JPS63117307A - Manufacture of conductor coil for thin film magnetic head - Google Patents

Abstract

PURPOSE:To obtain a high-reliability magnetic head with superior magnetic characteristics by forming the overlap part of a 1st and 2nd plane conductor layers as a 1st and 2nd external lead-out layers at the same height with a lower core. CONSTITUTION:The 1st plane conductor 5 is formed by being patterned by plural-time winding spirally in a plane and in one direction on an insulating layer so that it is connected electrically to the 1st lead-out layer through a 1st contact hole 4b. A 3rd contact hole is bored so as to communicate with the 2nd lead-out layer through a 2nd contact hole 7a on the 1st plane conductor layer 5, and the hole is covered with the insulating layer 7; and the 2nd plane conductor layer 9 is laminated connecting electrically with the 2nd lead-out layer through the 2nd contact hole and the 3rd contact hole while filling the gap of the 1st plane conductor layer 5 on the 2nd lead-out layer. Then the top surface of the 2nd plane conductor layer is polished to perform plural-time winding patterning spirally in a plane and in the same direction with the 1st plane conductor 5, and an insulating layer 11 is formed by a spin coating method on the 2nd plane conductor layer 9. Consequently, the conductor coil of a thin film magnetic head which is easily flattened and structurally thin is obtained.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a conductor coil for a thin-film magnetic head, and in particular to a method for manufacturing a conductor coil for a thin-film magnetic head that can perform high-density recording and reproduction with high sensitivity. Regarding the method.

[Conventional technology]

Conventionally, as a method for manufacturing a conductor coil for a thin film magnetic head of this type, for example, a method for manufacturing a conductor coil for a thin film magnetic head disclosed in Japanese Patent Publication No. 16408/1980 is known. The method for manufacturing a conductor coil is to pattern a conductor in one direction in a planar spiral shape with multiple turns on top of a first stage flattened conductor layer, and pattern the conductor in the other direction in a planar spiral pattern in multiple turns. The second stage of flattened conductor layers formed by the above are sequentially laminated, and the inner and outer ends of each flattened conductor layer are sequentially and continuously connected to form one continuous multi-layer, multi-turn conductor coil. It was designed to do so.

However, this TRtl! The method for manufacturing the conductor coil of the IF head is to manufacture a conductor coil with multiple layers and multiple turns of multiple conductors, so the packaging density of the conductor coil is low (and if you try to increase the number of turns of the conductor coil, the structure This made it difficult to increase sensitivity.

In order to eliminate the drawbacks of such a method for manufacturing a conductor coil for a thin film magnetic head and increase the packaging density of the conductor coil, a method for manufacturing a conductor coil for a thin film magnetic head as disclosed in Japanese Patent Laid-Open No. 56-98711 has been proposed. Methods have already been proposed. The method for manufacturing the conductor coil of this thin film magnetic head is as follows:
The first planarized conductor layer, which is formed by patterning the conductor in a planar spiral shape multiple times in one direction, is completely coated on the side! ! A second planar conductor layer is formed in the gap between the first planar conductor layers covered with an insulating layer by patterning the conductor layer in a planar spiral shape multiple times in the same direction, and a conductor coil is mounted. This increases the density and makes it possible to obtain a highly sensitive thin film magnetic head.

[Problem that the invention seeks to solve]

In the conventional method for manufacturing conductor coils for thin-film magnetic heads described above, there are always parts where the conductor coils overlap, so insulating the overlapping parts of the conductor coils requires more manufacturing steps, and the conductor coils have to be thick and flat. Therefore, there are problems in that the magnetic properties of the core are inferior and the reliability is lowered.

The purpose of the present invention is to avoid the above-mentioned points, and to reduce the manufacturing process by skillfully avoiding overlapping conductor coils;
It is an object of the present invention to provide a method for manufacturing a conductor coil for a thin film magnetic head that is easy to planarize and is structurally thin. - [Means for Solving the Problems] The method for manufacturing a conductor coil for a thin film magnetic head of the present invention includes the steps of forming a lower core and simultaneously forming first and second external lead-out layers, the lower core and An insulating layer serving as a magnetic gap is formed on the first and second external lead-out layers, and first and second contact holes communicating with the first and second external lead-out layers are formed in this insulating layer. and patterning the insulating layer in a planar spiral shape multiple times in one direction so as to electrically connect with the first external lead-out layer through the first contact hole. a step of forming a planarized conductor layer;
forming a third contact hole on the planarized conductor layer so as to communicate with the second external lead-out layer through the second contact hole to cover the insulating layer; A second planarized conductor layer that fills a gap in the first planarized conductor layer and is electrically connected to the second external lead-out layer through the second contact hole and the third contact hole. a step of laminating conductor layers; a step of etching the upper surface of the second planarized conductor layer to pattern it in a planar spiral shape with multiple turns in the same direction as the first planarized conductor layer; forming an insulating layer on the planarized conductor layer by spin coating.

