JP2678489C - - Google Patents

Info

Publication number

JP2678489C

JP2678489C JP2678489C JP 2678489 C JP2678489 C JP 2678489C JP 2678489 C JP2678489 C JP 2678489C

Authority

JP

Japan

Prior art keywords

shaped

frame

semiconductor element

ceramic sheet

unfired ceramic

Prior art date

1999-12-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000000919 ceramic Substances 0.000 claims description 66
• 239000004065 semiconductor Substances 0.000 claims description 46
• 238000004519 manufacturing process Methods 0.000 claims description 10
• 238000000034 method Methods 0.000 claims description 9
• 229910015365 Au—Si Inorganic materials 0.000 claims description 4
• 239000006023 eutectic alloy Substances 0.000 claims description 4
• 230000004308 accommodation Effects 0.000 claims 1
• 239000004020 conductor Substances 0.000 description 15
• 239000011572 manganese Substances 0.000 description 6
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
• 239000003960 organic solvent Substances 0.000 description 4
• 239000000843 powder Substances 0.000 description 4
• PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
• ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
• 239000011230 binding agent Substances 0.000 description 3
• 229910052748 manganese Inorganic materials 0.000 description 3
• 238000002844 melting Methods 0.000 description 3
• 230000008018 melting Effects 0.000 description 3
• 229910052751 metal Inorganic materials 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 229910052750 molybdenum Inorganic materials 0.000 description 3
• 239000011733 molybdenum Substances 0.000 description 3
• 238000003825 pressing Methods 0.000 description 3
• 238000007650 screen-printing Methods 0.000 description 3
• 238000005245 sintering Methods 0.000 description 3
• 239000002002 slurry Substances 0.000 description 3
• 239000000758 substrate Substances 0.000 description 3
• WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
• 229910052721 tungsten Inorganic materials 0.000 description 3
• 239000010937 tungsten Substances 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 238000005219 brazing Methods 0.000 description 2
• 238000006073 displacement reaction Methods 0.000 description 2
• 238000007606 doctor blade method Methods 0.000 description 2
• 238000004080 punching Methods 0.000 description 2
• 239000002904 solvent Substances 0.000 description 2
• 239000011800 void material Substances 0.000 description 2
• 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 239000002253 acid Substances 0.000 description 1
• 229910010293 ceramic material Inorganic materials 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000012777 electrically insulating material Substances 0.000 description 1
• 239000012467 final product Substances 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 230000001590 oxidative effect Effects 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1