JP3459520B2 - Copper alloy for lead frame - Google Patents
Copper alloy for lead frameInfo
- Publication number
- JP3459520B2 JP3459520B2 JP23508696A JP23508696A JP3459520B2 JP 3459520 B2 JP3459520 B2 JP 3459520B2 JP 23508696 A JP23508696 A JP 23508696A JP 23508696 A JP23508696 A JP 23508696A JP 3459520 B2 JP3459520 B2 JP 3459520B2
- Authority
- JP
- Japan
- Prior art keywords
- mass
- stamping
- copper alloy
- lead frame
- property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、リードフレームに
適した銅合金に関する。
【０００２】
【従来の技術】電子機器用材料には、電気・熱伝導性
（導電率）、強度が高いこと、Ａｇ等の貴金属のめっき
性や半田めっき性に優れること、半田付け性に優れるこ
と等が求められ、従来より鉄系材料やＣｕ合金が多用さ
れている。ところで、前記諸特性は、半導体機器の小型
薄肉化、高集積化、高密度化に対応してより厳しくなり
つつある。特にリードフレームは多ピン化が進み、導電
率や強度の他、打抜加工性又はエッチング加工性の向上
が求められている。このような状況の中で、電子機器用
材料には、析出硬化型のＣｕ−Ｆｅ系(C1940) 、Ｃｕ−
Ｎｉ−Ｓｉ系(C7025) 、Ｃｕ−Ｃｒ−Ｓｎ系等の銅合金
が用いられるようになった。
【０００３】
【発明が解決しようとする課題】これらの銅合金は導電
率を高める為に、合金元素量をできるだけ少なくし、又
不純物量も極力微量に抑えたものが使用されている。こ
の為エッチング性には優れるが、スタンピング性に劣る
という問題があった。本発明は、熱・電気伝導性（導電
率）、強度、熱間加工性、スタンピング性、半田付け
性、めっき性等に優れたリードフレーム用銅合金を提供
することを目的とする。
【０００４】
【課題を解決するための手段】請求項１記載の発明は、
Ｚｎを 5〜42mass% 含み、Ｓｎ、Ｓｉ、Ａｌ、Ｎｉ、Ｍ
ｎ、Ｔｉ、Ｚｒ、Ｉｎ、Ｍｇ、 0.005〜0.5 mass% のＰ
ｂ、 0.005〜0.5 mass% のＴｅのいずれか１種又は２種
以上を総計で 0.1〜3 mass% 含み、更に、Ｂｉ、Ｃａ、
Ｓｒ、Ｂａのいずれか１種又は２種以上を総計で 0.005
〜3 mass% 含み、残部Ｃｕと不可避的不純物からなるこ
とを特徴とするリードフレーム用銅合金である。
【０００５】
【発明の実施の形態】以下に本発明の電子機器用銅合金
の合金元素について説明する。Ｚｎはスタンピング性を
向上させる。その含有量を 5〜42mass% に規定した理由
は、5 mass% 未満でも42mass% を超えてもそのスタンピ
ング性向上効果が十分に得られなくなる為である。5 ma
ss% 未満では強度も十分に得られない。42mass% を超え
ると導電率、熱間加工性、半田付け性、めっき性も低下
する。特に望ましいＺｎ含有量は15〜38mass% である。
【０００６】Ｓｎ、Ｓｉ、Ａｌ、Ｎｉ、Ｍｎ、Ｔｉ、Ｚ
ｒ、Ｉｎ、Ｍｇ、Ｐｂ、Ｔｅは各々強度、スタンピング
性、半田付け性、めっき性を向上させる。その含有量を
総計で 0.1〜3 mass% に規定した理由は、0.1 mass% 未
満ではその効果が十分に得られず、3 mass% を超えると
熱間加工性と導電率が低下する為である。上記諸元素の
うちＰｂとＴｅは熱間加工後の酸化皮膜除去の際に行う
切削加工性をも改善する。その含有量を各々 0.005〜0.
5 mass% に規定した理由は、 0.005mass% 未満ではその
効果が十分に得られず、 0.5mass% を超えるとスタンピ
ング性が低下する為である。
【０００７】Ｂｉ、Ｃａ、Ｓｒ、Ｂａは、各々スタンピ
ング性と半田付け性を向上させる。その含有量を総計で
0.005〜3 mass% に規定した理由は、0.005 mass% 未満
ではその効果が十分に得られず、3 mass% を超えると熱
間加工性と導電率が低下する為である。これらは単独で
も効果があるが、複数元素を含有させると相互に化合物
を形成してその効果がより向上する。
【０００８】本発明の銅合金は、そのまま用いても優れ
た特性を示すが、更にＡｕ、Ａｇ、Ｎｉ、Ｐｄ、これら
の合金、又は半田等をめっきすることにより半田付け
性、耐応力腐食割れ性等が一層向上する。
【０００９】
【実施例】以下に本発明を実施例により詳細に説明す
る。表１、２に示す種々組成の合金を高周波溶解炉にて
溶解し鋳造して、厚さ30mm、幅 100mm、長さ 150mmの鋳
塊を得た。次にこれら鋳塊を 980℃で厚さ10mmに熱間圧
延し、表面の酸化被膜を切削して除去したのち、種々厚
さの素板に冷間圧延し、次いでこの素板に不活性雰囲気
中で 450℃×2hr の熱処理を施し、次いで各々を厚さ0.
15mmの板材に冷間圧延した。
【００１０】得られた各々の板材について、導電率、引
張強さ、熱間加工性、スタンピング性、半田付け性、め
っき性を調べた。導電率は、JIS-H-0505に、引張強さは
JIS-Z-2241にそれぞれ準じて測定した。熱間加工性は、
熱間圧延後の表面割れを目視観察して調べた。割れのな
いものを○、割れを生じたものを×で表示した。スタン
ピング性は、板材からQFP160ピンタイプのリードフレー
ムを SKD11製金型を用いて打抜き、インナーリードの段
差を測定して評価した。段差は小さい程スタンピング性
の良いことを示す。半田付け性は、板材に共晶半田(Pb-
63mass%Sn)を接着し、これを大気中で 150℃で1000時間
加熱したのち、 180度の密着曲げと曲げ戻しを行い、曲
げ戻し部分の前記共晶半田の接合状態を目視観察して評
価した。剥離のないものを○、剥離のあるものを×と表
示した。めっき性は、電解脱脂後、H2SO4-H2O2溶液でエ
ッチングし、Agめっき浴に浸漬してAgを厚さ 5μｍめっ
きし、その後 475℃で 5分間加熱して膨れの有無を顕微
鏡により観察して評価した。膨れのないものを○、膨れ
のあるものを×と表示した。結果を表３、４に示す。
【００１１】
【表１】【００１２】
【表２】
【００１３】
【表３】【００１４】
【表４】
【００１５】表３、４より明らかなように、本発明例の
No.1〜11は、全調査項目に対し、いずれも優れた特性を
示している。Pbを適量添加したNo.1、Teを適量添加した
No.5は熱間圧延材の面削がとりわけ良好に行えた。これ
に対し、比較例の No.12はZnが少ない為スタンピング性
に劣り、強度も低下した。 No.13はZnが多かった為スタ
ンピング性に劣り、その上、導電率、熱間加工性、半田
付け性、めっき性が低下した。 No.14はSnが少なかった
為、 No.17はSiとAlの量が少なかった為、いずれも強
度、スタンピング性、半田付け性が低下した。 No.16は
Bi,Ca,Sr,Ba のいずれも含有されていない為スタンピン
グ性と半田付け性が劣った。No.15はSnの量が多く、 N
o.18はNiの量が多く、 No.19はBiの量が多く、 No.20は
Caの量が多く、 No.21はSrの量が多く、 No.22はCaとBa
の量が多い為、いずれも導電率が低下し、又熱間加工で
割れが生じた。従来例のNo.23,24は共にスタンピング性
に劣った。 No.24は強度も低かった。
【００１６】得られた板材について応力腐食割れ感受性
をASTM法(G37) に準じて調べた。その結果いずれも耐応
力腐食割れ性に優れることが確認された。
【００１７】
【発明の効果】以上に述べたように、本発明のリードフ
レーム用銅合金は、電気・熱伝導性、強度、熱間加工
性、スタンピング性、半田付け性、めっき性に優れるの
で、電子機器の高密度化、高集積化等に十分対応でき
る。依って、工業上顕著な効果を奏する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy suitable for a lead frame . 2. Description of the Related Art Materials for electronic equipment have high electrical and thermal conductivity (conductivity), high strength, excellent plating properties of noble metals such as Ag, excellent solder plating properties, and excellent solderability. For example, iron-based materials and Cu alloys have been widely used. By the way, the above-mentioned characteristics are becoming more severe in response to the miniaturization, high integration, and high density of semiconductor devices. In particular, lead pins are becoming increasingly multi-pinned, and it is required to improve not only conductivity and strength but also punching workability or etching workability. Under such circumstances, materials for electronic devices include precipitation hardening type Cu-Fe (C1940), Cu-
