JP2732355B2 - Manufacturing method of high strength and high conductivity copper alloy material for electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a transistor or an integrated circuit (IC), which is suitable for use as a lead material and has excellent etching properties and bending in addition to high strength and electric conductivity. The present invention relates to a method for producing a high-strength and high-conductivity copper alloy material for electronic equipment having a property.

[0002]

2. Description of the Related Art In recent years, the trend of IC packages has been symbolized by "miniaturization and lightness". Recently, however, the trend has been further promoted by the spread of surface packages.
At the same time, the increase in the number of pins and the reduction in heat generation accompanying the enhancement of the functions of the chip are also progressing. On the other hand, looking at a specific transition process relating to the form of an IC package, a pin insertion type package represented by DIP has been frequently used in the past. Becomes more mainstream, SOJ, S
The shift to surface mount types such as OP and QFP is progressing. Recently, fine pitch QFPs, in which the lead pitch has been reduced, have increased with the increase in the number of pins.
Thinning such as QFP is progressing.

[0003] By the way, most of the multi-pin, narrow-pitch frames are generally formed by etching. In this etching, not only the etching in the target thickness direction but also the plate width direction is performed. Since side etching also occurs, the thinner the material plate is, the more advantageous in processing from the viewpoint of processing accuracy with respect to the lead width and the lead interval. Also, the package
It is also necessary to reduce the thickness of the lead frame material from the demand for thinner parts, so recently the plate thickness has been reduced from 0.15 mm to 0.125 mm,
Furthermore, it shows a tendency to become thinner to 0.10 mm.

[0004] However, such thinning of the lead frame and narrowing of the lead lower the lead strength and cause deformation of the lead during the assembly process and device mounting. Therefore, in order to solve such a problem, it is necessary to improve the strength of the lead frame material used as much as possible. Further, as the integration of ICs and the number of pins increase, power consumption increases, and measures to dissipate heat generated from chips become an important problem that cannot be ignored.

As described above, the lead frame material of semiconductor equipment is generally required to have the following various characteristics. a) The lead must have mechanical strength so that it is not easily deformed. b) It shall have the excellent etching and press workability required for forming the lead frame pattern. c) Chips High thermal conductivity to efficiently dissipate the heat generated by the device, d) excellent electrical characteristics, e) excellent solderability when mounting devices, and reliability of solder joints F) Ag plating for bonding, g) Excellent oxidation resistance without oxidizing the surface during the heating process, h) Excellent repetitive bendability I) The price is low.

However, in response to these various required characteristics, copper alloys such as phosphor bronze and the like which have been used in the past have been used.
All alloys (42 wt% Ni-Fe) had advantages and disadvantages, and none could satisfy all of the above characteristics. In particular, with the increase in the number of pins and miniaturization of leads, the complexity of the shape and the narrowing of the pins have progressed, and lead frames have been required to have better strength, etching properties and bending workability. In view of the above, it has been difficult to say that the conventional material has sufficient performance in these respects.

Accordingly, an object of the present invention is to provide a material which satisfies all of the above-mentioned characteristics required as a lead frame material or the like of a semiconductor device, in particular, has a Vickers hardness of about 10%. A metal that has a strength of 200 or more (65 kgf / mm ² or more in tensile strength), a conductivity of 50% IACS (about 15 times that of 42 alloy), and is sufficiently excellent in bending workability and etching properties. The purpose is to establish a means for providing stable materials.

[0008]

Means for Solving the Problems The present inventors have conducted intensive studies in order to achieve the above object, and have reached the following conclusion. That is, a copper alloy based on copper, which originally has a thermal conductivity far exceeding 42 alloy, is very advantageous in heat dissipation as compared with other lead frame materials, and has electrical characteristics and Ag plating. Relatively good characteristics can be ensured also in terms of properties, solderability, oxidation resistance, ductility and the like. Therefore, if the strength which can cope with thinning, the repetitive bending property, the etching property and the like can be added without impairing these characteristics to improve the drawbacks of the conventional copper alloy, the lead frame material and the conductive property of semiconductor equipment can be improved. It is considered that an excellent material can be realized as the elastic spring material or the like.

