JPH0749609Y2 - Multilayer wiring thin film coil - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a flattening technique for a multilayer wiring thin film coil, and more particularly to a multilayer wiring thin film coil effective for manufacturing a thin film magnetic head.

[Prior Art] In a thin film magnetic head, if the winding density of the wound thin film coil is increased, the recording / reproducing characteristics are improved. Therefore, the thin film coil wound around the thin film magnetic head has a multi-layer structure in a narrow space. A large number of windings can be obtained, for example, Japanese Patent Publication Sho 62-2
7445 thin film coils have been proposed.

FIG. 6 is a plan view showing an example of such a multi-layered thin film coil. In the drawing, the first coil 2 is spirally wound and formed on the substrate as indicated by the hatched lines.
The second coil 4 is wound and formed in the spiral gap formed between the coils with an insulating film (not shown) interposed therebetween.
Innermost peripheral end 2a of coil 2 and outermost peripheral end 4b of second coil 4
And are connected by a connecting line 6.

[Problems to be Solved by the Invention] However, such a thin-film coil having a two-layer wiring structure is
This is a mode in which the same conductive material as the second coil attached when forming the coil 4 surrounds the first coil 2 and the second coil 4, and finally surrounds the first coil 2 and the second coil 4. Excessive conductor material must be removed. This excess conductor material is removed by masking and etching the first coil 2 and the second coil 4 with a resist or the like. However, if the masking by the resist is inaccurate, There is also a problem that the outermost peripheral portion is also etched, resulting in a disconnection defect.

In particular, when forming a coil having a narrow conductor width, the above disconnection defect is likely to occur. Further, when a multi-element thin film head is to be formed by using such a thin film coil, an extra conductor material between the coils of the adjacent magnetic heads attached when forming the second coil 4 must be removed by etching. However, it is technically extremely difficult to accurately remove the extra conductor material between the coils, especially when the space between the adjacent coils is narrow, and a short circuit occurs between the adjacent coils, or a disconnection of the first coil 2, etc. However, as a result, the distance between adjacent coils cannot be reduced,
It was difficult to form a multi-element thin film head having a high track density.

The present invention has been made to solve such a problem, and it is not necessary to remove an extra conductor material surrounding the coil after forming the coil, and to form a coil having a high winding density without disconnection or short defect. Is intended to be performed with high precision.

[Means for Solving the Problems] The present invention provides a first coil wound spirally on the surface of an insulator substrate at an arbitrary pitch, and an insulator on the gap and outside of the first coil. A second coil wound in a spiral shape, an outermost peripheral end of the first coil and an innermost peripheral end of the second coil, or an innermost peripheral end of the first coil and the second coil. A thin-film coil comprising a connecting means for electrically connecting the outermost peripheral end of the coil, wherein the first coil is made of the same material as the first coil and restricts the outermost peripheral part of the second coil. The above-mentioned problem is formed by including a frame that is formed outside the outermost peripheral part of the first coil with a predetermined distance from the first coil and that is electrically insulated from the second coil by an insulating layer. Is the solution.

[Operation] In the present invention, the first coil is wound in a spiral shape at an arbitrary pitch, and at the same time, the outermost peripheral portion of the second coil is restricted to a portion separated by an arbitrary distance outside the first coil. The frame is made of the same material as the first coil, and the second coil is wound around the spiral gap formed between the frame and the first coil and between the first coils through an insulator, After electrically connecting the outermost peripheral end of the coil and the innermost peripheral end of the second coil by connecting means,
Since the first coil and the frame are separated and electrically insulated from each other by a means such as cutting or etching at a portion separated from the winding portion, a frame portion made of an extra conductor material unrelated to the coil is formed. There is no need to remove it, it does not lead to the occurrence of disconnection defects due to the removal of excess conductor material as in the past, the coil formation accuracy can be improved, and the entire surface of the substrate is flattened, so The thin film forming accuracy is improved.

[Embodiment] FIG. 1 is a plan view showing an embodiment of the present invention. In this figure, 10 is a first coil spirally wound on a substrate at an arbitrary pitch, and 12 is this coil. The second coil, 13 wound around the same winding spiral gap formed between the first coils includes the first coil 10 and the second coil 12.
A frame surrounding the first coil 10, and 14 is the outermost peripheral end of the first coil 10.
10b is a connecting wire that electrically connects the innermost peripheral end portion 12a of the second coil 12. Here, the first coil 10, the frame 13, the first coil bonding pad 16 and the second coil 12, which will be described later, are insulated by a film of an insulator (not shown).

Further, 16 is a first coil bonding pad, and the first coil bonding pad 16 is electrically connected to the innermost peripheral end portion 10a of the first coil 10 by a lead wire 20. Reference numeral 18 is a second coil bonding pad that forms an outermost peripheral end portion of the second coil 12, and reference numeral 22 is a magnetic flux passage opening formed substantially at the center of winding of the first coil 10 and the second coil 12.