Copper alloys such as Ni-Si (C7025) and Cu-Cr-Sn have come to be used. [0003] In order to increase the electrical conductivity, these copper alloys have been used in which the amount of alloying elements is reduced as much as possible and the amount of impurities is kept as small as possible. For this reason, the etching property is excellent, but there is a problem that the stamping property is poor. An object of the present invention is to provide a copper alloy for a lead frame excellent in thermal / electrical conductivity (conductivity), strength, hot workability, stamping property, solderability, plating property and the like. [0004] The invention as defined in claim 1 is:
Contains 5 to 42 mass % of Zn, Sn, Si, Al, Ni, M
n, Ti, Zr, In, Mg, 0.005 to 0.5 mass % P
b, contains a total of 0.1 to 3 mass % of one or more of 0.005 to 0.5 mass % of Te, and further contains Bi, Ca,
One or more of Sr and Ba in total 0.005
It is a copper alloy for lead frames , characterized in that it contains about 3 mass % and the balance is Cu and inevitable impurities. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The alloy elements of the copper alloy for electronic equipment of the present invention will be described below. Zn improves the stamping property. The reason that the content specified in 5 to 42 mass%, even exceed 42 mass% in less than 5 mass% is because the stamping improving effect is not sufficiently obtained. 5 ma
If it is less than ss %, sufficient strength cannot be obtained. If it exceeds 42 mass %, the electrical conductivity, hot workability, solderability, and plating property also decrease. A particularly desirable Zn content is 15 to 38 mass %. [0006] Sn, Si, Al, Ni, Mn, Ti, Z
r, In, Mg, Pb, and Te improve strength, stamping property, solderability, and plating property, respectively. The reason why the content is specified as 0.1 to 3 mass % in total is that if the content is less than 0.1 mass %, the effect is not sufficiently obtained, and if it exceeds 3 mass %, hot workability and electrical conductivity decrease. . Among the above elements, Pb and Te also improve the machinability performed when removing the oxide film after hot working. The content of each is 0.005-0.
