JP2643605B2 - Piezo components - Google Patents
Piezo componentsInfo
- Publication number
- JP2643605B2 JP2643605B2 JP2408816A JP40881690A JP2643605B2 JP 2643605 B2 JP2643605 B2 JP 2643605B2 JP 2408816 A JP2408816 A JP 2408816A JP 40881690 A JP40881690 A JP 40881690A JP 2643605 B2 JP2643605 B2 JP 2643605B2
- Authority
- JP
- Japan
- Prior art keywords
- box member
- damping material
- piezoelectric substrate
- piezoelectric
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、音声ＩＦ回路や復調回
路、トラップ回路等に利用される圧電部品に関する。The present invention relates to a piezoelectric component used for an audio IF circuit, a demodulation circuit, a trap circuit, and the like.
【０００２】[0002]
【従来の技術と課題】従来、この種の圧電部品としては
図３に示すものが知られている。ケーシング２０は箱部
材２１と蓋部材２６とで構成され、これら箱部材２１と
蓋部材２６とは接着剤２５を介して固着される。振動電
極を表面に設けた圧電体基板２７は、この圧電体基板２
７を覆うダンピング材２８と共にケーシング２０に収納
されている。箱部材２１の表面に形成した銀薄膜からな
る引出し電極２２は、圧電体基板２７の振動電極から引
き出された引出し電極に接続している。2. Description of the Related Art Conventionally, a piezoelectric component of this type has been known as shown in FIG. The casing 20 includes a box member 21 and a cover member 26, and the box member 21 and the cover member 26 are fixed to each other via an adhesive 25. The piezoelectric substrate 27 provided with the vibrating electrode on its surface is
The casing 7 is housed in the casing 20 together with a damping material 28 covering the casing 7. An extraction electrode 22 made of a silver thin film formed on the surface of the box member 21 is connected to an extraction electrode extracted from the vibration electrode of the piezoelectric substrate 27.
【０００３】以上の構成の圧電部品において、圧電体基
板２７をダンピング材２８で覆う場合、溶融状態のダン
ピング材を箱部材２１に注入すると、ダンピング材の一
部が引出し電極２２にしみ出し、しみ出し部分２８ａを
形成する。このしみ出し部分２８ａは、箱部材２１の接
着面に形成されるため、箱部材２１と蓋部材２６との固
着が不充分なものとなる。何故なら、通常接着剤として
使用されるエポキシ樹脂系の接着剤とダンピング材（例
えば、シリコンゴム）とは相互間の接着強度が弱いから
である。In the piezoelectric component having the above structure, when the piezoelectric substrate 27 is covered with the damping material 28, when the damping material in a molten state is injected into the box member 21, a part of the damping material exudes to the extraction electrode 22 and stains. An extension portion 28a is formed. Since the extruded portion 28a is formed on the bonding surface of the box member 21, the fixation between the box member 21 and the lid member 26 becomes insufficient. This is because the adhesive strength between the epoxy resin-based adhesive and the damping material (for example, silicone rubber), which are usually used as the adhesive, is weak.
【０００４】そこで、本発明の課題は、ダンピング材が
ケーシングの接着面にしみ出さない構造の圧電部品を提
供することにある。An object of the present invention is to provide a piezoelectric component having a structure in which a damping material does not exude to an adhesive surface of a casing.
【０００５】[0005]
【課題を解決するための手段】以上の課題を解決するた
め、本発明に係る圧電部品は、ケーシングが箱部材と蓋
部材とで構成され、該箱部材と蓋部材によって密閉され
た振動空間に臨む中間段を該箱部材の内壁面に設け、こ
の中間段の位置まで溶融状態のダンピング材を注入して
圧電体基板を覆ったことを特徴とする。In order to solve the above problems, a piezoelectric component according to the present invention has a casing composed of a box member and a lid member, which is hermetically sealed by the box member and the lid member.
An intermediate stage facing the vibrating space is provided on the inner wall surface of the box member, and a damping material in a molten state is injected to the position of the intermediate stage to cover the piezoelectric substrate.
【０００６】[0006]
【作用】以上の構成において、箱部材の内壁面に設けら
れ、かつ、該箱部材と蓋部材によって密閉された振動空
間に臨む中間段によって、箱部材の接着面とダンピング
材の界面との間の沿面距離が長くなる。その結果、ダン
ピング材のしみ出しが中間段の位置まで達しても、箱部
材の接着面にまで達することはなくなる。[Action] In the above configuration, et al provided on the inner wall surface of the box member
Vibrating air sealed by the box member and the lid member.
The intermediate step between them increases the creeping distance between the bonding surface of the box member and the interface of the damping material. As a result, even if the seepage of the damping material reaches the position of the intermediate stage, it does not reach the bonding surface of the box member.
【０００７】[0007]
【実施例】以下、本発明に係る圧電部品の一実施例を添
付図面を参照して説明する。図１は圧電部品の分解斜視
図である。絶縁性ケーシング１は箱部材２と蓋部材８と
で構成されている。箱部材２は凹部３を有し、この凹部
３の底面の両端部及び中央部に後述の圧電体基板１０を
横長の状態で水平に支持する段差２ａ，２ｂ，２ｃが設
けられている。凹部３の開口側周囲には、中間段４が、
箱部材２と蓋部材８によって密閉される振動空間に臨む
ように、設けられている。箱部材２の段差２ａ，２ｂ，
２ｃの部分には銀等の金属薄膜５ａ，５ｂ，５ｃが蒸着
又はスパッタ等の方法により形成されている。これら薄
膜５ａ〜５ｃは中間段４を横切り、箱部材２の上下面及
び側面に延在している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the piezoelectric component according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an exploded perspective view of the piezoelectric component. The insulating casing 1 includes a box member 2 and a lid member 8. The box member 2 has a concave portion 3, and steps 2 a, 2 b, and 2 c are provided at both ends and a central portion of the bottom surface of the concave portion 3 to horizontally support a piezoelectric substrate 10 described later in a horizontally long state. Around the opening side of the concave portion 3 , an intermediate stage 4 is provided .
Facing the vibration space sealed by the box member 2 and the lid member 8
As described above, it is provided. Steps 2a, 2b of the box member 2,
In the portion 2c, metal thin films 5a, 5b, 5c of silver or the like are formed by a method such as vapor deposition or sputtering. These thin films 5 a to 5 c traverse the intermediate step 4 and extend on the upper and lower surfaces and side surfaces of the box member 2.
【０００８】圧電体基板１０は、BaTiO3やPb(ZrTi)O3等
のセラミックス基板からなり、その表裏面に振動電極１
２ａ，１２ｂ，１２ｃ，１２ｄ，１２ｅ，１２ｆを設け
ている。この圧電体基板１０は、振動電極１２ａ，１２
ｄ，１２ｅ，１２ｆにそれぞれ接続している引出し電極
１３ａ，１３ｄ，１３ｅが、薄膜５ａ，５ｂ，５ｃに接
続するように箱部材２に収納される。この後、溶融状態
のシリコンゴム等が箱部材２の凹部３の中にディスペン
サ法等の方法により中間段４に達するまで注入される。
シリコンゴムは圧電体基板１０の裏面にも回り込み、圧
電体基板１０の振動部分を十分に覆う状態となる。この
シリコンゴムは固化してダンピング材７（図２参照）と
なる。このとき、シリコンゴムの一部は中間段４の面に
形成された金属薄膜５ａ，５ｂ，５ｃの部分にしみ出
し、しみ出し部分７ａを形成する。しかし、中間段４に
よって、箱部材２の接着面２ｅとダンピング材７の界面
との相互間の沿面距離が長くなったため、ダンピング材
７のしみ出し部分７ａは接着面２ｅにまで達しない。The piezoelectric substrate 10 is made of a ceramic substrate such as BaTiO 3 or Pb (ZrTi) O 3 , and has a vibrating electrode 1 on its front and back surfaces.
2a, 12b, 12c, 12d, 12e, and 12f are provided. The piezoelectric substrate 10 includes vibration electrodes 12a and 12a.
The extraction electrodes 13a, 13d, and 13e connected to d, 12e, and 12f, respectively, are housed in the box member 2 so as to be connected to the thin films 5a, 5b, and 5c. Thereafter, molten silicon rubber or the like is injected into the concave portion 3 of the box member 2 by a method such as a dispenser method until it reaches the intermediate stage 4.
The silicon rubber also wraps around the back surface of the piezoelectric substrate 10 and sufficiently covers the vibrating portion of the piezoelectric substrate 10. This silicone rubber solidifies to become the damping material 7 (see FIG. 2). At this time, a part of the silicon rubber exudes to the portions of the metal thin films 5a, 5b, 5c formed on the surface of the intermediate stage 4, forming an exuded portion 7a. However, since the creepage distance between the bonding surface 2e of the box member 2 and the interface of the damping material 7 is increased by the intermediate step 4, the extruded portion 7a of the damping material 7 does not reach the bonding surface 2e.
【０００９】蓋部材８は、その両端部及び中央部に金属
薄膜９ａ，９ｂ，９ｃが蒸着等の方法により形成されて
いる。この蓋部材８は圧電体基板１０が収納された箱部
材２の接着面２ｅに載置され、箱部材２の接着面２ｅに
予め塗布していた接着剤１４（図２参照）、例えば、エ
ポキシ系の接着剤にて箱部材２に固着される。こうし
て、圧電体基板１０は箱部材２と蓋部材８によって完全
に密閉された振動空間に収納された状態となる。この
後、金属薄膜５ａ，５ｂ，５ｃ，９ａ，９ｂ，９ｃの露
出部分にめっき等の手段にて金属厚膜１５（図２参照）
等を形成して完成品とする。The cover member 8 has metal thin films 9a, 9b, 9c formed at both ends and a center thereof by a method such as vapor deposition. The lid member 8 is placed on the bonding surface 2e of the box member 2 in which the piezoelectric substrate 10 is stored, and an adhesive 14 (see FIG. 2) previously applied to the bonding surface 2e of the box member 2, for example, epoxy It is fixed to the box member 2 with a system adhesive. Thus, the piezoelectric substrate 10 is housed in the vibration space completely closed by the box member 2 and the lid member 8. Thereafter, the exposed portions of the metal thin films 5a, 5b, 5c, 9a, 9b, 9c are plated with a metal thick film 15 (see FIG. 2) by means such as plating.
Etc. to form a finished product.
【００１０】なお、本発明に係る圧電部品は前記実施例
に限定するものではなく、その要旨の範囲内で種々に変
形することができる。特に、中間段は箱部材の凹部の外
周全てに設ける必要はなく、金属薄膜形成部分にのみ設
けてもダンピング材の接着面へのしみ出しは防止でき
る。The piezoelectric component according to the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the invention. In particular, the intermediate stage does not need to be provided on the entire outer periphery of the concave portion of the box member, and even if it is provided only on the portion where the metal thin film is formed, it is possible to prevent the damping material from seeping onto the bonding surface.
【００１１】[0011]
【発明の効果】以上のように、本発明によれば、箱部材
と蓋部材によって密閉された振動空間に臨む中間段を該
箱部材の内壁面に設けたため、箱部材の接着面とダンピ
ング材の界面との相互間の沿面距離が長くなり、ダンピ
ング材がケーシングの接着面にしみ出さない構造の圧電
部品が得られる。その結果、振動空間の密閉性が高いも
のが得られる。As described above, according to the present invention, the box member
The intermediate stage facing the sealed vibration space by the lid member
Since it is provided on the inner wall surface of the box member, the creeping distance between the bonding surface of the box member and the interface of the damping material is increased, and a piezoelectric component having a structure in which the damping material does not exude to the bonding surface of the casing is obtained. As a result, a vibrating space having a high hermeticity can be obtained.
【図１】本発明に係る圧電部品の分解斜視図。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.
【図２】図１のＸ−Ｘ’の垂直断面図。FIG. 2 is a vertical sectional view taken along line X-X 'of FIG.
【図３】従来例を示す垂直断面図。FIG. 3 is a vertical sectional view showing a conventional example.
１…ケーシング ２…箱部材 ２ｅ…接着面 ３…凹部 ４…中間段 ７…ダンピング材 ７ａ…しみ出し部分 ８…蓋部材 １０…圧電体基板 １２ａ，１２ｂ，１２ｃ，１２ｄ，１２ｅ，１２ｆ…振
動電極DESCRIPTION OF SYMBOLS 1 ... Casing 2 ... Box member 2e ... Adhesion surface 3 ... Concave part 4 ... Intermediate stage 7 ... Damping material 7a ... Exudation part 8 ... Lid member 10 ... Piezoelectric substrate 12a, 12b, 12c, 12d, 12e, 12f ... Vibration electrode
Claims (1)
体基板を覆うダンピング材と、前記圧電体基板とダンピ
ング材とを収納するケーシングとを備えた圧電部品にお
いて、 前記ケーシングが箱部材と蓋部材とで構成され、該箱部
材と蓋部材によって密閉された振動空間に臨む中間段を
該箱部材の内壁面に設け、この中間段の位置まで溶融状
態の前記ダンピング材を注入して前記圧電体基板を覆っ
たことを特徴とする圧電部品。1. A piezoelectric component comprising: a piezoelectric substrate provided with a vibrating electrode; a damping material covering the piezoelectric substrate; and a casing containing the piezoelectric substrate and the damping material, wherein the casing is a box member. And a lid member, and the box portion
Intermediate stage facing the vibration space sealed by the material and the lid member
A piezoelectric component, which is provided on the inner wall surface of the box member and covers the piezoelectric substrate by injecting the molten damping material to the position of the intermediate stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2408816A JP2643605B2 (en) | 1990-12-28 | 1990-12-28 | Piezo components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2408816A JP2643605B2 (en) | 1990-12-28 | 1990-12-28 | Piezo components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04233311A JPH04233311A (en) | 1992-08-21 |
| JP2643605B2 true JP2643605B2 (en) | 1997-08-20 |
Family
ID=18518221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2408816A Expired - Fee Related JP2643605B2 (en) | 1990-12-28 | 1990-12-28 | Piezo components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2643605B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018225351A1 (en) * | 2017-06-07 | 2018-12-13 | 日立オートモティブシステムズ株式会社 | Physical quantity detection device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63248211A (en) * | 1987-04-03 | 1988-10-14 | Murata Mfg Co Ltd | Electronic component and its manufacture |
| JPS63293959A (en) * | 1987-05-27 | 1988-11-30 | Murata Mfg Co Ltd | Electronic part |
-
1990
- 1990-12-28 JP JP2408816A patent/JP2643605B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04233311A (en) | 1992-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |