JPH07258805A - Production of high-strength and high-conductivity copper alloy material for electronic equipment - Google Patents

Abstract

PURPOSE:To stably produce a metallic material for electronic equipment, well balanced among various properties of strength, electric conductivity, bendability, solderability, etc., at a high level. CONSTITUTION:This copper alloy has a composition which consists of 0.05-0.40% Cr, 0.03-0.25% Zr, 0.10-1.80% Fe, 0.10-0.80% Ti, and the balance Cu with inevitable impurities or further contains either or both of 0.05-2.0% Zn and 0.01-1%, in total, of one or more elements among Sn, In, Mn, P, Mg, and Si and in which the weight ratio between Fe and Ti is regulated to 0.66-2.6 when Ti is 0.10-0.60% and to 1.1-2.6 when Ti is >0.60-0.80%. A stock of this copper alloy is successively subjected to the following treatments in the order named: (1) solution heat treatment at <950 deg.C; (2) cold working at 50-90% draft; (3) aging treatment at 300-580 deg.C; (4) cold working at 16-83% draft; (5) annealing at 350-700 deg.C.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is suitable as a lead material for semiconductor devices such as transistors and integrated circuits (ICs), and has excellent etching properties and bending properties in addition to high strength and electrical conductivity. TECHNICAL FIELD The present invention relates to a method for producing a high-strength and high-conductivity copper alloy material for electronic devices, which also has properties.

[0002]

2. Description of the Related Art The trend of IC packages in recent years has been symbolized by "miniaturization, lightness, thinness, and miniaturization". Recently, the trend has been further promoted by the spread of surface packages, and
Along with the high functionality of chips, the number of pins and the reduction of heat generation are being advanced at the same time. On the other hand, looking at the concrete transition process relating to the form of the IC package, the pin insertion type package represented by DIP has been widely used in the past, but "surface mounting" for the purpose of improving the mounting density. Becomes mainstream, SOJ, S
The shift to surface mount types such as OP and QFP is progressing. In recent years, fine pitch QFP, which has a reduced lead pitch, has increased with the increase in the number of pins, and TSOP, T
Thinning plates represented by QFP and the like are in progress.

By the way, most of the multi-pin, narrow-pitch frames are generally made by etching. In this etching, not only the intended etching in the plate thickness direction but also the plate width direction is performed. Since side etching also occurs, the thinner the material plate, the more advantageous in processing from the viewpoint of processing accuracy regarding the lead width and the lead interval. Also, the package
It is necessary to reduce the thickness of the lead frame material due to the demand for thinner wall thickness, so recently the plate thickness is 0.15 mm to 0.125 mm,
Furthermore, it has a tendency to become thinner to 0.10 mm.

However, such thinning of the lead frame and narrowing of the lead reduce the lead strength and cause deformation of the lead during the assembly process and device mounting. Therefore, in order to solve such a problem, it is necessary to improve the strength of the lead frame material used as much as possible. Further, as the integration of ICs increases and the number of pins increases, power consumption also increases, and measures to dissipate heat generated from chips become an important issue that cannot be ignored.

As described above, the lead frame material for semiconductor devices is generally required to have the following versatile characteristics. a) The mechanical strength of the lead does not easily deform, b) The excellent etching and press workability required for the pattern formation of the lead frame, and the chip. Has high thermal conductivity to dissipate heat efficiently with respect to heat generation, d) excellent electrical characteristics, e) excellent solderability during device mounting, and solder joint reliability High, f) excellent Ag plating property for bonding, g) excellent oxidation resistance that the surface does not oxidize in the heating process, and h) excellent repeated bendability. I) The price is low.

However, copper alloys such as phosphor bronze, which have been conventionally used, and 42 have been used for these various required characteristics.
All alloys (42 wt% Ni-Fe) have advantages and disadvantages, and none of them satisfy all of the above characteristics. In particular, as the number of leads increases and the miniaturization progresses, the shape becomes more complicated and the pins become narrower, so that the lead frame material is required to have better strength, etching properties, and bending workability. In consideration of the above, it was difficult to say that the above-mentioned conventional material has sufficient performance in these points.

Therefore, the object of the present invention is to achieve a material satisfying all of the above-mentioned characteristics required as a lead frame material for semiconductor devices, especially a Vickers hardness. A metal that has a strength of 200 or more (tensile strength of 65 kgf / mm ² or more), a conductivity of 50% IACS (about 15 times that of 42 alloy) or more, and is excellent in bending workability and etching property. It is to establish a stable supply means of materials.