The reason for specifying 5 mass % is that if the content is less than 0.005 mass %, the effect cannot be sufficiently obtained, and if the content exceeds 0.5 mass %, the stamping property decreases. [0007] Bi, Ca, Sr, and Ba improve the stamping property and the solderability, respectively. Their content in total
Reasons specified in 0.005 to 3 mass%, in less than 0.005 mass% the effect is insufficient, is because more than 3 mass% when the hot workability and conductivity is decreased. These are effective alone, but when they contain a plurality of elements, they form a compound with each other and the effect is further improved. [0008] The copper alloy of the present invention exhibits excellent properties when used as it is. However, by plating Au, Ag, Ni, Pd, an alloy thereof, or solder, the solderability and the stress corrosion cracking resistance are further improved. The properties are further improved. The present invention will be described below in detail with reference to examples. Alloys of various compositions shown in Tables 1 and 2 were melted and cast in a high-frequency melting furnace to obtain ingots having a thickness of 30 mm, a width of 100 mm and a length of 150 mm. Next, these ingots are hot-rolled at 980 ° C to a thickness of 10 mm, the oxide film on the surface is removed by cutting, and then cold-rolled into base plates of various thicknesses. In a heat treatment at 450 ° C for 2 hours,
It was cold rolled into a 15 mm plate. With respect to each of the obtained sheet materials, the conductivity, tensile strength, hot workability, stamping property, solderability, and plating property were examined. Conductivity is JIS-H-0505, tensile strength is
The measurement was performed according to JIS-Z-2241. Hot workability is
Surface cracks after hot rolling were visually observed and examined. Those without cracks were indicated by ○, and those with cracks were indicated by x. The stamping property was evaluated by stamping a QFP160 pin type lead frame from a sheet material using a SKD11 mold and measuring the step of the inner lead. The smaller the step, the better the stamping property. Solderability is determined by eutectic solder (Pb-
63 mass % Sn) and heated in air at 150 ° C. for 1000 hours, then subjected to 180 ° close bending and bending back, and visually observed the bonding state of the eutectic solder at the bent back part. evaluated. A sample without peeling was indicated by "O", and a sample with peeling was indicated by "X". Plating properties were as follows: electrolytic degreasing, etching with H 2 SO 4 -H 2 O 2 solution, immersion in an Ag plating bath, plating Ag with a thickness of 5 μm, and then heating at 475 ° C for 5 minutes to check for blisters. It was observed and evaluated with a microscope. Those without swelling were indicated by ○, and those with swelling were indicated by ×. The results are shown in Tables 3 and 4. [Table 1] [Table 2] [Table 3] [Table 4] As is clear from Tables 3 and 4,
Nos. 1 to 11 show excellent characteristics for all the survey items. No. 1 with an appropriate amount of Pb added, and an appropriate amount of Te added
In No. 5, the hot-rolled material was cut particularly well. In contrast, No. 12 of the comparative example was inferior in stamping property and reduced in strength because of a small amount of Zn. No.13 was inferior in stamping property due to the large amount of Zn, and furthermore, conductivity, hot workability, solderability, and plating property were reduced. No. 14 had a small amount of Sn, and No. 17 had a small amount of Si and Al, so that the strength, stamping properties, and solderability were all reduced. No.16 is
Since neither Bi, Ca, Sr, or Ba was contained, the stamping properties and solderability were poor. No.15 has a large amount of Sn and N
o.18 has a large amount of Ni, No.19 has a large amount of Bi, and No.20 has a large amount of Bi.
No. 21 has a large amount of Ca, No. 21 has a large amount of Sr, and No. 22 has a large amount of Ca and Ba.
, The conductivity decreased and cracking occurred during hot working. Both Nos. 23 and 24 of the prior art were inferior in stamping properties. No. 24 had low strength. The obtained sheet material was examined for susceptibility to stress corrosion cracking according to the ASTM method (G37). As a result, it was confirmed that all were excellent in stress corrosion cracking resistance. As described above, the lead frame of the present invention is
Since copper alloys for lame are excellent in electrical and thermal conductivity, strength, hot workability, stamping properties, solderability, and plating properties, they can sufficiently cope with high density and high integration of electronic devices.
