JP2628854B2 - Thin film magnetic head - Google Patents

Thin film magnetic head

Info

Publication number
JP2628854B2
JP2628854B2 JP61007739A JP773986A JP2628854B2 JP 2628854 B2 JP2628854 B2 JP 2628854B2 JP 61007739 A JP61007739 A JP 61007739A JP 773986 A JP773986 A JP 773986A JP 2628854 B2 JP2628854 B2 JP 2628854B2
Authority
JP
Japan
Prior art keywords
film
coil
conductor coil
layer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61007739A
Other languages
Japanese (ja)
Other versions
JPS62165718A (en
Inventor
恒夫 中村
直樹 小出
量二 南方
徹 吉良
光彦 吉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP61007739A priority Critical patent/JP2628854B2/en
Publication of JPS62165718A publication Critical patent/JPS62165718A/en
Application granted granted Critical
Publication of JP2628854B2 publication Critical patent/JP2628854B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3109—Details
    • G11B5/313—Disposition of layers
    • G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は薄膜磁気ヘッド、特に多層型導電体コイルを
用いた薄膜磁気ヘッドに関する。Description: TECHNICAL FIELD The present invention relates to a thin-film magnetic head, and more particularly to a thin-film magnetic head using a multilayer conductive coil.

（従来の技術とその問題点） 近年、軟磁性体バルク材料を加工して作成する磁気ヘ
ッドと比較して、狭トラック化、狭ギャップ化、多素子
化が容易なことから、高密度記録用ヘッドとして薄膜磁
気ヘッドが重要視されている。(Prior art and its problems) In recent years, compared to a magnetic head formed by processing a soft magnetic bulk material, it is easier to narrow a track, narrow a gap, and increase the number of elements. As a head, a thin film magnetic head is regarded as important.

ところで、この薄膜磁気ヘッドにおいて、高密度記録
を達成するためには、狭トラック化、狭ギャップ化、マ
ルチターン（複数巻）化による低電流化が要求される。
又、多トラック磁気ヘッドにおいては導電体コイルの配
置スペースの縮小化のため、一方、一トラック磁気ヘッ
ドでは上記マルチターン化による低電流化のため、それ
ぞれ軟磁性薄膜からなる下部磁気コアと上部磁気コア間
に導電体コイルを複数層積層して多層導電体コイル形状
とすることが好ましい。そして、このような多層コイル
形状を採用する場合、導電体コイルによって生じる段差
の平坦化が非常に重要となる。By the way, in order to achieve high-density recording in this thin-film magnetic head, it is required to reduce the current by narrowing the track, narrowing the gap, and increasing the number of turns (multiple turns).
In addition, in the case of a multi-track magnetic head, the lower magnetic core and the upper magnetic core, each of which is made of a soft magnetic thin film, are reduced in order to reduce the space for arranging the conductive coils, and in the one-track magnetic head, in order to reduce the current due to the multi-turn operation. It is preferable to form a multilayer conductor coil shape by laminating a plurality of conductor coils between cores. When such a multilayer coil shape is adopted, it is very important to flatten a step caused by the conductor coil.

すなわち、下層のコイルにより生じる段差の平坦化が
充分でなければ、上層の微細コイルのパターン精度の劣
化、上部磁気コアの透磁率、飽和磁束密度、抗磁力等の
磁気特性の劣化等の問題が生じる。そして、今後更にコ
イルの微細化、高集積化が進むにつれて薄膜磁気ヘッド
特性に及ぼす平坦化の影響が大きくなるものと思われ
る。That is, if the level difference caused by the lower coil is not sufficiently flattened, problems such as deterioration of pattern accuracy of the upper fine coil, deterioration of magnetic properties such as permeability, saturation magnetic flux density, coercive force of the upper magnetic core, and the like occur. Occurs. It is considered that the effect of flattening on the characteristics of the thin-film magnetic head will increase as the size of the coil further increases and the degree of integration increases.

ところで、従来平坦化の手法としてリフトオフ法又は
ポリイミド等の有機性絶縁材もしくは塗布型SiO2等を塗
布して平坦化する方法が知られている。それらの中で塗
布型SiO2を塗布する方法は手軽であり、かつ若干の有機
性を含んでいるが本質的に無機質であるから安定性が高
く、しかもプラズマエッチング等のドライプロセスを利
用できるという利点があって、非常に有用な手法であ
る。By the way, conventionally, as a method of flattening, a lift-off method or a method of flattening by applying an organic insulating material such as polyimide or coating type SiO 2 is known. Among them, the method of applying the coating type SiO 2 is easy, and although it contains some organic properties, it is inherently inorganic, so it has high stability and can use a dry process such as plasma etching. It has advantages and is a very useful technique.

