JP2754790B2 - Flexible printed circuit board and method of manufacturing the same - Google Patents
Flexible printed circuit board and method of manufacturing the sameInfo
- Publication number
- JP2754790B2 JP2754790B2 JP1264371A JP26437189A JP2754790B2 JP 2754790 B2 JP2754790 B2 JP 2754790B2 JP 1264371 A JP1264371 A JP 1264371A JP 26437189 A JP26437189 A JP 26437189A JP 2754790 B2 JP2754790 B2 JP 2754790B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- circuit board
- printed circuit
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、ビデオ・テレビなどの各種映像・音響残器
やコンピュータ・ワープロ・電話などの情報通信機器に
設けられるプリント配線基板に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board provided in various kinds of video / sound remnants such as video televisions and information communication equipment such as computers, word processors and telephones.
従来の技術 近年、電子機器の小型軽量化，多機能，高性能化が著
しく進みなかでも、小型軽量化については、機器のパー
ソナル化，ハンディ化にともなって、その要求は富にそ
の度合いを増している。とりわけ電子機器の主構成要素
であるプリント配線基板については、多層配線化，薄型
化が進み、昨今では、フレキシブルプリント配線基板の
多用化が図られ、電子機器の小型軽量化に寄与してい
る。2. Description of the Related Art In recent years, as electronic devices have been significantly reduced in size and weight, multi-function, and high performance, demands for the reduction in size and weight have increased with the personalization and handyness of devices. ing. In particular, printed wiring boards, which are the main components of electronic equipment, have been increasingly multi-layered and thinner. Recently, the use of flexible printed wiring boards has been increased, contributing to the reduction in size and weight of electronic equipment.
従来のフレキシブルプリント配線基板１の基本構造は
第４図で示すように、ポリイミドやポリエステルなどの
フィルム基板２の上に接着用樹脂を用いて銅などの導体
箔を接着させ、エッチングによって、回路導体３を形成
して得られる。この後、第５図，第６図に示すようにこ
れらフレキシブルプリント配線基板１の上に電子部品12
を装着し、半田付けを経てフレキシブルプリント回路基
板13となり、その可撓性を利用して最終的には屈曲構造
をなして、電子機器に組み込まれる。As shown in FIG. 4, the basic structure of a conventional flexible printed wiring board 1 is such that a conductive foil such as copper is adhered to a film substrate 2 such as polyimide or polyester using an adhesive resin, and the circuit conductor is etched. 3 is obtained. Thereafter, as shown in FIG. 5 and FIG.
Is mounted and soldered to form a flexible printed circuit board 13. By utilizing the flexibility, the flexible printed circuit board 13 is finally formed into a bent structure and incorporated into an electronic device.
発明が解決しようとする課題 上記のフレキシブルプリント配線基板は、基材が可撓
性のあるフィルム状のものであることから、外部応力に
対して極めて不安定で形状保持力が極端に弱い。したが
って回路基板とするための実装作業を行なう場合、例え
ば半田ペースト印刷時のスキージによる加圧応力，電子
部品装着時のマウント機ノズルによる押圧応力，半田付
け時の熱応力等によって容易に形状変化をきたし、現実
的には、上記工程が手作業やパレット治具に依存する状
態となっており、結果として量産性，信頼性に欠けるも
のとなっている。PROBLEM TO BE SOLVED BY THE INVENTION The above-mentioned flexible printed wiring board is extremely unstable to external stress and extremely weak in shape retention force since the base material is a flexible film. Therefore, when performing a mounting operation for forming a circuit board, the shape changes easily due to, for example, a pressing stress due to a squeegee when printing solder paste, a pressing stress due to a mounting machine nozzle when mounting electronic components, and a thermal stress during soldering. However, in reality, the above process depends on manual work and pallet jigs, and as a result, lacks mass productivity and reliability.