[0008]

Means for Solving the Problems The inventors of the present invention have made extensive studies in order to achieve the above object, and have reached the following conclusions. That is, a copper alloy based on copper, which originally has a thermal conductivity far exceeding 42 alloy, is very advantageous in terms of heat dissipation as compared with other lead frame materials, and also has electrical characteristics and Ag plating. It is possible to secure comparatively good characteristics in terms of solderability, solderability, oxidation resistance, and ductility. Therefore, if it is possible to improve the drawbacks of the conventional copper alloy by imparting strength capable of accommodating thin plate, repetitive bendability, etching property, etc. without deteriorating these characteristics, it is possible to use a lead frame material or a conductive material for semiconductor equipment. It is considered that an excellent material such as a flexible spring material can be realized.

Therefore, it is one of the precipitation-type copper alloys which can be made stronger without lowering the conductivity as compared with the solid solution type copper alloy.
As a result of research focusing on Cu-Cr-Zr alloy,
-Add Ti and Fe to the Zr alloy, or add Zn, Sn, In,
One or two or more of Mn, P, Mg or Si are added, and a copper alloy whose content ratio of each of these components is strictly adjusted is used as a raw material. Strength, conductivity, bendability, spring characteristics, Ag plating property, solder joint reliability can be obtained by controlling the diameter and then performing cold working, aging, final cold working and final annealing under specific conditions. It was possible to obtain the knowledge that "a material having various improved properties such as properties can be obtained."

The present invention has been made on the basis of the above findings and the like. "Cr: 0.05 to 0.40% (hereinafter,% representing a component ratio is a weight ratio), Zr: 0.03 to 0.25%, Fe : 0.10 to 1.80%,
Ti: 0.10 to 0.80% or further Zn: 0.05 to 2.0%, one or more of Sn, In, Mn, P, Mg and Si: 0.01 to 1% in total amount, or two or more. In addition to containing "0.10%
When ≦ Ti ≦ 0.60% ”, the Fe / Ti weight ratio satisfies 0.66 to 2.6, and when“ 0.60% <Ti ≦ 0.80% ”, the Fe / Ti weight ratio is 1.
A copper alloy material satisfying 1 to 2.6 with the balance being Cu and unavoidable impurities, 1) solution heat treatment at a temperature of less than 950 ° C, 2) cold working at a workability of 50 to 90% , 3) Aging treatment at a temperature of 300 to 580 ° C, 4) Cold working at a working degree of 16 to 83%, 5) Annealing at a temperature of 350 to 700 ° C. , That enables stable production of high-strength and high-conductivity copper alloy materials for electronic devices that balance various properties such as strength, conductivity, bending workability, and reliability of solder joints at a high level. " It has a great feature.

Next, the reason why the component composition of the copper alloy material and the treatment conditions are numerically limited as described above in the present invention will be described in detail together with its action. A) Component composition (a) Cr In the copper alloy according to the present invention containing Cr, Zr, Ti, Fe, etc., Cr precipitates in the matrix by the aging treatment following the solution treatment of the alloy, and its strength and electrical conductivity However, if the Cr content is less than 0.05%, the desired effect due to the above action cannot be obtained. On the other hand, if the Cr content exceeds 0.30%, undissolved Cr will remain in the matrix even after solution treatment, and if the Cr content exceeds 0.40%, it will exist as coarse inclusions. (It appears as a mustache-like coarse inclusion when the vertical section of rolling is etched), which deteriorates the etching property and the repetitive bendability of the alloy. Therefore, the Cr content is set to 0.05 to 0.40%.

(B) Zr In the copper alloy according to the present invention, Zr forms a compound with Cu by aging treatment and precipitates in the matrix phase to exert the action of strengthening it, but the Zr content is less than 0.03%. In the desired effect due to the above action is not obtained, on the other hand, if it is contained in excess of 0.25%, undissolved Zr remains in the mother phase even after solution treatment and decreases the electrical conductivity and bending workability, Zr content is
It was set to 0.03 to 0.25%.