[Effect]

In the method for manufacturing a conductor coil for a thin film magnetic head of the present invention,
At the same time as forming the lower core, first and second external lead-out layers are formed, and an insulating layer serving as a magnetic gear knob is formed on the lower core and the first and second external lead-out layers, and the first and second outer lead-out layers are formed on the insulating layer. First and second contact holes communicating with the second external lead layer are formed in one direction on the insulating layer so as to be electrically connected to the first external lead layer through the first contact hole. A first flattened conductor layer is formed by patterning the conductor layer in a plane spiral shape multiple times;
A third contact hole is formed on the first planarized conductor layer so as to communicate with the second external lead-out layer via the second contact hole, and the insulating layer is covered. A second planar conductor layer is stacked so as to fill the gap between the planar conductor layers and to be electrically connected to the second external lead-out layer through the second contact hole and the third contact hole. The upper surface of the second flattened conductor layer is polished and patterned in a plane spiral shape multiple times in the same direction as the first flattened conductor layer, and the second flattened conductor layer is insulated by spin coating. A layer is formed.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view showing a thin film magnetic head to which a method of manufacturing a conductor coil according to an embodiment of the present invention is applied. In this thin film magnetic node, an insulating layer 2 is formed on a non-magnetic substrate I, and a lower core 3 and first and second external lead-out layers 19 and 20 (see FIG. 2) are formed on this insulating layer N2. has been done. The lower core 3 forms a magnetic core together with the upper core 10 disposed above, and on the right side of the figure, the lower core 3 and the upper core 10 are close to each other and form a magnetic gap 1.
3 is formed. Further, the lower core 3 and the upper core 10 have a connection point 14 on the side opposite to the magnetic gap 13.
connected with.

A conductor coil 15 for a thin film magnetic head is disposed between the lower core 3 and the upper core IO, and this conductor coil 15 connects the lower core 3 and the upper core 10 around the connecting portion 14 as shown in FIG. It is formed to be wound around a magnetic core consisting of.

An insulating layer 4 is formed on the lower core 3 and the first and second external lead-out layers 19 and 20, and the insulating layer 4 has first and second contact holes 4a and 4b (see FIG. 2). First and second external lead-out layers 19 and 2
It is perforated so as to communicate with 0.

A first planarized conductor layer 5 is formed on the insulating layer 4 by patterning it in one direction in a planar spiral shape with multiple turns and protruding into an enemy shape. As shown in FIG. 2, this planarized conductor layer 5 has its inner end 5b electrically connected to the first external lead-out layer 19 via the first contact hole 4a.

An insulating layer 7 is formed on the first planarized conductor layer 5 and the insulating layer 4.
is formed. As shown in FIG. 2, this insulating layer 7 has a third contact hole 7a that communicates with the second external lead layer 20 via the second contact hole 4b. The insulating layer 7 serves to insulate the first planar conductor layer 5 and the second planar conductor layer 9, which will be described next.

In the groove between adjacent raised first flattened conductor layers 5,
Like the first planar conductor layer 5, the second planar conductor layer 9 is formed by patterning a plurality of turns in a planar spiral shape in the same direction. This second planarized conductor layer 9
and is connected to the second external lead layer 20 via second contact holes 7a and 4b.

An insulating layer 1 is placed on a conductor coil 15 consisting of a first planar conductor layer 5 and a second planar conductor layer 9 with an insulation Ft7 in between.
1 is formed, and the upper core 10 is placed on top of this insulation layer.
is formed, and a protective layer 12 is formed on this upper core 10.