課題を解決するための手段 本発明は、上記問題点を解決するためフィルム配線基
板と切断用加工孔とを有する硬質性の補強基材とを局部
的に貼り合わせて構成し、貼り合わせた部分を残して切
断するものである。Means for Solving the Problems The present invention solves the above problems by locally bonding a film wiring board and a hard reinforcing substrate having a processing hole for cutting, and forming a bonded portion. Is cut off.
作用 これら、フレキシブルプリント配線基板と切断用加工
孔とを有する硬質性の基材とを局部的に貼り合わせて構
成することにより、フィルム配線基板の形状保持力の不
足を硬質性基材が補うこととなり、製造時において実際
上硬質性のプリント配線基板と同様の取り扱いが可能と
なる。そして最終的には大部分の硬質性基材を切り離し
て用いることから、実質的にフレキシブル回路基板と同
様に可撓性を生かした実装ができる。The rigid base material compensates for the lack of the shape retention force of the film wiring board by locally bonding the flexible printed wiring board and the hard base material having the processing hole for cutting. Thus, at the time of manufacturing, the same handling as that of a hard printed wiring board is possible. Finally, since most of the hard base material is cut off and used, mounting can be performed utilizing flexibility substantially like a flexible circuit board.
実施例 以下、本発明の一実施例を図面にもとづいて説明す
る。第１図において、１はポリイミドやポリエステル素
材などからなるフレキシブルプリント配線基板であり、
その上に接着用樹脂を用いて銅などの金属箔を接着し、
エッチング等により回路導体３が形成されている。一
方、４はガラスエポキシやアルミニウムなどの硬質性を
有する基材であり、その所定の位置には、ミシン目状加
工孔５によって囲まれた固着部位６が複数ケ所に形成さ
れている。７はフレキシブルプリント配線板の対向面を
実質的に強化する補強部位である。上記フレキシブルプ
リント配線基板１を硬質性基材４上に形成されている固
着部位６とを接着剤９を介して貼り合わせ、本実施例の
硬質型フレキシブルプリント配線基板10を得る。Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, reference numeral 1 denotes a flexible printed circuit board made of a polyimide or polyester material,
Adhere a metal foil such as copper on it using an adhesive resin,
The circuit conductor 3 is formed by etching or the like. On the other hand, reference numeral 4 denotes a hard base material such as glass epoxy or aluminum, and a plurality of fixing portions 6 surrounded by perforated holes 5 are formed at predetermined positions. Reference numeral 7 denotes a reinforcing portion for substantially strengthening the facing surface of the flexible printed wiring board. The flexible printed wiring board 1 is bonded to the fixing portion 6 formed on the hard base material 4 with an adhesive 9 to obtain the rigid flexible printed wiring board 10 of this embodiment.
この硬質型フレキシブルプリント配線基板10に対し、
スクリーン印刷法などによって半田ペースト11を供給
し、第２図に示すようにその上に電子部品12を装着す
る。この時、半田ペースト11のスクリーン印刷時にはス
キージによる加圧応力が、電子部品12の装着時にはマウ
ント機のノズルの押圧応力がそれぞれ硬質型フレキシブ
ルプリント配線板10に加わるが、その下には硬質性基材
４の補強部位７や支持部位８が存在し、上記外部応力を
吸収緩和する。その次に、上記硬質型フレキシブルプリ
ント配線基板10を加熱し、半田ペースト11を溶融させ、
電子部品12と回路導体３を半田接続する。この場合は、
硬質型フレキシブルプリント配線基板10に対し、熱応力
が加わることとなるが、硬質性基材４の補強部位７や支
持部位８の安定効果によって、反りや捻れの発生を抑生
し均質な半田付け状態を維持することとなる。また硬質
型フレキシブルプリント配線板10の移載時には支持部位
８を利用して吸着や挟持動作を行うことから、これも、
硬質型フレキシブルプリント配線板10に損傷を与えな
い。For this rigid type flexible printed wiring board 10,
The solder paste 11 is supplied by a screen printing method or the like, and the electronic component 12 is mounted thereon as shown in FIG. At this time, when the solder paste 11 is screen-printed, the squeegee pressurizing stress is applied to the hard type flexible printed wiring board 10 when the electronic component 12 is mounted, and the pressing stress of the nozzle of the mounting machine is applied to the hard type flexible printed wiring board 10. The reinforcing portion 7 and the supporting portion 8 of the material 4 exist to absorb and reduce the external stress. Next, the above-mentioned hard type flexible printed wiring board 10 is heated to melt the solder paste 11,
The electronic component 12 and the circuit conductor 3 are connected by soldering. in this case,
Thermal stress is applied to the rigid type flexible printed wiring board 10. However, due to the stabilizing effect of the reinforcing portion 7 and the supporting portion 8 of the hard base material 4, the occurrence of warpage and twisting is suppressed and uniform soldering is performed. State will be maintained. Also, when the rigid flexible printed wiring board 10 is transferred, the suction and the clamping operation are performed by using the support portion 8.
