JP2010027888A - Method for manufacturing electronic component and device for manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal forming device and a terminal forming method, by which it does not take much time and efforts to perform a process of changing and positioning a surface, where a thin film becoming an external terminal is formed. <P>SOLUTION: A pair of centering plates 21 and 22 is put closer to each other to bring elastic portions 21A and 22A of the pair of the centering plates 21 and 22 into contact with one end and the other end of each of a plurality of chip component bodies 2A in a predetermined length direction, respectively. Consequently, center positions of component body holding grooves in an extending direction of the component body holding grooves are made to meet center positions of all the chip component bodies 2A in the predetermined length direction. Then a spray coating process, a spray cleaning process, a blast process, a plating process, an etching process, a process of sticking conductive paste, resist, resin, etc., on an exposed region, etc., are carried out in a state where the chip component bodies 2A are clamped with rubber films of the component body holding grooves. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component manufacturing method and an electronic component manufacturing apparatus for forming terminal electrodes such as chip components.

  As a method for forming a terminal electrode of a chip component such as a chip capacitor constituting an electronic component manufacturing method, after forming a terminal electrode as an external electrode at one end of the component body constituting the chip component, A method of forming a terminal electrode as an external electrode at the end is conventionally known.

  Japanese Patent Application Laid-Open No. 7-263273 (Patent Document 1) describes a method of forming a terminal electrode having this configuration. In the terminal electrode forming method, the capacitor main body as the component main body is inserted into the holding hole formed in the holding plate, and the plate is pressed against the lower side of the holding plate so that the upper end surface of the capacitor main body and the vicinity thereof Make the part protrude. And the thin film used as a terminal electrode is made to adhere to the upper end surface of the capacitor | condenser main body which protruded from the upper surface of the holding plate.

Next, a thin film to be a terminal electrode is formed on the lower end surface which is the end surface on the opposite side of the capacitor body. Specifically, another plate is pressed against the upper side of the holding plate to project the lower end surface of the capacitor body and the vicinity thereof from the lower surface of the holding plate. Then, the holding plate is turned upside down, and a thin film serving as a terminal electrode is attached to the lower end surface of the capacitor body protruding from the lower surface of the holding plate.
JP-A-7-263273

  However, in the method of forming the terminal electrode described in the above publication, after forming the thin film that becomes the external electrode on the upper end surface of the capacitor body as the component body as described above, the external electrode and the lower end surface of the capacitor body are formed. In other words, the process of positioning the portion where the thin film is to be formed is performed by changing the surface on which the thin film that is to be the external electrode is formed.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component manufacturing method and an electronic component manufacturing apparatus that do not require a troublesome process for positioning by changing a surface on which a thin film to be an external electrode is formed.

  In order to achieve the above object, the present invention provides a pair of holding parts each having opposing surfaces capable of holding a component main body having one end and the other end and having a predetermined length in a direction connecting the one end and the other end. A plurality of component body holding grooves are formed in parallel on at least one of the opposing surfaces to define at least each of the opposing surfaces and the component body holding grooves of the clamping portion. The surface of the clamping part formed is covered with an elastic member, and the length of the component body holding groove in the extending direction is shorter than the predetermined length of the component body, and one end of the component body holding groove in the extending direction The other end refers to the component main body holder that opens at the end face of the clamping portion, and the side surface in the length direction of the component main body is engaged in each component main body holding groove to support the component main body by the clamping portion. And extending the component body holder groove with the component body holder The component main body supporting step for positioning at a predetermined position and a pair of abutting members that can abut against one end and the other end of each component main body, and the pair of abutting abutting against one end and the other end of the component main body At least the surface portions of the contact surfaces of the members are pressed by causing the elastic portions of one corresponding contact member to contact one end of all the component bodies of the centering means having elastic portions that can be elastically deformed with the same displacement amount. At the same time, the elastic portion of the other corresponding contact member is brought into contact with and pressed against the other ends of all the component main bodies, so that the central position of the component main body holding grooves and the parts in the extending direction of the component main body holding grooves There is provided a method of manufacturing an electronic component having a centering step for matching the longitudinal center positions of all the component main bodies supported by the main body holding grooves.

  A pair of clamping portions each having a facing surface capable of sandwiching a component main body having a predetermined length in a direction connecting the one end and the other end, the facing surfaces being at least spaced apart from each other A plurality of component body holding grooves are formed in parallel on one opposing surface, and at least each of the opposing surfaces of the clamping part and the surface of the clamping part that defines the component body holding groove are covered with an elastic member. The length in the protruding direction is shorter than the predetermined length of the component main body, and one end and the other end in the extending direction of the component main body holding groove are in the respective component main body holding grooves of the component main body holder that opens at the end face of the clamping part. A component main body supporting step for engaging the side surfaces in the length direction of the component main body to support the component main body by the clamping portion, and positioning the component main body holder at a predetermined position in the extending direction of the component main body holding groove, and each component main body One end, the other end At least the surface portions of the contact surfaces of the pair of contact members that contact the one end and the other end of the component main body with a pair of contact members that can contact each other have elastic portions that can be elastically deformed with the same displacement amount. By pressing the elastic part of one abutting member against one end of all the component bodies and pressing the elastic part of the other abutting member against the other ends of all the component bodies A centering step for matching the center positions of the component body holding grooves in the extending direction of the component body holding grooves with the center positions in the length direction of all the component bodies supported by the component body holding grooves. Even if there are variations in the length of the component main body in the longitudinal direction, all the component main bodies can be centered in the component main body holder.

  In addition, by sandwiching the plurality of component bodies centered in this way with the elastic members of the pair of sandwiching portions, each component body can be used even when there is a variation in the cross-sectional shape cut perpendicular to the longitudinal direction of the component body. The central region of the side surface of the component body can be masked without a gap, and one end portion and the other end portion in the length direction of the component main body can be exposed regions that are not masked.

  In addition, the elastic member is in close contact with the masked central region, and the exposed region which is a part of the outer surface of the component main body and is not masked by the component main body holding groove is formed as a terminal electrode as it is. An area to be processed can be set. For this reason, it is possible to reliably perform the predetermined process only on the area where the predetermined process is desired.

  Here, after the centering step, the opposing surfaces are brought close to each other and brought into surface contact with each other so that the component bodies are inserted into the respective component body holding grooves, and the length of the component body is set between the pair of clamping portions. And sandwiching the side surface in the longitudinal direction and masking the central region of the side surface in the length direction of the component body with the elastic member, the portion is part of the outer surface of the component body and is masked with the elastic member. It is preferable to perform an exposed region processing step of performing a predetermined process on the unexposed region.