[0009] Therefore, it is one of the precipitation-type copper alloys capable of increasing the strength without lowering the conductivity as compared with the solid-solution-type copper alloy.
As a result of conducting research focusing on Cu-Cr-Zr alloys,
-Add Ti and Fe to Zr alloy, or add Zn, Sn, In,
One or more of Mn, P, Mg and Si are added, and a copper alloy is used as a material, in which the content ratio of each component is strictly adjusted. After controlling the diameter and further performing cold working, aging, final cold working and final annealing under specific conditions, the strength, conductivity, bending workability, spring characteristics, Ag plating properties, solder joint reliability, It is possible to obtain a material with further improved properties such as properties. "

The present invention has been made on the basis of the above findings and the like. "Cr: 0.05 to 0.40% (hereinafter,% representing the component ratio is a weight ratio), Zr: 0.03 to 0.25%, Fe : 0.10 to 1.80%,
Ti: 0.10 to 0.80%, or Zn: 0.05 to 2.0%, one or more of Sn, In, Mn, P, Mg, and Si: one or more of 0.01 to 1% in total amount And “0.10%
≦ Ti ≦ 0.60% ”, the Fe / Ti weight ratio satisfies 0.66 to 2.6, and“ 0.60% <Ti ≦ 0.80% ”, the Fe / Ti weight ratio is 1.
For copper alloy material that satisfies 1-2.6 and the remainder consists of Cu and unavoidable impurities, 1) solution treatment at a temperature of less than 950 ° C, 2) cold working at a working ratio of 50-90% , 3) aging treatment at a temperature of 300 to 580 ° C, 4) cold working at a working ratio of 16 to 83%, 5) annealing at a temperature of 350 to 700 ° C. The strength, conductivity, bending workability, and reliability of solder joints have been balanced at a high level to enable stable production of high-strength, high-conductivity copper alloy materials for electronic equipment. " It has great features.

Next, the reason why the component composition of the copper alloy material and the processing conditions in the present invention are numerically limited as described above will be described in detail together with the operation thereof. A) Component composition (a) Cr In the copper alloy according to the present invention containing Cr, Zr, Ti, Fe, etc., Cr precipitates in the parent phase by aging treatment following solution treatment of the alloy, and its strength and electric conductivity Although the effect of improving the properties is exhibited, if the Cr content is less than 0.05%, the desired effect by the above-mentioned effect cannot be obtained. On the other hand, if the Cr content exceeds about 0.30%, undissolved Cr will remain in the matrix even after solution treatment, and if the Cr content exceeds 0.40%, it will be present as coarse inclusions. (Appears as bald-burr-like coarse inclusions when the rolled vertical cross section is etched), thereby deteriorating the alloy's etching properties and repeated bending properties. Therefore, the Cr content was determined to be 0.05 to 0.40%.

(B) Zr In the copper alloy according to the present invention, Zr forms a compound with Cu by aging treatment and precipitates in the matrix to exert an effect of strengthening it, but the Zr content is less than 0.03%. In the above, the desired effect due to the above-mentioned action cannot be obtained.On the other hand, if the content exceeds 0.25%, undissolved Zr remains in the mother phase even after the solution treatment, thereby lowering the electrical conductivity and bending workability. Zr content is
0.03 to 0.25%.

(C) Ti and Fe In the copper alloy according to the present invention, Ti and Fe form an intermetallic compound of Ti and Fe in the mother phase when the alloy is aged, and as a result, the alloy strength is further improved. However, if their contents are less than 0.01%, the desired effects cannot be obtained. On the other hand, the Ti content is 0.80
% Or the Fe content exceeds 1.80%,
In addition, undissolved inclusions containing Fe as a main component have a size of 5 μm or more, and significantly impair the etching property. It should be noted here that the Ti content, which affects the strength and electrical conductivity of the alloy,
The effect of the Fe content is that the strength and electrical conductivity of the alloy are
The point is that even if the sum of the Fe contents is constant, it greatly changes depending on the Fe / Ti weight ratio. That is, “0.10% ≦ Ti ≦ 0.
In the range of “60%”, when the Fe / Ti weight ratio is less than 0.66, and in the range of “0.60% <Ti ≦ 0.80%”, when the Fe / Ti weight ratio is less than 1.1, the electric conductivity is remarkable. descend. On the other hand, the strength of the alloy is “0.10% ≦ Ti ≦ 0.80%”
Decreases when the Fe / Ti weight ratio exceeds 2.6 in the entire Ti content range. In other words, the electrical conductivity and the strength are in a contradictory relationship with respect to the Fe / Ti weight ratio, and the optimal Fe / Ti weight ratio that balances the two is "0.10% ≦ Ti ≦ 0.60%”.
For 0.66% to 2.6%, and for 0.60% <Ti ≦ 0.80%, 1.
1 to 2.6. Based on the above, the Ti content is set to 0.10 to 0.80% and the Fe content is set to 0.10 to 1.8% to satisfy the strength, electric conductivity and etching property of the alloy, respectively, and "0.10% ≦ Ti ≦ 0.60 % ”Is Fe / Ti
The weight ratio was limited to 0.66 to 2.6, and in "0.60% <Ti ≦ 0.80%", the Fe / Ti weight ratio was limited to 1.1 to 2.6.

