JP2762858B2 - Microwave IC - Google Patents
Microwave ICInfo
- Publication number
- JP2762858B2 JP2762858B2 JP21587292A JP21587292A JP2762858B2 JP 2762858 B2 JP2762858 B2 JP 2762858B2 JP 21587292 A JP21587292 A JP 21587292A JP 21587292 A JP21587292 A JP 21587292A JP 2762858 B2 JP2762858 B2 JP 2762858B2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- capacitor
- pad
- mmic
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Waveguide Connection Structure (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、マイクロ波ICに関
し、特にミリ波帯などで使用されるマイクロ波ICにお
けるモノリシックマイクロ波ICのDCインターフェー
スに用いる配線方法を改良したマイクロ波ICに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave IC, and more particularly to a microwave IC having an improved wiring method used for a DC interface of a monolithic microwave IC in a microwave IC used in a millimeter wave band or the like.
【0002】[0002]
【従来の技術】従来のマイクロ波ICは図2に示すよう
に、マイクロ波IC6で使用するモノリシックマイクロ
波IC(以下MMICという)3のDCインターフェー
スはDCパッド4からMMIC3の近傍に配置されたコ
ンデンサ2へワイヤ5で結ばれ、そこからMMIC自体
の端子(図示せず)へとつながれている。この場合にM
MIC3の高さh1とコンデンサh3は同じ高さであっ
た。2. Description of the Related Art As shown in FIG. 2, a conventional microwave IC has a DC interface of a monolithic microwave IC (hereinafter referred to as "MMIC") 3 used in a microwave IC 6, and a capacitor arranged between a DC pad 4 and the vicinity of the MMIC 3. 2 is connected by a wire 5 to a terminal (not shown) of the MMIC itself. In this case M
The height h1 of the MIC3 and the capacitor h3 were the same.
【0003】[0003]
【発明が解決しようとする課題】この従来のMMICの
パッドから直接コンデンサにワイヤでつなぐ方法ではM
MIC上のDCパッドの位置とコンデンサの配置の自由
度が小さく、かつ、前述の高さh1とh3が同一の高さ
なので、コンデンサ等の配置によってはどうしてもワイ
ヤが長くなりスペースをとってしまうなどの欠点があっ
た。特にミリ波帯等の高周波で使用するマイクロ波IC
では、パッケージの大きさでカットオフ周波数特性が決
定されるので、ワイヤを出来るだけ短くすることは、省
スペース化をはかることとともに重要な課題である。In the conventional method of connecting a wire directly from a pad of an MMIC to a capacitor, M
Since the position of the DC pad on the MIC and the degree of freedom of the arrangement of the capacitor are small, and the heights h1 and h3 are the same, the wires are inevitably long depending on the arrangement of the capacitor and the like, and the space is taken up. There were drawbacks. In particular, microwave ICs used at high frequencies such as the millimeter wave band
Then, since the cut-off frequency characteristic is determined by the size of the package, shortening the wire as much as possible is an important issue as well as saving space.
【0004】[0004]
【課題を解決するための手段】本発明のマイクロ波IC
はモノリシックマイクロ波IC用のDCインターフェー
スとなるDCパッドとマイクロ波IC本体上のコンデン
サとの間の接続において、前記コンデンサの高さを前記
モノリシックマイクロ波ICの高さよりわずかに高く
し、平板上の端子と短いワイヤでコンデンサとDCパッ
ドとの間を接続する。SUMMARY OF THE INVENTION A microwave IC according to the present invention.
In the connection between the DC pad serving as the DC interface for the monolithic microwave IC and the capacitor on the microwave IC body, the height of the capacitor is slightly higher than the height of the monolithic microwave IC, and Connect between the capacitor and the DC pad with a terminal and a short wire.
【0005】[0005]
【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例の斜視図である。図1に示
すように、コンデンサ2の高さh2はMMIC3の高さ
h1より高くし、平板状の端子1をMMIC3のDCパ
ッド4とコンデンサ2との間を接続しやすい位置にくる
ように、かつ、最短距離で取り付ける。したがってMM
IC3の中央部にDCパッド4が配置されていても、短
いワイヤ5で接続でき、またコンデンサ2も従来より自
由な位置に配置できる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of one embodiment of the present invention. As shown in FIG. 1, the height h2 of the capacitor 2 is higher than the height h1 of the MMIC 3, and the flat terminal 1 is located at a position where it is easy to connect between the DC pad 4 of the MMIC 3 and the capacitor 2. And install it at the shortest distance. Therefore MM
Even if the DC pad 4 is arranged at the center of the IC 3, it can be connected with the short wire 5, and the capacitor 2 can be arranged at a more free position than before.
