KR960012745B1 - 자동박막계측장치 - Google Patents

자동박막계측장치 Download PDF

Info

Publication number
KR960012745B1
KR960012745B1 KR1019920021993A KR920021993A KR960012745B1 KR 960012745 B1 KR960012745 B1 KR 960012745B1 KR 1019920021993 A KR1019920021993 A KR 1019920021993A KR 920021993 A KR920021993 A KR 920021993A KR 960012745 B1 KR960012745 B1 KR 960012745B1
Authority
KR
South Korea
Prior art keywords
semiconductor substrate
weight
thin film
precision balance
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920021993A
Other languages
English (en)
Korean (ko)
Other versions
KR930010535A (ko
Inventor
오바따 마사노리
Original Assignee
미쓰비시 뎅끼 가부시끼가이샤
시기 모리야
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 뎅끼 가부시끼가이샤, 시기 모리야 filed Critical 미쓰비시 뎅끼 가부시끼가이샤
Publication of KR930010535A publication Critical patent/KR930010535A/ko
Application granted granted Critical
Publication of KR960012745B1 publication Critical patent/KR960012745B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G1/00—Weighing apparatus involving the use of a counterweight or other counterbalancing mass
    • G01G1/18—Balances involving the use of a pivoted beam, i.e. beam balances
    • G01G1/24—Platform-type scales, i.e. having the pans carried above the beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Physical Vapour Deposition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1019920021993A 1991-11-28 1992-11-21 자동박막계측장치 Expired - Fee Related KR960012745B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3314851A JP2647585B2 (ja) 1991-11-28 1991-11-28 自動薄膜計測装置
JP91-314851 1991-11-28

Publications (2)

Publication Number Publication Date
KR930010535A KR930010535A (ko) 1993-06-22
KR960012745B1 true KR960012745B1 (ko) 1996-09-24

Family

ID=18058378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920021993A Expired - Fee Related KR960012745B1 (ko) 1991-11-28 1992-11-21 자동박막계측장치

Country Status (4)