(D) Zn In the alloy according to the present invention, Zn exerts an effect of improving the heat-resistant peeling property of the solder, and is therefore a component that can be added if necessary. The desired effect due to the action cannot be obtained. On the other hand, if the content exceeds 2.0%, the conductivity will be reduced. Therefore, the Zn content is determined to be 0.05 to 2.0%.

(E) Sn, In, Mn, P, Mg and Si In the alloy according to the present invention, Sn, In, Mn, P, Mg and Si
In any case, one or two or more of these are added as necessary to exert the effect of improving strength mainly by solid solution strengthening without significantly lowering the conductivity of the alloy.
If their contents are less than 0.01% in total, the desired effects due to the above effects cannot be obtained. On the other hand, when their contents exceed 1.0% in total, the conductivity and bending workability of the alloy deteriorate. Therefore, the content of Sn, In, Mn, P, Mg or Si is determined to be 0.01 to 1% in total.

B) Treatment Conditions (a) Solution Treatment The solution treatment involves forcibly forming a solid solution of Cr, Zr, Ti, and Fe in the matrix, and then precipitating on the matrix by aging to obtain high strength and conductivity. Basically, it is expected that the higher the solution treatment temperature, the higher the solid solution amount of Cr, Zr, Ti and Fe, and therefore the greater the precipitation strengthening by aging.
However, when the solution temperature is too high, there is a problem that the crystal grains become coarse and the bending workability deteriorates. However, when various investigations were made on the alloy having the composition according to the present invention, it was found that when the solution temperature was lower than 950 ° C., the average crystal grain size was less than 60 μm, and finally a sufficiently satisfactory bending workability could be secured. On the other hand, when the solution temperature was 950 ° C. or higher, it was clarified that secondary recrystallization partially including coarse particles of 70 μm or more and the bending workability was significantly deteriorated. Therefore, in the present invention, it is determined that the solution treatment is performed at less than 950 ° C. In addition, in the alloy having the composition according to the present invention, the higher the cooling rate during the solution treatment, the higher the strength is easily obtained. Therefore, specifically, the cooling after the solution treatment is desirably water-cooled.

(B) Cold work (first time) The reason why cold work is performed after the solution treatment is that the "work hardening" and the "precipitation rate of precipitates in the aging process" are made in order to increase the strength. Is to promote it. The reason why the cold working ratio is limited to 50 to 90% is that the cold working ratio is 5 to 90%.
If it is less than 0%, the above effects obtained by cold working are insufficient, and a tensile strength of 65 kgf / mm ² or more cannot be obtained. On the other hand, if the working degree exceeds 90%, bending workability is deteriorated. .

(C) Aging treatment The aging treatment is an indispensable step for improving the strength and conductivity of the material. However, if the aging conditions are not optimized, desired strength and conductivity cannot be obtained. That is, if the aging temperature is lower than 300 ° C., the precipitation reaction is hardly promoted, so that the desired aging treatment effect cannot be secured.
If the temperature exceeds 80 ° C., the softening proceeds and the strength is reduced. Therefore, in the present invention, the aging treatment temperature is limited to 300 to 580 ° C.

