface of the substrate 16 on the circuit 22 side. Two
8 is formed.
【００３３】次に、図３（チ）に示す通り、基板１６の
回路２３側の表面に感光性液状レジストインク２９を感
光性液状レジストインク２４と同一条件で塗布し、乾燥
しそして冷却する。Next, as shown in FIG. 3C, a photosensitive liquid resist ink 29 is applied to the surface of the substrate 16 on the circuit 23 side under the same conditions as the photosensitive liquid resist ink 24, dried and cooled.
【００３４】冷却後、基板１６をＵＶコンベア機に載
せ、図３（リ）に示す通り、基板１６の反対側の回路２
２を形成した面の方から紫外線３０を照射する。この際
のＵＶコンベア条件は、７．５ＫＷメタルハライドラン
プ３灯でコンベア速度４ｍ／minとし、その露光量を感
光性液状レジストインク２４の露光の際の露光量の約
１．２〜５．０倍にする。そしてこの露光処理と同時に
（あるいは前後でもよい）、感光性液状レジストインク
２９の表面にネガフィルム３１を被せて紫外線３２を照
射する。After cooling, the substrate 16 is placed on the UV conveyor machine and, as shown in FIG.
Ultraviolet rays 30 are radiated from the surface on which 2 is formed. The UV conveyer conditions at this time were such that the conveyer speed was 4 m / min with three 7.5 KW metal halide lamps, and the exposure amount was about 1.2 to 5.0 times the exposure amount when the photosensitive liquid resist ink 24 was exposed. To Simultaneously with (or before or after) this exposure process, the surface of the photosensitive liquid resist ink 29 is covered with a negative film 31 and irradiated with ultraviolet rays 32.
【００３５】露光処理後、図１の実施例と同一の条件で
現像し、硬化して、図３（ヌ）に示す通り、基板１６の
回路２３側の表面に第２のはんだレジスト層３３を形成
する。After the exposure process, the film is developed and cured under the same conditions as those in the embodiment of FIG. 1, and a second solder resist layer 33 is formed on the surface of the substrate 16 on the circuit 23 side as shown in FIG. Form.
【００３６】この実施例によって製造したプリント配線
板３４は、回路２２と第１のはんだレジスト層２８との
間及び回路２３と第２のはんだレジスト層３３との間に
隙間が無かった。In the printed wiring board 34 manufactured according to this example, there were no gaps between the circuit 22 and the first solder resist layer 28 and between the circuit 23 and the second solder resist layer 33.
【００３７】なお、上記実施例において、感光性液状レ
ジストインク２４及び２９を基板１６の反対面側から各
々紫外線２５及び３０を照射して露光する際、感光性液
状レジストインク２４及び２９に各々ネガフィルム２６
及び３１を被せて紫外線２７及び３２を照射して露光し
ている。しかし、このネガフィルム２６及び３１を用い
た露光処理は無くてもよく、あるいはどちらか一方を無
くして、例えばネガフィルム２６に紫外線２７を照射す
るだけか、ネガフィルム３１に紫外線３２を照射するだ
けにしてもよい。In the above embodiment, when the photosensitive liquid resist inks 24 and 29 are exposed by irradiating ultraviolet rays 25 and 30 from the opposite surface side of the substrate 16, the photosensitive liquid resist inks 24 and 29 are negatively exposed. Film 26
And 31 are covered and ultraviolet rays 27 and 32 are irradiated to expose. However, the exposure process using the negative films 26 and 31 may be omitted, or either one may be removed and only the negative film 26 is irradiated with the ultraviolet rays 27 or the negative film 31 is irradiated with the ultraviolet rays 32. You may
【００３８】図４には比較のため従来例の製造工程を示
し、図１と同一のものは同一の符号で示す。FIG. 4 shows a conventional manufacturing process for comparison, and the same parts as those in FIG. 1 are designated by the same reference numerals.
【００３９】先ず、基板１は、図４（イ）に示す通り、
図１と同じ片面銅張り積層板を用いる。First, the substrate 1 is, as shown in FIG.