【0006】[0006]
【発明の効果】以上説明したように本発明は、MMIC
より高さの高いコンデンサに端子を取り付けることによ
り、MMICのDCパッドとの接続を容易にすることに
より、省スペースと高周波特性を良好にできる効果があ
る。また、MMICのパッド及びコンデンサの配置の自
由度を大きくするという効果も有する。As described above, the present invention provides an MMIC.
Attachment of the terminal to a taller capacitor facilitates connection with the DC pad of the MMIC, which has the effect of saving space and improving high-frequency characteristics. Also, there is an effect that the degree of freedom of arrangement of pads and capacitors of the MMIC is increased.
【図1】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of one embodiment of the present invention.
【図2】従来のマイクロ波ICの斜視図である。FIG. 2 is a perspective view of a conventional microwave IC.
1 端子 2 コンデンサ 3 モノリシックマイクロ波IC(MMIC) 4 DCパッド 5 ワイヤ 6 マイクロ波IC 1 Terminal 2 Capacitor 3 Monolithic Microwave IC (MMIC) 4 DC Pad 5 Wire 6 Microwave IC
Claims (1)
ンターフェースとなるDCパッドとマイクロ波IC本体
上のコンデンサとの間の接続において、前記コンデンサ
の高さを前記モノリシックマイクロ波ICの高さよりわ
ずかに高くし、平板上の端子と短いワイヤでコンデンサ
とDCパッドとの間を接続することを特徴とするマイク
ロ波IC。In a connection between a DC pad serving as a DC interface for a monolithic microwave IC and a capacitor on a microwave IC body, the height of the capacitor is made slightly higher than the height of the monolithic microwave IC. A microwave IC wherein a terminal on a flat plate and a short wire connect between a capacitor and a DC pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21587292A JP2762858B2 (en) | 1992-08-13 | 1992-08-13 | Microwave IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21587292A JP2762858B2 (en) | 1992-08-13 | 1992-08-13 | Microwave IC |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0669413A JPH0669413A (en) | 1994-03-11 |
JP2762858B2 true JP2762858B2 (en) | 1998-06-04 |
Family
ID=16679663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21587292A Expired - Lifetime JP2762858B2 (en) | 1992-08-13 | 1992-08-13 | Microwave IC |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2762858B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10303467A (en) * | 1997-04-28 | 1998-11-13 | Rohm Co Ltd | Multichip module |
-
1992
- 1992-08-13 JP JP21587292A patent/JP2762858B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0669413A (en) | 1994-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6087720A (en) | Integrated circuit package electrical enhancement | |
JPS61117858A (en) | Semiconductor device | |
JP2762858B2 (en) | Microwave IC | |
JP2728322B2 (en) | Semiconductor device | |
JP2520511B2 (en) | High frequency semiconductor device | |
US5161000A (en) | High-frequency thick-film semiconductor circuit | |
JPH09213868A (en) | Lead frame for microwave semiconductor integrated circuit | |
JP2506783Y2 (en) | Semiconductor device | |
JP2604506B2 (en) | Container for semiconductor device | |
JPS6233326Y2 (en) | ||
JPH01143502A (en) | Microwave integrated circuit | |
JPH05211279A (en) | Hybrid integrated circuit | |
JP3494550B2 (en) | Semiconductor device | |
JPH0621319A (en) | Lead frame for semiconductor device | |
JPS6399566A (en) | Hybrid integrated circuit characterized by high frequency and high output power | |
JP2933793B2 (en) | Multi-chip module | |
JPH0243761A (en) | Microwave monolithic integrated circuit device | |
JPS63174342A (en) | Envelope for high-frequency semiconductor | |
JPH06169047A (en) | Semiconductor device | |
JPH0652156U (en) | High frequency IC lead frame | |
JPS5840339B2 (en) | high frequency transistor | |
JP2001127096A (en) | Semiconductor device and its manufacturing method | |
JPH01108745A (en) | Semiconductor device | |
JPH04109659A (en) | Package for semiconductor device | |
JPS59132149A (en) | Ultrahigh frequency transistor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980224 |