JP2712988B2 - Electronic component manufacturing jig and electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for manufacturing an electronic component and a method for manufacturing an electronic component, and more particularly, to a jig used for forming an electrode on an outer surface of an electronic component body by a dry plating method. The present invention relates to a component manufacturing jig and a method for manufacturing an electronic component using the jig.

[0002]

2. Description of the Related Art Conventionally, external electrodes of an electronic component such as a multilayer capacitor have been formed by applying a paste containing Ag or an Ag-Pd alloy to a predetermined portion of the outer surface of an electronic component body and baking it. . An example of this type of external electrode forming method will be described with reference to FIGS.

First, a jig 2 is prepared by forming a large number of through holes 1 in a rectangular plate member whose outer surface is made of silicon rubber (FIG. 6). Next, an electronic component element on which an external electrode is to be formed is inserted into the through hole 1 of the jig 2, and the electronic component element element is inserted into the through hole 1 as shown in a cross-sectional view of FIG. 3
Hold. The electronic component body 3 shown in FIG. 7 is a ceramic sintered body for a multilayer capacitor in which a plurality of internal electrodes 4 are embedded. Electronic component body 3 is inserted into through hole 1 of jig 2
While holding as shown in the figure, the external electrode layers 5a and 5b are formed by applying and baking Ag or an Ag-Pd-containing paste on both end surfaces of the electronic component body 3. Since the external electrode layers 5a and 5b contain Ag, when soldering is performed, a solder cracking phenomenon occurs. Therefore,
External electrode layers 5a, 5b
The external electrode layers 6a and 6b made of Ni are formed on the outer surface of the substrate by wet plating. Further, since the external electrode layers 6a and 6b made of Ni have poor solderability, in order to enhance the solderability, the outer surfaces of the external electrode layers 6a and 6b are further coated with Sn or Sn—Pb alloy by wet plating. The external electrode layers 7a and 7b made of are formed.

However, when the external electrode layers 6a, 6b, 7a, and 7b are formed by the wet plating method as described above, the plating solution may enter the electronic component element body 3 or may be formed between the external electrode layers 5a to 7b. There is a problem that the electronic component body 3 and the internal electrode 4 may be corroded due to the remaining. Therefore, a method has been proposed in which external electrodes are formed by a dry plating method such as evaporation or sputtering instead of the wet plating method.

[0005]

However, using the jig 2 whose outer surface is made of silicon rubber, dry plating is performed with the electronic component body 3 held in the through-hole 1. In this case, there were various problems as described below. That is, the dry plating is performed in a high vacuum of about 1 × 10 ⁻³ torr and a high temperature exceeding 200 ° C.
Under such an environment, the silicon rubber is decomposed in the jig 2 to generate gas, and pores are formed between the electrode film and the electronic component element, so that the adhesion strength of the electrode film is reduced. ,
In some cases, an electrode film having a desired composition could not be formed.

When dry plating is performed while holding the electronic component element body 3 in the through hole 1, a dry plating film is formed on the inner peripheral surface of the through hole 1 of the jig 2 and on both main surfaces of the jig 2. Or the size of the through-hole 1 tends to change. Therefore, it is necessary to remove the dry plating film adhered to the jig 2 by etching, but the silicon rubber of the jig 2 was corroded by an etchant for removing the dry plating film, and could not be used repeatedly. .

An object of the present invention is to provide a jig for manufacturing an electronic component, which is suitable for forming an external electrode by a dry plating method and is made of a material which is not attacked by an etching solution for removing an attached dry plating film. An object of the present invention is to provide a method for manufacturing an electronic component using the jig for manufacturing an electronic component.

[0008]

A first invention of the present application is a jig for manufacturing an electronic component used for forming an electrode on an electronic component body by dry plating, and has a plurality of through holes formed therein. A metal plate, formed so as to cover the inner surface of the through-hole of the metal plate and both main surfaces of the metal plate, thereby being smaller than the outer shape of the electronic component body and inserting the inserted electronic component body; A jig for manufacturing an electronic component, comprising: a fluorine-based rubber layer forming a holding hole having an inner peripheral surface having a shape and dimensions to be in close contact with a portion.

According to a second aspect of the present invention, an electronic component element is inserted into a holding hole of the electronic component manufacturing jig according to the first aspect, and an electrode forming portion is projected from the holding hole. Holding the electronic component body so as to form an electrode on the electrode forming portion of the electronic component body by a dry plating method,
A method for manufacturing an electronic component, comprising the steps of:

[0010]

In the jig for manufacturing an electronic component according to the first aspect of the present invention, since the surface is formed of a fluorine-based rubber layer, it is difficult to be decomposed even in a high vacuum and high temperature environment. Further, even if the dry plating film adhered to the surface of the jig is removed by a strongly acidic etching solution, the dimension of the holding hole hardly changes because the fluorine-based rubber layer has excellent acid resistance. In the method of manufacturing an electronic component according to the second aspect of the present invention, an electrode is formed on the electrode forming portion of the electronic component body by a dry plating method using the electronic component manufacturing jig according to the first aspect of the present invention. Moreover,
Since the electrode forming portion projects from the holding hole and is subjected to dry plating, the inner surface of the holding hole of the jig also functions as a mask, so that the electrode is accurately formed by dry plating.
In addition, since an electronic component having an external electrode formed by the dry plating film can be obtained, corrosion of the electronic component body and the internal electrode formed in the electronic component body hardly occurs.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component manufacturing method using an electronic component manufacturing jig according to an embodiment of the present invention will be described below.
Electronic component manufacturing jig 11 shown in FIG.
2 and are prepared. The electronic component manufacturing jig 11 is formed by forming a fluorine-based rubber layer described later on the outer surface of the rectangular metal plate 13 shown in FIG. On the metal plate 13,
A large number of through holes 14 are aligned and formed, and a reference hole 15 for performing a positioning operation to be described later is provided near the corner.
Are formed. The jig 11 for manufacturing an electronic component shown in FIG. 2 is formed by forming a fluorine-based rubber layer so as to cover the inner surface of the through hole 14 of the metal plate 13 and both main surfaces of the metal plate 13. .

That is, as shown partially in a sectional view in FIG. 1A, a fluorine-based material having a predetermined thickness is provided so as to cover both main surfaces of the metal plate 13 and the inner peripheral surface of the through hole 14. A rubber layer 16 is formed. By adjusting the thickness of the fluorine-based rubber layer 16, a holding hole 17 having a shape and dimensions suitable for the outer shape of the electronic component body 12 shown in FIG. 2 is formed. The holding hole 17 having a shape and dimensions suitable for the outer shape of the electronic component body 12 is a state in which the outer surface of the electronic component body 12 is in a state where the electronic component body 12 is inserted into the holding hole 17. The jig 1 for manufacturing an electronic component according to the present embodiment refers to a shape and a size so as to be in close contact with the inner surface of the
Then, the inner surface of the holding hole 17 also functions as a mask in dry plating described later.

The metal plate 13 is used for maintaining the shape of the jig 11, and can be made of an appropriate material such as a stainless steel plate. The fluorine-based rubber layer 16 is made of a fluorine resin, can withstand a temperature exceeding 300 ° C., and
Even when heated to a temperature exceeding 200 ° C. under a high vacuum exceeding × 10 ⁻³ torr, decomposition and the like hardly occur. As is clear from FIGS. 1 and 2, even after the fluorine-based rubber layer 16 is formed, the reference hole 15 (see FIG. 3)
Is exposed. That is, the fluorine rubber layer 16 is formed so that the reference hole 15 is exposed.

Next, with reference to the reference hole 15, FIG.
The electronic component body 12 is inserted into the holding hole 17 as shown in FIG. Since the inner surface of the holding hole 17 is formed in a shape and a size suitable for the outer shape of the electronic component body 12, the inserted electronic component body 12 is, as shown in FIGS.
It is held in the holding hole 17. And the holding hole 17
In this state, the outer peripheral side surface of the electronic component body 12 is in close contact with the fluorine-based rubber layer 16, so that the electrodes 18 and 19 can be formed by dry plating in this state. That is, the electrodes 18 and 19 made of the dry plating film are formed on the outer surface of the electronic component body 12 except for the portion covered by the inner surface of the holding hole 17.