The same single-sided copper-clad laminate as in FIG. 1 is used.
【００４０】次に、基板１の銅箔２表面にエッチングレ
ジストを積層し、エッチング処理をして、図４（ロ）に
示す通り、回路３を形成する。Next, an etching resist is laminated on the surface of the copper foil 2 of the substrate 1 and subjected to etching treatment to form the circuit 3 as shown in FIG.
【００４１】回路３を形成後、図４（ハ）に示す通り、
基板１の表面４にスクリーン印刷法により感光性液状レ
ジストインク５を塗布する。スクリーン条件は、テトロ
ン１３５製でメッシュ２２．５度バイヤスの版を用い、
乳剤３５μｍとし、スキージゴム硬度７０度で印刷す
る。塗布後、温度８０℃で２０分間乾燥し、その後、室
温近くまで冷却する。After forming the circuit 3, as shown in FIG.
A photosensitive liquid resist ink 5 is applied to the surface 4 of the substrate 1 by a screen printing method. The screen conditions are Tetron 135, mesh 22.5 degree bias plate,
Emulsion is 35 μm and printing is performed with a squeegee rubber hardness of 70 degrees. After coating, it is dried at a temperature of 80 ° C. for 20 minutes and then cooled to near room temperature.
【００４２】冷却後、半自動露光機により、図４（ニ）
に示す通り、感光性液状レジストインク５の表面をネガ
フィルム４０で被い、紫外線４１を照射して露光する。
このときの露光量は約３５０〜６００ｍＪ／cm2 とす
る。After cooling, a semi-automatic exposure machine was used to obtain the result shown in FIG.
As shown in (1), the surface of the photosensitive liquid resist ink 5 is covered with the negative film 40, and ultraviolet rays 41 are irradiated to expose it.
The exposure amount at this time is about 350 to 600 mJ / cm 2 .
【００４３】露光処理後、図１の実施例と同一条件で現
像処理し、硬化処理する。これにより、図４（ホ）に示
す通り、所定の部分にはんだレジスト層４２を形成す
る。After the exposure processing, development processing and curing processing are performed under the same conditions as in the embodiment of FIG. As a result, the solder resist layer 42 is formed on a predetermined portion as shown in FIG.
【００４４】この従来例のプリント配線板４３では、結
果的に、回路３とはんだレジスト層４２との間に５０〜
２００μｍの隙間４４ができた。In the conventional printed wiring board 43, as a result, the distance between the circuit 3 and the solder resist layer 42 is 50 to 50.
A gap 44 of 200 μm was formed.
【００４５】[0045]
【発明の効果】以上の通り、本発明の製造方法によれ
ば、回路の形成面に感光性レジストを積層した後、基板
の反対面側から紫外線を照射して感光性レジストを露光
してはんだレジスト層を形成しているため、製造が容易
で、製造コストを低くでき、はんだブリッジを防止でき
るプリント配線板が得られる。As described above, according to the manufacturing method of the present invention, after the photosensitive resist is laminated on the surface on which the circuit is formed, the photosensitive resist is exposed by irradiating ultraviolet rays from the opposite surface side of the substrate to solder. Since the resist layer is formed, it is easy to manufacture, the manufacturing cost can be reduced, and a printed wiring board that can prevent a solder bridge can be obtained.
【図１】請求項１の発明の実施例の工程図を示す。FIG. 1 shows a process chart of an embodiment of the invention of claim 1.
【図２】請求項１の発明の他の実施例の工程図を示す。FIG. 2 is a process drawing of another embodiment of the invention of claim 1;
【図３】請求項２の発明の実施例の工程図を示す。FIG. 3 is a process chart of an embodiment of the invention of claim 2;
【図４】従来例の工程図を示す。FIG. 4 shows a process chart of a conventional example.