Country Link
US (1) US5321634A (enExample)
JP (1) JP2647585B2 (enExample)
KR (1) KR960012745B1 (enExample)
DE (1) DE4239439C2 (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2576338B2 (ja) * 1992-07-31 1997-01-29 株式会社島津製作所 ウエハ自動秤量システム
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
FR2720824B1 (fr) * 1994-06-02 1997-01-24 Macofar Spa Procédé pour le contrôle en ligne du poids de capsules et appareil relatif.
US5801337A (en) * 1996-01-11 1998-09-01 Barnstead/Thermolyne Corporation Method of and apparatus for compensating for load/environment temperature differential-induced measured load weight error
US5924058A (en) * 1997-02-14 1999-07-13 Applied Materials, Inc. Permanently mounted reference sample for a substrate measurement tool
DE59812856D1 (de) * 1997-03-11 2005-07-21 Mettler Toledo Gmbh Elektronische Waage
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6023666A (en) * 1998-07-20 2000-02-08 Micron Technology, Inc. In-line method of monitoring die attach material adhesive weight
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
GB0016562D0 (en) * 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6902647B2 (en) * 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
US20050105997A1 (en) * 2003-09-11 2005-05-19 Englhardt Eric A. Methods and apparatus for carriers suitable for use in high-speed/high-acceleration transport systems
DE102004007952B3 (de) * 2004-02-18 2005-09-01 Infineon Technologies Ag Verfahren zum Bestimmen der Tiefe von in einem Trägersubstrat ausgebildeten Vertiefungen
US20060154385A1 (en) * 2005-01-07 2006-07-13 Ravinder Aggarwal Fabrication pathway integrated metrology device
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719469D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
DK2251454T3 (da) 2009-05-13 2014-10-13 Sio2 Medical Products Inc Coating og inspektion af beholder
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
KR101181274B1 (ko) * 2009-12-31 2012-09-11 한국과학기술연구원 플렉서블 기판상의 금속층 두께 측정방법
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
JP5630093B2 (ja) * 2010-06-24 2014-11-26 株式会社島津製作所 電子天びん
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US8851816B2 (en) * 2011-04-07 2014-10-07 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
AU2012318242A1 (en) 2011-11-11 2013-05-30 Sio2 Medical Products, Inc. Passivation, pH protective or lubricity coating for pharmaceutical package, coating process and apparatus
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
WO2013170044A1 (en) * 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Inspection methods for pecvd coatings
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
CA2890066C (en) 2012-11-01 2021-11-09 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
EP2925903B1 (en) 2012-11-30 2022-04-13 Si02 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
US9354108B2 (en) * 2012-12-05 2016-05-31 Shimadzu Corporation Electronic balance
EP2961858B1 (en) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Coated syringe.
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
JP6160819B2 (ja) 2013-05-22 2017-07-12 株式会社タニタ 重量測定装置、生体測定装置及び重量測定プログラム
EP3693493A1 (en) 2014-03-28 2020-08-12 SiO2 Medical Products, Inc. Antistatic coatings for plastic vessels
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10081869B2 (en) 2014-06-10 2018-09-25 Lam Research Corporation Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
US11077233B2 (en) 2015-08-18 2021-08-03 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
KR20170134094A (ko) * 2016-05-27 2017-12-06 세메스 주식회사 기판 처리 장치 및 방법
KR102063322B1 (ko) 2016-05-27 2020-01-08 세메스 주식회사 기판 처리 장치 및 방법
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN109374467B (zh) * 2018-12-29 2024-08-09 无锡威孚环保催化剂有限公司 测定汽车尾气催化剂涂层均匀度的方法
CN113029070B (zh) * 2019-12-25 2023-04-18 中国科学院微电子研究所 一种监测原子层沉积薄膜生长厚度的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198325A (ja) * 1983-04-27 1984-11-10 Ishida Scales Mfg Co Ltd 自動零点調整方法
CH667921A5 (de) * 1985-09-18 1988-11-15 Mettler Instrumente Ag Analysenwaage.
US5104276A (en) * 1989-05-19 1992-04-14 Applied Materials, Inc. Robotically loaded epitaxial deposition apparatus

Also Published As

Publication number Publication date
DE4239439C2 (de) 1995-03-09
JPH05149741A (ja) 1993-06-15
KR930010535A (ko) 1993-06-22
DE4239439A1 (enExample) 1993-06-03
US5321634A (en) 1994-06-14
JP2647585B2 (ja) 1997-08-27

Similar Documents

Publication Publication Date Title
KR960012745B1 (ko) 자동박막계측장치
US5625170A (en) Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
US6910381B2 (en) System and method of operation of an embedded system for a digital capacitance diaphragm gauge
US6622104B2 (en) Heat treatment apparatus, calibration method for temperature measuring system of the apparatus, and heat treatment system
US20060095228A1 (en) Apparatus and method for investigating semiconductor wafers
WO2003040656A1 (en) Self-calibrating inertial measurement system method and apparatus
US11959934B2 (en) High precision weighing system and weighing method, thermogravimetric analyser and storage medium
US6826502B2 (en) Methods and systems for calibration and compensation of accelerometers with bias instability
JP6449889B2 (ja) 半導体ウェハの質量に関する情報を判定するための方法および装置
JP2000121423A (ja) 校正適否の判断機構を有する電子秤
JP2001165648A (ja) 膜厚測定装置及び膜厚測定方法
JPH0650803A (ja) ウエハ自動秤量システム
JP6558907B2 (ja) ガス濃度測定装置及びガス濃度測定方法
JP2005011851A (ja) 基板処理装置及び基板処理方法
JPH06331427A (ja) 電子秤
JPH0583847B2 (enExample)
JPH04151594A (ja) 温度補正装置
JPH0415549A (ja) 熱量計
JPS59202033A (ja) 感度自動補正装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20040910

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20050925

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20050925

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000