JP2002252101A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic components that improve mountability by suppressing the occurrence of element lifting phenomena and can be manufactured with high productivity. SOLUTION: The electronic components are equipped with a base 11, an element-forming film 12 provided on the base 11, and an element section S provided by forming grooves 13, etc., into the element-forming film 12. The components are also equipped with terminal sections 16 and 17 provided on the base 11 and a ceramic film 14 provided on the element section S.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic components (chip resistors, chip inductors, chip capacitors, chip antennas, composite chip electronic components, etc.) suitably used for electronic equipment and the like.

[0002]

2. Description of the Related Art There are chip components having a structure as shown in FIGS. That is, terminal portions 1 and 2 are provided at both ends of a prismatic base (not shown), and a protective material 3 is provided between the terminal portions 1 and 2. On the base, an element forming film, a resistance film, etc. are formed, and furthermore, by providing a spiral groove, an element portion is provided,
A chip resistor, a chip inductor, a chip capacitor, a chip antenna, and the like are manufactured by the configuration of the element unit.

As a prior example, Japanese Patent Application Laid-Open No. H11-23862 has been proposed.
No. 4, JP-A-11-233345, and the like.

[0004]

However, in the above configuration, as shown in FIG. 6, in some electronic components, when the protective member 3 is made of only the resin, as shown in a point P, both end portions are formed. There is a problem that a portion bulging from the terminal portions 1 and 2 is formed, and when an electronic component is mounted on a circuit board or the like and reflow is performed, a phenomenon that the electronic component starts up (Manhattan phenomenon) occurs. there were. In some cases, the protection member 3 is pressed by a press or the like to prevent the occurrence of the bulging portion. However, such a configuration requires time and effort, and the shape of the protection member 3 varies to cause a problem.

An object of the present invention is to solve the above-mentioned conventional problems, and it is an object of the present invention to provide an electronic part which can suppress the phenomenon of standing up of the element, improve the mountability, and have high productivity.

[0006]

According to the present invention, there is provided a base, an element formation film provided on the base, an element portion provided by forming a groove or the like in the element formation film, and a base. The terminal part provided was provided with a ceramic film provided on the element part.

[0007]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 comprises a base,
An element formation film provided on the base, an element portion provided by forming a groove or the like in the element formation film, a terminal portion provided on the base, and an element provided on the element portion. The electronic component is characterized in that it has a ceramic film and a protective film made of resin is unnecessary, or a very thin protective material can be used. Can be suppressed, the element standing phenomenon can be suppressed, the mountability can be improved, and the productivity can be improved.

According to a second aspect of the present invention, there is provided the electronic component according to the first aspect, wherein the constituent material of the ceramic film and the constituent material of the base are the same or the main components are the same. The thermal expansion coefficient and the like of the base and the ceramic film can be the same or approximated, and peeling of the ceramic due to stress can be prevented.

According to a third aspect of the present invention, the electronic component according to the first aspect, wherein an alumina film is provided as the ceramic film, the weather resistance is significantly improved, and the film is securely adhered. And the hardness can be made very high.

According to a fourth aspect of the present invention, there is provided an electronic component according to the first aspect, wherein an adhesion reinforcing layer is provided on the element portion before forming the ceramic layer. In the case where the compatibility with the ceramic layer is poor and a ceramic film cannot be formed on the element forming film well, bonding can be surely performed by providing the adhesion reinforcing layer.

According to a fifth aspect of the present invention, in the electronic component according to the fourth aspect, a titanium oxide film is used as the adhesion reinforcing layer, and the element forming film is made of a metal, a metal compound, or the like. Even so, the titanium oxide film can be reliably formed on the element forming film, and the adhesion strength with the ceramic film can be increased.

According to a sixth aspect of the present invention, there is provided the electronic component according to the first aspect, wherein a step portion is provided on the base over the entire circumference, and an element portion is provided in the step portion. Since a gap can be provided between the element portion and the circuit board or the like, the characteristics do not vary at the time of mounting, and even when a protective material made of resin is provided, the protective material does not protrude greatly. Therefore, the seating of the electronic parts is deteriorated, and the mountability is not poor.