FIG. 2 is a plan view of the main part of the conductor coil of the thin 11 [gas head] shown in FIG.
It is a sectional view along A'. As shown in FIG. 2, the first planarized conductor layer 5 and the second planarized conductor layer 9 are spirally formed around the connecting portion 14 with the lower core 3 and the upper core IO.

The outer end of the first flattened conductor layer 5 serves as an external lead-out terminal 5a, and the inner end 5b is connected to an external lead-out terminal 18 serving as a center tap via a first external lead-out layer 19. . Further, the outer end portion 9a of the second planarized conductor layer 9 is in contact with the external V
The inner end portion 9b is connected to the external connection terminal 17 via the second external lead-out layer 20.

Therefore, since both planar conductors N5 and 9 are in common contact with the inner end 5b and the outer end 9a,
The number of turns of the conductor coil 15 is increased when viewed between the external lead-out terminal 5a and the external lead-out terminal 7. Also, looking between the external lead terminals 5a and 17 and the external lead terminal 18,
The conductor coil 15 has a bifilar winding.

In this way, the first planarized conductor layer 5 and the second planarized conductor layer N
9, the conductor coil 15 is thin because it does not have a two-layer structure but is formed on the same plane and requires only the first and second external lead-out layers 19 and 20 whose overlapping parts are at the same height as the lower core 3. formed into a structure.

Note that by adopting a bifilar structure for the first planarized conductor N5 and the second planarized conductor layer 9, a conductor coil 15 with a good S/N ratio of strong against externally induced noise can be obtained. Become.

3+al to U) are cross-sectional views showing the sequential manufacturing steps of the conductor coil of the thin film magnetic head shown in FIGS. 1 and 2. FIG. The manufacturing method will be described below with reference to this figure.

First, as shown in FIG. 3(a), an insulating layer 2 is formed on a nonmagnetic substrate 1 by sputtering or the like, and then the insulating layer 2 is
Menki on top. A lower core 3 made of a magnetic material is formed over one surface by sputtering or the like, and patterned into a predetermined shape. At this time, as shown in FIG.
And second external lead-out layers 19 and 20 are simultaneously formed to have the same thickness. At the same time, an external lead-out layer may be formed near the region where the external lead-out terminal 5a is to be formed.Next, an insulating layer 4 forming a magnetic gap is laminated on the lower core 3 to form a predetermined shape. pattern. At this time, as shown in FIGS. 1 and 2, in order to connect the first and second external lead-out layers 19 and 20 to the first planar conductor layer 5 and the second planar conductor layer 9 First and second contact holes 4a and 4b are simultaneously drilled.

Next, as shown in FIG. 3 fbl, a first planarized conductor layer 5 is formed over the insulating layer 4. This first planarized conductor N5 has a three-layer structure of Ti, Cu, and Ti. The reason why the first planarized conductor layer 5 has a three-layer structure is as follows.
This is to improve the processing accuracy of Cu as a conductive material by using Ti as a mask material. First planarized conductor layer 5
When forming the first planar conductor layer 5, the first planarized conductor layer 5 is connected to the first external lead layer 19 via the first contact hole 4a.

Subsequently, as shown in FIG. 3fcl, a resist layer 6 is formed on the first planarized conductor N5, and is selectively exposed to light to pattern the resist layer 6 in one direction in a planar spiral shape with multiple turns. After removing the resist layer 6 other than the patterned portion,
As shown in FIG. 3 fdl, the upper Ti layer of the first planarized conductor layer 5 in the portion where the resist layer 6 is not left is etched by, for example, reactive ion etching using the resist layer 6 as a mask, and the resist layer 6 is etched by reactive ion etching. After removing 6, the intermediate layer Cu is ion beam etched in, for example, an Ar+Oz atmosphere using the upper Ti layer as a mask, and the upper and lower Ti layers are further ion beam etched in, for example, an Ar atmosphere. As a result, as shown in Figure 3 tel,
The first planarized conductor layer 5 is formed by patterning a plurality of turns in a planar spiral shape in one direction so that the first planarized conductor layer 5 is raised in the shape of an enemy.

Next, as shown in FIG. 3 ([1), sputtering of alumina (AlzCh) or silicon dioxide (SiO3), etc., is performed on the first planarized conductor layer 5 to form the insulation M4 and the first planar conductor layer 5. An insulating layer 7 is formed on the conductor layer 5 and patterned into a predetermined shape.At this time, as shown in FIG. 3 contact hole 7a
are drilled and formed at the same time.

