JP2647585B2 - 自動薄膜計測装置 - Google Patents

自動薄膜計測装置

Info

Publication number
JP2647585B2
JP2647585B2 JP3314851A JP31485191A JP2647585B2 JP 2647585 B2 JP2647585 B2 JP 2647585B2 JP 3314851 A JP3314851 A JP 3314851A JP 31485191 A JP31485191 A JP 31485191A JP 2647585 B2 JP2647585 B2 JP 2647585B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
weight
measurement
origin
precision balance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3314851A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05149741A (ja
Inventor
正則 小畑
純一 有馬
勝弘 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3314851A priority Critical patent/JP2647585B2/ja
Priority to US07/850,026 priority patent/US5321634A/en
Priority to KR1019920021993A priority patent/KR960012745B1/ko
Priority to DE4239439A priority patent/DE4239439C2/de
Publication of JPH05149741A publication Critical patent/JPH05149741A/ja
Application granted granted Critical
Publication of JP2647585B2 publication Critical patent/JP2647585B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G1/00—Weighing apparatus involving the use of a counterweight or other counterbalancing mass
    • G01G1/18—Balances involving the use of a pivoted beam, i.e. beam balances
    • G01G1/24—Platform-type scales, i.e. having the pans carried above the beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Physical Vapour Deposition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP3314851A 1991-11-28 1991-11-28 自動薄膜計測装置 Expired - Fee Related JP2647585B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3314851A JP2647585B2 (ja) 1991-11-28 1991-11-28 自動薄膜計測装置
US07/850,026 US5321634A (en) 1991-11-28 1992-03-12 Automatic thin-film measuring apparatus
KR1019920021993A KR960012745B1 (ko) 1991-11-28 1992-11-21 자동박막계측장치
DE4239439A DE4239439C2 (de) 1991-11-28 1992-11-24 Automatisches Dünnfilm-Meßgerät

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3314851A JP2647585B2 (ja) 1991-11-28 1991-11-28 自動薄膜計測装置

Publications (2)

Publication Number Publication Date
JPH05149741A JPH05149741A (ja) 1993-06-15
JP2647585B2 true JP2647585B2 (ja) 1997-08-27

Family

ID=18058378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3314851A Expired - Fee Related JP2647585B2 (ja) 1991-11-28 1991-11-28 自動薄膜計測装置

Country Status (4)

Country Link
US (1) US5321634A (enExample)
JP (1) JP2647585B2 (enExample)
KR (1) KR960012745B1 (enExample)
DE (1) DE4239439C2 (enExample)

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JP2576338B2 (ja) * 1992-07-31 1997-01-29 株式会社島津製作所 ウエハ自動秤量システム
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
FR2720824B1 (fr) * 1994-06-02 1997-01-24 Macofar Spa Procédé pour le contrôle en ligne du poids de capsules et appareil relatif.
US5801337A (en) * 1996-01-11 1998-09-01 Barnstead/Thermolyne Corporation Method of and apparatus for compensating for load/environment temperature differential-induced measured load weight error
US5924058A (en) * 1997-02-14 1999-07-13 Applied Materials, Inc. Permanently mounted reference sample for a substrate measurement tool
DE59812856D1 (de) * 1997-03-11 2005-07-21 Mettler Toledo Gmbh Elektronische Waage
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6023666A (en) * 1998-07-20 2000-02-08 Micron Technology, Inc. In-line method of monitoring die attach material adhesive weight
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
GB0016562D0 (en) * 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6902647B2 (en) * 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
US20050105997A1 (en) * 2003-09-11 2005-05-19 Englhardt Eric A. Methods and apparatus for carriers suitable for use in high-speed/high-acceleration transport systems
DE102004007952B3 (de) * 2004-02-18 2005-09-01 Infineon Technologies Ag Verfahren zum Bestimmen der Tiefe von in einem Trägersubstrat ausgebildeten Vertiefungen
US20060154385A1 (en) * 2005-01-07 2006-07-13 Ravinder Aggarwal Fabrication pathway integrated metrology device
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719469D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
DK2251454T3 (da) 2009-05-13 2014-10-13 Sio2 Medical Products Inc Coating og inspektion af beholder
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
KR101181274B1 (ko) * 2009-12-31 2012-09-11 한국과학기술연구원 플렉서블 기판상의 금속층 두께 측정방법
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
JP5630093B2 (ja) * 2010-06-24 2014-11-26 株式会社島津製作所 電子天びん
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US8851816B2 (en) * 2011-04-07 2014-10-07 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
AU2012318242A1 (en) 2011-11-11 2013-05-30 Sio2 Medical Products, Inc. Passivation, pH protective or lubricity coating for pharmaceutical package, coating process and apparatus
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
WO2013170044A1 (en) * 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Inspection methods for pecvd coatings
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
CA2890066C (en) 2012-11-01 2021-11-09 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
EP2925903B1 (en) 2012-11-30 2022-04-13 Si02 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
US9354108B2 (en) * 2012-12-05 2016-05-31 Shimadzu Corporation Electronic balance
EP2961858B1 (en) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Coated syringe.
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
JP6160819B2 (ja) 2013-05-22 2017-07-12 株式会社タニタ 重量測定装置、生体測定装置及び重量測定プログラム
EP3693493A1 (en) 2014-03-28 2020-08-12 SiO2 Medical Products, Inc. Antistatic coatings for plastic vessels
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10081869B2 (en) 2014-06-10 2018-09-25 Lam Research Corporation Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
US11077233B2 (en) 2015-08-18 2021-08-03 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
KR20170134094A (ko) * 2016-05-27 2017-12-06 세메스 주식회사 기판 처리 장치 및 방법
KR102063322B1 (ko) 2016-05-27 2020-01-08 세메스 주식회사 기판 처리 장치 및 방법
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN109374467B (zh) * 2018-12-29 2024-08-09 无锡威孚环保催化剂有限公司 测定汽车尾气催化剂涂层均匀度的方法
CN113029070B (zh) * 2019-12-25 2023-04-18 中国科学院微电子研究所 一种监测原子层沉积薄膜生长厚度的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198325A (ja) * 1983-04-27 1984-11-10 Ishida Scales Mfg Co Ltd 自動零点調整方法
CH667921A5 (de) * 1985-09-18 1988-11-15 Mettler Instrumente Ag Analysenwaage.
US5104276A (en) * 1989-05-19 1992-04-14 Applied Materials, Inc. Robotically loaded epitaxial deposition apparatus

Also Published As

Publication number Publication date
DE4239439C2 (de) 1995-03-09
JPH05149741A (ja) 1993-06-15
KR960012745B1 (ko) 1996-09-24
KR930010535A (ko) 1993-06-22
DE4239439A1 (enExample) 1993-06-03
US5321634A (en) 1994-06-14

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