(C) Ti and Fe In the copper alloy according to the present invention, Ti and Fe form an intermetallic compound of Ti and Fe in the matrix when the alloy is aged, and as a result, the alloy strength is further improved. However, if the content of each of these is less than 0.01%, the desired effect due to the above action cannot be obtained. On the other hand, the Ti content is 0.80
% Or the Fe content exceeds 1.80%, Ti
And undissolved inclusions containing Fe as the main component have a size of 5 μm or more, and significantly impair the etching property. Here, it should be noted that the Ti content, which affects the strength and electrical conductivity of the alloy,
It is the effect of Fe content, and the strength and electrical conductivity of the alloy are
The point is that even if the sum of the Fe contents is constant, it greatly changes depending on the Fe / Ti weight ratio. That is, `` 0.10% ≤ Ti ≤ 0.
If the Fe / Ti weight ratio is less than 0.66 in the "60%" range, and the Fe / Ti weight ratio is less than 1.1 in the "0.60% <Ti ≤ 0.80%" range, the electrical conductivity will be remarkably high. descend. On the other hand, the strength of the alloy is "0.10% ≤Ti≤0.80%"
It decreases when the Fe / Ti weight ratio exceeds 2.6 in the entire Ti content range. In other words, regarding the Fe / Ti weight ratio, electrical conductivity and strength are in a contradictory relationship, and the optimum Fe / Ti weight ratio that balances the two in a high order is “0.10% ≦ Ti ≦ 0.60%”
For 0.66 to 2.6, and for 0.60% <Ti ≤ 0.80% 1.
It means 1 to 2.6. Based on the above, the Ti content was set to 0.10 to 0.80% and the Fe content was set to 0.10 to 1.8% in order to satisfy the strength, electrical conductivity and etching property of the alloy, and "0.10% ≤Ti≤0.60 % ”Is Fe / Ti
The weight ratio was limited to 0.66 to 2.6, and in the case of "0.60% <Ti≤0.80%", the Fe / Ti weight ratio was limited to 1.1 to 2.6.

(D) Zn In the alloy according to the present invention, Zn has a function of improving the heat-resistant peeling property of the solder, and therefore, it is a component which may be contained if necessary, but if the content is 0.05% or less, The desired effect due to the action cannot be obtained, and on the other hand, if the content exceeds 2.0%, the conductivity is lowered, so the Zn content was set to 0.05 to 2.0%.

(E) Sn, In, Mn, P, Mg and Si In the alloy according to the present invention, Sn, In, Mn, P, Mg and Si
Each of them has an effect of improving strength mainly by solid solution strengthening without greatly reducing the conductivity of the alloy, so one or more of these are added as necessary,
If the total content of them is less than 0.01%, the desired effect due to the above action cannot be obtained. On the other hand, if the total content of these exceeds 1.0%, the electrical conductivity and bendability of the alloy deteriorate. Therefore, the total content of Sn, In, Mn, P, Mg or Si is set to 0.01 to 1%.

B) Treatment Conditions (a) Solution Treatment The solution treatment is to forcibly dissolve Cr, Zr, Ti and Fe in the mother phase and then precipitate them on the mother phase by aging to obtain high strength and conductivity. It is expected that the precipitation strengthening by aging will be large because the solid solution amount of Cr, Zr, Ti and Fe increases at higher solution treatment temperature.
However, if the solution heat treatment temperature is too high, the crystal grains become coarse and bending workability deteriorates. However, as a result of various investigations on the alloy having the composition according to the present invention, when the solution treatment temperature is lower than 950 ° C., a grain size controlled structure having an average crystal grain size of less than 60 μm is formed, and finally a sufficiently satisfactory bending workability can be secured. On the other hand, it became clear that when the solution treatment temperature becomes 950 ° C. or higher, secondary recrystallization containing coarse particles of 70 μm or larger in part becomes secondary recrystallization, and bending workability is significantly deteriorated. Therefore, in the present invention, it was determined that the solution treatment should be performed at a temperature lower than 950 ° C. In the alloy having the composition according to the present invention, the higher the cooling rate during the solution treatment, the higher the strength is likely to be obtained. Therefore, it is desirable that the cooling after the solution treatment is specifically water cooling.

(B) Cold working (first time) The reason for performing cold working after solution treatment is to improve "work hardening" and "precipitation rate of precipitates in aging process" in order to increase strength. It is to promote. And the reason why the workability of this cold working is limited to 50 to 90% is that the workability is 5%.
If it is less than 0%, the above effect obtained by cold working is insufficient and a tensile strength of 65 kgf / mm ² or more cannot be obtained. On the other hand, if the workability exceeds 90%, the bending workability deteriorates. .

(C) Aging treatment Although an aging treatment is an essential step for improving the strength and conductivity of the material, the desired strength and conductivity cannot be obtained unless the aging conditions are optimized. That is, if the aging temperature is less than 300 ° C., the precipitation reaction is hardly promoted, so that the desired aging treatment effect cannot be secured, while the aging temperature is 5
If the temperature exceeds 80 ° C., softening proceeds and the strength decreases, so the aging treatment temperature is limited to 300 to 580 ° C. in the present invention.