You. I Yo, provides the industrial significant effect.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 平井 崇夫 東京都千代田区丸の内２丁目６番１号 古河電気工業株式会社内 (56)参考文献 特開 平１−123041（ＪＰ，Ａ) 特開 昭63−156443（ＪＰ，Ａ) 特開 平６−184675（ＪＰ，Ａ) 特開 平１−156443（ＪＰ，Ａ) 特開 平５−311278（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C22C 9/04 H01L 23/48 ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Takao Hirai 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (56) References JP-A 1-123041 (JP, A) JP-A Sho 63-156443 (JP, A) JP-A-6-184675 (JP, A) JP-A-1-156443 (JP, A) JP-A-5-311278 (JP, A) (58) Fields investigated (Int. Cl. 7, DB name) C22C 9/04 H01L 23/48
Claims (1)
Ａｌ、Ｎｉ、Ｍｎ、Ｔｉ、Ｚｒ、Ｉｎ、Ｍｇ、 0.005〜
0.5 mass% のＰｂ、 0.005〜0.5 mass% のＴｅのいずれ
か１種又は２種以上を総計で 0.1〜3 mass% 含み、更
に、Ｂｉ、Ｃａ、Ｓｒ、Ｂａのいずれか１種又は２種以
上を総計で 0.005〜3 mass% 含み、残部Ｃｕと不可避的
不純物からなることを特徴とするリードフレーム用銅合
金。(57) [Claims 1] It contains 5 to 42 mass % of Zn, and contains Sn, Si,
Al, Ni, Mn, Ti, Zr, In, Mg, 0.005 ~
0.5 mass% of Pb, comprise 0.1 to 3 mass% in total of one or more one of 0.005 to 0.5 mass% of Te, further, Bi, Ca, Sr, any one or more of Ba hints 0.005 to 3 mass% in total, the lead frame copper alloy and the balance Cu and unavoidable impurities.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23508696A JP3459520B2 (en) | 1996-09-05 | 1996-09-05 | Copper alloy for lead frame |
| PCT/JP1997/003080 WO1998010105A1 (en) | 1996-09-05 | 1997-09-03 | Copper alloy for electronic devices |
| KR1019980703273A KR20000064324A (en) | 1996-09-05 | 1997-09-03 | Copper alloy for electronic device |
| TW86112865A TW434324B (en) | 1996-09-05 | 1997-09-03 | Copper alloy for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23508696A JP3459520B2 (en) | 1996-09-05 | 1996-09-05 | Copper alloy for lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1081926A JPH1081926A (en) | 1998-03-31 |
| JP3459520B2 true JP3459520B2 (en) | 2003-10-20 |
Family
ID=16980866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23508696A Expired - Fee Related JP3459520B2 (en) | 1996-09-05 | 1996-09-05 | Copper alloy for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3459520B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056396B2 (en) | 1998-10-09 | 2006-06-06 | Sambo Copper Alloy Co., Ltd. | Copper/zinc alloys having low levels of lead and good machinability |
| US8506730B2 (en) | 1998-10-09 | 2013-08-13 | Mitsubishi Shindoh Co., Ltd. | Copper/zinc alloys having low levels of lead and good machinability |
| JP3917304B2 (en) * | 1998-10-09 | 2007-05-23 | 三宝伸銅工業株式会社 | Free-cutting copper alloy |
| JP4129807B2 (en) * | 1999-10-01 | 2008-08-06 | Ｄｏｗａホールディングス株式会社 | Copper alloy for connector and manufacturing method thereof |
| ES2387065T3 (en) | 2005-09-22 | 2012-09-12 | Mitsubishi Shindoh Co., Ltd. | Easy machining copper alloy that contains very low lead content |
| KR101083122B1 (en) * | 2011-05-11 | 2011-11-11 | 조주현 | Cu-p-sr brazing alloy |
| JP6029296B2 (en) * | 2012-03-08 | 2016-11-24 | Ｊｘ金属株式会社 | Cu-Zn-Sn-Ca alloy for electrical and electronic equipment |
| JP5869422B2 (en) * | 2012-05-09 | 2016-02-24 | サンエツ金属株式会社 | Brass alloy with excellent high temperature brittleness resistance |
-
1996
- 1996-09-05 JP JP23508696A patent/JP3459520B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1081926A (en) | 1998-03-31 |
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