JP2932962B2 - Electronic component case and electronic component using this electronic component case - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case for an electronic component, and more particularly to a case for an electronic component having a recess for accommodating an electronic element, and an electronic component using the case for an electronic component.

[0002]

2. Description of the Related Art Conventionally, for example, a piezoelectric component has been known as this kind of electronic component. The piezoelectric component includes a piezoelectric resonator, a case having a concave portion for accommodating the piezoelectric resonator, and a lid for closing an opening of the case. FIG. 12 shows an example of a case used for a conventional piezoelectric component.

The insulating case 40 has a concave portion 41, and notches 42a, 42b are formed at both ends of the concave portion 41, respectively.
Is provided. The internal extraction electrodes 46 and 47 are provided at both ends of the insulating case 40 with cuts 42a and 42b, respectively.
Is provided so as to cover the surface.

[0004]

In a conventional piezoelectric component, electrodes 46 and 47 are connected to a case 4 as shown in FIG.
After the stainless steel mask 50 is set on the surface on which the concave portion 41 is formed, the stainless steel mask 50 is formed by vapor deposition or sputtering. Holes 51a and 51b are provided at desired positions in the mask 50, and vapor deposition metal or sputtering metal scattered from a vapor deposition source or a sputtering source is formed in the holes 5a and 51b.
The electrodes 46 and 47 are formed at both ends of the case 40 by reaching the both ends of the case 40 after passing through 1a and 51b.

However, after the vapor deposition metal or the sputtering metal passes through the holes 51a and 51b, a part thereof
There is a problem that a wraparound phenomenon occurs on the back side of 0, and it adheres to regions I and II indicated by dotted lines in the figure. Therefore, the insulation reliability between the electrodes 46 and 47 is low, and in the worst case, the electrodes 46 and 47 may be short-circuited. Therefore, an object of the present invention is to provide a case for an electronic component having a structure capable of sufficiently securing insulation between the electrodes when a plurality of electrodes are formed in a recess for accommodating an electronic element, and a case for the electronic component. To provide electronic components.

[0006]

In order to achieve the above object, an electronic component case according to claim 1 of the present invention comprises:
It has a recess for accommodating an electronic element, electrodes are provided at both ends of the recess, and short-circuit prevention projections are provided at predetermined positions of the recess between the electrodes.

According to a second aspect of the present invention, there is provided an electronic component case having a recess for accommodating an electronic element.
Electrodes are provided at both ends and a substantially central portion of the concave portion, and short-circuit preventing projections are provided at predetermined positions of the concave portion between these electrodes. Further, an electronic component according to the present invention includes an electronic element and an electronic component case according to the first or second aspect. Here, examples of the electronic element include a piezoelectric resonator, an inductor element, a capacitor element, a resistance element, and a semiconductor element.

[0008]

According to the above arrangement, when a plurality of electrodes are formed in the recess, the amount of wraparound of the vapor deposition metal or the sputtering metal on the back side of the mask is regulated by the short-circuit prevention projection provided between the electrodes. Moreover, the creeping distance between the electrodes provided in the concave portion is increased by the short-circuit preventing projection.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component case according to the present invention and an electronic component using the electronic component case will be described below with reference to the accompanying drawings. In each embodiment, a piezoelectric component will be described as an example of an electronic component, but the electronic component is not necessarily limited to a piezoelectric component. First Embodiment, FIGS. 1 to 4 As shown in FIG. 1, a piezoelectric component comprises a piezoelectric resonator 1, an insulating case 10 containing the piezoelectric resonator 1, and a sealing lid 20. I have. The piezoelectric resonator 1 is made of a ceramic material such as PZT, and has vibration electrodes 3 and 4 on the front and back surfaces. The lead portion 3a of the vibration electrode 3 is exposed at one end of the piezoelectric resonator 1, and the lead portion 4a of the vibration electrode 4 is exposed at the other end of the piezoelectric resonator 1.

The insulating case 10 has a concave portion 11 and cut portions 12a and 12b are provided at both ends of the concave portion 11. At the center of the bottom wall 11a of the concave portion 11, short-circuit preventing protrusions 13a and 13b are provided side by side. The height of the short-circuit preventing protrusions 13a, 13b is set lower than the height of the horizontal plane of the cuts 12a, 12b, thereby preventing the protrusions 13a, 13b from contacting the vibrating portion of the piezoelectric resonator 1.
Internal extraction electrodes 16 and 17 are formed on both ends of the case 10 by thin film forming means such as sputtering or vapor deposition.

Here, a method of forming the internal extraction electrodes 16 and 17 will be described with reference to FIG. As shown in FIG.
A stainless steel mask 25 is set on the concave portion forming surface 10a of the case 10. The mask 25 is provided with holes 26a and 26b for forming electrodes at desired positions. next,
Vapor deposition or sputtering processing is performed, and the vapor deposition metal or sputtering metal scattered from the vapor deposition source or sputtering source passes through the holes 26a and 26b to reach both ends of the case 10, and the internal extraction electrodes 16 and 17 are respectively provided at both ends. To form At this time, after a part of the deposition metal or the sputtering metal passes through the holes 26a and 26b,
A wraparound phenomenon occurs on the back side of the mask 25. However, due to the short-circuit preventing protrusions 13a and 13b provided on the bottom wall 11a of the concave portion 11, the amount of wraparound of the deposition metal or the sputtered metal can be reduced in the regions I and I shown by the dotted lines in the drawing.
Limited to II. In this case, the short-circuit preventing protrusions 13a,
13b, as shown in FIG. 3, when the height of the projections 13a and 13b is H, the distance between the projections 13a and 13b is L, and the incident angle of the deposition metal or the sputtering metal is θ, the following relationship is established. It is preferable to design so that

(H / L)> tan θ Further, the creeping distance between the electrodes 16 and 17 is longer than that of the conventional piezoelectric component due to the short-circuit preventing protrusions 13a and 13b. From the above results, sufficient insulation between the electrodes 16 and 17 is ensured. The sealing lid 20 has conductors 21 and 22 formed at both ends by a method such as sputtering or vapor deposition.

Next, a procedure for assembling the above components will be described. A paste-like conductive adhesive is applied to the cut portions 12a and 12b of the case 10. The piezoelectric resonator 1 is housed horizontally in a horizontally elongated state with the notches 12a and 12b of the case 10 as a guide, and the vibrating portion is formed with a short-circuit prevention protrusion 13.
notches 12a, 12b so as not to contact
Supported by Then, the piezoelectric resonator 1 and the case 10 are fixed via the conductive adhesive by hardening the paste-like conductive adhesive, and are electrically connected. Further, the sealing lid 20 is fixed to the opening end surface of the case 10 with an adhesive, and a piezoelectric component having a vibration space sealed inside is obtained. Next, as shown in FIG. 4, external input / output electrodes 27 and 28 are provided at both ends of the piezoelectric component to complete a product.

[Second Embodiment, FIGS. 5 to 7] In the second embodiment, a case of a piezoelectric component having two vibrators will be described. As shown in FIG. 5, the piezoelectric component includes a piezoelectric resonator 61, an insulating case 70 containing the piezoelectric resonator 61, and a sealing lid 80. The piezoelectric resonator 61 has vibration electrodes 62a and 62b and vibration electrodes 63a and 63b on its surface.
Are provided, and vibration electrodes 62c and 63c (see FIG. 6) are provided on the back surface. The vibrating electrodes 62a and 63b are electrically connected to extraction electrodes 64a and 64b provided at the ends of the surface of the piezoelectric resonator 61, respectively.
3a is electrically connected via a conductor path. further,
As shown in FIG. 6, auxiliary electrodes 66a and 66b for connection are provided on the back surface of the piezoelectric resonator 61, and an extraction electrode 67 is provided at the center.

The insulating case 70 has a concave portion 71, and cut portions 72a and 72b are provided at both ends of the concave portion 71. A pedestal portion 73 is provided at the center of the bottom wall 71a of the concave portion 71.
Is provided. Further, short-circuit prevention protrusions 74 a and 74 b are provided on the bottom wall 71 a of the recess 71 in parallel with the pedestal portion 73. A pair of short-circuit prevention protrusions 74a and 74b are provided between the pedestal portion 73 and the cut portion 72a and between the pedestal portion 73 and the cut portion 72b. Protrusion 74
The heights of the bases 73 and the cuts 72a, 72
The height is set lower than the height of the horizontal plane b to prevent the projections 74a and 74b from coming into contact with the vibrating portion of the piezoelectric resonator 61.

At the both ends and the center of the case 70, internal extraction electrodes 76, 77 and 78 are formed by means of vapor deposition or sputtering in the same manner as in the first embodiment.
Is formed. At this time, the short-circuit prevention protrusions 74a, 74
The amount of wraparound of the vapor deposition metal or the sputtering metal is limited by b. Further, the creepage distance between the electrodes 76 and 78 and the creepage distance between the electrodes 77 and 78 are longer than those of the conventional piezoelectric component due to the short-circuit prevention protrusions 74a and 74b. From the above results, between the electrodes 76 and 78,
Insulation between the electrodes 77 and 78 is sufficiently ensured.

The sealing lid 80 has conductors 8 at both ends and a center.
1, 82 and 83 are formed by a method such as sputtering or vapor deposition. FIG. 7 is an electrical equivalent circuit diagram of the piezoelectric component including the above components.

[Other Embodiments] The electronic component case according to the present invention and the electronic component using this electronic component case are not limited to the above-described embodiment, but may be variously modified within the scope of the invention. Can be.

The number, shape, etc. of the short-circuit preventing projections are arbitrary. For example, as shown in FIG. 8, the short-circuit preventing projections 13a and 13b may be provided on the bottom wall 11a apart from each other.
As shown in FIG. 9, a short-circuit prevention projection 31 having a recess 32 at the top and having a substantially rectangular cross section may be provided on the bottom wall 11 a alone. Alternatively, as shown in FIG.
A short-circuit prevention projection 33 having a substantially triangular cross section
May be independently provided on the bottom wall 11a, or as shown in FIG.
7 may be provided close to each other.

[0020]

As is apparent from the above description, according to the present invention, since the short-circuit preventing projections are provided between the electrodes provided in the concave portions, the electrodes are formed by thin film forming means such as vapor deposition or sputtering. In this case, the amount of the deposited metal or the sputtered metal on the back side of the mask can be regulated by the short-circuit prevention projection. In addition, the creepage distance between the electrodes can be increased by the short-circuit prevention protrusion. As a result, an electronic component having a structure capable of sufficiently securing insulation between the electrodes when the electrodes are formed in the concave portion for housing the electronic element is obtained.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of an electronic component case and an electronic component according to the present invention.

FIG. 2 is a sectional view for explaining electrode formation of the case shown in FIG. 1;

FIG. 3 is an enlarged sectional view of a short-circuit preventing protrusion shown in FIG. 2;

FIG. 4 is a perspective view showing the appearance of the electronic component.

FIG. 5 is an exploded perspective view showing a second embodiment of the piezoelectric component case and the electronic component according to the present invention.

FIG. 6 is a perspective view of the piezoelectric resonator shown in FIG. 5 as viewed from the back.

7 is an electric equivalent circuit diagram of the electronic component shown in FIG.

FIG. 8 is a sectional view of a case showing another embodiment.

FIG. 9 is an enlarged cross-sectional view of a short-circuit preventing protrusion showing another embodiment.

FIG. 10 is an enlarged cross-sectional view of a short-circuit preventing protrusion according to yet another embodiment.

FIG. 11 is an enlarged cross-sectional view of a short-circuit preventing protrusion according to still another embodiment.

FIG. 12 is a perspective view of a case used for a conventional electronic component.

FIG. 13 is a cross-sectional view for explaining formation of electrodes in the case shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric resonator 10 ... Insulating case 13a, 13b ... Short circuit prevention protrusion 16, 17 ... Internal lead-out electrode 31, 33, 36, 37 ... Short circuit prevention protrusion 61 ... Piezoelectric resonator 70 ... Insulating case 74a, 74b ... short-circuit prevention projections 76, 77, 78 ... internal extraction electrodes

Claims (3)

(57) [Claims] A concave portion for accommodating the electronic element;
An electronic component case, wherein electrodes are provided at both ends of the concave portion, and short-circuit preventing protrusions are provided at predetermined positions of the concave portion between the electrodes. 2. It has a recess for accommodating an electronic element,
An electronic component case, wherein electrodes are provided at both ends and a substantially central portion of the concave portion, and a short-circuit preventing protrusion is provided at a predetermined position of the concave portion between these electrodes. 3. An electronic component, comprising: an electronic element; and the electronic component case according to claim 1.