第４図及び第５図に平坦化用に塗布型SiO2を用いた従
来の２層６ターンの薄膜磁気ヘッドを示す。第４図は２
層目コイルを取り除いて示す１層目３ターンの導電体コ
イル部の概略平面図であり、第５図は第４図のＶ−Ｖ線
に沿う概略拡大断面図である。両図において、１は基板
であり、該基板１上に下部磁気コア２及び絶縁膜３を介
して１層目の薄膜状導電体コイル４が形成され、この導
電体コイル４上に絶縁膜５が形成されるとともに、絶縁
膜５上に平坦化用のSiO2膜６が塗布されている。更に塗
布型SiO2膜６上に、１層目と同様に、２層目導電体コイ
ル７、絶縁膜８、平坦化用塗布型SiO2膜９が設けられ、
その後該SiO2膜９上に図示しない上部磁気コアが形成さ
れる。FIGS. 4 and 5 show a conventional two-layer, six-turn thin-film magnetic head using coating type SiO 2 for planarization. Fig. 4 shows 2
FIG. 5 is a schematic plan view of the first-layer three-turn conductor coil portion shown with the layer coil removed, and FIG. 5 is a schematic enlarged cross-sectional view along the line VV in FIG. In both figures, reference numeral 1 denotes a substrate, on which a first-layer thin-film conductor coil 4 is formed via a lower magnetic core 2 and an insulating film 3, and an insulating film 5 is formed on the conductor coil 4. Is formed, and a flattening SiO 2 film 6 is applied on the insulating film 5. Further, on the coating type SiO 2 film 6, similarly to the first layer, a second-layer conductor coil 7, an insulating film 8, and a coating type SiO 2 film 9 for planarization are provided.
Thereafter, an upper magnetic core (not shown) is formed on the SiO 2 film 9.

第５図に示す磁気ヘッドにおいて、１層目の導電体コ
イル４の表面を被覆する絶縁膜５上に塗布された平坦化
用塗布型SiO2膜６により、該塗布膜６における導電体コ
イル４の両側縁部に対応する部位に形成された段差部分
の傾斜勾配が該SiO2膜形成用塗料の流動性に基づいてあ
る程度緩和される。ところで、１層目の導電体コイル４
と２層目の導電体コイル７のパターンは互いにほぼ同一
の形状を有して互いに同心状に重なっており、第５図中
矢印b1及びb2を付して示す、２層目（この実施例におい
ては最上位）の導電体コイル７の外周部及び内周部、す
なわち、該導電体コイル７の表面上に付着させられた絶
縁膜における該コイル７の最外側及び最内側縁部に対応
する部位では、１及び２層目の導電体コイル４及び７の
２層分の厚みに対応する累積段差が生じ、該コイル７表
面を被覆する絶縁膜の上部に付着させられた平坦化用塗
布型SiO2膜９におけるそれらの部位に末広がり状にかな
り大きな厚肉部が形成される。従って、焼成時の体積収
縮又は他の膜から及ぼされる引張り荷重に対する応力等
により２層目SiO2膜９にクラックが発生しやすい状態と
なっている。このようなクラックは薄膜磁気ヘッドの安
定性、信頼性に悪影響を与える。In the magnetic head shown in FIG. 5, the flattening coating type SiO 2 film 6 applied on the insulating film 5 covering the surface of the first-layer conductor coil 4 forms the conductor coil 4 in the coating film 6. The slope gradient of the step formed at the portions corresponding to the both side edges of the SiO 2 film is moderated to some extent based on the fluidity of the SiO 2 film forming paint. By the way, the first-layer conductor coil 4
If the pattern of the second layer of conductive coil 7 overlaps substantially the same concentric to each other have a shape with each other are denoted by 5 in the arrow b 1 and b 2, the second layer (this In the embodiment, the outermost and inner peripheral portions of the uppermost conductor coil 7, that is, the outermost and innermost edges of the coil 7 in the insulating film adhered on the surface of the conductor coil 7. In the corresponding portion, a cumulative step corresponding to the thickness of the two layers of the first and second conductive coils 4 and 7 is generated, and a flattening step is attached to the upper part of the insulating film covering the surface of the coil 7. At those portions of the coating type SiO 2 film 9, a considerably large thick portion is formed in a divergent shape. Accordingly, cracks are likely to occur in the second-layer SiO 2 film 9 due to volume shrinkage at the time of firing or stress due to a tensile load exerted by another film. Such cracks adversely affect the stability and reliability of the thin-film magnetic head.