According to a seventh aspect of the present invention, there is provided the electronic component according to the first aspect, wherein the cross section of the terminal portion has a circular shape or a substantially regular polygonal shape. As a result, bulk mounting becomes possible and mountability is improved.

The invention according to claim 8 is the electronic device according to claim 1, wherein the element forming films formed on both ends of the base are a pair of terminals, and the element is provided between the pair of terminals. By forming a component, both ends can be joined to a circuit board or the like, mounting can be performed reliably, and it can be used as a chip component.

According to a ninth aspect of the present invention, the element forming film is formed of a conductive material, and furthermore, a spiral groove is formed in the element forming film, so that the axis is aligned with the longitudinal direction of the base. The electronic component according to claim 1, wherein a predetermined inductance is formed by providing an element-forming film in a shape of small, and a chip inductor having a small size and excellent weather resistance can be mass-produced with high productivity.

According to a tenth aspect of the present invention, the element forming film is formed of a resistive material, and further, a spiral groove is formed in the element forming film so that the axis of the spiral extends along the longitudinal direction of the base. The electronic component according to claim 1, wherein a predetermined resistance value is obtained by providing an element-forming film in a shape of a small, and a chip resistor having a small size and excellent weather resistance can be mass-produced with high productivity.

According to a still further aspect of the present invention, the element forming film is made of a conductive material, and the device forming film is divided by forming an annular groove in the element forming film. By forming the electronic component according to the first aspect of the present invention, a chip capacitor having excellent weather resistance can be obtained.

According to a twelfth aspect of the present invention, the element forming film is formed of a conductive material, and the spiral groove is formed in the element forming film so that the axis is along the longitudinal direction of the base. An electronic component according to claim 1, wherein a chip-shaped antenna having a small size and high weather resistance can be mass-produced by providing an element-forming film in a shape of a letter and obtaining antenna characteristics by using a terminal portion as a power supply portion. it can.

According to a thirteenth aspect of the present invention, in the electronic component according to the first aspect, a protective material made of resin is further provided on the ceramic layer. , Pick-up mistakes are greatly reduced.

Hereinafter, embodiments of the electronic component according to the present invention will be described.

1 and 2 are a perspective view and a side sectional view, respectively, showing an electronic component according to an embodiment of the present invention.

In FIGS. 1 and 2, reference numeral 11 denotes a base formed by subjecting an insulating material or the like to press working, extrusion, or the like, and reference numeral 12 denotes an element formation film provided on the base 11, The film 12 is formed on the base 11 by a plating method, a vapor deposition method such as a sputtering method, a baking method, or the like. Reference numeral 13 denotes a groove provided in the element forming film 12, and the groove 13
Is formed by irradiating the element forming film 12 with a laser beam or the like, is formed mechanically by applying a grindstone or the like to the element forming film 12, or is formed by selective etching using a resist or the like. By providing the groove 13 in a spiral shape, the spiral element forming film 12 is formed in the element forming film 12. Further, the groove 13 is preferably formed in both the base 11 and the element forming film 12. With such a configuration, the element forming film 12 can be completely cut, and deterioration of characteristics can be prevented.

In this embodiment, as described above, at least the groove 13 is provided in the element forming film 12 itself to form the element portion S having functions such as resistance, inductor, and capacitor. Even if the grooves 13 are not formed in the formation film 12 by a laser or the like, the element formation film 12 is formed on the base 11 after a photoresist layer is provided on a portion where the element formation film 12 is not arranged on the base 11. The groove 13 may be formed only in the element forming film 12 by forming the film and then removing the photoresist layer.

Reference numeral 14 denotes a ceramic film provided so as to cover the element forming film 12, and the ceramic film 14 protects the element forming film 12 and the like.

Reference numeral 15 denotes a protective material formed on the element forming film 12 (element part S), and reference numerals 16 and 17 denote terminal parts provided on the end of the base 11, respectively.

As described above, the ceramic film 14 having excellent weather resistance and high strength is formed by forming the ceramic film 14 (device portion S).
By providing it on the upper side, the bulging portion as shown in FIG. 6 is not formed as compared with the conventional case where the protective material is made of only the resin.

That is, if the element formation film is protected only by the resin as in the prior art, the resin must be applied very thick in terms of weather resistance and strength. Although such a bulging portion is formed, a problem occurs. However, by forming the ceramic film 14 as in the present embodiment, sufficient weather resistance can be obtained even with a very thin film, and the ceramic film 14 itself can be obtained. Because the strength is large,
A bulging portion is not formed as in the related art, and an element standing phenomenon can be suppressed.

In the case of this embodiment, when the ceramic film 14 is exposed on the surface during pickup by the mounting machine, the suction property by the nozzle is poor, so that a thin protective material 15 made of resin is provided. So, we solved this problem,
When such a problem does not occur, it is not necessary to provide the protection member 15. Therefore, the protection material 15 is unnecessary, or even if the protection material 15 is formed, the thickness is very thin and the accuracy may be poor, so that the productivity is improved.

Further, by making the cross sections of the terminal portions 16 and 17 into a regular polygonal shape or a circular shape, any side surface of the terminal portions 16 and 17 may be used as a mounting surface, so that mountability is greatly improved.

First, the shape of the base 11 will be described.

The base 11 is preferably formed in a prismatic or cylindrical shape. By forming the base 11 in a prismatic shape as shown in FIGS. And the like. In addition, among the rectangular bases, the base 11 is particularly preferably formed in a square pillar shape, which greatly facilitates the mounting and the positioning of the element on the circuit board. Further, since the base 11 has a prismatic structure, the structure becomes very simple, so that the productivity is good and the cost is very advantageous.

Further, by forming the base 11 into a columnar shape, the element formation film 12 is formed on the base 11 as described later.
When the groove 13 is formed in the element forming film 12 by laser processing or the like, the depth and the like of the groove 13 can be formed with high accuracy, and variations in characteristics can be suppressed.

Except for both ends of the base 11, a step portion 11z is formed over the entire circumference, and the element portion S is provided in the step portion 11z. By providing the step portion 11z, it is possible to prevent such a problem that the element portion S comes into direct contact with a circuit board or the like to cause a change in characteristics. It should be noted that the circuit board or the like is devised, or
When the risk of contact between the element portion S and the circuit board or the like is extremely small by other means, it is not particularly necessary to provide the step portion 11z (see FIG. 3). When the step portion does not need to be provided on the base 11, the base 11 has a very simple configuration, productivity is improved, and accuracy and the like can be improved.

As described above, the cross-sectional shape of both ends of the base 11 is preferably circular or polygonal.
In addition, it is preferable to use a polygonal shape, in particular, a regular polygonal shape, because the characteristics do not change much in any direction. Similarly, the cross section of the step portion 11z is also preferably circular or polygonal, and when it is polygonal, it is particularly preferably regular polygonal. The cross-sectional shape of the step portion 11z and the cross-sectional shape of both end portions may be different from each other,
The shape may be the same.

The constituent material of the base 11 is an insulating material,
A resistance material, a dielectric material, or the like can be used. Also,
The base 11 may be made of a magnetic material such as ferrite.

In this embodiment, the element forming film 12
The surface strength of the base 11 was adjusted by adjusting the surface roughness of the base 11, but, for example, between the base 11 and the element forming film 12, simple carbon or other elements were added to carbon. , Cr alone or an alloy of Cr and another metal (eg, N
By providing an intermediate layer constituted of at least one of i-Cr and the like, the adhesion strength between the element forming film 12 and the base 11 can be improved without adjusting the surface roughness.

Next, the element forming film 12 will be described.

Hereinafter, the element forming film 12 will be specifically described.

As a constituent material of the element forming film 12, for example, if the desired electronic component is a chip resistor, the element forming film 12 is formed of a resistive material such as carbon, and the desired electronic component is a chip inductor, a chip. For a capacitor, a chip antenna, or the like, a conductive material such as copper, a copper alloy, tin, or a tin alloy is preferably used.

Although the manufacturing method of the element forming film 12 differs depending on the constituent material, the element forming film 12 is formed directly on the base 11 by, for example, a plating method, a vacuum thin film forming technique such as a vapor deposition method or a sputtering method. May be.

As still another method, after a carbon film is formed on the base 11 by a carbon baking method or a vacuum thin film forming technique, the element forming film 12 may be formed on the carbon film. In particular, by using carbon as the base film, the adhesion strength between the element formation film 12 and the base 11 can be improved, and peeling of the element formation film 12 and the like can be prevented.

The thickness of the element forming film 12 is 1
To 50 μm (preferably 2 μm to 20 μm), and when the film thickness of the element forming film 12 is smaller than 1 μm,
The skin depth required for high-frequency current to flow cannot be sufficiently secured, or the DCR becomes high, resulting in poor characteristics.
If it is larger than 0 μm, the skin depth can be sufficiently ensured, but not only does the productivity deteriorate, but also the environmental resistance such as heat shock deteriorates.

The structure of the element part S in each chip component will be described.

First, the case of a chip resistor will be described.

In this case, the element forming film 12 is preferably made of a resistance material, and the groove 13 is provided spirally over the entire side surface of the base 11 as shown in FIGS.
A spiral element forming film 12 whose winding axis intersects with the end face of the base 11 is formed to be an element portion S. With such a configuration, for example, the spiral element forming film 12
The resistance value of the chip resistor can be adjusted by adjusting the width, the formation length, and the like of the chip resistor. Further, as long as a predetermined resistance value can be obtained without providing the groove 13, it is not particularly necessary to provide the groove 13. Further, a resistance value may be adjusted by providing a circular hole in the element forming film 12 and adjusting the number of the holes.

Next, the chip inductor will be described.

In this case, the element forming film 12 is made of a conductive material such as copper or a copper alloy, and the groove 13 is provided spirally over the entire side surface of the base 11 as shown in FIGS. Thus, a spiral element forming film 12 in which the winding axis intersects the end face of the base 11 is formed, and the element portion S is formed. With such a configuration, for example, the inductance value of the chip inductor can be adjusted by adjusting the width, the formation length, and the like of the spiral element formation film 12.

Next, the chip antenna will be described.

In this case, the element forming film 12 is made of a conductive material such as copper or a copper alloy, and the grooves 13 are provided spirally over the entire side surface of the base 11 as shown in FIGS. Thus, a spiral element forming film 12 in which the winding axis intersects the end face of the base 11 is formed, and the element portion S is formed. With such a configuration, for example, the frequency characteristics and the like of the chip antenna can be adjusted by adjusting the width and the formation length of the spiral element forming film 12. Also,
One of the terminal portions 16 and 17 is mounted on a circuit board as a power supply portion.

Next, the chip capacitor will be described.

In this case, the element forming film 12 is made of a conductive material such as copper or a copper alloy, and a ring-shaped continuous groove 13 is provided in the element forming film 12 as shown in FIG. The element forming film 12 on the 16 side and the terminal section 17 side is electrically separated to form an element section S. With such a configuration, a capacitance can be obtained between the separated element forming films 12, and the capacitance can be adjusted by adjusting the width and depth of the groove 13.

Next, the ceramic film 14 will be described.

As the ceramic film 14, an alumina film is preferably used. The alumina film is very hard, has excellent weather resistance, and has very good adhesion. Also,
When composed of an alumina film, the thickness is 0.05 μm or more.
It is preferable that the thickness is about 1.1 μm. 0.
If it is less than 05 μm, it is difficult to obtain sufficient weather resistance,
When the thickness is 1.1 μm or more, the alumina film is easily peeled.

As a method for forming an alumina film, first, an aluminum hydroxide sol aqueous solution is applied by a dipping method or the like on at least the element portion S except for the element forming film 12 to be the terminal portions 16 and 17. At this time,
The desired thickness of the alumina film can be realized by adjusting the alumina content in the aluminum hydroxide sol. That is, a thin alumina film can be formed by reducing the amount of alumina in the aluminum hydroxide sol to be applied, and a thick alumina film can be formed by increasing the concentration.

For example, when the thickness of the alumina film is set in the above range, the alumina content is 0.8 wt%.
Preferably, the content is about 8 wt%. In addition, as a specific alumina hydroxide sol, for example, a trade name (alumina sol 100 manufactured by Nissan Chemical Industries, Ltd.) or the like can be used.

After the application of the alumina sol, the coating is dried, for example, for about 0.5 to 10 hours.
Heat treatment is performed at a temperature of 30 ° C. for 30 minutes to form an alumina film.

In particular, when the base 11 is made of alumina alone or a material containing alumina as a main component, the base 1
1 and the ceramic film 14 have very similar coefficients of thermal expansion, so that the alumina film is very unlikely to be peeled off by stress.

That is, by making the constituent material of the base 11 and the constituent material of the ceramic film 14 equal or very similar, for example, the base 11 and the ceramic film 14 exposed from the groove 13 are formed. It can firmly adhere and can alleviate the accumulation of stress due to the difference in thermal expansion coefficient.

In the case where the ceramic film 14 is difficult to be formed on the element forming film 12 due to the compatibility of the materials and the like, although not shown, first, a sol-gel method or the like is applied to the portion where the ceramic film 14 is to be formed. After a titanium oxide (famous for photocatalyst) film is formed in a thickness of 0.1 μm to several μm by using a ceramic film 1 such as an alumina film as described above,
By forming 4, the ceramic film 14 can be firmly formed on the element forming film 12. In this case, the titanium oxide film has a function as an adhesion reinforcing layer.

Next, the protective member 15 will be described.

The protection member 15 is provided as needed.
In other words, the weather resistance is sufficient since the protective material 15 is provided, so that the protective material 15 may not be provided depending on specifications and the like.

In some cases, a thin protective material 15 may be provided for the purpose of ensuring insulation between the element portion S and a circuit board or the like. As described above, the ceramic film 14 is formed on the element portion S.
Is provided, there is no problem in weather resistance, and it is not necessary to provide a uniform and thick protective material 15 as in the related art, so that productivity is improved.

In the case of mounting by suction with the nozzle of the mounting machine, if the surface in contact with the nozzle is the ceramic film 14, a suction error may occur. By making the film thin, it is possible to significantly reduce suction errors.

Further, by providing the protective material 15, the portions exposed from the protective material 15 can be used as the terminal portions 16 and 17, and the terminal portions 16 and 17 can be clarified. Accuracy can be improved. In addition,
In particular, in the case of a chip antenna, one of the terminal portions 16 and 17 must be used as a power supply portion. Thus, by providing the protective material 15 in this manner, the position (terminal portion 1) that becomes the power supply portion is provided.
By unifying the distance between 6, 17 and the element section S),
At the time of mounting, a chip antenna with small variations in characteristics can be obtained.

As the protective material 15, a method of applying an epoxy resin or the like, a method of forming a cationic paint or the like by an electrodeposition method, that is, a method of forming an electrodeposited resin film on the protective material 15 is preferably used. Used.

Next, the terminal portions 16 and 17 will be described.

In the case where the element forming film 12 is formed of a material having a good bonding property with solder or the like, the element forming film 12 itself may be used as the terminal portions 16 and 17. A conductive corrosion-resistant layer such as Ni or a Ni alloy is provided on the element forming film 12 and has a corrosion resistance. The terminals 16 and 17 may be formed by laminating layers. In addition, at least bonding is required among the corrosion resistant layer and the bonding layer. In addition, a lead-free electronic component can be obtained by using a bonding layer such as Sn alone or a Sn alloy (excluding a lead alloy).

Further, by providing the protective members 15 on at least all side surfaces of the terminal portions 16 and 17, the directionality at the time of mounting can be eliminated. That is, the terminal portions 16 and 1
The protection member 15 and the element forming film 12 may be provided or not provided on each of the opposing end surfaces of 7 without protection.

With respect to the electronic component configured as described above,
Hereinafter, the manufacturing method will be described.

First, the base 11 is manufactured by pressing or extruding an insulating material such as alumina. Next, an element forming film 12, a groove 13, or the like is formed on the entire base 11 (or on all side faces excluding the end face) by a plating method, a sputtering method, or the like, and an element portion S is formed on the side surface of the base 11. . In the case of a chip resistor, a chip inductor, or a chip antenna, it is preferably an element portion S provided with a spiral element forming film 12, and in the case of a chip capacitor, a ring-shaped left and right element forming film 12 is separated. The element section S is provided as described above. When the grooves 13 are formed in the element forming film 12 without using a photoresist or the like, laser processing or cutting with a grindstone is preferably used.

Next, as described above, the ceramic film 14 is formed on the element portion S by applying, drying, and heat-treating the ceramic film 14. At this time, the ceramic film 14 is formed except for the terminal portions 16 and 17. Sometimes ceramic membrane 1
Before forming 4 on the element portion S, an adhesion strengthening layer such as a titanium oxide film is formed.

Next, depending on the specifications of the electronic component, etc., the protective member 15 is provided so as to avoid both ends or to cover the element portion S.

As described above, in the electronic component constituting the element portion S on the surface of the base 11, the provision of the ceramic film 14 eliminates the need to provide the resin protective material 15 at all, or makes it extremely thin. Since it is only necessary to form them, it is not necessary to form the bulging portion of the protective material 15 as in the related art, and it is possible to prevent the occurrence of an element standing phenomenon or the like.

[0074]

According to the present invention, there are provided a base, an element forming film provided on the base, an element portion provided by forming a groove or the like in the element forming film, and a terminal provided on the base. And the ceramic film provided on the element portion, the protective material made of resin becomes unnecessary, or a very thin protective material can be used. Can be suppressed, the element standing phenomenon can be suppressed, the mountability can be improved, and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing the electronic component according to the embodiment of the present invention;

FIG. 3 is a side sectional view showing the electronic component according to the embodiment of the present invention;

FIG. 4 is a side sectional view showing an electronic component according to one embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional electronic component.

FIG. 6 is a side view showing a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Base 11z Step part 12 Element formation film 13 Groove 14 Ceramic film 15 Protective material 16, 17 Terminal part S Element part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01Q 1/38 H01G 1/14 CF term (Reference) 5E028 BB01 CA01 JC06 5E033 AA10 BB03 BD01 5E070 AA01 AB04 CC03 5J046 AA00 AA09 AB00 AB12 PA01

Claims (13)

[Claims] 1. A base, an element forming film provided on the base, an element part formed by forming a groove or the like in the element forming film, and a terminal part provided on the base And a ceramic film provided on the element section. 2. The electronic component according to claim 1, wherein the constituent material of the ceramic film and the constituent material of the base are the same or the main components are the same. 3. The electronic component according to claim 1, wherein an alumina film is provided as the ceramic film. 4. The electronic component according to claim 1, wherein an adhesion strengthening layer is provided on the element portion before forming the ceramic layer. 5. The electronic component according to claim 4, wherein a titanium oxide film is used as the adhesion reinforcing layer. 6. The electronic component according to claim 1, wherein a step portion is provided on the base over the entire circumference, and an element portion is provided in the step portion. 7. The electronic component according to claim 1, wherein the cross section of the terminal portion has a circular shape or a substantially regular polygonal shape. 8. The device according to claim 1, wherein the element forming film and the protective film formed on both ends of the base are a pair of terminals, and the element is provided between the pair of terminals. Electronic components. 9. The element forming film is formed of a conductive material, and a spiral groove is formed in the element forming film so that the spiral element forming film is formed so that the axis thereof is along the longitudinal direction of the base. 2. The electronic component according to claim 1, wherein the electronic component is provided to form a predetermined inductance. 10. An element forming film made of a resistance material, and a spiral groove is formed in said element forming film.
2. The electronic component according to claim 1, wherein a predetermined resistance value is obtained by providing a spiral element forming film such that the axis is along the longitudinal direction of the base. 11. An element forming film made of a conductive material, and by forming an annular groove in the element forming film, the element forming film is divided, and a capacitance is formed between the divided element forming films. The electronic component according to claim 1, wherein: 12. An element forming film is formed of a conductive material, and a spiral groove is formed in said element forming film.
2. The electronic component according to claim 1, wherein a spiral element forming film is provided so that an axis thereof extends along a longitudinal direction of the base, and antenna characteristics are obtained by using a terminal portion as a feeding portion. 13. The electronic component according to claim 1, further comprising a resin protective material provided on the ceramic layer.