Next, a method of manufacturing the thin film coil will be described with reference to FIG.

As shown in FIG. 2A, a first conductor film 26 to be the first coil 10 is deposited on the insulating substrate 24 having a flat surface by a predetermined thickness.

The first conductor film 26 is etched by photolithography as shown in FIG. 2B to form the spiral first coil 10 and the frame 13 (not shown). At this time, at the same time, the bonding pad portion 18 (not shown) of the second coil 12 is also formed by this etching.

An insulating film 28 having a desired thickness is applied to the entire surface of the thus formed first coil as shown in FIG. 2 (c).

Next, the second conductor film 30 to be the second coil 12 is deposited to a desired thickness as shown in FIG. 2 (d).

The surface of the second conductor film 30 is removed by polishing until the top of the first coil 10 appears, as shown in FIG.
Alternatively, polishing is performed until the insulating film on the top of the first coil 10 appears.

By the above work, the second coil is sandwiched between the first coils 10.
The coil 12 is formed.

Then, using photolithography technology, the first coil 1
0, the magnetic flux passage port 22 at the winding center of the second coil 12 is formed by etching (not shown).

Next, as shown in FIG. 2F, an insulating film 32 is deposited on the first coil 10 and the second coil 12.

The insulating film 32 on the innermost and outer peripheral ends of the first coil 10 and the second coil 12 and on the first coil bonding pad 16 part is
As shown in FIG. 3G, the photolithography technique is used for etching removal.

As shown in FIG. 2 (h), the conductor film 34 is deposited on the first and second coils. The conductor film 34 is connected to the connecting wire 14 for electrically connecting the outermost peripheral end 10b of the first coil 10 and the innermost peripheral end 12a of the second coil 12 by etching using a photolithography technique later. Innermost end 1 of the first coil 10
It is formed as a lead wire 20 (not shown) that electrically connects 0a and the first coil bonding pad 16 part.

Finally, by means such as cutting or etching, the first
The outermost peripheral end 10b of the coil 10, the first coil bonding pad 16 and the frame 13 are separated (not shown).

By following the above steps, the frame of FIG.
A two-layer wiring thin film coil having 13 is completed.

Application Example FIG. 3 is a plan view showing an application example of the thin film coil of the present invention to a thin film magnetic head, and FIG. 4 is a sectional view of the thin film magnetic head of FIG. In 9 is substrate 24
The lower magnetic pole piece 10, which is partially formed on the upper part, is a first coil which is spirally wound on the lower magnetic pole piece and the substrate 24 at an arbitrary pitch with the insulating film 1 interposed therebetween. A second coil 13 wound around a spiral gap formed between the first coils 13 is a frame surrounding the first coil 10 and the second coil 12. First coil 10 and frame 13, first coil bonding pad 16 and second coil
It is insulated from 12 by an insulator film (not shown).

The outermost peripheral end 10b of the first coil 10 and the innermost peripheral end 12a of the second coil 12 are electrically connected by a connecting wire 14. 16 is the first coil bonding pad, 18 is
The second coil bonding pads, 19 forming the outermost peripheral end of the second coil 12 are insulating films, and the first coil bonding pad 16 and the innermost peripheral end 10a of the first coil 10 are electrically connected by a lead wire 20. Connected to each other.

Reference numeral 22 is a magnetic flux passage opening formed in the substantially central winding portion of the first coil 10 and the second coil 12, and the first coil 10 and the second coil 12 are provided in the portion where the magnetic flux passage opening is formed. An upper magnetic pole piece 36 is provided on the upper side of the above to face the lower magnetic pole piece 9.

The insulating film 11 forms a gap material 11 a between the upper magnetic pole piece 36 and the lower magnetic pole piece 9.

Next, a method of manufacturing the thin film magnetic head will be described with reference to FIG.

(1) A groove 38 for embedding the lower magnetic pole piece 9 in one surface of the substrate 24 having a flat surface as shown in FIG.
Are formed by etching.

(2) A magnetic film 40 such as sendust or amorphous is deposited on the surface of the substrate 24 by the PVD method as shown in FIG. 5 (b).

(3) The surface of the magnetic film 40 is polished as shown in FIG. That is, the magnetic film 40 embedded in the groove 38 of the substrate 24.
The remaining part of the magnetic film 40 is removed, the surface of the substrate 24 is exposed, and polishing is performed until the entire surface is planarized. The remaining magnetic film 40 becomes the lower magnetic pole piece 9.

The above steps may be performed by the following method. That is, a non-magnetic film is formed on a substrate, a hole for filling the lower pole piece is formed by etching the non-magnetic film, and the lower pole piece is embedded in this hole, or a magnetic film is formed on the substrate. Alternatively, a method may be used in which the lower magnetic pole piece is etched to form a lower magnetic pole piece and the periphery of the lower magnetic pole piece is filled with a non-magnetic substance.