The aging treatment may be carried out by either "isothermal annealing (isothermal aging)" or "annealing in which the temperature is continuously changed twice from high temperature to low temperature (multi-step aging)". According to the differential scanning calorimetry measurement, the precipitation temperature range of the alloy according to the present invention is 320 to 440 ° C. and 50.
Since it is 0 to 580 ° C., it is preferable to set the aging conditions as follows based on this data. A) When applying isothermal aging In the case of isothermal aging, the aging treatment temperature is preferably set to 350 to 580 ° C. If the temperature is lower than 350 ° C, an aging time of at least 12 hours or more is required, which is not practical in the field operation. On the other hand, if the temperature is higher than 580 ° C, softening due to coarsening of precipitates progresses and the strength decreases. Is caused. (B) When performing multi-step aging In the case of multi-step aging, the first step aging is performed at a high temperature in order to recover the conductivity to some extent, and the aging time is shortened so that the driving force for precipitation is retained in the second step and thereafter. Moreover, the size and distribution of the precipitates are finely controlled by making the aging temperature of the second step lower than the aging temperature of the first step, aiming at further promotion of age hardening. Even in this case, if the aging temperature is lower than 300 ° C, the precipitation reaction hardly progresses and it takes a long time to control the size and distribution of the precipitates, which is not practical in the field operation. When aging at 300 ° C, softening causes a decrease in strength.
It is better to set it up to 580 ° C.

(D) Cold rolling (second time) Cold working after aging treatment is carried out in order to secure a further remarkable increase in strength due to work hardening and refinement of precipitates.
However, when the workability at this time is less than 16%, the tensile strength is 6
It is not possible to obtain high strength of 5kgf / mm ² or more, while 8
When the workability exceeds 3%, the bending workability deteriorates.

(E) Strain relief annealing After the final cold working, strain relief annealing is performed at a temperature of 350 to 700 ° C. in order to improve the spring property and restore the ductility. If the annealing temperature at this time is less than 350 ° C, it takes a long time to obtain sufficient springiness and ductility, which is not practical in the field operation.
In the temperature range exceeding 10 ° C., the re-dissolution of precipitates becomes remarkable, and unless the annealing time is controlled with an accuracy of 0.1 to 1 second, the strength and the electric conductivity are remarkably lowered, which is also impractical.

It should be noted that the above-mentioned definition of the manufacturing conditions relates to the "process after the solution treatment" according to the present invention, and the conditions in the processes before that may be arbitrary. That is, conditions such as solution treatment, hot working, intermediate annealing, cold working performed before the treatment (solution treatment → cold working → aging treatment → cold working → annealing) prescribed in the present invention. Need not be specified.

Next, the effects of the present invention will be described more specifically by way of examples.

[Examples] Copper alloy having various component compositions shown in Tables 1 and 2 was melted at 1200 ° C in a high frequency melting furnace using electrolytic copper as a raw material, and cast into an ingot. Then, the ingot was chamfered, heated at 950 ° C. for 1 hour, and hot-rolled into a plate material having a thickness of 8 mm.

[0024]

[Table 1]

[0025]

[Table 2]

Next, the hot rolled sheet was subjected to solution treatment, cold rolling, aging treatment, final cold rolling and strain relief annealing under the conditions shown in Tables 3 and 4 in order to obtain a 0.125 mm plate.

[0027]

[Table 3]

[0028]

[Table 4]

Next, the crystal grain size (average crystal grain size) of each of the obtained plate materials was investigated, and "tensile strength", "elongation", and "elongation" were evaluated as evaluation items as a lead frame material.
"Electrical conductivity", "Repeatable bendability", "Soldering property", "Soldering resistance against peeling", "Ag plating property" and "Etching property" were investigated.

Here, "tensile strength" and "elongation" were measured by a tensile test, and "electrical conductivity" was evaluated by electric conductivity (% IACS). The evaluation criteria of tensile strength and conductivity are
A tensile strength of 65 kgf / mm ² or more was acceptable, and a conductivity of 50% IACS or more was acceptable. "Repeatable bendability" is a 90 degree repetitive bending test in the same direction under the bending condition of "(bending radius) / (sheet thickness) = 1", and the number of times to break is counted by counting the number of reciprocations as one. Evaluated.
In addition, the evaluation criteria of the repetitive bendability were that the number of bending times 4 or more was acceptable (◯), and the number of bending times less than 4 was unacceptable (x).