１，１６…基板、 ３，２２，２３…回路、５，２４，
２９…感光性液状レジストインク、６，１４，２５，３
０…紫外線、 ８，１４…はんだレジスト層、９，１
５，３４…プリント配線板、 ２８…第１のはんだレジ
スト層、３３…第２のはんだレジスト層。1, 16 ... Substrate, 3, 22, 23 ... Circuit, 5, 24,
29 ... Photosensitive liquid resist ink, 6, 14, 25, 3
0 ... Ultraviolet ray, 8, 14 ... Solder resist layer, 9, 1
5, 34 ... Printed wiring board, 28 ... First solder resist layer, 33 ... Second solder resist layer.
Claims (2)
はんだレジスト層を形成するプリント配線板の製造方法
において、回路の形成面に感光性レジストを積層し、反
対面側から紫外線を照射して露光し、現像してはんだレ
ジスト層を形成することを特徴とするプリント配線板の
製造方法。1. A circuit is formed on at least one side of a substrate,
In a method for manufacturing a printed wiring board for forming a solder resist layer, a photosensitive resist is laminated on a surface on which a circuit is formed, ultraviolet rays are radiated from the opposite surface side for exposure, and development is performed to form a solder resist layer. And a method for manufacturing a printed wiring board.
スト層を形成するプリント配線板の製造方法において、
一方の回路の形成面に感光性レジストを積層し、反対面
側から紫外線を照射して露光し、現像して第１のはんだ
レジスト層を形成し、次に、他方の回路の形成面に感光
性レジストを積層し、反対面側から紫外線を照射して露
光し、現像して第２のはんだレジスト層を形成すること
を特徴とするプリント配線板の製造方法。2. A method for manufacturing a printed wiring board, wherein a circuit is formed on both surfaces of a substrate and a solder resist layer is formed,
A photosensitive resist is laminated on the surface on which one circuit is formed, exposed from the opposite surface to ultraviolet rays, exposed, and developed to form a first solder resist layer, and then on the surface on which the other circuit is formed. A conductive solder is laminated, the ultraviolet ray is irradiated from the opposite surface side to be exposed, and the resist is developed to form a second solder resist layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20007893A JPH0738236A (en) | 1993-07-19 | 1993-07-19 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20007893A JPH0738236A (en) | 1993-07-19 | 1993-07-19 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0738236A true JPH0738236A (en) | 1995-02-07 |
Family
ID=16418491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20007893A Pending JPH0738236A (en) | 1993-07-19 | 1993-07-19 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0738236A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547081A (en) * | 2012-07-10 | 2014-01-29 | 深南电路有限公司 | Ultra-thick copper coil circuit board resistance welding method, system and circuit board |
| CN109152235A (en) * | 2018-10-09 | 2019-01-04 | 珠海杰赛科技有限公司 | A kind of printing method of circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0278295A (en) * | 1988-09-14 | 1990-03-19 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
| JPH04277695A (en) * | 1991-03-06 | 1992-10-02 | Matsushita Electric Ind Co Ltd | Printed wiring board |
| JPH04314385A (en) * | 1991-04-12 | 1992-11-05 | Nec Toyama Ltd | Manufacture of printed wiring board |
| JPH04348590A (en) * | 1991-05-27 | 1992-12-03 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit board |
| JPH04364089A (en) * | 1991-06-11 | 1992-12-16 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
-
1993
- 1993-07-19 JP JP20007893A patent/JPH0738236A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0278295A (en) * | 1988-09-14 | 1990-03-19 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
| JPH04277695A (en) * | 1991-03-06 | 1992-10-02 | Matsushita Electric Ind Co Ltd | Printed wiring board |
| JPH04314385A (en) * | 1991-04-12 | 1992-11-05 | Nec Toyama Ltd | Manufacture of printed wiring board |
| JPH04348590A (en) * | 1991-05-27 | 1992-12-03 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit board |
| JPH04364089A (en) * | 1991-06-11 | 1992-12-16 | Matsushita Electric Ind Co Ltd | Manufacture of printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547081A (en) * | 2012-07-10 | 2014-01-29 | 深南电路有限公司 | Ultra-thick copper coil circuit board resistance welding method, system and circuit board |
| CN109152235A (en) * | 2018-10-09 | 2019-01-04 | 珠海杰赛科技有限公司 | A kind of printing method of circuit board |
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