JPS6297119A - Thin film magnetic head - Google Patents

Abstract

PURPOSE:To obtain a thin film magnetic head consisting of multi-layered and multi-wound thin film coils having a good insulating characteristic at a good process yield by constituting said head of a non-magnetic insulator which is formed relatively thick in the inter-coil step parts of the thin spiral film coils and relatively soft non-magnetic conductors for embedment. CONSTITUTION:The coil 4 is formed by laminating a lower magnetic layer 1 and insulating layer 3a, forming Cr, Cu and Cr by a method such as vapor deposition or sputtering and spirally patterning the same by a method such as on milling. The insulating layer 3b consisting of SiO2, Al2O3, etc. is further provided and Cr, Cu and Cr are laminated thereon and are flattened by mechining such as lapping or etching such as ion milling utilizing the characteristic of smoothing an org. coating material; further, the insulating layer 3c consisting of SiO2, Al2O3, etc. is laminated thereon. The 2nd coil 6 is formed by the similar method. The insulating layer 3b in the steps between the coils of the spiral thin film coil 4 can be formed relatively thick and therefore, the inter-coil short circuit is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thin film magnetic head, and more particularly to a multilayer, multiturn thin film coil with good process yield.

[Background of the invention]

An example of reducing the resistance of a multi-layer, multi-turn thin film coil for a thin film magnetic head is given in Japanese Patent Publication No. 16408/1983. The resistance value of the thin film coil of a thin film magnetic head is related to head impedance, and reducing the resistance value of K is an important issue in order to obtain high performance.

In Japanese Patent Publication No. 57-16408, since a multi-layer, multi-turn thin film coil is effectively constructed, low resistance can be emphasized. However, as shown in FIG. 6 of Japanese Patent Publication No. 57-16408, in this configuration, the cross sections of the first coil 10 and the second coil 12 need to have similar shapes in a finite space, so the interlayer insulating layer 11 is It is impossible to increase the film thickness. In particular, the interlayer insulating layer 11
In the step part of the cross section of 0, the film quality deteriorates due to the shadow effect, and the film thickness becomes thinner, deteriorating the insulation properties. Therefore, in such a thin film coil configuration, short circuits occur between the coils, resulting in poor yield. There's a problem.

Another method is to cover all the steps between coils of a spiral thin film coil with a non-magnetic insulator, but with this configuration the insulation between the coils is maintained, but the non-magnetic insulator 5i02 r If you use an inorganic material such as Alt Os,
As the film thickness increases, there is a problem of peeling due to increased film stress, and when polyimide-based organic materials are used, problems such as poor heat resistance deteriorate the process yield.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a thin film magnetic head having a multi-layer, multi-turn thin film coil with good process yield.

[Summary of the invention]

The feature of the present invention is to flatten the steps between the coils of a multilayer spiral thin film coil by laminating and flattening an inorganic non-magnetic insulator and a non-magnetic conductor that does not have a coil function, thereby reducing the film stress. This is due to improved insulation.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a thin film magnetic head according to a first embodiment of the present invention. 1 is a lower magnetic body formed on the substrate, 5a, 5h
, 5c, 5d, and 3g are inorganic nonmagnetic insulators made of 5i0@, A120B, etc., 4 is a first layer spiral signal thin film coil, 5 is a nonmagnetic conductor for embedding, and 6 is a second layer spiral 7 is a non-magnetic conductive material for embedding, and 2 is an upper magnetic material. In this embodiment, the thin film coil 4,
6 and the nonmagnetic conductor 6.7 for embedding are used.

A specific method for manufacturing the thin film coil is shown in FIG. In the same figure (α), lower magnetic layers 1 and 5i02 +
Layer an insulating layer 3α such as AltOs, and further form Cr (film thickness ~500A to improve adhesion), Cu (film thickness approximately 5 μm), and CR (film thickness approximately 500A) by vapor deposition or sputtering. Then, it is buttered into a spiral shape by a method such as ion milling. In (A), an insulating layer 6b of 5i02, Al10H, etc. is further added to a film thickness of 2 to 5 μm, and Cr, CrbCr is added to 3 μm as in (α).
Lamination is performed by a method such as ~5 μm sputtering. (1
), flattening is performed by mechanical processing such as lapping or etching such as ion milling using the smoothing properties of the organic coating material, and then an insulating layer 3 of 5iO1, M2O5, etc.
Stack c. The second coil 6 can also be formed by a similar method.

In the thin film magnetic head constructed in this way,
Compared to the head shown in No. 16408, the insulating layer 3A at the step between the coils of the spiral thin film coil 4 can be made relatively thick, so short circuits between the coils can be prevented. In addition, by using a comparative material such as Cu as the non-magnetic conductor 5 for embedding, peeling due to increased film stress when all the steps between coils are made of inorganic insulators can be effectively reduced. The process yield can be greatly improved.

In this embodiment, C@L was used as the thin film coil 4 and the non-magnetic conductor 5 for implantation, but any material with low specific resistance may be used for the thin film coil 4. , Cu, Zru, A1. Au, Ag,
Any suitable metal material such as Sμ, Ti, Pb, or an alloy thereof may be used.

FIG. 3 is a sectional view of a thin film magnetic head according to a second embodiment of the invention. The constituent materials are the same as in the first embodiment. As shown in the figure, a part of the non-magnetic conductors 5 and 7 for 1 embedding is configured to extend and connect to the top of the thin film coil 4.6.

Even with such a configuration, the effects of the present invention remain the same.

Although the plan view of the embodiment of the present invention is omitted, the embedded non-magnetic conductor 5.7 is partially cut off so as not to interlink with the magnetic circuit of the magnetic head and create a short circuit. Needless to say, there are. Moreover, even if the non-magnetic conductor 5.7 for embedding is only the first coil 4 or only the second coil 6, the effect of the present invention of improving the process yield remains unchanged.

〔Effect of the invention〕

According to the present invention, the film difference between the coils of the spiral thin film coil is made of a relatively thick non-magnetic insulator and a non-magnetic conductor for embedding, thereby improving insulation properties and process yield. A thin film magnetic head with a good multi-layer multi-turn thin film coil can be realized.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a thin film magnetic head according to a first embodiment of the present invention, FIG. 2 is an explanatory diagram of a process, and FIG. 3 is a sectional view of a thin film magnetic head according to a second embodiment. 1.2・・・・・・・・・・・・・・・・・・・・・
・・・・・・・・・Magnetic material 4.6・・・・・・・・・・・・
・・・・・・・・・・・・・・・・・・・・・Spiral thin film coil 5.7・・・・・・・・・・・・・・・・・・・・・
・・・・・・・・・Nonmagnetic conductor for embedding 3g, 3A
, 3c, 3d, 3g ---Nonmagnetic insulator 1st eye 2nd figure

Claims (1)

[Claims] 1. In a thin film magnetic head in which a magnetic material, an insulator, a conductor coil, etc. are formed in a predetermined shape on a substrate, the conductor coil is laminated in at least one layer in a planar spiral shape. A thin film magnetic head characterized in that a non-magnetic conductor having no function as a signal coil is formed and flattened at the stepped portion between the conductor coils of each layer. 2. The thin film magnetic head according to claim 1, wherein the nonmagnetic conductor and the conductor coil formed in the stepped portion are made of the same material.