  After the centering step, the side surfaces in the length direction of the component main body are clamped by a pair of clamping portions in a state where the component main bodies are respectively inserted in the respective component main body holding grooves by bringing the opposing surfaces closer to each other and abutting the surfaces. When the central region of the side surface in the longitudinal direction of the main body is masked with an elastic member, an exposed region that performs a predetermined treatment on an exposed region that is part of the outer surface of the component main body and is not masked with the elastic member In order to carry out the processing steps, once a plurality of component bodies are centered and once sandwiched by a pair of sandwiching portions and mounted on the component body holder, a predetermined process is performed on one end in the length direction of all the component bodies. After that, when performing a predetermined process on all the other end parts or when performing another predetermined process on the one end part of all the component main bodies, the position of each component main body is not adjusted with respect to the component main body holder. Need. Therefore, it is not necessary to move all the component main bodies with respect to the component main body holder when performing another predetermined process after all the component main bodies are once mounted on the component main body holder. It is not necessary to bring a jig or the like into contact, and it is not necessary to bring anything into contact with the one end subjected to the predetermined treatment. As a result, when another predetermined process is performed, it is possible to prevent damage to one end portion that has already been subjected to the predetermined process.

  Further, since the predetermined processing can be performed with a plurality of component main bodies mounted on the component main body holder, the predetermined processing can be performed collectively for each component main body holder.

  In the exposed region processing step, it is preferable that the predetermined processing is simultaneously performed on one end and the other end in the length direction of the component main body held by the holding portion. In the exposed region processing step, predetermined processing is simultaneously performed on one end and the other end in the length direction of the component main body sandwiched between the sandwiching portions. For example, the predetermined processing is heating such as end electrode formation processing by sputtering or the like. In the case of the processing to be performed, the end surface portion of the sandwiching portion near one end in the length direction of the component body and the end surface portion of the sandwiching portion near the other end in the length direction of the component body can be similarly heated. For this reason, the thermal deformation of the component main body holder can be suppressed as much as possible. For this reason, the dimensional accuracy of the terminal electrode etc. provided by the predetermined process can be improved. Moreover, since a predetermined process can be performed simultaneously on both one end and the other end in the length direction of the component main body, the production efficiency can be improved.

  Moreover, it is preferable that this predetermined process is a terminal electrode formation process which forms a terminal electrode in this exposed area. Since the predetermined process is a terminal electrode forming process in which the terminal electrode is formed in the exposed region, the terminal electrode can be efficiently formed on a plurality of component bodies at once.

  The present invention also includes a pair of clamping portions each having an opposing surface capable of clamping a component body having one end and the other end and having a predetermined length in a direction connecting the one end and the other end. A plurality of component main body holding grooves are formed in parallel on at least one of the opposing surfaces, and at least each of the opposing surfaces of the holding portion and the holding portion of the holding portion defining the component main body holding groove. The surface is covered with an elastic member, and the length of the component main body holding groove in the extending direction is shorter than the predetermined length of the component main body. One end and the other end of the component main body holding groove in the extending direction are The lengths of the component main bodies at the pair of sandwiching portions in the state where the component main bodies are inserted into the respective component main body holding grooves by opening the respective end surfaces of the respective parts and bringing the opposed surfaces into contact with each other and contacting the surfaces. The side of the component body can be sandwiched and the length of the component body Component main body holder capable of masking the central region of the side surface in the direction, component main body holder positioning means for positioning the component main body holder at a predetermined position in the extending direction of the component main body holding groove, one end of each component main body, etc. A pair of abutting members that can abut each of the ends, and at least surface portions of the abutting surfaces of the pair of abutting members that abut one end and the other end of the component main body are elastically deformable with the same amount of displacement. Each elastic body of one corresponding contact member abuts and presses against one end of all the component main bodies, and at the same time the elastic portion of the other corresponding contact member contacts the other end of all of the component main bodies. Centering that matches the center position of the component body holding groove in the extending direction of the component body holding groove with the center position in the length direction of all the component bodies supported by the component body holding groove by pressing hand It provides an apparatus for producing an electronic component including and.

  A pair of clamping portions each having a facing surface capable of sandwiching a component main body having a predetermined length in a direction connecting the one end and the other end, the facing surfaces being at least spaced apart from each other A plurality of component body holding grooves are formed in parallel on one opposing surface, and at least each of the opposing surfaces of the clamping part and the surface of the clamping part that defines the component body holding groove are covered with an elastic member. The length in the protruding direction is shorter than the predetermined length of the component body, and one end and the other end in the extending direction of the component body holding groove are opened at the end surface of the clamping part, and the opposing surfaces are brought close to each other and are in surface contact with each other. The side surfaces in the length direction of the component main body can be clamped by the pair of holding portions in a state where the component main body is inserted into each component main body holding groove, and the central region of the side surface in the length direction of the component main body can be masked Parts body holder A component body holder positioning means for positioning the component body holder at a predetermined position in the extending direction of the component body holding groove, and a pair of abutting members capable of abutting on one end and the other end of each component body. At least the surface portions of the abutting surfaces of the pair of abutting members that abut one end and the other end have elastic portions that can be elastically deformed with the same amount of displacement, respectively. The center of the component body holding groove in the extending direction of the component body holding groove and the component body are obtained by the elastic portion of the other contact member abutting against and pressing the other end of all the component bodies at the same time as the elastic portion contacts and presses Since there is a centering means for matching the center position in the length direction of all the component bodies supported by the holding grooves, even when there are variations in the dimensions in the longitudinal direction of the plurality of component bodies, The component body of Te can be centered in the component body holder.

  In addition, by sandwiching the plurality of component bodies centered in this way with the elastic members of the pair of sandwiching portions, each component body can be used even when there is a variation in the cross-sectional shape cut perpendicular to the longitudinal direction of the component body. The central region of the side surface of the component body can be masked without a gap, and one end portion and the other end portion in the length direction of the component main body can be exposed regions that are not masked.

  In addition, the elastic member is in close contact with the masked central region, and the exposed region which is a part of the outer surface of the component main body and is not masked by the component main body holding groove is formed as a terminal electrode as it is. An area to be processed can be set. For this reason, it is possible to reliably perform the predetermined process only on the area where the predetermined process is desired.