なお、クラックの発生頻度低減のため塗布型SiO2に有
機成分を含有させる方法が知られているが、有機成分が
多くなれば絶縁膜８に対するSiO2膜９の付着力の低下を
招き、又構造安定性にも問題が生じるので、必ずしも有
用な方法とはいえない。A method of containing an organic component in the coating type SiO 2 to reduce the frequency of occurrence of cracks is known. However, an increase in the amount of the organic component causes a decrease in the adhesion of the SiO 2 film 9 to the insulating film 8, and This is not always a useful method because it causes problems in structural stability.

（問題点を解決するための手段） 本発明は上述の不具合を解消するためになされたもの
であって、具体的には、軟磁性薄膜製の上部磁気コアと
下部磁気コア間に、互いに実質的に同一の平面形状を有
する複数の膜状導電体コイルを絶縁膜を介して順次同心
状に積み重ねるとともに各膜状導電体コイル表面を被覆
する絶縁膜上に膜面平坦化用塗布膜を付着させて形成し
た積層導電体コイルを有する、薄膜磁気ヘッドにおい
て、上記積層導電体コイルにおける膜状導電体コイル層
のうち、最上層を除く各層の膜状導電体コイルの内周部
及び外周部にそれぞれの導電体コイルに沿って膜状ダミ
ーコイルを配置し、これにより上記積層導電体コイルの
最上位の膜状導電体コイル表面を被覆する絶縁膜状に塗
布された膜面平坦化用塗布膜における上記最上位の膜状
導電体コイルの側縁部に対応する部位に形成された段差
部分の膜厚を低減させたことを特徴とする。(Means for Solving the Problems) The present invention has been made in order to solve the above-mentioned problems, and more specifically, the present invention has a structure in which an upper magnetic core and a lower magnetic core made of a soft magnetic thin film are substantially mutually separated. A plurality of film conductor coils having the same planar shape are sequentially stacked concentrically via an insulation film, and a coating film for planarizing the film surface is deposited on the insulation film covering the surface of each film conductor coil. In the thin-film magnetic head having the laminated conductor coil formed by the above, in the film conductor coil layers of the laminated conductor coil, the inner peripheral portion and the outer peripheral portion of the film conductor coil of each layer except the uppermost layer are formed. A film-like dummy coil is arranged along each conductor coil, and thereby a coating film for flattening a film surface applied to an insulating film covering the uppermost film-like conductor coil surface of the laminated conductor coil. Above The thickness of a step portion formed at a portion corresponding to a side edge portion of an upper film-shaped conductor coil is reduced.

なお、上記積層導電体コイルは少なくとも３つ以上の
膜状導電体コイルを用いて形成し、該積層導電体コイル
における膜状導電体コイル層のうち、最上層を除く各層
の膜状導電体コイルの内周部及び外周部に、該各層の導
電体コイルに沿って積層導電体コイルの下層部に向かっ
て増大するコイル横幅寸法を有する膜状ダミーコイルを
配置し、これにより上記積層導電体コイルの各膜状導電
体コイル表面を被覆する絶縁膜上にそれぞれ塗布して形
成された膜面平坦化用塗布膜において、これは平坦化用
塗布膜における上記膜状導電体コイルの側縁部に対応す
る部位に形成された段差部分の膜厚を低減させるように
することが好ましい。The laminated conductor coil is formed by using at least three or more film conductor coils, and the film conductor coils of each layer except the uppermost layer among the film conductor coil layers in the laminated conductor coil are formed. And a film-like dummy coil having a coil width dimension increasing toward a lower layer portion of the laminated conductor coil along the conductor coil of each layer on the inner peripheral portion and the outer peripheral portion of the laminated conductor coil. In the coating film for flattening the film surface formed by coating on the insulating film covering the surface of each of the film-shaped conductor coils of the above, this is applied to the side edge of the film-shaped conductor coil in the flattening coating film. It is preferable to reduce the thickness of the step portion formed at the corresponding portion.

（実施例） 次に、添付図面を参照しながら本発明を詳細に説明す
る。Next, the present invention will be described in detail with reference to the accompanying drawings.

第１図〜第３図に従来の導電体コイルに本発明のダミ
ーコイルを付加した１トラック薄膜磁気ヘッドを示す。
以下、この磁気ヘッドの構造及び製法を述べる。耐摩耗
性に優れたアルミナ、フェライト、ガラス等の基板11上
にFe−Al−Si、Ni−Ｆ又はCo系アモルファス等の軟磁性
薄膜をスパッタリング法、電子ビーム蒸着法等により積
層して下部磁気コア12を形成する。次に、プラズマCVD
（Chemical Vapor Deposition）法、スパッタリング
法、電子ビーム蒸着法等によりSiO2、Si3N4、Al2O3等か
らなる絶縁膜13を形成する。更に、Cu、Al、Au、Ag等の
導電体膜をスパッタリング法、蒸着法、メッキ法等によ
り積層し、引続きイオンミリング法、スパッタエッチン
グ法等により上記導電耐膜を所定形状に加工して１層目
３ターンの薄膜状導電体コイル14を形成する。又、これ
と同時に導電体コイル14と同一材料及び同一製法により
ダミーコイル14a〜14eを形成する。1 to 3 show a one-track thin-film magnetic head in which a dummy coil of the present invention is added to a conventional conductor coil.
Hereinafter, the structure and manufacturing method of the magnetic head will be described. Soft magnetic thin films such as Fe-Al-Si, Ni-F or Co-based amorphous are laminated on a substrate 11 made of alumina, ferrite, glass, etc. with excellent wear resistance by sputtering, electron beam evaporation, etc. The core 12 is formed. Next, plasma CVD
An insulating film 13 made of SiO 2 , Si 3 N 4 , Al 2 O 3 or the like is formed by a (Chemical Vapor Deposition) method, a sputtering method, an electron beam evaporation method, or the like. Further, a conductive film such as Cu, Al, Au, Ag or the like is laminated by a sputtering method, a vapor deposition method, a plating method or the like, and then the conductive film is processed into a predetermined shape by an ion milling method, a sputter etching method or the like. The third-layer thin-film conductor coil 14 is formed. Simultaneously, the dummy coils 14a to 14e are formed using the same material and the same manufacturing method as the conductor coil 14.

次に、プラズマCVD法、スパッタリング法、電子ビー
ム蒸着法等により上記導電体コイル14及びダミーコイル
14a〜14e上にSiO2、Al2O3、Si3N4等からなる絶縁膜17を
形成する。更に該絶縁膜17上に塗布型SiO2を塗布して１
層目の平坦化用SiO2膜18を形成し、導電体コイル14及び
ダミーコイル14a〜14eの上面と基板11間の段差を吸収す
る。その場合塗布型SiO2膜18の平坦部18aは、導電体コ
イル14の内周及び外周からダミーコイル14a〜14eに沿っ
て延長される。Next, the conductor coil 14 and the dummy coil are formed by a plasma CVD method, a sputtering method, an electron beam evaporation method, or the like.
An insulating film 17 made of SiO 2 , Al 2 O 3 , Si 3 N 4 or the like is formed on 14a to 14e. Further, a coating type SiO 2 is applied on the insulating film 17 to
An SiO 2 film 18 for flattening the layer is formed to absorb a step between the upper surface of the conductor coil 14 and the dummy coils 14 a to 14 e and the substrate 11. In that case, the flat portion 18a of the coating type SiO 2 film 18 extends from the inner circumference and the outer circumference of the conductor coil 14 along the dummy coils 14a to 14e.

以下、１層目と同様の手順で上記１層目SiO2膜18上に
順次２層目３ターンの薄膜状導電体コイル19、絶縁膜2
0、２層目の平坦化用SiO2膜21を設ける。その後フロン
トギャップ部15のSiO2膜21がプラズマエッチング法、反
応性イオンエッチング法等によりエッチングされ、磁気
ギャップ層22を積層後、バックコア接続部の絶縁層がエ
ッチングされる。このようにして、基板11上に形成され
た膜状の下部磁気コア12の上部に、２つの膜状導電体コ
イル14、19をそれぞれ絶縁膜、平坦化用塗布型SiO2膜を
介して積み重ねられた積層導電体コイルが一体的に形成
される。そして軟磁性薄膜製の上部磁気コア23を形成す
るというような工程が続く。Thereafter, the second-layer three-turn thin-film conductor coil 19 and the insulating film 2 are successively formed on the first-layer SiO 2 film 18 in the same procedure as the first-layer.
0, a second-layer flattening SiO 2 film 21 is provided. Thereafter, the SiO 2 film 21 of the front gap portion 15 is etched by a plasma etching method, a reactive ion etching method or the like, and after laminating the magnetic gap layer 22, the insulating layer of the back core connection portion is etched. In this manner, the two film-shaped conductor coils 14 and 19 are stacked on the film-shaped lower magnetic core 12 formed on the substrate 11 via the insulating film and the coating type SiO 2 film for planarization, respectively. The laminated conductor coil is integrally formed. Then, a process of forming the upper magnetic core 23 made of a soft magnetic thin film continues.

上記製造工程において、１層目SiO2膜18の平坦部18a
がダミーコイル14a〜14eに沿って径方向に延長されるこ
とにより、２層目導電体コイル19の内周部及び外周部に
おける導電体コイル19の上面と１層目SiO2膜18間の段差
が減少する。従って、例えば第２図中に矢印b3で示す如
く、導電体コイル19の内周部及び外周部において、２層
目SiO2膜21の膜厚を従来（第５図の矢印b1部参照）より
薄くして導電体コイル19と１層目SiO2膜18間の段差を緩
やかに平坦化することができる。このように、塗布型Si
O2膜21における導電体コイル14の両側縁部に対応する内
周部及び外周部における２層目SiO2膜21の膜厚を低減さ
せることができるので、焼成時における当該部位のクラ
ックを減少させることが可能になる。In the above manufacturing process, the flat portion 18a of the first SiO 2 film 18
Are radially extended along the dummy coils 14a to 14e, so that the step between the upper surface of the conductor coil 19 and the first-layer SiO 2 film 18 at the inner and outer peripheral portions of the second-layer conductor coil 19 Decrease. Thus, for example, as indicated by arrow b 3 in FIG. 2, the inner peripheral portion and outer peripheral portion of the conductive coil 19, the thickness of the second layer SiO 2 film 21 prior (arrow b 1 part reference of FIG. 5 4) The step between the conductor coil 19 and the first-layer SiO 2 film 18 can be gently flattened by making it thinner. Thus, the coating type Si
Since the thickness of the second-layer SiO 2 film 21 at the inner peripheral portion and the outer peripheral portion corresponding to both side edges of the conductor coil 14 in the O 2 film 21 can be reduced, cracks in the portion during firing can be reduced. It becomes possible to do.

なお、導電体コイル14の内周部及び外周部における２
層目SiO2膜21の膜厚を薄くするため、スペース的に余裕
がある場合はダミーコイルの幅寸法をできるだけ大きく
することが好ましい。そして例えば外周左側部のダミー
コイル14bのように全体として幅寸法を大きくする場
合、その中央にギャップ14fを設ければ、金属（ダミー
コイル14b）−絶縁物（絶縁膜13）間の接触面積を小さ
く、絶縁物（絶縁膜17）−絶縁物（絶縁膜13）間の接触
面積を大きくすることができるので、付着力の点で有利
になる。又フロントギャップ部15及びバックコア接続部
16（第３図参照）近傍におけるダミーコイル14c及び14a
は例えば１〜５μｍ程度にその線幅を小さくすることに
より、磁路長をあまり長くせずに、かつ本発明の効果も
得られるようになる。Note that the inner and outer peripheral portions of the conductor coil 14
In order to reduce the film thickness of the layer SiO 2 film 21, it is preferable to increase the width of the dummy coil as much as possible when there is room in space. When the width is increased as a whole like the dummy coil 14b on the left side of the outer periphery, for example, if a gap 14f is provided at the center, the contact area between the metal (dummy coil 14b) and the insulator (insulating film 13) can be reduced. Since it is small and the contact area between the insulator (insulating film 17) and the insulator (insulating film 13) can be increased, it is advantageous in terms of adhesion. Front gap 15 and back core connection
Dummy coils 14c and 14a near 16 (see FIG. 3)
By reducing the line width to, for example, about 1 to 5 μm, the effect of the present invention can be obtained without increasing the magnetic path length too much.

