JPS63239608A - Conductor coil for thin film magnetic head and its production - Google Patents

Abstract

PURPOSE:To improve the packaging density of the titled conductor coil and to reduce the influence of external noise by using electrostatic shielding layer including a 1st insulating layer, a non-magnetic metallic film layer and a 2nd insulating layer to from an insulating layer held between 1st and 2nd planed conductor layers. CONSTITUTION:The conductor coil 15 has the 1st planed conductor layer 5 patterned by winding a conductor spirally on a plane plural times in one direction, the insulating layer applied to the surface of the 1st layer 5 and the 2nd planed conductor layer 9 patterned by winding a conductor spirally on a plane plural times in the same direction as the 1st layer 5. The insulating layer consists of the electrostatic shielding layer 16 including the 1st insulating layer 7a applied to the surface of the 1st conductor layer 5, the non-magnetic metallic layer 8 and the 2nd insulating layer 7b. Since both the planed conductor layers 5, 9 are electrostatically shielded by the non-magnetic metallic film layer 8, electrostatic capacity between the conductor coils is reduced, resonance frequency is increased and a high frequency component can be correctly reproduced without generating distortion in a reproduced waveform. Consequently, the conductor coil can resist externally induced noise and is allowed to be formed with a thin structure.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a conductor coil for a thin film magnetic head and a method for manufacturing the same, and particularly to a conductor coil for a thin film magnetic head that can perform high-density recording and reproduction with high sensitivity. It relates to its manufacturing method.

[Conventional technology]

Conventionally, the conductor coil for this type of thin film magnetic head was
For example, a conductor coil for a thin film magnetic head disclosed in Japanese Patent Publication No. 57-16408 is known. The conductor coil of this thin-film magnetic head is formed by patterning a conductor in a planar spiral pattern in one direction to form a large number of turns.The conductor is then patterned in a planar spiral pattern in the other direction on top of a first stage flattened conductor layer. A second stage planarized conductor layer formed by patterning is sequentially laminated,
The inner end and outer end of each planarized conductor layer are successively connected to form one continuous multi-layer multi-turn conductor coil.

However, since the conductor coil of this thin film magnetic head is a conductor coil made of multiple layers of multiple conductors, the packaging density of the conductor coil is low, and if the number of turns of the conductor coil is increased, the structure becomes thicker. It was difficult to increase sensitivity.

In order to eliminate the drawbacks of such a multilayer multi-turn conductor coil and increase the packaging density of the conductor coil, Japanese Patent Application Laid-Open No. 56-98711
A conductor coil for a thin film magnetic head as disclosed in the above publication has already been proposed. The conductor coil of this thin film magnetic head is formed by forming an insulating layer on the side of a first flattened conductor layer, which is formed by patterning a conductor in one direction in a planar spiral shape with many turns, and then covering it with a vA edge layer. A second planarized conductor layer is formed in the gap between the first planarized conductor layers by patterning it in a planar spiral shape with multiple turns in the same direction, increasing the packaging density of the conductor coils and producing a highly sensitive thin-film magnetic head. It was made so that it could be obtained.

[Problem that the invention seeks to solve]

In order to increase the mounting density of the conductor coils in the conventional thin-film magnetic head mentioned above and to reduce the influence of external noise, adjacent conductor coils are formed close together in the same manner as bifilar winding of ordinary coils. In this case, the capacitance between the conductor coils increases and the resonant frequency decreases.
When performing high-density recording at a high recording frequency, there is a problem in that harmonic components contained in the reproduced signal cannot be correctly reproduced, resulting in waveform distortion.

In view of the above-mentioned points, an object of the present invention is to increase the mounting density of conductor coils, suppress the capacitance between the conductor coils, and increase the resonance frequency so that the reproduced waveform is not distorted and is less susceptible to external noise. An object of the present invention is to provide a conductor coil for a thin S magnetic head.

Another object of the present invention is to provide a method for manufacturing a conductor coil for a thin-film magnetic head, which can easily manufacture the conductor coil for the above-mentioned thin-film magnetic head.