  Here, the side surfaces in the length direction of the component main body are clamped by the pair of clamping portions in a state in which the component main bodies are respectively fitted in the component main body holding grooves by bringing the opposing surfaces close to each other and abutting the surfaces. And when the central region of the side surface of the component body in the length direction is masked by the elastic member, the exposed region which is a part of the outer surface of the component body and is not masked by the elastic member. It is preferable to provide an exposed area processing means for performing predetermined processing.

  The side surfaces in the length direction of the component main body are clamped between the pair of holding portions in a state in which the component main bodies are respectively inserted in the respective component main body holding grooves by bringing the opposing surfaces close to each other and surface contact with each other. When the central region of the side surface is masked with an elastic member, there is provided an exposed region processing means for performing a predetermined process on an exposed region that is a part of the outer surface of the component body and is not masked by the elastic member. Once a plurality of component bodies are centered and once clamped by a pair of clamping portions and mounted on a component body holder, all the component body lengthwise ends are subjected to predetermined processing, When a predetermined process is performed on the other end part or when another predetermined process is performed on the one end part of all the component main bodies, it is not necessary to adjust the position of each component main body with respect to the component main body holder. Therefore, it is not necessary to move all the component main bodies with respect to the component main body holder when performing another predetermined process after all the component main bodies are once mounted on the component main body holder. It is not necessary to bring a jig or the like into contact, and it is not necessary to bring anything into contact with the one end subjected to the predetermined treatment. As a result, when another predetermined process is performed, it is possible to prevent damage to one end portion that has already been subjected to the predetermined process.

  Further, since the predetermined processing can be performed with a plurality of component main bodies mounted on the component main body holder, the predetermined processing can be performed collectively for each component main body holder.

  Further, a pair of the exposed region processing means are provided to face each other, and simultaneously with respect to the exposed region on one end side in the length direction of the component main body and the exposed region on the other end side sandwiched by the sandwiching portion. It is preferable that the predetermined processing can be performed.

  A pair of exposed area processing means are provided opposite to each other, and a predetermined process can be simultaneously performed on an exposed area on one end side and an exposed area on the other end side in the length direction of the component main body held by the holding portion. Therefore, for example, when the predetermined process is a heating process such as an end electrode forming process by sputtering or the like, the end surface portion of the clamping part near one end in the length direction of the component body and the length direction of the component body The end surface portion of the sandwiching portion in the vicinity of the other end can be similarly heated. For this reason, the thermal deformation of the component main body holder can be suppressed as much as possible. For this reason, the dimensional accuracy of the terminal electrode etc. provided by the predetermined process can be improved. Moreover, since a predetermined process can be performed simultaneously on both one end and the other end in the length direction of the component main body, the production efficiency can be improved.

  The exposed region processing means is preferably terminal electrode forming means for forming a terminal electrode in the exposed region. Since the exposed region processing unit is a terminal electrode forming unit that forms a terminal electrode in the exposed region, the terminal electrode can be efficiently formed on a plurality of component bodies at once.

  As described above, the present invention can provide an electronic component manufacturing method and an electronic component manufacturing apparatus that do not require time and effort in the process of positioning by changing the surface on which a thin film to be an external electrode is formed.

  An electronic component manufacturing method and an electronic component manufacturing apparatus according to an embodiment of the present invention will be described with reference to FIGS. First, an electronic component manufacturing apparatus will be described. As shown in FIG. 1, an electronic component manufacturing apparatus 1 includes a component main body holder 10 having a pair of clamping parts, a pair of centering plates 21 and 22, and a sputtering apparatus having a sputtering target 31 (FIG. 10). As shown in FIG. 3, terminal electrodes 2B and 2C, which are external electrodes, are provided at the longitudinal ends of the chip component 2, which is an electronic component, more specifically at the longitudinal ends of the chip capacitor. It is configured to be able to.

  Here, the chip component 2 has a chip component main body 2A and terminal electrodes 2B and 2C as shown in FIG. As shown in FIG. 4B and the like, the chip component main body 2A has a substantially square bottom surface 2D and a top surface 2E (FIG. 3), and is a direction orthogonal to the bottom surface 2D and the top surface 2E of FIG. It has a quadrangular prism shape having a predetermined length in the left-right direction (hereinafter referred to as “predetermined length direction”). The length of the chip component 2 in the predetermined length direction is about 1 mm, and one side of the bottom surface 2D and the top surface 2E having a substantially square shape is about 0.5 mm. The terminal electrodes 2B and 2C are subjected to sputtering treatment at both ends in the left-right direction in FIG. 3, that is, one end 2F and the other end 2G in the predetermined length direction of the chip component main body 2A, whereby Cr (chrome) is applied. A thin film made of, for example, is formed, and further plated with Sn (tin) or the like. The chip component main body 2A corresponds to the component main body, the bottom surface 2D corresponds to one end of the component main body, and the upper surface 2E corresponds to the other end of the component main body.

  As shown in FIG. 2, the clamping portion of the component main body holder 10 is composed of a pair of upper and lower portions 11 and 12 each made of stainless steel and having a plate shape that is thinner than a predetermined length of the chip component main body 2A. The lower end surface 11A of the upper portion 11 and the upper end surface 12A of the lower portion 12 are opposed to each other and are configured to be separated from each other. Screwed portions 11B and 12B are provided at both ends of the upper portion 11 and the lower portion 12, respectively. In the screwing portions 11B and 12B, through holes 11a into which screws (not shown) can be inserted and through holes (not shown) into which female screws capable of screwing screws are threaded are formed in the vertical direction in FIG. As shown in FIG. 2, a screw (not shown) inserted into the through hole 11a of the screwing portion 11B in a state where the lower end surface 11A of the upper portion 11 and the upper end surface 12A of the lower portion 12 are in surface contact with each other. The upper portion 11 can be fixed to the lower portion 12 by being screwed into a female screw of a through hole (not shown) of the screwing portion 12B.

