JP2773494B2 - Optical coupling device - Google Patents
Optical coupling deviceInfo
- Publication number
- JP2773494B2 JP2773494B2 JP29536591A JP29536591A JP2773494B2 JP 2773494 B2 JP2773494 B2 JP 2773494B2 JP 29536591 A JP29536591 A JP 29536591A JP 29536591 A JP29536591 A JP 29536591A JP 2773494 B2 JP2773494 B2 JP 2773494B2
- Authority
- JP
- Japan
- Prior art keywords
- receiving element
- light receiving
- optical coupling
- lead frame
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は光結合素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device.
【０００２】[0002]
【従来の技術】従来の光結合素子は、図３に示すよう
に、リードフレームのアイランド部６にマウントされた
発光ダイオード１と、リードフレームのアイランド部５
にマウントされた受光素子２と、発光ダイオード１と受
光素子２の光導通路の役割を果たす透明シリコン樹脂３
を有している。2. Description of the Related Art As shown in FIG. 3, a conventional optical coupling device includes a light emitting diode 1 mounted on an island portion 6 of a lead frame and an island portion 5 of the lead frame.
Light-receiving element 2 mounted on a transparent silicon resin 3 serving as a light conducting path between light-emitting diode 1 and light-receiving element 2
have.
【０００３】次に動作について、受光素子２に光起電力
ダイオードアレー８を設けた場合の例を図３と図４を参
照して説明する。光結合素子７に入力信号が入ると発光
ダイオード１が発光する。この光は、透明シリコン樹脂
３を通過して受光素子２上にある光起電力ダイオードア
レイ８を照らし、光起電力ダイオードアレイ８において
光起電力を発生し、光結合素子７の出力となる。[0003] Next, the operation of the photodetector 2 in which a photovoltaic diode array 8 is provided will be described with reference to FIGS. 3 and 4. When an input signal enters the optical coupling element 7, the light emitting diode 1 emits light. This light passes through the transparent silicon resin 3 and illuminates the photovoltaic diode array 8 on the light receiving element 2, generates photovoltaic power in the photovoltaic diode array 8, and becomes the output of the optical coupling element 7.
【０００４】ここで、この光結合素子７の出力である光
起電力を増加させる為には発光ダイオード１の光が受光
素子２上の光起電力ダイオードアレイ８により多く入射
する必要があり、また部分的に光の弱い所があると、そ
れによって効率が制限されていた。その為に、従来にお
いては、図３，図４に示す様に受光素子２をマウントす
るリードフレームのアイランド部５を受光素子２に対し
て充分広い面積になる様にし、受光素子全体を透明シリ
コン樹脂３でポッティングし光導通路の幅を広げてい
た。Here, in order to increase the photovoltaic power which is the output of the optical coupling element 7, more light from the light emitting diode 1 needs to be incident on the photovoltaic diode array 8 on the light receiving element 2; In some places, where light was weak, efficiency was limited thereby. Therefore, conventionally, as shown in FIGS. 3 and 4, the island portion 5 of the lead frame for mounting the light receiving element 2 is made to have a sufficiently large area with respect to the light receiving element 2, and the entire light receiving element is made of transparent silicon. The width of the light conducting path was widened by potting with resin 3.
【０００５】又、受光素子２のチップ外周部において透
明シリコン樹脂３の付着量が小なく、発光ダイオード１
の光が入射しずらいことから、図５に示すように、受光
素子５の外周に行くに従って、光起電力ダイオード１４
の面積を広くする事により、光起電流の発生量を増加さ
せたりしていた。Further, the amount of the transparent silicon resin 3 adhered to the periphery of the chip of the light receiving element 2 is not small,
5 is hard to be incident, and as shown in FIG.
By increasing the area of the photovoltaic device, the amount of photocurrent generated has been increased.
【０００６】[0006]
【発明が解決しようとする課題】従来の光結合素子で
は、光起電力をより多く発生させるために発光ダイオー
ドと受光素子の光結合の効率向上を図り、受光素子をマ
ウントしているリードフレームのアイランド部の面積を
広くし透明シリコン樹脂のポッティング量を増すことに
より光導通路の幅を広げていたが、透明シリコン樹脂の
量及び粘度により光導通路の形状が変動する為に、光結
合効率が不安定になってしまうという問題点があった。
また、受光素子のチップ外周部においては、透明シリコ
ン樹脂の付着量が小なく、光が弱くなるため光起電力ダ
イオードの面積を大きくしなければならずその為任意の
光起電圧、光起電流を得る為には、受光素子を大きくし
なけらばならないという問題点もあった。In a conventional optical coupling element, the efficiency of optical coupling between a light emitting diode and a light receiving element is improved in order to generate more photovoltaic power, and a lead frame mounting the light receiving element is required. Although the width of the light conducting path was widened by increasing the area of the island portion and increasing the potting amount of the transparent silicon resin, the optical coupling efficiency was not improved because the shape of the light conducting path fluctuated due to the amount and viscosity of the transparent silicon resin. There was a problem that it became stable.