[Means for solving problems]

The thin film magnetic head of the present invention includes a first planar conductor layer formed by patterning a plurality of turns in a planar spiral shape in one direction, and an insulating layer coated on the first planar conductor layer. , a second planarized conductor layer is formed in the gap between the first planarized conductor layer on this insulating layer by patterning the first planarized conductor layer in the same direction as the first planarized conductor layer in a planar spiral shape with multiple turns. Yli 15I! ff In the conductor coil of the air head, the insulating layer includes a first insulating layer coated on the first planarized conductor layer, and a nonmagnetic metal film layer laminated on the first insulating layer. , and a second insulating layer laminated on the non-magnetic metal 1IN.

The method for manufacturing a conductor coil for a thin film magnetic head according to the present invention further includes a step of forming a first flattened conductor layer by patterning the conductor coil in a plane spiral shape in one direction a plurality of times; a step of coating an insulating layer on the insulating layer, and patterning a second planar conductor layer in a planar spiral shape in the same direction as the first planarized conductor layer in the gap of the first planarized conductor layer on the insulating layer. In the method for manufacturing a conductor coil for a GL film magnetic head, the step of coating the first planar conductor layer with an insulating layer includes the step of forming a conductor coil on the first planar conductor layer. a step of coating a first insulating layer on the first insulating layer, a step of laminating a non-magnetic metal film layer on the first insulating layer, and a step of laminating a second insulating layer on the non-magnetic metal LLN. It is characterized by

[Function] In the thin film magnetic head of the present invention, the insulating layer Ii provided between the first planarized conductor layer and the second planarized conductor layer is
The electrostatic shield layer includes an insulating layer, a nonmagnetic metal film layer, and a second insulating layer, and reduces line capacitance between the first planar conductor layer and the second planar conductor layer. let

Further, in the method for manufacturing a conductor coil for a thin film magnetic head of the present invention, the step of coating the first planarized conductor layer with the insulating layer may include coating the first insulating layer on the first planarized conductor layer. It consists of a plurality of steps including a step, a step of laminating a non-magnetic metal film layer on the first insulating layer, and a step of laminating a second insulating layer on the non-magnetic metal film layer. An electrostatic shield layer including one insulating layer, a nonmagnetic metal film layer, and a second insulating layer is formed as an insulating layer.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention. In the thin film magnetic head shown in the figure, an insulating layer 2 is formed on a substrate 1, and a lower core 3 is formed on this insulating layer N2. This lower core 3 forms a magnetic core together with an upper core 10 disposed above, and on the right side of the figure, the lower core 3
A magnetic gap 13 is formed in close proximity to the upper core 10 .

Further, the lower core 3 and the upper core 10 are connected at a connection point 14 on the side opposite to the magnetic gap 13.

A conductor coil 15 for a thin film magnetic head is disposed between the lower core 3 and the upper core 10, and the conductor coil 15 connects the lower core 3 and the upper core 10 around the connecting portion 14 as shown in FIG. It is formed to be wound around a magnetic core consisting of.

An insulating layer N4 is formed on the lower core 3, and a first planarized conductor layer 5 is formed on this insulating layer 4 by patterning it in a planar spiral shape in one direction in a plurality of turns and protruding it into an enemy shape. There is. A second planarized conductor Ff9 is formed in the groove between adjacent raised first planarized conductor layers 5 by patterning the second planarized conductor Ff9 in the same direction in a planar spiral shape with multiple turns.

Between the first planarized conductor N5 and the second planarized conductor layer 9, there is an electrostatic shield formed by sequentially laminating a first insulating layer 1as, a nonmagnetic metal film layer 8, and a second insulating layer 7b. A layer 16 is formed which provides insulation and electrostatic shielding between the first planarized conductor layer 5 and the second planarized conductor layer 9.

The nonmagnetic metal film layer 8 is made of, for example, Cu, Ti, or Cr.

It is made of AI or the like, and as shown in FIG. 4, a cut 8a is provided in a part of the area where the nonmagnetic metal film layer 8 is formed. This cut 8a prevents eddy current from flowing through the non-magnetic metal film layer 8 centering on the connecting portion 14.
This is provided to prevent a decrease in electromagnetic conversion efficiency. The non-magnetic metal film layer 8 provides electrostatic shielding between the first planarized conductor N5 and the second planarized conductor N9.
The conductor coil 15 has a high resonant frequency by reducing the influence of line capacitance between the planarized conductor layer 5 and the second planarized conductor N9.
It is said that

First planarized conductor layer 5 with electrostatic shield 71116 in between
A conductor coil [11] is formed on the conductor coil [5], an upper core 10 is formed on the insulation N11, and a protective layer 1 is formed on the upper core lO.
2 is formed.