  Component body holding grooves 11b and 12b are formed in the lower end surface 11A of the upper part 11 and the upper end surface 12A of the lower part 12 of the component body holder 10, respectively. The component main body holding grooves 11b and 12b are formed so as to extend in a direction connecting the front surfaces 11C and 12C and the rear surfaces 11D and 12D (FIG. 5A, etc.) of the upper part 11 and the lower part 12 having a plate shape. The component body holding grooves 11b are parallel to each other, and the plurality of component body holding grooves 12b are parallel to each other. The cross-sectional shape of the component main body holding groove 11b cut by a plane perpendicular to the extending direction of the component main body holding groove 11b of the upper portion 11 is a chip oriented in a predetermined length direction as shown in FIG. A substantially V-shape substantially matching the shape of the upper side of the figure divided by one diagonal line oriented horizontally in the figure of the bottom surface 2D of the chip part body 2A in a state rotated by 45 ° about the axis of the component body 2A It has a shape. The cross-sectional shape of the component main body holding groove 12b cut by a plane perpendicular to the extending direction of the component main body holding groove 12b of the holding portion of the lower portion 12 is directed to the bottom surface 2D of the chip component main body 2A in the horizontal direction of FIG. A substantially V-shape substantially matching the shape on the lower side of the figure divided by the one diagonal line.

  In addition, one end and the other end of the component main body holding grooves 11b and 12b in the extending direction are opened on the front surface 11C and the rear surface 11D of the upper portion 11 and the front surface 12C and the rear surface 12D of the lower portion 12, respectively. Further, the pair of upper part 11 and lower part 12 of the component main body holder 10 has a plate shape that is thinner than a predetermined length of the chip component main body 2A, and therefore in the extending direction of the component main body holding grooves 11b and 12b. The length is shorter than a predetermined length of the chip component body 2A. The front surface 11C and the back surface 11D of the upper part 11 of the component main body holder 10, and the front surface 12C and the back surface 12D of the lower part 12 respectively correspond to the end surfaces of the clamping parts.

  As shown in FIG. 9B, a portion corresponding to the lower side of the bottom surface 2D of the chip component main body 2A divided into two by the diagonal line oriented in the horizontal direction in the drawing is formed in the component main body holding groove 12b of the lower portion 12. The portion corresponding to the upper side of the bottom surface 2D of the chip component main body 2A divided into two by the diagonal line is engaged with the component main body holding groove 11b of the upper portion 11, and the lower end surface 11A and the lower portion 12 of the upper portion 11 are engaged. By placing the upper end surface 12A in surface contact with each other, a chip component main body is formed by a rubber film 13 described later in the component main body holding groove 11b in the upper portion 11 and a rubber film 14 described later in the component main body holding groove 12b in the lower portion 12. The side surface 2H (FIG. 9A) in the predetermined length direction of 2A can be sandwiched. In addition, the component main body holder 10 including the upper portion 11 and the lower portion 12 with the chip component main body 2A sandwiched in this manner has a positional relationship in which the through holes 11a of the screwing portions 11B and 12B and the through holes (not shown) are matched. As shown in FIG. 10, the plurality of component holders 10 can be combined in the direction of the through hole 11 a and the through hole (not shown).

  As shown in FIG. 5B and the like, the upper portion 11 and the lower portion 12 that define the component main body holding grooves 11b and 12b, the lower end surface 11A of the upper portion 11 and the upper end surface 12A of the lower portion 12 that form opposing surfaces. Are covered with rubber films 13 and 14 each made of rubber (for example, fluorine-based) which is an elastic member. Since the component main body holding grooves 11b and 12b are covered with the rubber films 13 and 14, the chip component main body 2A is sandwiched between the upper part 11 component main body holding groove 11b and the lower part 12 component main body holding groove 12b. The central region of the side surface 2H in the predetermined length direction of the chip component body 2A, that is, the region where the terminal electrodes 2B and 2C are not formed can be masked by the rubber films 13 and 14.

  The component main body holder 10 is configured to be temporarily fixed so as not to move to a position indicated by a one-dot chain line in FIG. 1 by being held by a fixing portion (not shown). It is fixed like this when you are. The screwing portions 11B and 12B, screws (not shown), and fixing portions (not shown) correspond to the component body holder positioning means.

  As shown in FIG. 1, the pair of centering plates 21 and 22 are arranged opposite to each other while always maintaining a parallel positional relationship, and the opposing surfaces facing each other are elastically deformable rubber plates with the same displacement amount. It is comprised by the elastic parts 21A and 22A which consist of. The pair of centering plates 21 and 22 correspond to contact members, and the opposing surfaces correspond to contact surfaces of contact members that contact the top surface 2E and the bottom surface 2D, as will be described later. The pair of centering plates 21 and 22 is the diameter position of the pinion 15 in which the rotation axis is arranged at the center position in the extending direction of the component main body holding grooves 11b and 12b of the component main body holder 10 indicated by a one-dot chain line in FIG. Are fixed to racks 16 and 17, respectively. The extending directions of the racks 16 and 17 are in a positional relationship parallel to the extending direction of the component main body holding grooves 11b and 12b of the component main body holder 10 indicated by a one-dot chain line in FIG. Accordingly, the pair of centering plates 21 and 22 are movable integrally with the racks 16 and 17, respectively. The pair of centering plates 21 and 22, the pinion 15, and the racks 16 and 17 correspond to centering means.

  With this configuration, the pair of centering plates 21 and 22 are shortest from the center position with the center position in the extending direction of the component body holding grooves 11b and 12b of the component body holder 10 indicated by the alternate long and short dash line in FIG. They can be spaced apart from each other so that the distance is always the same. Therefore, as shown in FIG. 5B, the part corresponding to the lower side of the bottom surface 2D of the chip component main body 2A divided into two by the diagonal line oriented in the horizontal direction in the figure is the component main body holding groove of the lower portion 12. As a state of being engaged with 12b, a pair of centering plates 21 and 22 are brought into contact with one end and the other end in the predetermined length direction of the chip component main body 2A, respectively, thereby extending the component main body holding groove 12b in the extending direction. The central position of the component main body holding groove 12b and the central position in the predetermined length direction of the chip component main body 2A can be matched.

  The sputter target 31 can irradiate a metal made of Cr (chromium) or the like as a plasma and perform a sputtering process on the one end 2F and the other end 2G in the predetermined length direction of the chip component body 2A as will be described later. It is comprised so that the thin film which consists of Cr (chromium) etc. can be formed in the said one end part 2F and the other end part 2G by a sputtering process. The sputter target 31 is located at a position facing one end and the other end in the predetermined length direction of the chip component main body 2A sandwiched between the component main body holding grooves 11b and 12b when an electronic component manufacturing process described later is performed. A pair is provided, and the one end 2F and the other end 2G in the predetermined length direction of the chip component main body 2A can be simultaneously sputtered. The sputter target 31 corresponds to a terminal electrode forming unit, a sputtering unit, and an exposed region processing unit.