Subsequently, as shown in FIG. 3 (phantom), a second planarized conductor layer 9 is formed and patterned on the insulating layer 7, and the grooves formed between the first planarized conductor layers 5 are formed into second planarized conductor layers 9. It is filled with a planarized conductor layer 9.This second planarized conductor layer 9 is also formed of a three-layer structure of Ti, Cu, and Ti, similarly to the first planarized conductor layer 5. When the second planarized conductor layer 9 is formed, the second planarized conductor layer 9 is connected to the second external lead-out layer 20 via the third contact hole 7a and the second contact hole 4b. Ru.

Next, as shown in FIG.
Ion beam etching is performed to the position of the upper surface of the insulating layer 7 formed on the raised first planarized conductor layer 5, and the second planarized conductor layer 9 above this upper surface is removed. As a result, the second planar conductor layer 5 is interposed between the first planarized conductor layer 5 and the insulating layer 7 interposed therebetween.
The planarized conductor layer 9 is formed by patterning a plurality of turns in a planar spiral shape in the same direction as the first planarized conductor layer 5, thereby forming a conductor coil 15. First planarized conductor layer 5
The overlapping portion of the second planarized conductor layer 9 is
Since only the portions 9 and 20 are formed, the upper surface of the conductor coil 15 can be formed completely flat.

Next, as shown in FIG. 3+11, an insulating layer 11 is formed by spin coating with resin.

Subsequently, as shown in FIG. 3 (II), an upper core IO is further formed on the insulating IJ11.

Finally, by covering the protective layer 12, the first
A thin film magnetic head as shown in the figure is obtained.

〔Effect of the invention〕

As explained above, according to the method of manufacturing a conductor coil for a thin-film magnetic head of the present invention, the overlapping portion of the first and second planarized conductor layers is located at the same height as the lower core. Since it becomes an external lead-out layer, the conductor coil can be formed flatly, and a flat insulating layer can be easily formed on the second flattened conductor layer by spin coating, so that the main part can be removed in the next step. A flat upper core can be formed. As a result, a magnetic head with excellent magnetic properties and high reliability can be obtained.

In addition, since the first and second external lead-out layers can be formed at the same time as the lower core in order to avoid the overlapping portion of the first and second planarized conductor layers, compared to conventional conductor coils with a two-layer structure, etc. This has the advantage that a flat, thin conductor coil can be formed through a simple manufacturing process.

Furthermore, the bifilar structure increases resistance to externally induced noise, and since the coil is tightly wound, the reproduction efficiency is improved (and the winding space is not taken up).

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing a thin film magnetic head to which a method of manufacturing a conductor coil according to an embodiment of the present invention is applied, and FIG. 2 is a plan view of the main part of the conductor coil of the thin film magnetic head shown in FIG. 3 (at to fil are cross-sectional views showing the sequential steps of the method for manufacturing the conductor coil of the thin-film magnetic head of this embodiment. In the figure, 3... lower core, 4... insulation Layer, 4a, 4b... contact hole, 5... first planarized conductor layer, 5a... external lead-out terminal, 6... resist layer, 7... insulating layer, 7a... contact hole, 9... Second flattened conductor layer, 10... Upper core, 11... Insulating layer, 15... Conductor coil, 17, 18. External lead-out terminal, 19, 20. External lead-out layer. .

Claims (1)

[Claims] A step of forming first and second external lead-out layers at the same time as forming a lower core, and forming an insulating layer to serve as a magnetic gap on the lower core and the first and second external lead-out layers. forming first and second contact holes communicating with the first and second external lead-out layers in the insulating layer; forming a first planarized conductor layer by patterning the insulating layer in a planar spiral shape multiple times in one direction so as to electrically connect with the first planarized conductor layer; forming a third contact hole so as to communicate with the second external lead-out layer through the second contact hole to cover the insulating layer; laminating a second flattened conductor layer so as to fill the gap between the flattened conductor layers and electrically connect to the second external lead-out layer through the second contact hole and the third contact hole; etching the upper surface of the second planarized conductor layer to pattern it in a planar spiral shape with multiple turns in the same direction as the first planarized conductor layer; 1. A method for manufacturing a conductor coil for a thin-film magnetic head, comprising: forming an insulating layer by a spin coating method.