(4) An insulating film 11 is formed on the surface, and unnecessary portions are removed by etching as shown in FIG. 5 (d). A part of the insulating film 11 may also serve as the gap material 11a.

(5) The first conductor film 26 is deposited as shown in FIG.

(6) A frame for restricting the outermost periphery of the second coil 12, as shown in FIG. 5 (f), at the spiral first coil 10 and a portion separated by an arbitrary distance outside the first coil 10. 13 is formed by etching.

(7) After depositing an insulating film (not shown) over the entire surface of the substrate, a second conductor film 30 is deposited as shown in FIG. 5 (g).

(8) The surface of the second conductor film 30 is polished until the surface of the first coil 10 appears as shown in FIG.

By the above work, the second coil 12 is formed in a state of being sandwiched between the frame 13 and the line of the first coil 10.

(9) A part of the frame 13 and the conductor film 26 at the connecting portion of the upper and lower magnetic pole pieces 9 and 36 of the magnetic head are removed by etching as shown in FIG. 5 (i).

(10) Forming the insulating film 19, connecting the upper and lower magnetic pole pieces 9 and 36, the outermost and inner peripheral ends of the first coil 10 and the second coil 12,
Then, the insulating film 19 on the first coil bonding pad portion 16 is removed by etching as shown in FIG. 5 (j).

Further, the insulating film 11a where the upper and lower magnetic pole pieces 9 and 36 face each other to form an operating gap is removed by etching, leaving a thickness corresponding to the gap length.

(11) A magnetic film 37 to be the upper magnetic pole piece 36 is deposited to a desired thickness as shown in FIG.

(12) Except for the upper magnetic pole piece 36, the connecting wire 14 and the lead wire 20, the unnecessary magnetic film is removed by etching as shown in FIG.

Then, the magnetic head chip is obtained by cutting at the ero and han portions. At this time, the first coil 10, the frame 13 and the first coil bonding pad portion 16 are completely separated,
Be electrically isolated. Then, by polishing the surface corresponding to the sliding surface of the magnetic head chip until the desired gap depth is obtained, the thin film magnetic head having the frame 13 shown in FIGS. 3 and 4 is completed.

[Advantages of the Invention] Since the present invention is configured as described above, it is possible to improve the coil forming accuracy due to the presence of the frame, and since it is not necessary to remove the frame, defects such as disconnection of the coil can be reduced. There is an effect.

In particular, when a multi-element thin film head is formed by the thin film coil according to the present invention, the frame acts as a partition between the coils of adjacent vapor heads, and by thinning this partition, coil short-circuiting, disconnection, etc. There is an effect that the coil interval can be easily narrowed without causing defects.

Further, in the present invention, since the upper magnetic pole piece is formed on the flattened coil, no large internal stress is generated in the upper magnetic pole piece and the magnetic characteristics of the magnetic film of the upper magnetic pole piece are maximized. Therefore, there is an effect that a magnetic head having excellent recording and reproducing characteristics can be manufactured.

Further, the present invention has an effect that the step of removing the frame, which is an extra conductor material unrelated to the coil, can be omitted, so that the productivity is excellent and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention, FIGS. 2 (a) to 2 (h) are sectional views for explaining a method of manufacturing a thin film coil according to the present invention, and FIG. FIG. 4 is a plan view of an example in which the thin film coil of FIG. 4 is applied to a thin film magnetic head, FIG. 4 is a sectional view taken along the line IV-IV of FIG. 3, and FIGS. FIG. 6 is a plan view of a conventional thin-film coil for explaining the manufacturing method of FIG. 10 …… First coil, 10a, 12a …… Innermost end, 10b ……
Outermost edge, 11, 19, 28, 32 ... Insulating film, 11a ... Gap, 12 ... Second coil, 13 ... Frame, 14 ... Connecting wire, 16 ... First coil bonding pad, 18 ...... Second
Coil bonding pad, 20 …… Leader wire, 22 ……
Magnetic flux passage, 24 ... Insulating substrate, 26 ... First conductor film, 30 ...
… Second conductor film, 34 …… Conductor film, 36 …… Upper pole piece, 37,
40 ... Magnetic film, 38 ... Groove.

Claims (1)

[Scope of utility model registration request] 1. A first coil spirally wound on a surface of an insulator substrate at an arbitrary pitch, and a spiral coil wound around the gap and the outside of the first coil with an insulator interposed therebetween. 2 coils, the outermost peripheral end of the first coil and the second coil
A thin film coil comprising: an innermost peripheral end of the coil; or a connecting means for electrically connecting the innermost peripheral end of the first coil and the outermost peripheral end of the second coil, One coil is made of the same material, and is formed outside the outermost peripheral portion of the first coil at a predetermined distance from the first coil so as to regulate the outermost peripheral portion of the second coil,
A multilayer wiring thin-film coil characterized by comprising a frame electrically insulated from the second coil through an insulating layer.