The above-mentioned aging treatment can be carried out by any of "isothermal annealing (isothermal aging)" and "annealing in which the temperature is continuously changed from high temperature to low temperature two or more times (multi-stage aging)". The precipitation temperature range of the alloy according to the present invention was 320 to 440 ° C. and 50
Since the temperature is from 0 to 580 ° C., the aging condition is preferably determined as follows based on this data. B) Isothermal aging In the case of isothermal aging, the aging treatment temperature is preferably set to 350 to 580 ° C. This is not practical for on-site operation because an aging time of at least 12 hours or more is required at a temperature lower than 350 ° C. On the other hand, at a temperature exceeding 580 ° C., the softening due to coarsening of the precipitate proceeds and the strength decreases. Is caused. B) In the case of multi-stage aging In the case of multi-stage aging, the first-stage aging is performed at a high temperature in order to recover the conductivity to some extent, and the aging time is shortened so that the driving force for precipitation remains in the second and subsequent stages. In addition, the size and distribution of the precipitates are finely controlled by lowering the aging temperature of the second stage from the aging temperature of the first stage, and the aim is to further promote the age hardening. In this case, too, when the aging treatment temperature is lower than 300 ° C., the precipitation reaction hardly proceeds and it takes a long time to control the size and distribution of the precipitates, which is not practical for on-site operation. When aging is performed, the strength is reduced due to softening.
The temperature is preferably set to 580 ° C.

(D) Cold rolling (second time) The cold working after the aging treatment is carried out in order to secure a further remarkable increase in strength due to work hardening and miniaturization of precipitates.
However, if the working ratio is less than 16%, the tensile strength is 6%.
High strength of 5 kgf / mm ² or more could not be obtained, while 8
If a working ratio of more than 3% is given, bending workability deteriorates.

(E) Strain relief annealing After the final cold working, strain relief annealing is performed at a temperature of 350 to 700 ° C. in order to improve the spring property and restore the ductility. If the annealing temperature at this time is lower than 350 ° C., it takes a long time to obtain a sufficient spring property and ductility, so that it is not practical in the field operation.
In a temperature region exceeding the above range, the re-dissolution of the precipitate becomes remarkable, and unless the annealing time is controlled with an accuracy of 0.1 to 1 second, the strength and the electric conductivity are remarkably reduced, so that it is not practical.

It should be noted that the above-mentioned production conditions relate to the "steps after the solution treatment" according to the present invention, and the conditions in the steps before the steps may be arbitrary. That is, even if conditions such as solution treatment, hot working, intermediate annealing, cold working, etc. are performed before the treatment (solution treatment → cold working → aging treatment → cold working → annealing) specified in the present invention. Does not need to be specified at all.

Next, the effects of the present invention will be described more specifically with reference to examples.

EXAMPLES Copper alloys having various component compositions shown in Tables 1 and 2 were melted at 1200 ° C. in a high frequency melting furnace using electrolytic copper as a raw material, and cast into ingots. Then, the ingot was chamfered, heated at 950 ° C. for 1 hour, and hot-rolled to obtain a sheet material having a thickness of 8 mm.

[0024]

[Table 1]

[0025]

[Table 2]

Next, the hot-rolled sheet was subjected to a solution treatment, a cold rolling, an aging treatment, a final cold rolling, and a strain relief annealing under the conditions shown in Tables 3 and 4 in that order to obtain a 0.125 mm plate.

[0027]

[Table 3]

[0028]

[Table 4]

Next, the grain size (average crystal grain size) of each of the obtained sheet materials was examined, and "tensile strength", "elongation" and "elongation" were evaluated as evaluation items as a lead frame material.
"Electrical conductivity", "Repeated bending property", "Soldering property", "Solder heat resistance peeling property", "Ag plating property" and "Etching property" were examined.

Here, "tensile strength" and "elongation" were measured by a tensile test, and "electric conductivity" was evaluated by electrical conductivity (% IACS). The evaluation criteria for tensile strength and conductivity are as follows:
The tensile strength was 65 kgf / mm ² or more, and the conductivity was 50% IACS or more. "Repeatable bendability" is defined as the number of times to break by performing a 90 ° repetitive bending test in the same direction under the bending condition of “(bending radius) / (plate thickness) = 1” and counting back and forth once. Was evaluated.
In addition, the evaluation criteria of the repetitive bendability were evaluated as acceptable (o) when the number of times of bending was 4 or more, and as negative (x) when the number of times of bending was less than 4 times.