The hard type flexible printed wiring board 10 is not damaged.
最後に、半田付けを完了した後の硬質型フレキシブル
プリント配線基板10の硬質性基材４内に設けられたミシ
ン目状加工孔５によって囲まれた固着部位６を切断し硬
質性基材の補強部位７と支持部位８を切り離すことによ
って第３図に示すようなフレキシブルプリント回路基板
14を得ることとなる。このフレキシブルプリント回路基
板14には切断された固着部位６が付着しているが、その
面積は小さいものであるため、可撓性は従来のものと同
等であり実装上支障を来たすことはない。また固着部位
６を、フレキシブルプリント配線基板１の角部に位置さ
せて設けることより、実装時にフレキシブルプリント回
路基板10の角が傷むことが少なくなり、また角部以外に
も必要な所に固着部位６を設けることにより、本体シャ
ーシ等との位置決め（例えば本体シャーシに対応する凹
部を設けておき、両者を嵌合させる）にも利用できるな
ど実用上の効果も大きいものである。Lastly, after the soldering is completed, the fixing portion 6 surrounded by the perforated holes 5 provided in the hard base material 4 of the hard flexible printed wiring board 10 is cut to reinforce the hard base material. The flexible printed circuit board as shown in FIG.
You will get 14. Although the cut fixing portion 6 is adhered to the flexible printed circuit board 14, its area is small, so that its flexibility is equal to that of the conventional one, and there is no trouble in mounting. Further, since the fixing portion 6 is provided at the corner of the flexible printed circuit board 1, the corner of the flexible printed circuit board 10 is less likely to be damaged at the time of mounting. The provision of 6 has a great practical effect, such as being able to be used for positioning with the main body chassis or the like (for example, providing a concave portion corresponding to the main body chassis and fitting them together).
発明の効果 本発明によるフレキシブルプリント回路基板の製造方
法は、硬質性基材の安定効果によって製造工程での外部
応力を吸収緩和することにより、高生産性，高信頼性を
達成することが可能となり、工業上極めて有用である。
さらに、本発明によって得られるフレキシブルプリント
回路基板は、フレキシブル配線基板の一方の面の一部に
硬質性基材を貼り合わせていることにより、可撓性を阻
害することなく補強するものである。EFFECT OF THE INVENTION The method for manufacturing a flexible printed circuit board according to the present invention makes it possible to achieve high productivity and high reliability by absorbing and relaxing external stress in the manufacturing process by the stabilizing effect of the hard base material. It is extremely useful industrially.
Further, the flexible printed circuit board obtained according to the present invention reinforces the flexible printed circuit board without impairing flexibility by bonding a hard base material to a part of one surface of the flexible wiring board.
第１図は本発明の一実施例における硬質型フレキシブル
プリント配線基板の構成を示す斜視図、第２図は硬質型
フレキシブルプリント配線基板を電子部品を装着し半田
付けする工程を示す斜視図、第３図は硬質型フレキシブ
ルプリント配線基板を用いてできるフレキシブル回路基
板の構造を示す斜視図、第４図は従来のフレキシブルプ
リント配線基板の基本構造を示す斜視図、第５図は上記
基板に電子部品を装着し半田付けをする従来の工程を示
す斜視図、第６図は半田付けを経て得られる従来のフレ
キシブルプリント回路基板の構造を示す斜視図である。 １……フレキシブルプリント配線基板、２……可撓性基
材、３……回路導体、４……硬質性基材、５……ミシン
目状加工孔、６……固着部位、７……補強部位、８……
支持部位、９……接着剤、10……硬質型フレキシブルプ
リント配線基板、11……半田ペースト、12……電子部
品、14……フレキシブルプリント回路基板。FIG. 1 is a perspective view showing a configuration of a rigid flexible printed wiring board in one embodiment of the present invention, FIG. 2 is a perspective view showing a step of mounting and soldering electronic components on the rigid flexible printed wiring board, 3 is a perspective view showing the structure of a flexible circuit board formed using a rigid flexible printed circuit board, FIG. 4 is a perspective view showing the basic structure of a conventional flexible printed circuit board, and FIG. FIG. 6 is a perspective view showing a conventional process of mounting and soldering, and FIG. 6 is a perspective view showing a structure of a conventional flexible printed circuit board obtained through soldering. DESCRIPTION OF SYMBOLS 1 ... Flexible printed wiring board, 2 ... Flexible base material, 3 ... Circuit conductor, 4 ... Hard base material, 5 ... Perforated processing hole, 6 ... Fixed part, 7 ... Reinforcement Part, 8 ...
Supporting part, 9 ... Adhesive, 10 ... Hard type flexible printed circuit board, 11 ... Solder paste, 12 ... Electronic component, 14 ... Flexible printed circuit board.
Claims (2)
た固着部位を有する硬質性基材と回路導体を備えた可撓
性のあるフレキシブルプリント配線基板とを前記固着部
位で部分的に貼り合わせて硬質型フレキシブルプリント
配線基板とする工程、上記硬質型フレキシブルプリント
配線に電子部品を装着し半田付けをする工程、上記固着
部位を切り離してフレキシブルプリント回路基板とする
工程とからなることを特徴としたフレキシブルプリント
回路基板の製造方法。1. A rigid base material having a fixing portion surrounded by perforated holes for cutting and a flexible flexible printed wiring board provided with a circuit conductor are partially attached at the fixing portion. Combined with a step of forming a rigid-type flexible printed circuit board, mounting electronic components on the rigid-type flexible printed circuit and soldering, and separating the fixed portion into a flexible printed circuit board. Of manufacturing a flexible printed circuit board.
の、請求項１の製造方法で製造されたフレキシブルプリ
ント回路基板。2. A flexible printed circuit board manufactured by the manufacturing method according to claim 1, wherein the separated fixing portion remains attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1264371A JP2754790B2 (en) | 1989-10-11 | 1989-10-11 | Flexible printed circuit board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1264371A JP2754790B2 (en) | 1989-10-11 | 1989-10-11 | Flexible printed circuit board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126286A JPH03126286A (en) | 1991-05-29 |
| JP2754790B2 true JP2754790B2 (en) | 1998-05-20 |
Family
ID=17402225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1264371A Expired - Fee Related JP2754790B2 (en) | 1989-10-11 | 1989-10-11 | Flexible printed circuit board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2754790B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6024919A (en) * | 1983-07-20 | 1985-02-07 | Shinden Kogyo Kk | Lining method of helmet |
| JPS6413759U (en) * | 1987-07-15 | 1989-01-24 |
-
1989
- 1989-10-11 JP JP1264371A patent/JP2754790B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03126286A (en) | 1991-05-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |