JP2636465B2 - Electronic component mounting equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus, and relates to an electronic component mounting apparatus, which measures a thickness of an electronic component adsorbed to a nozzle by a measuring device, obtains an average value, and calculates an average value. By adjusting the vertical stroke of the nozzle, mistakes in take-up and mounting of electronic components are eliminated.

(Prior Art) An electronic component mounting apparatus is configured to take up an electronic component by raising and lowering a nozzle of a transfer head in an electronic component supply unit, and transfer the mounted electronic component to a substrate of a mounting unit. Has become.

(Problems to be Solved by the Invention) However, since the electronic component mounting apparatus is operated at a high speed, there is a problem in that mistakes in take-up of the electronic component by the nozzle are apt to occur frequently. Since the height of the lower end varies, the present applicant has proposed a solution to this problem (Japanese Patent Laid-Open No. 1-261899). However, take-up mistakes are caused not only by the above-mentioned causes but also by variations in the thickness of electronic components. That is, even with the same electronic component, there is a variation in thickness due to molding errors, and if the thickness is too small, the lower end of the nozzle cannot land on the upper surface of the electronic component and makes a take-up mistake, which is too large. Then, the lower end of the nozzle lands strongly on the upper surface of the electronic component, and the electronic component is destroyed.

For the same reason, a mounting error occurs in the mounting section. That is, if the thickness of the electronic component is too small, even if the nozzle descends, the electronic component cannot land on the substrate, and the suction state by the nozzle is released before landing,
Electronic components fall naturally, causing positional displacement and stiffness. If the thickness of the electronic component is too large, the electronic component that has landed on the substrate will be broken by being pressed by the nozzle.

Therefore, an object of the present invention is to provide a means for eliminating a take-up mistake and a mounting mistake due to a variation in the thickness of an electronic component.

(Means for Solving the Problems) For this purpose, the present invention includes a supply unit for an electronic component and a mounting unit for mounting the electronic component on a substrate. In the supply unit, the nozzle of the transfer head is moved up and down. In an electronic component mounting apparatus in which an electronic component is sucked at a lower end portion of the nozzle and transferred to and mounted on the substrate, a measuring device is arranged on a moving path of the transfer head, and the measuring device suctions the nozzle. The thickness of the obtained electronic component is measured, the average value of the thickness of the electronic component is calculated by a computer for each type of electronic component, and the vertical stroke of the nozzle is adjusted based on the average value. Things.

(Operation) In the above configuration, while the transfer head having taken up the electronic component in the supply unit transfers the electronic component to the substrate of the mounting unit, the measuring device detects the electronic component sucked at the lower end of the nozzle by the measuring device. Measure the thickness. This measurement is performed for each type of electronic component, and the average value of the thickness of each electronic component is calculated. Then, by taking up and lowering strokes of the nozzles based on this average value, take-up mistakes and mounting mistakes are eliminated.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings, taking a rotary head type electronic component mounting apparatus as an example.

FIG. 1 is a perspective view of an electronic component mounting apparatus, wherein 1 is a main body box, 2 is a rotary head rotatably mounted below the box 1, and 3 is a mounting of electronic components composed of XY tables 4 and 5. Department. 6 is a clamp part on the mounting part 3
The substrate 6 is positioned by 10, and the substrate 6 is slid in an arbitrary direction J by sliding of the XY tables 4 and 5, and is positioned. On the lower surface of the rotary head 2, a number of transfer heads 7 are arranged side by side along the circumferential direction, and each transfer head 7 includes a nozzle 8 projecting downward (second nozzle).
See also figure). Reference numeral 9 denotes a spring provided to allow a slight vertical movement of the nozzle 8. This nozzle 8
Sucks the electronic component C at its lower end by vacuum pressure.

FIG. 3 is a plan view of the rotary head 2. Numeral 12 denotes a supply unit of the electronic component C disposed on the opposite side of the mounting unit 3, and the index rotation of the rotary head 2 in the N direction as described later. And the raising and lowering operation of the nozzle 8, the supply unit
The 12 electronic components C are taken up and transferred and mounted on the substrate 6.

In FIG. 3, reference numeral 13 denotes a recognition device disposed between the supply unit 12 and the mounting unit 3 for detecting errors in the XY direction and the rotation direction of the electronic component C sucked to the lower end of the nozzle 8. .
The error in the XY direction is corrected by moving the substrate 6 in the same direction. In addition, the error in the rotation direction is determined by driving the motor 14 (see FIG. 2) mounted on the rotary head 2 and moving the transfer head 7 via the belt 15, the spline shaft 16, the gears 17, 18 and the like. In the H direction (see Fig. 3)
Rotate to correct. Numeral 80 denotes a measuring device arranged on the transfer path from the supply unit 12 to the mounting unit 3 for measuring the thickness of the electronic component C adsorbed on the nozzle 8, and FIG. The detailed structure will be described with reference to FIG.

81 is a mounting bracket, 82 is a pulse motor mounted on the back of the bracket 81, 83 is a cam driven by the pulse motor 82, 84 is a cam follower abutting on the peripheral surface of the cam 83, and 85 is a connecting member 86 And a lift plate connected to the cam follower 84. The lifting plate 85 is a spring material that urges it downward.
When the cam 83 is rotated by the drive of the motor 82, the elevating plate 85 moves up and down in the vertical direction P. 88 is a guide rail mounted on the front surface of the bracket 81, 89 is a slider mounted on the back surface of the elevating plate 85, and the slider 89 moves up and down along the guide rail 88. Reference numeral 90 denotes a support plate attached to the lower end of the elevating plate 85, which protrudes horizontally forward. At its tip, measuring elements 91 and 92 are arranged with the conveying path of the nozzle 8 interposed therebetween.

When the cam 83 is rotated by driving the pulse motor 82, the support plate 90 that follows the peripheral surface of the cam 83 via the cam follower 84.
Descends from above to below (see the solid and chain lines in FIG. 6),
The thickness of the electronic component C sucked to the lower end of the nozzle 8 is measured, and the measurement result is input to a computer 59 (described later).
The rotation speed of the cam 83 is synchronized with the index rotation pitch of the rotary head 2, and the pulse motor 82 is driven during the intermittent stop of the rotary head 2 to perform the above measurement.

Next, the drive mechanism of the transfer head 7 will be described with reference to FIGS.

Reference numeral 20 denotes a drive unit box disposed immediately above the rotary head 2 in the box 1, reference numeral 21 denotes a drive unit of the drive unit box 20, and reference numeral 22 denotes a support frame. The rotary head 2 is attached to the output shaft 23a of the drive unit box 20,
The rotary head 2 is rotated by the index by the drive of the drive unit 21. The drive unit 21 is a servomotor, and its power is transmitted to the transfer head 7 via a transmission path described below, and the transfer head 7 moves up and down at a predetermined stroke.

25a is a pulley attached to another output shaft 23b of the drive unit box 20, 25b is another pulley, 26 is a timing belt tuned to the pulleys 25a and 25b, 27 is a pulley 2
This is the rotation axis of 5b. At both ends of the rotating shaft 27, in order to raise and lower the transfer head 7 at two places, the supply unit 12 and the mounting unit 3,
Cams 30, 30 are mounted. Since the raising and lowering mechanism of the transfer head 7 in the supply unit 12 and the mounting unit 3 is the same,
With reference to FIG. 2 in particular, the lifting mechanism on the mounting section 3 side will be described.

Numeral 31 denotes a cam follower which comes into contact with the peripheral surface of the cam 30, and is axially mounted on a cam-shaped lever 33. 34 is a cam follower 31
The cam follower 31 moves up and down following the rotation of the cam 30, and the lever 33 swings about the pin 32 in the direction of arrow a. That is, these members 30 to 34 constitute a first drive direction converter 35 that converts the rotational movement of the cam 30 into the swinging movement of the lever 33.

Reference numeral 40 denotes a tie rod, which is disposed horizontally, and rollers 41 and 42 are pivotally mounted on both ends thereof. One roller 41 is fitted in a groove 36 formed on the lower end of a lever 33, and the other roller 42 is fitted in a groove 44 of another lever 43. When the lever 33 swings, the tie rod 40 reciprocates in the horizontal direction b, and the lever 43 swings about the pin 45 in the direction of arrow c.

50 is a pulse motor arranged above the tie rod 40,
51 is a support bracket, 52 is a coupling, 53 is a screw rod, and the tie rod 40 moves up and down in the vertical direction d by driving the pulse motor 50. This motor 50 is a computer
Automatically controlled by 59. The data of the thickness of each electronic component mounted in order on the board 6 is input to the computer 59 in advance, and a pulse based on the data is transmitted to control the motor 50. The tie rod 40 is moved up and down by the motor 50, and the movement is transmitted to the elevating shaft 63 of the transfer head 7. 54 and 55 are guide members for guiding the tie rod 40 up and down (see FIG. 1), 56 is a guide member for guiding reciprocal movement in the horizontal direction, and 57 is a support member for the guide members 55 and 56.

Reference numeral 60 denotes a second drive direction changing unit, which comprises a guide body 61 erected on the bottom surface of the main body box 1 and a slider 62 which moves up and down along the guide body 61. Slider 62
A groove 46 is formed on both sides of the transfer head 7. A roll 46 of the lever 43 is provided in one groove, and a roll 64 mounted on an elevating shaft 63 of the transfer head 7 is provided in the other groove. Mated. 65 is a ring guide of another roll 64 attached to the upper part of the shaft 63, and 66 is an elevating guide of the shaft 63. FIG. 4 shows the driving unit 21 described above.
This is a simplified illustration of a transmission mechanism from the shaft to the elevating shaft 63. Next, the operation will be described with reference to FIG.

With the continuous rotation of the cam 30, the lever 33 swings in the direction of arrow a, and the tie rod 40 reciprocates in the horizontal direction b. Then, the other lever 43 swings in the direction of arrow c, and the slider 62 moves up and down along the guide body 61, and thus the transfer head 7 connected to the slider 62 via the shaft 63.
Also move up and down.

Here, as shown by the solid line in the figure, when the position of the tie rod 40 is high and the roll 41 is deeply entering the groove portion 36 of the lever 33, the tie rod 40 is reciprocated small by the lever 33, Is short, the swing of the other lever 43 is also small, and the elevating stroll S1 of the transfer head 7 is short. On the contrary, the position of the tie rod 40 is low as shown by the chain line in the figure, and the roll 41 is
, The tie rod 40 reciprocates with a large stroke L, and therefore the lifting stroke S2 of the transfer head 7 is also long. As described above, the elevating stroke of the transfer head 7 changes depending on the height of the tie rod 40. Therefore, this device uses a motor automatically controlled by the computer 59.
By driving the 50 to change the height of the tie rod 40, the size of the stroke of the transfer head 7 set according to the shape of the cam 30 can be adjusted. As described above, the tie rod 40 and the up-and-down moving means of the tie rod 40 constitute the adjusting unit 58 of the transmission amount transmitted from the first driving direction conversion unit 35 to the second driving direction conversion unit 60.

The present apparatus has the above-described configuration, and the operation of the present apparatus will now be described with reference to FIG.

Transfer head 7 that has picked up electronic component C in supply section 12
Is transported to the mounting section 3 by the rotation of the index of the rotary head 2. A measuring device 80 is provided in the middle of the transport path, whereby the thickness of the electronic component C adsorbed on the lower end of the nozzle 8 is measured, and the measurement signal is input to the computer 59, and the computer 59 The thickness is corrected by calculating the average value of the measured values and the thicknesses D1 to Dn of the electronic components C1 to Cn registered in 59, and thereafter, based on the corrected value, the adjustment unit The pulse motor 50 for driving the transfer head 58 is controlled to adjust the vertical stroke of the transfer head 7.

In FIG. 7, S1, S2,.
9 shows a vertical stroke based on the thicknesses D1 to Dn registered in FIG. As shown in this figure, the electronic components C1 to
In any case, the stroke error △
S1, △ S2... △ Sn exist. However, the errors ΔS1 to ΔSn are measured by measuring the thicknesses of the electronic components C1 to Cn by the measuring device 80 as described above, and
Is corrected by adjusting the vertical stroke of the transfer head 7 based on this correction value, so that the nozzle 8 reliably takes up the electronic component C. Of course, if the vertical movement stroke of the transfer head 7 due to the variation in the thickness of the electronic component C is corrected in this way, the vertical movement stroke of the transfer head 7 in the mounting section 3 is also appropriate, and the electronic component C sucked to the nozzle 8 Can be reliably mounted on the substrate 6. Note that the present invention is not limited to the above-described embodiment, and can be applied to an electronic component mounting apparatus of a type in which electronic components are mounted on a board while moving a mounting head in the XY directions.

(Effect of the Invention) As described above, the present invention provides an electronic component supply unit,
A mounting unit for mounting an electronic component on a substrate, wherein the supply unit raises and lowers a nozzle of a transfer head, sucks the electronic component at a lower end of the nozzle, and transfers and mounts the electronic component on the substrate. In the mounting device, a measuring device is provided on the moving path of the transfer head, and the measuring device measures the thickness of the electronic component sucked by the nozzle, and determines the thickness of the electronic component for each type of electronic component. Is calculated by a computer, and based on this average value, the up / down stroke of the nozzle is adjusted, so that the up / down stroke of the nozzle is corrected according to the variation in the thickness of the electronic component, and Electronic parts can be reliably taken up and mounted on the mounting part.

[Brief description of the drawings]

1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a front view of the same, and FIG.
FIG. 4 is a plan view of the rotary head, FIG. 4 is a front view of the drive unit, FIG. 5 is a perspective view of the measuring device, FIG. 6 is a side view of the device, and FIG. . 3 Mounting section 6 Substrate 7 Transfer head 8 Nozzle 12 Supply section 59 Computer 80 Measurement device

Claims (1)

(57) [Claims] An electronic component supply section and a mounting section for mounting an electronic component on a substrate are provided. In the supply section, a nozzle of a transfer head is moved up and down to suck the electronic component at a lower end of the nozzle. In the electronic component mounting apparatus configured to be transferred and mounted on the substrate, a measuring device is disposed on the moving path of the transfer head, and the thickness of the electronic component adsorbed to the nozzle is measured by the measuring device. An electronic component mounting apparatus, wherein an average value of the thickness of the electronic component is calculated by a computer for each type of electronic component, and the elevating stroke of the nozzle is adjusted based on the average value.