  In the electronic component manufacturing method, first, a component main body supporting step is performed. In the component main body supporting step, first, a screw (not shown) is inserted into the through hole 11a of the screwing portion 11B of the component main body holder 10, and the screw (not shown) is screwed into the female screw of the through hole (not shown) of the screw fixing portion 12B. And the lower part 12 of the component main body holder 10 is fixed to the position shown with the dashed-dotted line of FIG. 1 by hold | maintaining with the fixing | fixed part which is not shown in figure. Next, as shown in FIG. 4, a portion corresponding to the lower side of the bottom surface 2 </ b> D of the chip component main body 2 </ b> A divided into two by the diagonal line oriented in the horizontal direction in the figure is a component of the lower portion 12 of the component main body holder 10. The chip component main body 2A is supported in a state of being engaged with the main body holding groove 12b.

  Next, a centering process is performed. In the centering step, as shown in FIG. 5, the pair of centering plates 21 and 22 (FIG. 1) are brought closer to each other, and as shown in FIG. A pair of centering plates 21 and 22 are brought into contact with the other end, respectively.

  More specifically, when the pair of centering plates 21 and 22 are brought closer to each other as shown in FIG. 6, when the predetermined length of the chip component main body 2A varies as shown in FIG. Although the predetermined length is long, the bottom surface 2D and the top surface 2E are in contact with the centering plates 22 and 21, respectively, and the center position of the component main body holding groove 12b in the extending direction of the component main body holding groove 12b and the predetermined length. The center position of the long chip component main body 2A in the predetermined length direction is matched. Further, the chip component main body 2A other than the chip component main body 2A having a long predetermined length has the bottom surface 2D or the upper surface 2E in contact with the centering plates 22 and 21 and pressed in the extending direction of the component main body holding groove 12b. The holding groove 12b is moved in the extending direction. The top surface 2E or the bottom surface 2D, which is the end surface on the opposite side of the chip component main body 2A, is also in contact with the centering plates 21 and 22, so that the center position of the component main body holding groove 12b in the extending direction of the component main body holding groove 12b and the chip The center position of the component main body 2A in the predetermined length direction is matched. At this time, the bottom surface 2D of the chip component main body 2A having a predetermined length and the vicinity thereof, the top surface 2E and the elastic portions 21A, 22A of the centering plates 21, 22 are the same as shown in FIG. The elastic parts 21A and 22A that have been elastically deformed by the amount of displacement are in a state of being bitten, and the central position of the component main body holding groove 12b in the extending direction of the component main body holding groove 12b and the central position of the chip component main body 2A in the predetermined length direction Are maintained in a matched state.

  Next, the upper part 11 of the component main body holder 10 is lowered, the lower end surface 11A of the upper part 11 and the upper end face 12A of the lower part 12 are brought into surface contact with each other, and the screwing part is passed through the through hole 11a of the screwing part 11B. The upper part 11 is fixed to the lower part 12 as shown in FIG. 9 by screwing a screw into a female screw of a through hole (not shown) of 12B. As a result, the chip component main body 2A is sandwiched between the component main body holding grooves 11b and 12b. The above process is performed on the plurality of component body holders 10 to prepare a plurality of component body holders 10 with the chip component body 2A sandwiched therebetween.

  Next, the plurality of component body holders 10 sandwiching the chip component body 2A are fixed to each other so that the through holes 11a of the screwing portions 11B and 12B and the through holes (not shown) coincide with each other. As shown in FIG. 10, the predetermined length direction of the chip component main body 2 </ b> A is aligned with the direction connecting the pair of sputter targets 31, 31, and fixedly arranged at the center position of the pair of sputter targets 31, 31.

  Next, a terminal electrode forming step is performed. In the terminal electrode formation step, first, sputtering is performed by irradiating the one end portion 2F and the other end portion 2G of the chip component body 2A in a predetermined length direction with a metal plasma made of Cr (chromium) or the like from the sputter targets 31, 31. A sputtering process for performing the treatment is performed. As a result of this sputtering process, Cr (not shown) is exposed on the one end portion 2F and the other end portion 2G, which is an outer surface region of the chip component main body 2A that is not masked by the rubber films 13 and 14 of the component main body holding grooves 11b and 12b. A thin film made of chromium or the like is formed.

  Next, as shown in FIG. 11, a plurality of component main body holders 10 fixed to each other are taken out from the center position of the sputtering targets 31 and 31, and the thin film is formed on the portion where the thin film is formed by the sputtering process. Are plated with Sn (tin) or the like to form terminal electrodes 2B and 2C as external electrodes on one end 2F and the other end 2G in the predetermined length direction of the chip component body 2A. The above is the terminal electrode forming step. The sputtering process for forming the terminal electrode corresponds to a predetermined process, and the terminal electrode forming process corresponds to an exposed region processing process.

  Next, as shown in FIG. 12, the fixing of the plurality of component main body holders 10 fixed to each other is released, and in the individual component main body holder 10, the upper portion 11 is separated from the lower portion 12, and the component main body holding grooves 11 b and 12 b. 2 is released, and the chip component body 2A on which the terminal electrodes 2B and 2C are formed is taken out from the component body holding groove 12b of the lower portion 12. The above is the manufacturing method of the electronic component.

  The component main body holding groove 11b, 12b of the component main body holder 10 having the above-described configuration supports the chip component main body 2A, and the component main body holder 10 in the extending direction of the component main body holding groove 12b of the lower portion 12 in FIG. The component main body supporting step of positioning at a position, the center position of the component main body holding groove 11b in the extending direction of the component main body holding groove 11b of the upper portion 11, and the chip component main body 2A supported by the component main body holding groove 12b of the lower portion 12 A centering step for matching the center position in a predetermined length direction, and by sandwiching a plurality of centered chip component main bodies 2A with the rubber films 13 and 14 of the component main body holder 10 having a pair of clamping portions, Even if there is a variation in the cross-sectional shape cut perpendicular to the longitudinal direction of the chip component body 2A, the inside of the side surface of each chip component body 2A It can be masked without any gap region, and a predetermined length direction of one end 2F and the other end portion 2G of the chip component body 2A, can be exposed region to form terminal electrodes 2B and 2C.