The conductor coil 15 and the electrostatic shield layer 16 are also formed on the opposite side of the magnetic core with respect to the connecting portion 14, so that the conductor coil 15 is formed so as to wind around the magnetic core.

Note that both ends of the nonmagnetic metal film N8 of the electrostatic shield layer 16 are slightly thicker than the first insulating layer 7a and the second insulating layer 7b so that the nonmagnetic metal film layer 8 does not contact the upper core 10. It is formed short.

2 is a plan view of essential parts of the thin film magnetic head shown in FIG. 1, and FIG. 1 is a sectional view taken along arrow A-A' in FIG. As shown in FIG. 2, the first planarized conductor layer 5 and the second planarized conductor layer 9 are spirally formed around the connecting portion 14 with the lower core 3 and the upper core 10. The outer end of the first planarized conductor layer 5 is an external lead-out terminal 5
a, and the inner end portion 5b is connected to an external lead-out terminal 18 serving as a center tap. Further, the outer end 9a of the second planarized conductor layer 9 is connected to the external connection terminal 18, and the inner end 9b is connected to the external connection terminal 17.

Therefore, since both planarized conductor layers 5 and 9 are commonly connected at the inner end 5b and outer end 9a, the conductor coil 15 is connected between the external lead terminal 5a and the external lead terminal 17.
The number of turns is increasing. Further, when viewed between the external lead-out terminals 5a and 17 and the external lead-out terminal 18, the conductor coil 15 has a bifilar winding.

In this way, the first planarized conductor N5 and the second planarized conductor layer 9 are not formed in a two-layer structure but on the same plane, so that the conductor coil 15 is formed in a thin structure.

In addition, by adopting a bifilar structure for the first planarized conductor N5 and the second planarized conductor layer 9, a conductor coil 15 with a good S/N ratio can be obtained. Become.

3(a) to 3(1) are cross-sectional views showing the sequential manufacturing steps of the conductor coil portion of the thin film magnetic head shown in FIGS. 1 and 2. FIG. The manufacturing method will be described below with reference to this figure.

First, as shown in FIG.
After forming a lower core 3 thereon, an insulating layer 4 is formed on this lower core 3.

Next, as shown in FIG. 3(b), a first planarized conductor layer 5 is formed over the insulating layer 4.

Subsequently, as shown in FIG. 3(C), a resist N6 is formed on the first planarized conductor layer 5, and selectively exposed to light to pattern the resist N6 in a planar spiral shape with multiple turns in one direction. Note that in this case, a Ti layer may be formed beforehand under the resist layer 6.

After removing the portions other than the patterned portions of the resist N6, as shown in FIG. The layer 5 is removed, and the first planarized conductor layer 5 is formed by bulging it in a spiral pattern in a planar shape with multiple turns in one direction as shown in FIG.

Next, the resist layer 6 remaining on the raised first planarized conductor layer 5 is removed as shown in FIG.

After removing the resist N6, sputtering or vapor deposition of, for example, alumina or silicon dioxide (Sing) is performed from the upper edge of the first planarized conductor layer 5 in FIG. 3 (as shown in C1) to form the insulating layer 4. Then, a first insulating layer Jii 7 a is formed on the first planarized conductor layer 5 .

Next, as shown in FIG.
, a Ti layer, a nonmagnetic metal film layer 8 made of Cr, A1, etc., and further a second insulating layer 7 on this nonmagnetic metal film layer 8.
b is formed in the same manner as the first insulating layer 7a as shown in FIG. 3, thereby forming the electrostatic shield layer 16.

Subsequently, as shown in FIG. 3 (11), the electrostatic shield layer 1
A second planarized conductor N9 is formed on the second planarized conductor layer 6, and the grooves formed between the first planarized conductor layers 5 are filled with the second planarized conductor layer 9.

Next, as shown in FIG. 30), the second planarized conductor layer 9 formed on the electrostatic shield layer 16 is replaced with a raised first planarized conductor layer 5, leaving only the groove portion. Ion beam etching is performed using a resist mask of a predetermined shape up to the top surface of the electrostatic shield layer 16, which is formed on the first insulating layer 7a, the nonmagnetic metal film layer 8, and the second insulating layer 7b. Then, the second planarized conductor layer 9 above this upper surface is removed.

As a result, the second planarized conductor layer 9 is wound multiple times in a planar spiral shape in the same direction as the first planarized conductor N5 through the electrostatic shield layer 16 between the first planarized conductor layer 5. The conductor coil 15 is formed by patterning and is formed by connecting the first planarized conductor layer 5 and the second planarized conductor N9 at the inner end 5b and the outer end 9a as shown in FIG. It is formed.

On the conductor coil 15 thus formed, an insulating layer 11 is formed as shown in FIG. 3(G), and an upper core 10 is further formed on this insulating layer 11.

Finally, by covering the protective layer 12, the first
A thin film magnetic head as shown in the figure is obtained.

[Effects of the Invention] As explained above, according to the thin film magnetic herad conductor coil of the present invention, the first insulating layer is provided between the first planar conductor layer and the second planar conductor layer. Since the electrostatic shield layer is formed of a non-magnetic metal film layer and a second insulating layer, the capacitance between the conductor coils is reduced by electrostatic shielding between both planar conductor layers by the non-magnetic metal film layer. is lowered, the resonant frequency becomes higher, and the harmonic components can be reproduced correctly without distortion in the reproduced waveform.

Furthermore, by adopting a bifilar structure, it is strong against externally induced noise, and since the conductor coils are formed on almost the same plane, it is advantageous in that it can be formed structurally thin.

Further, according to the method for manufacturing a conductor coil for a thin film magnetic head of the present invention, there is not a large number of steps required to provide electrostatic shielding between the first planarized conductor layer and the second planarized conductor layer. This has the advantage that a conductor coil for a thin film magnetic head in which electrostatic shielding is achieved between the first planarized conductor layer and the second planarized conductor layer can be easily obtained by only increasing the number of relatively simple steps.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view showing an embodiment of the present invention.
A plan view of the main part of the conductor coil of the thin film magnetic head of this embodiment, FIGS.
FIG. 2 is a diagram for explaining a formation region of a nonmagnetic metal IIIM shown in FIG. 1; In the figure, 3...lower core, 4...insulating layer, 5...first planarized conductor layer, 6...resist layer, 7a...first insulating layer, 7b...second 8... Nonmagnetic metal film layer, 9... Second flattened conductor layer, 10... Upper core, 11... Insulating layer, 15... Conductor coil, 16...・It is an electrostatic shield layer.

Claims (2)

[Claims] (1) A first planarized conductor layer formed by patterning a plurality of turns in a planar spiral shape in one direction, an insulating layer coated on this first planarized conductor layer, and an insulating layer coated on this insulating layer. a second planarized conductor layer formed by patterning the first planarized conductor layer in a plurality of turns in the same direction as the first planarized conductor layer in the gap between the first planarized conductor layers. In the conductor coil of the head, the insulating layer includes a first insulating layer coated on the first planarized conductor layer, a nonmagnetic metal film layer laminated on the first insulating layer, and a non-magnetic metal film layer laminated on the first insulating layer. A second layer laminated on the non-magnetic metal film layer
A conductor coil for a thin film magnetic head, comprising an electrostatic shielding layer comprising an insulating layer and an insulating layer. (2) forming a first planarized conductor layer by patterning the first planarized conductor layer multiple times in a planar spiral in one direction; coating the first planarized conductor layer with an insulating layer; and A second planar conductor layer is patterned in a planar spiral shape in the same direction as the first planar conductor layer in the gap between the first planar conductor layers on the layer.
A method of manufacturing a conductor coil for a thin-film magnetic head comprising the step of forming a planarized conductor layer, the step of coating an insulating layer on the first planarized conductor layer,
a step of coating a first insulating layer on the first planarized conductor layer, a step of laminating a nonmagnetic metal film layer on the first insulating layer, and a step of laminating a second insulating layer on the nonmagnetic metal film layer. 1. A method of manufacturing a conductor coil for a thin film magnetic head, the method comprising: laminating an insulating layer.