In addition, since the amount of the transparent silicon resin adhered to the outer periphery of the chip of the light receiving element is small and the light is weak, the area of the photovoltaic diode must be increased. In order to obtain the above, there is a problem that the light receiving element must be enlarged.
【０００７】[0007]
【課題を解決するための手段】本発明の光結合素子は、
受光素子をマウントしているリードフレームに、透明シ
リコン樹脂を保持するストップ部を受光素子の周囲を囲
むように形成し構成になっている。The optical coupling device of the present invention comprises:
A stop portion for holding the transparent silicon resin is formed on a lead frame on which the light receiving element is mounted so as to surround the periphery of the light receiving element.
【０００８】[0008]
【作用】ストッパ部により透明シリコン樹脂の量及び粘
度による形状のばらつきが低減できる。The variation in shape due to the amount and viscosity of the transparent silicone resin can be reduced by the stopper.
【０００９】また、ストッパ部により透明シリコン樹脂
の付着量のコントロールが容易になり、光起電力ダイオ
ードアレイに効率より、より均等に、光を導くことがで
き、特性のバラツキを減少できる。Further, the stopper makes it easy to control the amount of the transparent silicon resin adhered, and can guide the light more evenly to the photovoltaic diode array than the efficiency, thereby reducing the variation in characteristics.
【００１０】[0010]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例の光結合素子７の断面図
で、図２は本発明の一実施例の光結合素子の受光素子を
マウントしたリードフレームの外観図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of an optical coupling element 7 according to one embodiment of the present invention, and FIG. 2 is an external view of a lead frame on which a light receiving element of the optical coupling element according to one embodiment of the present invention is mounted.
【００１１】受光素子２を取り囲む様にして形成された
ストッパ部４を有し、且つ受光素子２のチップ厚よりも
段差が小さくなる様に折り曲げ加工されたリードフレー
ムのアイラド部５の上に受光素子２がマウントされてお
る。リードフレームのアイランド部６の上にマウントさ
れた発光ダイオード１は受光素子２と対向する様に配置
され、透明シリコン樹脂３によって受光素子２に光結合
されている。透明シリコン樹脂３は、リードフレームの
ストッパ部４により形状がコントロールされ受光素子２
上の光起電力ダイオードアレイ８上に均等に付着してい
る。A light receiving element is provided on an Irad portion 5 of a lead frame which has a stopper portion 4 formed so as to surround the light receiving element 2 and is bent so as to have a step smaller than the chip thickness of the light receiving element 2. Element 2 is mounted. The light emitting diode 1 mounted on the island portion 6 of the lead frame is disposed so as to face the light receiving element 2, and is optically coupled to the light receiving element 2 by the transparent silicon resin 3. The shape of the transparent silicon resin 3 is controlled by the stopper 4 of the lead frame, and the light receiving element 2
It is evenly attached on the upper photovoltaic diode array 8.
【００１２】なお、図２中、９，１０は光起電力ダイオ
ードアレイ出力パッド、１１，１２はボンディングワイ
ヤ、１３はリードフレームアイランド部である。In FIG. 2, reference numerals 9 and 10 denote photovoltaic diode array output pads, 11 and 12 denote bonding wires, and 13 denotes a lead frame island portion.
【００１３】[0013]
【発明の効果】以上説明したように本発明は受光素子を
マウントするリードフレームにストッパ部を形成したの
で、光起電力ダイオードアレイ上において透明シリコン
樹脂の付着量の小ない部分が形成されず、光起電力ダイ
オードアレイ全体に発光ダイオードの光が照射され、全
体として光効率が向上し特性改善の効果がある。As described above, according to the present invention, since the stopper is formed on the lead frame on which the light receiving element is mounted, a portion with a small amount of the transparent silicon resin adhered is not formed on the photovoltaic diode array. The light of the light emitting diode is irradiated onto the entire photovoltaic diode array, thereby improving the light efficiency as a whole and improving the characteristics.