  For this reason, unlike the above-described embodiment, even if the terminal electrodes 2B and 2C are alternately formed without forming the terminal electrodes 2B and 2C at the same time, once the plurality of chip component main bodies 2A are once mounted on the component main body holder 10, When the terminal electrode 2C is formed on the other end 2G after the terminal electrode 2B is formed on the one end 2F in the predetermined length direction of the chip component main body 2A, the position of each chip component main body 2A relative to the component main body holder 10 is adjusted. You do n’t have to. Therefore, it is not necessary to move all the chip component main bodies 2A with respect to the component main body holder 10 after all the chip component main bodies 2A are once mounted on the component main body holder 10, so that a jig or the like is used for the chip component main body 2A. And no contact with the terminal electrode 2B formed on the one end portion 2F. As a result, it is possible to prevent the terminal electrode 2B formed on the one end 2F from being damaged.

  Further, the upper end surface 12A of the lower portion 12 and the lower end surface 11A of the upper portion 11 are opposed to each other and are in surface contact with each other, whereby the side surfaces of the chip component main body 2A in the predetermined length direction are brought into contact with the component main body holding grooves 11b and 12b. 2H is sandwiched and the central region of the side surface 2H in the predetermined length direction of the chip component main body 2A is masked, it is a part of the outer surface of the chip component main body 2A and the component main body holding grooves 11b and 12b. In order to perform the terminal electrode formation process for forming the terminal electrodes 2B and 2C in the unmasked exposed region, the rubber films 13 and 14 are in close contact with the masked central region, and the exposed region is left as it is. It can be set as the area | region which forms. For this reason, it is possible to reliably form the terminal electrodes 2B and 2C only in the region where the terminal electrodes 2B and 2C are to be formed.

  Further, since the terminal electrode forming step includes a sputtering step of simultaneously performing the sputtering process on the one end 2F and the other end 2G in the predetermined length direction of the chip component main body 2A sandwiched between the component main body holding grooves 11b and 12b. Sputtering is similarly performed on one end 2F and the other end 2G of the chip component main body 2A sandwiched between the component main body holding grooves 11b and 12b in the predetermined length direction, and one end of the chip component main body 2A in the predetermined length direction. It is possible to heat the surfaces 11C and 12C as the end faces of the upper part 11 and the lower part 12 near 2F and the back surface 12D as the end faces of the upper part 11 and the lower part 12 near the other end 2G of the chip component main body 2A in the predetermined length direction in the same manner. it can. For this reason, the thermal deformation of the component main body holder 10 can be suppressed as much as possible. For this reason, the dimensional accuracy of the terminal electrodes 2B and 2C to be formed can be improved. Further, since the terminal electrodes 2B and 2C are simultaneously formed on both the one end 2F and the other end 2G in the predetermined length direction of the chip component body 2A, the production efficiency can be improved.

  Further, even if there are variations in the longitudinal dimension of the plurality of chip component bodies 2A, all the chip component bodies 2A can be centered in the component body holder 10.

  Further, in the centering step in the present embodiment, the pair of centering plates 21 and 22 are brought close to each other, and the pair of centering plates 21 and 22 are respectively provided at one end and the other end in the predetermined length direction of the chip component body 2A. By making contact, the central position of the component main body holding groove 12b in the extending direction of the component main body holding groove 12b and the central position of the chip component main body 2A in the predetermined length direction are matched, but the present invention is not limited to this method. For example, the chip component main body 2A is supported by the component main body holding groove 12b and both ends of the chip component main body 2A are supported, and the lower portion 12 and the upper portion 11 are formed in the component main body holding groove 12b in the predetermined length direction of the chip component main body 2A. The center position of the component main body holding groove 12b in the extending direction of the component main body holding groove 12b may be matched with the central position of the chip component main body 2A in the predetermined length direction.

  The electronic component manufacturing method and the electronic component manufacturing apparatus of the present invention are not limited to the above-described embodiments, and various modifications and improvements can be made within the scope described in the claims. For example, the cross-sectional shape of the component main body holding groove 12b cut by a plane perpendicular to the extending direction of the component main body holding groove 11b of the upper part 11 and the component main body holding groove 12b of the holding part of the lower part 12 is the bottom surface 2D of the chip part main body 2A. Is substantially V-shaped substantially matching the upper and lower shapes of the figure divided into two by the diagonal line oriented in the horizontal direction in FIG. 4B. It is not limited.

  For example, as shown in FIG. 14, the cross-sectional shapes of the component main body holding groove 111b of the upper part 111 and the component main body holding groove 112b of the lower part 112 may be substantially U-shaped, respectively, and as shown in FIG. The component main body holding groove 212b is formed only in the lower portion 212 to have a substantially U-shaped cross section, and the upper portion 211 may not be formed with the component main body holding groove. Further, as shown in FIG. 16, the cross-sectional shapes of the component main body holding groove 311b of the upper portion 311 and the component main body holding groove 312b of the lower portion 312 may be semicircular. Even in this case, the central region of the side surface 2H in the predetermined length direction of the chip component main body 2A can be masked by the elastic deformation of the rubber films 13 and 14.

  Further, the upper part 11 and the lower part 12 of the component main body holder 10 are each made of stainless steel, and the upper part 11 and the lower part 12 that define the component main body holding grooves 11b and 12b, and the lower end surface 11A of the upper part 11 that forms an opposing surface. The upper end surface 12A of the lower portion 12 is covered with rubber films 13 and 14 made of rubber as an elastic body, respectively, but is not limited to this configuration. As shown in FIG. 17, the whole upper part 413 and lower part 414 of the component body holder may be made of rubber, and the component body holding grooves 413b and 414b may be made of rubber as an elastic body.

  Further, the exposed region processing means is constituted by the sputter target 31, but is not limited to the sputter target 31. Similarly, the exposed region processing step is configured by the terminal electrode forming step, but is not limited to the terminal electrode forming step. Similarly, the predetermined process is configured by the sputtering process for forming the terminal electrode, but is not limited to the sputtering process.

  For example, instead of the sputter target 31, as shown in FIG. 18, the exposed area processing means may be configured to perform the spray coating process using the spray nozzle 41 that can spray the coating liquid as the exposed area processing process. Alternatively, the exposure area processing means may be configured by spray cleaning with a nozzle capable of spraying the cleaning liquid and spray cleaning may be performed as the exposure area processing process, or may be exposed using a nozzle capable of spraying an abrasive (media). The step of constituting and blasting the region processing means may be performed as the exposed region processing step.

  Alternatively, as shown in FIG. 19, a step of immersing the upper part 11 and the lower part 12 in a state of sandwiching a plurality of chip component bodies 2A in an electrolytic plating solution 51 or an electroless plating solution, and performing a plating process on the exposed region. May be performed as an exposed region processing step. Similarly, the step of immersing the upper portion 11 and the lower portion 12 in a state of sandwiching the plurality of chip component main bodies 2A in an etching solution and performing the etching process on the exposed region is performed. You may perform as a process process. Alternatively, as shown in FIG. 20, the upper 11 and the lower 12 in the state of sandwiching the plurality of chip component bodies 2A, the exposed area on the bottom surface 2D side or the exposed area on the top surface 2E side of the chip component body 2A is electrically conductive paste, A process of performing a process of immersing in a paint 61 such as a resist or a resin and attaching them to the exposed area may be performed as an exposed area processing process. Processing for performing each of these steps corresponds to predetermined processing.

  In these exposure region processing steps, the centering step according to the present embodiment is performed once, and the center position of the component main body holding groove 12b in the extending direction of the component main body holding groove 12b and the predetermined length direction of all the chip component main bodies 2A. A plurality of chip component main bodies 2A are sandwiched between the component main body holders 10 in a state where the center positions coincide with each other. That is, it is not necessary to adjust the position of each chip component main body 2A with respect to the component main body holder 10 each time these steps are performed.

  In addition, since the predetermined process for performing the above-described process can be performed while the plurality of chip component bodies 2A are held between the component body holders 10, the predetermined process can be efficiently performed on the plurality of chip component bodies 2A at a time. It can be performed.

  The elastic portions 21A and 22A are composed of rubber plates that can be elastically deformed with the same amount of displacement. However, the elastic portions 21A and 22A are not limited to such rubber plates. For example, two bags having fluid inside and communicating with each other Of these, one bag may be provided as one elastic portion, and the other bag may be provided as the other elastic portion. Since the internal fluid can flow in the two bags, the two bags can be elastically deformed with the same amount of displacement.

  In addition, although a pair of sputter targets 31 is provided, as shown in FIG. Even in this case, as in the present embodiment, once the chip component main body 2A is sandwiched between the component main body holder 10, the other end is formed after the terminal electrode 2B is formed on one end 2F in the length direction of the component main body. When the terminal electrode 2C is formed on the part 2G, it is not necessary to adjust the position of the component main body with respect to the component main body holder 10.

  In the present embodiment, the centering step is performed before the chip component main body 2A is sandwiched between the component main body holding groove 11b of the upper portion 11 and the component main body holding groove 12b of the lower portion 12 of the component main body holder 10 of the clamping portion. You may perform a centering process after pinching.

  The sputter targets 31 and 31 are provided at positions facing one end and the other end in the predetermined length direction of the chip component main body 2A sandwiched between the component main body holding grooves 11b and 12b in the terminal electrode forming step. The position may not be opposite to the one end and the other end. For example, in the terminal electrode forming step, the chip component main body 2A sandwiched between the component main body holding grooves 11b and 12b has one end 2F and the other end 2G in the predetermined length direction facing the side surface 2H in the predetermined length direction. May be provided.

  Further, the component body holding groove 11b of the upper part 11 has a cross-sectional shape cut by a plane perpendicular to the direction in which the component body holding groove 11b extends, as shown in FIG. The bottom surface 2D of the chip component main body 2A in a state rotated by 45 ° about the axis of the chip component main body 2A to be directed is substantially the same as the shape on the upper side of the figure divided by one diagonal line oriented in the horizontal direction in the figure. The component main body holding groove 12b of the lower part 12 has a V shape, and the cross-sectional shape of the component main body holding groove 12b cut by a plane perpendicular to the direction in which the component main body holding groove 12b extends is shown in FIG. b) Although it had a substantially V shape substantially matching the shape on the lower side of the figure divided into two by a diagonal line oriented in the horizontal direction, it is rotated by 45 ° around the axis of the chip component body 2A. It is not limited to the shape of the state made to do. For example, it may have a shape rotated by 30 °.

  Moreover, in the terminal electrode formation process, although it plated on the said thin film with respect to the part in which the thin film was formed by the sputtering process, the terminal electrodes 2B and 2C were formed, it does not need to perform plating.

  The electronic component manufacturing method and electronic component manufacturing apparatus of the present invention are useful in the field of chip components in which terminal electrodes are provided at one end and the other end of a chip component main body.

1 is a schematic perspective view showing an electronic component manufacturing apparatus according to an embodiment of the present invention. The schematic perspective view which shows the component main body holder which comprises the clamping part of the manufacturing apparatus of the electronic component by embodiment of this invention. The side view which shows the electronic component manufactured by the manufacturing method of the electronic component by embodiment of this invention, and the manufacturing apparatus of an electronic component. It is the schematic which shows the component main body support process of the manufacturing method of the electronic component by embodiment of this invention, (a) is a front view, (b) is a side view. It is the schematic which shows the centering process of the manufacturing method of the electronic component by embodiment of this invention, (a) is a front view, (b) is a side view. The schematic plan view which shows the state which the elastic part has not yet contact | abutted to the chip component main body at the centering process of the manufacturing method of the electronic component by embodiment of this invention. The schematic plan view which shows the state which the elastic part began to contact | abut to a chip component main body at the centering process of the manufacturing method of the electronic component by embodiment of this invention. The schematic plan view which shows the state which the elastic part contact | abutted all the chip component main bodies at the centering process of the manufacturing method of the electronic component by embodiment of this invention, and all centered. It is the schematic which shows the state which clamped the chip component main body by the component main body holding groove in the manufacturing method of the electronic component by embodiment of this invention, (a) is a front view, (b) is a side view. The schematic front view which shows the manufacturing process of the electronic component of the manufacturing method of the electronic component by embodiment of this invention. The schematic side view which shows a mode that a metal-plating process is performed in the manufacturing method of the electronic component by embodiment of this invention. The schematic side view which shows a mode that a chip component is taken out from a component main body holder in the manufacturing method of the electronic component by embodiment of this invention. The schematic front view which shows the modification of the manufacturing process of the electronic component of the manufacturing method of the electronic component by embodiment of this invention. The schematic side view which shows the modification of the component main body holder of the manufacturing apparatus of the electronic component by embodiment of this invention. The schematic side view which shows the modification of the component main body holder of the manufacturing apparatus of the electronic component by embodiment of this invention. The schematic side view which shows the modification of the component main body holder of the manufacturing apparatus of the electronic component by embodiment of this invention. The schematic side view which shows the modification of the component main body holder of the manufacturing apparatus of the electronic component by embodiment of this invention. Schematic which shows the modification of the exposure area | region process of the exposure area | region process process of the manufacturing method of the electronic component by embodiment of this invention, and the manufacturing apparatus of an electronic component. Schematic which shows the modification of the exposure area | region process of the exposure area | region process process of the manufacturing method of the electronic component by embodiment of this invention, and the manufacturing apparatus of an electronic component. Schematic which shows the modification of the exposure area | region process of the exposure area | region process process of the manufacturing method of the electronic component by embodiment of this invention, and the manufacturing apparatus of an electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component manufacturing apparatus 2 Chip component 2A Chip component main body 2B, 2C Terminal electrode 2D Bottom surface 2E Upper surface 2F One end part 2G Other end part 2H Side surface 10 Component main body holder 11, 111, 211, 311, 413 Upper part 12, 112, 212 , 312, 414 Lower part 11A Lower end face 12A Upper end face 11B, 12B Screw fixing part 11b, 12b, 111b, 112b, 212b, 311b, 312b, 413b, 414b Component body holding groove 11C, 12C Surface 11D, 12D Back surface 13, 14 Rubber Film 15 Pinion 16, 17 Rack 21, 22 Centering plate 21A, 22A Elastic part 31 Sputter target 41 Spray nozzle 51 Electroplating solution 61 Paint