（発明の効果） 以上説明したように、本発明では、最上層以外の導電
体コイルの内周部及び／又は外周部にダミーコイルを形
成したので、当該部位における段差を減少させることが
でき、それにより当該部位における平坦化用塗布膜の膜
厚を低減させることが可能になる。(Effects of the Invention) As described above, in the present invention, since the dummy coil is formed on the inner peripheral portion and / or the outer peripheral portion of the conductor coil other than the uppermost layer, the step at the portion can be reduced, This makes it possible to reduce the thickness of the flattening coating film at the site.

又、導電体コイルを３層以上とする場合、ダミーコイ
ルを最上層以外の各層に設けるとともに下層におけるほ
ど導電体コイルから径方向に離れた位置まで延長させる
ようにすれば、隣接する各層間で上述の効果を得ること
ができる。When the conductor coil has three or more layers, if the dummy coil is provided in each layer other than the uppermost layer and the lower layer is extended to a position radially away from the conductor coil in the lower layer, between adjacent layers, The above effects can be obtained.

又多トラック素子の場合でも同様に導電体コイル２層
分以上の厚みの段差が生じる箇所にダミーコイルを設置
することにより同様の効果を得ることができる。Similarly, in the case of a multi-track element, the same effect can be obtained by installing a dummy coil at a position where a step having a thickness of two or more conductor coils occurs.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明の実施例に係る薄膜磁気ヘッドおける１
層目導電体コイルの平面図、 第２図及び第３図はそれぞれ第１図のII−II線及びIII
−III線に沿う拡大断面部分図、 第４図は従来の薄膜磁気ヘッドにおける１層目導電体コ
イルの平面図、 第５図は第４図のＶ−Ｖ線に沿う拡大断面部分図であ
る。 12……下部磁気コア 17……絶縁層 14a〜14e……ダミーコイル、 18、21……平坦化用塗布型SiO2膜。FIG. 1 shows a thin film magnetic head 1 according to an embodiment of the present invention.
FIGS. 2 and 3 are plan views of the layered conductor coil, respectively, taken along lines II-II and III in FIG.
FIG. 4 is an enlarged cross-sectional partial view taken along the line III, FIG. 4 is a plan view of the first-layer conductive coil in the conventional thin-film magnetic head, and FIG. 5 is an enlarged cross-sectional partial view taken along the line VV in FIG. . 12 Lower magnetic core 17 Insulating layers 14a to 14e Dummy coil 18, 21 Coating type SiO 2 film for flattening.

フロントページの続き (72)発明者 南方 量二 大阪市阿倍野区長池町22番22号 シヤー プ株式会社内 (72)発明者 吉良 徹 大阪市阿倍野区長池町22番22号 シヤー プ株式会社内 (72)発明者 吉川 光彦 大阪市阿倍野区長池町22番22号 シヤー プ株式会社内 (56)参考文献 実開 昭61−34616（ＪＰ，Ｕ) 実開 昭61−132512（ＪＰ，Ｕ)Continuing on the front page (72) Inventor Souji Minami 22-22, Nagaike-cho, Abeno-ku, Osaka City Inside Sharp Corporation (72) Inventor Toru Kira 22-22, Nagaike-cho, Abeno-ku, Osaka City Inside Sharp Corporation (72) Inventor Mitsuhiko Yoshikawa 22-22, Nagaike-cho, Abeno-ku, Osaka-shi Inside Sharp Corporation (56) Reference: Japanese Utility Model Application No. Sho 61-34616 (JP, U) Japanese Utility Model Application No. Sho 61-132512 (JP, U)