The "solder wettability" was evaluated by measuring the zero cross time by the surface tension method using a meniscograph using a solder checker. The solder used was 60% Sn-40% Pb, and the solder bath temperature was set to 230 ± 5 ° C. At this time, the zero-cross time was less than 1 second (○), and 1 second or more was rejected (× ) Was evaluated. "Soldering resistance against heat peeling" is 1 after applying 90% Sn-10% Pb solder plating of about 5 μm thickness to the sample.
Hold for up to 1000 hours in air at 50 ° C for 10
Take out every 0 hours and "(bending radius) / (plate thickness) = 1"
90 degree bending was performed once under reciprocal bending conditions, and the presence or absence of plating peeling at the bent portion was examined and evaluated. In addition, the evaluation criteria of the solder heat resistant peeling property were acceptable (◯) when the peeling start time exceeded 500 hours, and judged as bad (x) when the peeling start time was 500 hours or less.

The "silver plating property" is about 5 μm thick on the sample surface.
m was plated with silver, the sample was heated in the air at 350 ° C. for 3 minutes, and then the presence or absence of blistering on the surface of the silver plating was observed and evaluated. In addition, the evaluation standard of the silver-plating property was that the case where no blistering occurred was acceptable (◯), and the case where the blistering occurred was not acceptable (x). The "etchability" was evaluated by etching the sample with ferric chloride and measuring the maximum inclusion size with a scanning electron microscope. The evaluation criteria for the etching property were that the maximum inclusion size was less than 1 μm (good), 1 μm or more and less than 5 μm was acceptable (◯), and 5 μm or more was not (x). The evaluation results are shown in Tables 5 and 6.

[0033]

[Table 5]

[0034]

[Table 6]

From the results shown in Tables 5 and 6, the following is clear. That is, in the test numbers 1 to 26 satisfying the specified conditions of the present invention, the obtained plate materials are all 65 kg.
It can be seen that it has a tensile strength of f / mm ² or more, a conductivity of 50% IACS or more, and is excellent in repeated bending property, soldering property, solder heat-resistant peeling property, Ag plating property and etching property.

On the other hand, in Comparative Example 27, since the Cr content exceeds the upper limit specified in the present invention, the inclusions in the obtained plate material are coarsened to 5 μm or more, and the etching property and the repeated bending The sex is deteriorated. In Comparative Example 29, since the Zr content exceeds the upper limit value specified in the present invention, the repetitive bendability of the obtained plate material is poor. Also, a comparative example
In Nos. 28, 30 and 32, the strength of the obtained plate material did not reach 65 kgf / mm ² because the content of Cr, Zr or Fe was less than the lower limit value specified in the present invention.

In Comparative Example 31, since the respective contents of Ti and Fe exceeded the upper limits specified in the present invention, the conductivity of the obtained plate material was reduced to less than 50% IACS, and further the bending property,
Ag plating property and etching property are deteriorated. Comparative example 3
Nos. 3, 36, and 38 have Fe / Ti weight ratios below the lower limit specified in the present invention, so that the conductivity of the plate material obtained is 50% IACS.
To less than Fe, while in Comparative Examples 34, 35 and 37, Fe /
Since the Ti weight ratio exceeds the upper limit specified in the present invention, the strength of the plate material obtained is low at less than 65 kgf / mm ² .

Further, in Comparative Example 39, the Zn content exceeds the upper limit defined by the present invention, and thus the electrical conductivity of the obtained plate material is low. On the other hand, in Comparative Examples 40 to 43, since the Zn content is below the lower limit value defined in the present invention or is not contained, the solder heat-resistant peeling time of the obtained plate material is 500 although there is an influence of other components. The result is inferior as it is less than the time. In Comparative Examples 41 to 47, the total amount of Sn, In, Mn, P, Mg and Si exceeds the upper limit value defined in the present invention,
The electrical conductivity of the obtained plate material is lowered.

In Comparative Examples 48, 49 and 52, the solution treatment temperature exceeded the upper limit and the crystal grains were coarsened, so that the repetitive bendability of the obtained plate material was deteriorated. In Comparative Example 50, the workability of the first cold rolling exceeds the upper limit defined by the present invention, and the repetitive bendability of the obtained plate material is deteriorated. In Comparative Example 51, the workability of the first cold rolling was lower than the lower limit defined by the present invention, and thus the strength of the obtained sheet material was decreased, and at the same time, the workability of the second cold rolling was higher than the upper limit. Since it exceeds the limit, the plate material obtained is repeatedly deteriorated in bendability. In Comparative Examples 53 and 54, the aging temperature exceeds the upper limit value specified in the present invention, so that the softening of the plate material progresses and the strength of the obtained plate material is lowered. In Comparative Example 55, since the annealing temperature exceeded 700 ° C., remelting proceeded extremely, and the strength and conductivity of the obtained plate material were both reduced.