【００１４】又、リードフレームのストッパ部により透
明シリコン樹脂の量や粘度による光導通路の形状が均一
化され光結合素子の製造バラツキが減少し、歩留りの向
上の効果もある。Further, the stopper portion of the lead frame makes the shape of the light conducting path uniform due to the amount and viscosity of the transparent silicon resin, thereby reducing the manufacturing variation of the optical coupling element and improving the yield.
【００１５】又、リードフレームのストッパ部により、
透明シリコン樹脂が受光素子をマウントしているリード
フレームの裏面に周り込まないので光結合素子の耐熱性
が向上するという効果もある。Also, the stopper portion of the lead frame
Since the transparent silicon resin does not go around the back surface of the lead frame on which the light receiving element is mounted, there is also an effect that the heat resistance of the optical coupling element is improved.
【図１】本発明の一実施例である光結合素子の断面図。FIG. 1 is a sectional view of an optical coupling element according to an embodiment of the present invention.
【図２】図１に示した光結合素子の受光素子とそれをマ
ウントするリードフレームの外観図。FIG. 2 is an external view of a light receiving element of the optical coupling element shown in FIG. 1 and a lead frame on which the light receiving element is mounted.
【図３】従来の光結合素子の断面図。FIG. 3 is a cross-sectional view of a conventional optical coupling element.
【図４】従来の光結合素子の受光素子とそれをマウント
するリードフレームの外観図。FIG. 4 is an external view of a light receiving element of a conventional optical coupling element and a lead frame for mounting the same.
【図５】従来の光結合素子のレイアウト図である。FIG. 5 is a layout diagram of a conventional optical coupling element.
１ 発光ダイオード ２ 受光素子 ３ 透明シリコン樹脂 ４ リードフレームストッパ部 ５，６ リードフレームアイランド部 ７ 光結合素子 ８ 光起電力ダイオードアレイ ９，１０ 光起電力ダイオードアレイ出力パッド １１，１２ ボンディングワイヤ １３ リードフレームアイランド部 １４ 光起電力ダイオード DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Light receiving element 3 Transparent silicon resin 4 Lead frame stopper part 5, 6 Lead frame island part 7 Optical coupling element 8 Photovoltaic diode array 9, 10 Photovoltaic diode array output pad 11, 12 Bonding wire 13 Lead frame Island part 14 Photovoltaic diode
Claims (1)
た発光ダイオードと、リードフレームのアイランド部に
載置した受光素子とを対向配置し、前記発光ダイオード
と前記受光素子を透明シリコン樹脂で光結合した光結合
素子において、前記透明シリコン樹脂の形状を保持する
環状のストッパ部を、前記受光素子の周囲を囲むように
して、前記受光素子をマウントするリードフレームに一
体に、且つ、前記アイランド部と異なる平面上に形成し
たことを特徴とする光結合素子。1. A light emitting diode mounted on an island part of a lead frame and a light receiving element mounted on an island part of the lead frame are arranged to face each other, and the light emitting diode and the light receiving element are optically coupled with a transparent silicon resin. In the optical coupling element, the shape of the transparent silicon resin is maintained.
An annular stopper so as to surround the periphery of the light receiving element.
To the lead frame on which the light receiving element is mounted.
An optical coupling element formed on a body and on a plane different from the island portion .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29536591A JP2773494B2 (en) | 1991-11-12 | 1991-11-12 | Optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29536591A JP2773494B2 (en) | 1991-11-12 | 1991-11-12 | Optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05206505A JPH05206505A (en) | 1993-08-13 |
| JP2773494B2 true JP2773494B2 (en) | 1998-07-09 |
Family
ID=17819685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29536591A Expired - Fee Related JP2773494B2 (en) | 1991-11-12 | 1991-11-12 | Optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2773494B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04111765U (en) * | 1991-03-18 | 1992-09-29 | 鹿児島日本電気株式会社 | Lead frame for optical coupler |
-
1991
- 1991-11-12 JP JP29536591A patent/JP2773494B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05206505A (en) | 1993-08-13 |
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| Date | Code | Title | Description |
|---|---|---|---|
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Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980324 |
|
| R250 | Receipt of annual fees |
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|
| R250 | Receipt of annual fees |
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| LAPS | Cancellation because of no payment of annual fees |