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】軟磁性薄膜製の上部磁気コアと下部磁気コ
ア間に、互いに実質的に同一の平面形状を有する複数の
膜状導電体コイルを絶縁膜を介して順次同心状に積み重
ねるとともに各膜状導電体コイル表面を被覆する絶縁膜
上に膜面平坦化用塗布膜を付着させて形成した積層導電
体コイルを有する、薄膜磁気ヘッドにおいて、 上記積層導電体コイルにおける膜状導電体コイル層のう
ち、最上層を除く各層の膜状導電体コイルの内周部及び
外周部にそれぞれの導電体コイルに沿って膜状ダミーコ
イルを配置し、これにより上記積層導電体コイルの最上
位の膜状導電体コイル表面を被覆する絶縁膜上に塗布さ
れた膜面平坦化用塗布膜における上記最上位の膜状導電
体コイルの側縁部に対応する部位に形成された段差部分
の膜厚を低減させたことを特徴とする、薄膜磁気ヘッ
ド。A plurality of film conductor coils having substantially the same planar shape are sequentially stacked concentrically between an upper magnetic core and a lower magnetic core made of a soft magnetic thin film via an insulating film. A thin-film magnetic head having a laminated conductor coil formed by depositing a coating film for planarizing a film on an insulating film covering the surface of the film-shaped conductor coil, wherein the film-shaped conductor coil layer in the laminated conductor coil is provided. Among them, a film-like dummy coil is arranged along the respective conductor coils on the inner peripheral portion and the outer peripheral portion of the film-like conductor coil of each layer except for the uppermost layer, whereby the uppermost film of the laminated conductor coil is formed. The thickness of the step portion formed at the portion corresponding to the side edge portion of the uppermost film-shaped conductor coil in the film flattening coating film applied on the insulating film covering the surface of the coiled conductor coil That we have reduced Characterized by a thin-film magnetic head. 【請求項２】積層導電体コイルは少なくとも３つ以上の
膜状導電体コイルを用いて形成し、該積層導電体コイル
における膜状導電体コイル層のうち、最上層を除く各層
の膜状導電体コイルの内周部及び外周部に、該各層の導
電体コイルに沿って積層導電体コイルの下層部に向かっ
て増大するコイル横幅寸法を有する膜状ダミーコイルを
配置し、これにより上記積層導電体コイルの各膜状導電
体コイル表面を被覆する絶縁膜上にそれぞれ塗布して形
成された膜面平坦化用塗布膜において、これら平坦化用
塗布膜における上記膜状導電体コイルの側縁部に対応す
る部位に形成された段差部分の膜厚を低減させた、第１
項記載の薄膜磁気ヘッド。2. The laminated conductor coil is formed using at least three or more film conductor coils, and the film conductor of each layer except the uppermost layer among the film conductor coil layers in the laminated conductor coil is formed. A film-like dummy coil having a coil width dimension increasing toward the lower layer portion of the laminated conductor coil is disposed along the conductor coil of each layer on the inner peripheral portion and the outer peripheral portion of the body coil. In the coating film for flattening the film surface formed by coating on the insulating film covering the surface of each film-shaped conductor coil of the body coil, a side edge of the film-shaped conductor coil in the flattening coating film The thickness of the step portion formed at the portion corresponding to
Item 7. The thin film magnetic head according to Item 1.
JP61007739A 1986-01-16 1986-01-16 Thin film magnetic head Expired - Fee Related JP2628854B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61007739A JP2628854B2 (en) 1986-01-16 1986-01-16 Thin film magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61007739A JP2628854B2 (en) 1986-01-16 1986-01-16 Thin film magnetic head

Publications (2)

Publication Number Publication Date
JPS62165718A JPS62165718A (en) 1987-07-22
JP2628854B2 true JP2628854B2 (en) 1997-07-09

Family

ID=11674068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61007739A Expired - Fee Related JP2628854B2 (en) 1986-01-16 1986-01-16 Thin film magnetic head

Country Status (1)

Country Link
JP (1) JP2628854B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153257B1 (en) 2014-09-25 2015-10-06 Seagate Technology Llc Write head having reduced dimensions
US9159340B1 (en) * 2014-08-28 2015-10-13 Seagate Technology Llc Coil structure for write head
US9230570B1 (en) * 2014-08-28 2016-01-05 Seagate Technology Llc Write head having two yokes
US9286918B1 (en) 2014-08-28 2016-03-15 Seagate Technology Llc Write head with coil structure aligned with yoke

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134616U (en) * 1984-07-31 1986-03-03 ソニー株式会社 thin film head
JPS61132512U (en) * 1985-02-05 1986-08-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9159340B1 (en) * 2014-08-28 2015-10-13 Seagate Technology Llc Coil structure for write head
US9230570B1 (en) * 2014-08-28 2016-01-05 Seagate Technology Llc Write head having two yokes
US9286918B1 (en) 2014-08-28 2016-03-15 Seagate Technology Llc Write head with coil structure aligned with yoke
US9153257B1 (en) 2014-09-25 2015-10-06 Seagate Technology Llc Write head having reduced dimensions

Also Published As

Publication number Publication date
JPS62165718A (en) 1987-07-22

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