The reference hole 15 is exposed because the outer surface of the jig 11 is covered with a fluorine-containing rubber layer 16 having elasticity. This is because the positioning error increases when used. That is, the reference holes 15 are previously formed in the metal plate 13 serving as the internal skeleton material, and the electrodes 18 and 19 are inserted and removed by using the reference holes 15 as a positioning reference to insert and remove the electronic component body 12. It can be formed accurately.

In the conventional method of forming an external electrode using a wet plating method, there is a problem that the plating solution remains, thereby causing corrosion of the electronic component element and the internal electrode.
In this embodiment, since the electrodes 18 and 19 are formed by the dry plating method, the above-described problem due to the residual plating solution does not occur. In addition, since the fluorine-based rubber layer 16 is excellent in heat resistance and hardly decomposed even when heated under high vacuum, the electrodes 18 and 19 formed of a dry plating film having a desired composition and having excellent adhesion strength are formed. can do. When the electrodes 18 and 19 are formed by the dry plating method, the outer surface of the jig 11, that is, the holding hole 1 of the fluorine rubber layer 16 is formed.
A dry plating film is also formed in a portion except for the inside of the substrate 7, and such a dry plating film is formed by nitric acid, sulfuric acid, hydrochloric acid,
It can be easily removed with an etching solution such as an iron solution. In addition, even if the dry plating film is removed using such a strongly acidic etching solution, the fluorine-based rubber layer 16 is excellent in acid resistance, so that there is no possibility that the dimensions of the holding holes 17 will be out of order. .

Further, as is apparent from FIGS. 1A and 1B, the inner surface of the holding hole 17 also functions to mask the electronic component body 12, so that by adjusting the thickness of the jig 11, The electrodes 18 and 19 as external electrodes can be formed in desired areas, that is, not only on both end faces of the electronic component body, but also on four side faces connecting the both end faces. In addition,
As shown in FIG. 1B, the electrodes 18 and 19 are formed by the above-mentioned dry plating method, and the electrodes 18 and 19 can be formed in the same process by vapor deposition in a vacuum chamber. Also in the sputtering method, if the targets are arranged both above and below the electronic component element body 12, they can be formed in the same step. However,
The electrodes 18 and 19 may be formed in another step.

Further, when the length of the electronic component body is long, a plurality of jigs 11 are stacked as shown in FIG. It is also possible to form external electrodes on both end faces. in this way,
The electronic component manufacturing jig 11 of the present embodiment may be used by laminating a plurality of pieces. In FIG. 1B, the electrodes 18, 1 made of a dry plating film are directly provided on both end surfaces of the electronic component body 12.
9 was formed, but electrodes 18 and 19 made of a dry plating film were formed.
An electrode layer made of Ag or an Ag—Pd alloy or the like may be formed in advance on the underlayer. Further, in order to increase the adhesion strength of the fluorine-based rubber layer 16 to the metal plate 13, it is preferable that the surface of the metal plate 13 is treated by blasting.

The dimensions of the holding hole 17 are as follows.
It is preferable to make the size of the electronic component body 12 smaller by about 1 to 10% than the size of a portion to be inserted into the holding hole 17. The reason will be described with reference to FIG. FIG. 5 shows the diameter of the holding hole 17 when the electrode is formed a plurality of times by the dry plating method using the electronic component manufacturing jig 11 and when the attached dry plating film is removed by etching according to the above embodiment. FIG. In FIG. 5, DM stands for dry plating. As is clear from FIG. 5, the diameter of the holding hole 17 is increased by about 3 to 4% after the electrode is first formed by the dry plating method. Also, even if electrode formation by dry plating is repeated a plurality of times, the size of the hole is almost the same as that after the first plating, and the dry plating film adhered to the surface of the fluorine-based rubber layer It can be seen that after removing by etching, the hole size returns to the initial value. This is due to the difference in linear expansion coefficient between the fluorine-based rubber layer 16 and the dry plating film adhered to the surface thereof, that is, the fluorine-based rubber layer 16 is greatly expanded by the heat during the dry plating as compared with the dry plating film. It is considered that the dry plating film was formed. However, the rate of change in the size of the holding hole 17 differs depending on the conditions of the dry plating.