[0040]

[Summary of Effects] As described above, according to the present invention, the tensile strength, elongation, electrical conductivity, bending workability, etching property, Ag plating property, solderability, and solder heat resistance peeling property are high, and the surface characteristics are high. And highly reliable "high-strength and high-conductivity copper alloy material suitable for electronic equipment such as lead frame material" can be stably manufactured, which greatly contributes to the performance improvement of electronic equipment. It has an extremely useful effect in industry.

Claims (4)

[Claims] 1. A weight ratio of Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, Ti: 0.10 to 0.80%, and "0.
In the case of “10% ≦ Ti ≦ 0.60%”, the Fe / Ti weight ratio satisfies 0.66 to 2.6, and in the case of “0.60% <Ti ≦ 0.80%”, the Fe / Ti weight ratio is
A copper alloy material satisfying 1.1 to 2.6 with the balance being Cu and inevitable impurities, 1) solution heat treatment at a temperature below 950 ° C, 2) cold working at a workability of 50 to 90% , 3) aging treatment at a temperature of 300 to 580 ° C., 4) cold working at a working degree of 16 to 83%, 5) annealing at a temperature of 350 to 700 ° C. A method for producing a high-strength and high-conductivity copper alloy material for electronic devices, which is characterized. 2. The weight ratio of Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, Ti: 0.10 to 0.80%, Zn: 0.05 to 2.0%, and Fe / Ti in 0.10% ≤ Ti ≤ 0.60%
The weight ratio satisfies 0.66 to 2.6, and "0.60% <Ti ≤ 0.80
% ", The Fe / Ti weight ratio satisfies 1.1 to 2.6, and the balance is a copper alloy material consisting of Cu and inevitable impurities. 1) Solution treatment at a temperature lower than 950 ° C, 2) 50 to 90 % Cold working, 3) aging treatment at a temperature of 300 to 580 ° C, 4) cold working at a working degree of 16 to 83%, 5) annealing at a temperature of 350 to 700 ° C, The method for producing a high-strength and high-conductivity copper alloy material for electronic devices, which comprises sequentially performing the following processes in this order. 3. A weight ratio of Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, including Ti: 0.10 to 0.80%, Sn, In, M
One or more of n, P, Mg and Si: contains 0.01 to 1% in total, and Fe / Ti in the case of "0.10% ≤Ti≤0.60%"
The weight ratio satisfies 0.66 to 2.6, and "0.60% <Ti ≤ 0.80
% ", The Fe / Ti weight ratio satisfies 1.1 to 2.6, and the balance is a copper alloy material consisting of Cu and inevitable impurities. 1) Solution treatment at a temperature lower than 950 ° C, 2) 50 to 90 % Cold working, 3) aging treatment at a temperature of 300 to 580 ° C, 4) cold working at a working degree of 16 to 83%, 5) annealing at a temperature of 350 to 700 ° C, The method for producing a high-strength and high-conductivity copper alloy material for electronic devices, which comprises sequentially performing the following processes in this order. 4. The weight ratio of Cr: 0.05 to 0.40%, Zr: 0.03 to 0.25%, Fe: 0.
10 to 1.80%, Ti: 0.10 to 0.80%, Zn: 0.05 to 2.0%
And one or more of Sn, In, Mn, P, Mg, and Si: 0.01 to 1% in total, and "0.10% ≤Ti≤0.60
%, The Fe / Ti weight ratio satisfies 0.66 to 2.6, and "0.
When 60% <Ti ≤ 0.80% ", Fe / Ti weight ratio satisfies 1.1-2.6 and the balance is copper alloy material consisting of Cu and unavoidable impurities. 1) Solution treatment at temperature below 950 ℃ , 2) Cold working at a working degree of 50% or more and 90% or less, 3) Aging treatment at a temperature of 300 to 580 ° C, 4) Cold working at a working degree of 16 to 83%, 5) 350 ~ A method for producing a high-strength and high-conductivity copper alloy material for electronic equipment, characterized in that annealing at a temperature of 700 ° C. and subsequent treatments are sequentially performed in this order.