Claims (8)

Provided with a pair of clamping portions each having an end surface and an opposing surface capable of clamping a component main body having a predetermined length in a direction connecting the one end and the other end, and the opposing surfaces can be separated from each other A plurality of component body holding grooves are formed in parallel on at least one of the opposing surfaces, and at least each of the opposing surfaces of the clamping part and the surface of the clamping part that defines the component body holding groove are covered with an elastic member. The length of the component main body holding groove in the extending direction is shorter than the predetermined length of the component main body, and one end and the other end of the component main body holding groove in the extending direction are opened at the end surface of the clamping portion, respectively. The component main body holder is engaged with a side surface in the length direction of the component main body in each component main body holding groove to support the component main body with the clamping portion, and the component main body holder is attached to the component main body holding groove. To be positioned at a predetermined position in the extending direction And body supporting step,
A pair of abutting members capable of abutting on one end and the other end of each component body are provided, and at least surface portions of the abutting surfaces of the pair of abutting members abutting on one end and the other end of the component body are the same. Centering means each having an elastic part that can be elastically deformed by a displacement amount, presses the elastic part of one corresponding contact member against one end of all the component main bodies and simultaneously presses the elastic part of the other corresponding contact member. All the components supported by the central position of the component main body holding groove and the component main body holding groove in the extending direction of the component main body holding groove by contacting and pressing the other end of all the component main bodies And a centering step for matching a central position in a longitudinal direction of the main body.   After the centering step, the opposing surfaces are brought close to each other and brought into surface contact with each other so that the component main bodies are respectively fitted in the component main body holding grooves, and the pair of holding portions in the length direction of the component main bodies. When the central portion of the side surface in the length direction of the component main body is masked by the elastic member while sandwiching the side surface, the part of the outer surface of the component main body that is not masked by the elastic member is exposed. 2. The method of manufacturing an electronic component according to claim 1, wherein an exposed region processing step of performing predetermined processing on the region is performed.   3. The method of manufacturing an electronic component according to claim 2, wherein in the exposed region processing step, the predetermined processing is simultaneously performed on one end and the other end of the component main body sandwiched by the sandwiching portion. .   4. The method of manufacturing an electronic component according to claim 2, wherein the predetermined process is a terminal electrode forming process for forming a terminal electrode in the exposed region. Provided with a pair of clamping portions each having an end surface and an opposing surface capable of clamping a component main body having a predetermined length in a direction connecting the one end and the other end, and the opposing surfaces can be separated from each other A plurality of component body holding grooves are formed in parallel on at least one of the opposing surfaces, and at least each of the opposing surfaces of the clamping part and the surface of the clamping part that defines the component body holding groove are covered with an elastic member. The length of the component main body holding groove in the extending direction is shorter than the predetermined length of the component main body, and one end and the other end of the component main body holding groove in the extending direction are opened at the end surface of the clamping portion, respectively. In addition, the side surfaces in the length direction of the component main body can be clamped by the pair of clamping portions in a state in which the component main body is fitted in each component main body holding groove by bringing the facing surfaces close to each other and abutting the surfaces. And the side of the component body in the length direction A component body holder maskable the central region of,
A component body holder positioning means for positioning the component body holder at a predetermined position in the extending direction of the component body holding groove;
A pair of abutting members capable of abutting on one end and the other end of each component body are provided, and at least surface portions of the abutting surfaces of the pair of abutting members abutting on one end and the other end of the component body are the same. Each elastic part has an elastic part that can be elastically deformed by the amount of displacement, and the elastic part of one corresponding contact member abuts and presses on one end of all the component bodies, and at the same time, the other corresponding contact on the other end of all the component bodies. The central position of the component main body holding groove in the extending direction of the component main body holding groove and the length direction of all the component main bodies supported by the component main body holding groove when the elastic part of the member abuts and presses An electronic component manufacturing apparatus comprising centering means for matching the center position of the electronic component.   The opposing surfaces are brought close to each other and brought into surface contact with each other to hold the side surfaces in the length direction of the component main body with the pair of clamping portions in a state where the component main body is fitted in the component main body holding grooves. When the central region of the side surface in the length direction of the component main body is masked by the elastic member, a predetermined amount is applied to an exposed region that is a part of the outer surface of the component main body and is not masked by the elastic member. 6. The electronic component manufacturing apparatus according to claim 5, further comprising exposed area processing means for performing processing.   A pair of the exposed area processing means are provided opposite to each other, and the predetermined area is simultaneously applied to the exposed area on one end side in the length direction of the component main body and the exposed area on the other end side of the component body. The electronic component manufacturing apparatus according to claim 6, wherein the processing can be performed.   8. The electronic component manufacturing apparatus according to claim 6, wherein the exposed region processing means is terminal electrode forming means for forming a terminal electrode in the exposed region.

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