"Solder wettability" was evaluated by measuring the zero-cross time by a surface tension method using a meniscograph using a solder checker. The solder used was 60% Sn-40% Pb, and the temperature of the solder bath was set at 230 ± 5 ° C. At this time, the zero-crossing time was allowed to be less than 1 second (○), and the zero-crossing time was not allowed to be more than 1 second (× ). "Solder heat peelability" is measured by applying 90% Sn-10% Pb solder plating of about 5μm thickness to the sample.
Hold in air at 50 ° C for up to 1000 hours,
Take out every 0 hours, "(bending radius) / (plate thickness) = 1"
Under the above bending conditions, 90-degree bending was performed once in a reciprocating manner, and the presence or absence of plating peeling at the bent portion was examined and evaluated. The evaluation criteria for the solder heat-peelability were acceptable (可) when the peeling start time exceeded 500 hours, and negative (x) when the peeling time was 500 hours or less.

"Silver plating property" means that the surface of the sample has a thickness of about 5 μm.
m, and the sample was heated in the air at 350 ° C. for 3 minutes, and then evaluated by observing the presence or absence of swelling on the surface of the silver plating. In addition, the evaluation criteria of the silver plating property were evaluated as acceptable (○) when no blistering occurred, and as negative (x) when blistering occurred. The "etching property" was evaluated by etching the sample with ferric chloride and measuring the maximum inclusion size with a scanning electron microscope. The evaluation criteria of the etching property were as follows: good (◎) when the maximum inclusion size was less than 1 μm, acceptable (○) when 1 μm or more and less than 5 μm, and bad (×) when 5 μm or more. Tables 5 and 6 show the results of these evaluations.

[0033]

[Table 5]

[0034]

[Table 6]

The following is clear from the results shown in Tables 5 and 6. That is, in Test Nos. 1 to 26 satisfying the specified conditions of the present invention, the obtained plate materials are all 65 kg.
It can be seen that it has a tensile strength of f / mm ² or more and a conductivity of 50% IACS or more, and is excellent in all of the repetitive bending property, soldering property, solder heat peeling property, Ag plating property and etching property.

On the other hand, in Comparative Example 27, since the Cr content exceeded the upper limit specified in the present invention, the inclusions in the obtained plate material were coarsened to 5 μm or more, and the etching property and the repeated bending Has deteriorated. In Comparative Example 29, since the Zr content exceeded the upper limit specified in the present invention, the obtained sheet material was inferior in repeated bending property. Also, a comparative example
In Nos. 28, 30 and 32, since the content of Cr, Zr or Fe is less than the lower limit specified in the present invention, the strength of the obtained plate does not reach 65 kgf / mm ² .

In Comparative Example 31, since the respective contents of Ti and Fe exceeded the upper limits specified in the present invention, the conductivity of the obtained plate material was reduced to less than 50% IACS.
Ag plating property and etching property are deteriorated. Comparative Example 3
3, 36 and 38 show that the conductivity of the plate material obtained because the Fe / Ti weight ratio is less than the lower limit specified in the present invention is 50% IACS.
, While Comparative Examples 34, 35 and 37 have Fe /
Since the Ti weight ratio exceeds the upper limit specified in the present invention, the strength of the obtained plate material is as low as less than 65 kgf / mm ² .

In Comparative Example 39, since the Zn content exceeded the upper limit specified in the present invention, the conductivity of the obtained plate material was low. On the other hand, in Comparative Examples 40 to 43, since the Zn content is lower than the lower limit specified in the present invention or is not contained, the soldering heat-peeling time of the obtained plate material is 500 despite the influence of other components. The result was inferior to less than an hour. In Comparative Examples 41 to 47, the total amount of Sn, In, Mn, P, Mg, and Si exceeded the upper limit specified in the present invention,
The conductivity of the obtained plate material is reduced.

In Comparative Examples 48, 49 and 52, since the solution treatment temperature exceeded the upper limit and the crystal grains became coarse, the repetitive bendability of the obtained sheet material was deteriorated. In Comparative Example 50, the workability of the first cold rolling exceeds the upper limit specified in the present invention, and the obtained sheet material has deteriorated repetitive bendability. In Comparative Example 51, a reduction in the strength of the obtained sheet material was observed because the working ratio of the first cold rolling was below the lower limit specified in the present invention, and at the same time, the working ratio of the second cold rolling was the upper limit. Because of the excess, the obtained plate material has repeatedly deteriorated bendability. In Comparative Examples 53 and 54, since the aging temperature exceeds the upper limit specified in the present invention, the softening of the sheet material progresses, and the strength of the obtained sheet material is reduced. In Comparative Example 55, since the annealing temperature was higher than 700 ° C., the re-melting was extremely advanced, and both the strength and the electrical conductivity of the obtained plate material were reduced.