Therefore, the size of the holding hole 17 is set so that the electronic component body 12 can be held sufficiently and securely even if the holding hole becomes large when the electrode is formed by dry plating. It must be smaller than the inside diameter of the part to be inserted into the holding hole. Therefore, as described above, it is preferable that the size of the holding hole 17 be smaller by about 1 to 10% than the outer diameter of the part where the electronic component element body to be inserted into the holding hole 17 is inserted. In the above embodiment, the sintered body for a rectangular multilayer capacitor is shown as the electronic component body 12, but the electronic component manufacturing jig and the electronic component manufacturing method of the present invention are not limited to the multilayer capacitor. The present invention can also be applied to a case where an electrode is formed on the outer surface of the electronic component and a case where an electrode is formed on the outer surface of the electronic component body having a shape other than the rectangular shape.

[0021]

As described above, in the jig for manufacturing an electronic component according to the present invention, the surface is constituted by a fluorine-based rubber layer, and the fluorine-based rubber layer is excellent in heat resistance, high vacuum and high vacuum. Since it is difficult to decompose at high temperature, an electrode film having a desired composition and excellent adhesion strength can be formed by dry plating. Further, since the fluorine-based rubber layer is also excellent in acid resistance, even if the unnecessary dry plating film adhered to the surface of the electronic component manufacturing jig is removed with a strongly acidic etching solution, corrosion or the like hardly occurs.

In addition, since the inner peripheral surface of the holding hole formed in the fluororubber layer is in close contact with the inserted electronic component body, the inner surface of the holding hole is dry-plated on the electronic component body. It acts as a mask for this. Therefore, an electrode can be reliably formed on a desired portion of the outer surface of the electronic component body, and the invasion of the electrode material to a portion to be masked by the elasticity of the fluorine-based rubber layer is reliably prevented.
Short circuit failure accidents can be reliably prevented.

Further, since the mechanical strength of the electronic component manufacturing jig is enhanced by the metal plate, there is no need to externally reinforce the electronic component manufacturing jig. Therefore, complicated steps such as assembling and screwing of the electronic component manufacturing jig can be omitted, so that the cost of the electronic component manufacturing jig does not increase. Therefore, according to the electronic component manufacturing method using the electronic component manufacturing jig of the present invention, the electrodes can be accurately formed on the outer surface of the electronic component body by the dry plating method. Can be solved, and an electronic component having excellent reliability can be provided.

[Brief description of the drawings]

FIGS. 1A and 1B are a partially cutaway perspective view and a partially cutaway sectional view showing a state in which an electrode is formed by inserting an electronic component body into a holding hole in one embodiment of the present invention.

FIG. 2 is a perspective view showing a step of inserting an electronic component body into an electronic component manufacturing jig.

FIG. 3 is a perspective view showing a metal plate used for an electronic component manufacturing jig.

FIG. 4 is a partially cutaway perspective view showing an example in which two electronic component manufacturing jigs are stacked and used in another embodiment of the present invention.

FIG. 5 is a diagram showing a change in the size of a holding hole when dry plating is repeated a plurality of times in an example.

FIG. 6 is a perspective view showing a conventional electronic component manufacturing jig.

FIG. 7 is a partially cutaway sectional view showing a step of forming external electrodes on an electronic component body by a wet plating method using a conventional electronic component manufacturing jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Electronic component manufacturing jig 12 ... Electronic component base 13 ... Metal plate 16 ... Fluorine-based rubber layer 17 ... Holding hole 18, 19 ... Electrode

Claims (2)

(57) [Claims] An electronic component manufacturing jig used when forming an electrode on an electronic component body by dry plating, comprising: a metal plate having a large number of through holes; It is formed so as to cover both the inner surface and both main surfaces of the metal plate, so that it is smaller than the outer shape of the electronic component body and has a shape and a size that are in close contact with the inserted portion of the inserted electronic component body. A jig for manufacturing an electronic component, comprising: a fluorine-based rubber layer having a holding hole having a peripheral surface. 2. The electronic component element according to claim 1, wherein an electronic component element is inserted into the holding hole of the electronic component manufacturing jig according to claim 1, so that an electrode forming portion projects from the holding hole. A method for manufacturing an electronic component, comprising: holding a body; and forming an electrode on the electrode forming portion of the electronic component body by a dry plating method.