[0040]

[Summary of effects] As described above, according to the present invention, the tensile strength, elongation, electrical conductivity, bending workability, etching properties, Ag plating properties, solderability and solder heat-resistant peeling properties are high, and the surface properties are high. High reliability and high reliability "High-strength, high-conductivity copper alloy material suitable for electronic devices such as lead frame materials" can be manufactured stably, greatly contributing to the improvement of the performance of electronic devices. And industrially very useful effects.

──────────────────────────────────────────────────の Continuation of front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location C22F 1/00 630 8719-4K C22F 1/00 630K 661 8719-4K 661A 683 8719-4K 683 684 8719 -4K 684C 685 8719-4K 685Z 686 8719-4K 686Z 691 8719-4K 691B 8719-4K 691C 694 8719-4K 694A

Claims (4)

(57) [Claims] (1) Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10-1.80%, Ti: 0.10-0.80%, and "0.
In 10% ≦ Ti ≦ 0.60% ”, the Fe / Ti weight ratio satisfies 0.66 to 2.6, and in“ 0.60% <Ti ≦ 0.80% ”, the Fe / Ti weight ratio is
For copper alloy material that satisfies 1.1-2.6 and the remainder consists of Cu and unavoidable impurities, 1) solution treatment at a temperature of less than 950 ° C, 2) cold working at a working ratio of 50-90% , 3) aging treatment at a temperature of 300 to 580 ° C, 4) cold working at a working ratio of 16 to 83%, 5) annealing at a temperature of 350 to 700 ° C, and so on. A method for producing a high-strength, high-conductivity copper alloy material for electronic equipment, which is characterized by the following. 2. Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, Ti: 0.10 to 0.80%, Zn: 0.05 to 2.0%, and “0.10% ≦ Ti ≦ 0.60%”, Fe / Ti
The weight ratio satisfies 0.66 to 2.6, and “0.60% <Ti ≦ 0.80
%), The Fe / Ti weight ratio satisfies 1.1 to 2.6 and the balance is Cu and unavoidable impurities. 1) Solution treatment at a temperature lower than 950 ° C, 2) 50 to 90% %) Aging at a temperature of 300 to 580 ° C, 4) Cold working at a degree of working of 16 to 83%, 5) Annealing at a temperature of 350 to 700 ° C, A method for producing a high-strength and high-conductivity copper alloy material for electronic equipment, characterized by sequentially performing the following processes in this order. (3) Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, including Ti: 0.10 to 0.80%, Sn, In, M
At least one of n, P, Mg, and Si: contains 0.01 to 1% in total amount and Fe / Ti in "0.10% ≦ Ti ≦ 0.60%”.
The weight ratio satisfies 0.66 to 2.6, and “0.60% <Ti ≦ 0.80
%), The Fe / Ti weight ratio satisfies 1.1 to 2.6 and the balance is Cu and unavoidable impurities. 1) Solution treatment at a temperature lower than 950 ° C, 2) 50 to 90% %) Aging at a temperature of 300 to 580 ° C, 4) Cold working at a degree of working of 16 to 83%, 5) Annealing at a temperature of 350 to 700 ° C, A method for producing a high-strength and high-conductivity copper alloy material for electronic equipment, characterized by sequentially performing the following processes in this order. (4) Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, Ti: 0.10 to 0.80%, Zn: 0.05 to 2.0%
And one or more of Sn, In, Mn, P, Mg and Si: 0.01-1% in total, and "0.10% ≦ Ti ≦ 0.60
%, The Fe / Ti weight ratio satisfies 0.66 to 2.6, and "0.
For 60% <Ti ≦ 0.80%, the Fe / Ti weight ratio satisfies 1.1 to 2.6 and the balance is copper alloy material consisting of Cu and unavoidable impurities. 1) Solution treatment at a temperature lower than 950 ° C , 2) Cold working at a working ratio of 50% or more and 90% or less, 3) Aging treatment at a temperature of 300-580 ° C, 4) Cold working at a working ratio of 16-83%, 5) 350- A method for producing a high-strength, high-conductivity copper alloy material for electronic equipment, characterized by sequentially performing annealing at a temperature of 700 ° C. in this order.